CN102740646B - A kind of installation method of power device and installation component - Google Patents
A kind of installation method of power device and installation component Download PDFInfo
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- CN102740646B CN102740646B CN201110093762.7A CN201110093762A CN102740646B CN 102740646 B CN102740646 B CN 102740646B CN 201110093762 A CN201110093762 A CN 201110093762A CN 102740646 B CN102740646 B CN 102740646B
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Abstract
The invention discloses a kind of installation method and installation component of power device, the method comprises: the power device holddown with power device draw-in groove and PCB buckle is assembled to pcb board; Power device is placed in power device draw-in groove, to form power device assembly; Power device assembly is placed in radiator.The present invention by increasing power device holddown between power device and pcb board, thus solves the stress-retained and safety of pin when power tube is installed apart from inadequate problem.
Description
Technical field
The present invention relates to the mounting technique of power device, particularly a kind of installation method of power device and installation component.
Background technology
The mounting means of existing power tube has two kinds: first method is directly fixing on a heat sink through metal-oxide-semiconductor with screw, and this method power tube pin after fixing has stress-retained, and the power tube that stress is large is easily breakdown; Second method first press against power tube with pcb board, then fix on a heat sink through after the through hole in pcb board and metal-oxide-semiconductor with screw, this method can solve stress-retained problem, but the distance of pcb board and radiator is very near, pin distances radiator is less than 3mm, and safety distance not.
Summary of the invention
The object of the present invention is to provide a kind of installation method and installation component of power device, for solving the stress-retained and safety of pin when power tube is installed apart from inadequate problem.
According to an aspect of the present invention, provide a kind of installation method of power device, comprise the following steps:
A, the power device holddown with power device draw-in groove and PCB buckle is assembled to pcb board;
B, power device is placed in power device draw-in groove, to form power device assembly;
C, power device assembly is placed in radiator.
Preferably, step B also comprises: after power device is placed in power device draw-in groove, and the exposed surface of power device places insulating trip, forms the power device assembly being followed successively by pcb board, power device holddown, power device and insulating trip.
Preferably, pcb board, power device holddown, power device and insulating trip have internal thread through hole, form the installing hole of power device assembly, screw through installing hole, and is screwed into the internal thread hole of radiator.
Preferably, the PCB buckle of briquetting is pawl shape, for after the pilot hole inserting pcb board, is fixed on pcb board.
Preferably, at screw through before installing hole, in installing hole, screw insulating case is loaded.
Preferably, screw insulating case is inserted in the through hole of insulating trip and power device.
Preferably, at power device draw-in groove, central authorities are provided with groove, and this groove diameter is greater than the diameter of screw hole.
Preferably, the diameter of the diameter of groove and the degree of depth and screw insulating case circle cap is suitable with thickness, so that screw insulating case circle cap loads in groove.
According to a further aspect in the invention, provide a kind of installation component of power device, comprising:
With the pcb board of pilot hole;
Have the power device holddown of power device draw-in groove and PCB buckle, PCB buckle snaps in the pilot hole of pcb board;
Load the power device in power device draw-in groove.
Preferably, installation component also comprises:
Be used for the radiator of dissipation power device heat;
Be arranged on the insulating trip between power device and radiator;
Screw is installed, is used for pcb board, power device holddown, power device, insulating trip and radiator to be fixed together.
Compared with prior art, beneficial effect of the present invention is: the present invention by increasing power device holddown between power device and pcb board, thus solves the stress-retained and safety of pin when power tube is installed apart from inadequate problem.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of power device installation method provided by the invention;
Fig. 2 be power device provided by the invention installation component assembling after analyse and observe design sketch;
Fig. 3 a is the three-dimensional effect diagram of the power device holddown that the embodiment of the present invention provides;
Fig. 3 b be the power device holddown that provides of the embodiment of the present invention overlook design sketch;
Fig. 4 is the assembly flow charts of the power device holddown loading pcb board that the embodiment of the present invention provides;
Fig. 5 is the assembly flow charts that the power device that provides of the embodiment of the present invention and power device holddown and pcb board combine;
Fig. 6 is the assembly flow charts that the insulating trip that provides of the embodiment of the present invention and power device combine;
Fig. 7 is the assembly flow charts of the loading screw insulating case that the embodiment of the present invention provides.
Embodiment
Below in conjunction with accompanying drawing to a preferred embodiment of the present invention will be described in detail, should be appreciated that following illustrated preferred embodiment is only for instruction and explanation of the present invention, is not intended to limit the present invention.
Fig. 1 is the flow process signal of power device installation method provided by the invention, as shown in Figure 1:
Step S101, power device holddown is assembled to pcb board, this power device holddown is with power device draw-in groove, PCB buckle and screw hole, PCB buckle is pawl shape and matches with the pilot hole of pcb board, and the pilot hole inserting pcb board when assembling realizes the Automatic Combined of power device holddown and pcb board.
Step S102, is placed in power device draw-in groove power device, then places insulating trip on the exposed surface of power device, forms the power device assembly being followed successively by pcb board, power device holddown, power device and insulating trip.
Pcb board, power device holddown, power device and insulating trip all have through hole, and therefore power device assembly has an installing hole.
Screw insulating case can be loaded in the through hole of power device, to strengthen high voltage protection, the installation of screw insulating case can by following two kinds of modes: first kind of way is that screw insulating case inserts from the insulating trip of power device assembly, successively through insulating trip and power device; The second way is before power device is placed in power device draw-in groove, screw insulating case is inserted in power device, which needs the power device draw-in groove central design groove at power device holddown, its diameter is greater than the diameter of screw hole, the diameter of diameter and the degree of depth and screw insulating case circle cap is suitable with thickness, when adopting this mounting means, screw insulating case is successively through power device and insulating trip.
Wherein, before installation screw, plain cushion and bullet pad can be placed between screw terminal and pcb board, this plain cushion and bullet pad have through hole, so that screw inserts.
Step S103, is placed in radiator power device assembly, is inserted through installing hole and is screwed into the internal thread hole of radiator thus makes power device assembly fixing on a heat sink with a screw from the through hole of pcb board.
Fig. 2 show power device provided by the invention installation component assembling after analyse and observe effect, as shown in Figure 2, installation component comprises pcb board 1, power device holddown 2, power device 3, radiator 4, insulating trip 5, screw insulating case 6, screw 7, plain cushion 8 and bullet pad 9.
Wherein, pcb board 1 is used for power device holddown 2 with pilot hole 1a and through hole 1b (as shown in Figure 4), pilot hole 1a and assembles automatic cooperation of pcb board 1, through hole 1b is used for screw 7 and inserts.
Power device holddown 2 is with power device draw-in groove 2a, PCB buckle 2b, screw hole 2c (as shown in Figure 3 a) and groove 2d (as shown in Figure 3 b).Size and the power device 3 of power device draw-in groove 2a match, for placing power device 3.PCB buckle 2b is pawl shape, automatically coordinates after inserting the pilot hole 1a on pcb board 1 with pcb board 1.Screw hole 2c is positioned at the middle part of power device holddown 2, inserts for screw 7.Groove 2d is positioned at the bottom of power device holddown 2, and the bottom of size and screw insulating case 6 is to mating.
With through hole 5a (as shown in Figure 6) on insulating trip 5, insert for screw 7.
Fig. 3 a shows the stereoeffect of power device holddown provided by the invention, as shown in Figure 3 a, screw hole 2c is positioned at the center of power device holddown 2, it is a through hole, PCB buckle 2b is by the cylinder symmetrical both sides being positioned at screw hole 2c respectively of four pawl shapes, power device draw-in groove 2a is positioned at the bottom of power device holddown 2, and there is projection both sides respectively.
What Fig. 3 b showed power device holddown provided by the invention overlooks effect, and as shown in Figure 3 b, groove 2d is positioned at the bottom of power device holddown 2, and in the center of power device draw-in groove 2a, its radius is greater than the radius of screw hole 2c.
Fig. 4 shows the assemble flow that power device holddown provided by the invention loads pcb board, as shown in Figure 4, with pilot hole 1a and through hole 1b on pcb board 1, power device holddown 2 with PCB buckle 2b plugging in fitting hole 1a, then pcb board 1 and power device holddown 2 coordinate automatically.
Fig. 5 shows the assemble flow that power device and power device holddown and pcb board are combined provided by the invention, as shown in Figure 5, power device 3 is placed in the power device draw-in groove 2a of power device holddown 2, and power device 3 is welded on pcb board 1 by pad 3b, the through hole 3a of power device 3 just aims at the screw hole 2c of power device holddown 2.
Fig. 6 shows insulating trip that the embodiment of the present invention provides and the assemble flow that power device combines, and as shown in Figure 6, insulating trip 5 is silica gel sheet, and have one side to be with toughness, the through hole 3a through hole 5a of insulating trip 5 being aimed at power device is attached on power device 3.
Fig. 7 shows the assemble flow of the loading screw insulating case that the embodiment of the present invention provides, and as shown in Figure 7, is the mode that screw insulating case 6 is inserted from insulating trip 5, once through insulating trip 5 and power device 3.
In sum, the present invention has following technique effect: the present invention by increasing power device holddown between power device and pcb board, before installation screw, screw insulating case is installed in screw hole, directly active force is produced to power device without screw, too increase the distance between pcb board and radiator, thus the stress-retained and safety of pin solved when power tube is installed is apart from inadequate problem.
Although above to invention has been detailed description, the present invention is not limited thereto, those skilled in the art can carry out various amendment according to principle of the present invention.Therefore, all amendments done according to the principle of the invention, all should be understood to fall into protection scope of the present invention.
Claims (10)
1. an installation method for power device, is characterized in that, comprises the following steps:
A, the power device holddown with power device draw-in groove and PCB buckle is assembled to pcb board;
B, power device is placed in described power device draw-in groove, to form power device assembly;
C, described power device assembly is placed in radiator.
2. method according to claim 1, it is characterized in that, described step B also comprises: after power device is placed in described power device draw-in groove, the exposed surface of power device places insulating trip, forms the power device assembly being followed successively by pcb board, power device holddown, power device and insulating trip.
3. method according to claim 2, it is characterized in that, described pcb board, described power device holddown, described power device and described insulating trip have through hole, form the installing hole of described power device assembly, screw through described installing hole, and is screwed into the internal thread hole of described radiator.
4. method according to claim 3, is characterized in that, described PCB buckle is pawl shape, for after the pilot hole inserting pcb board, is fixed on described pcb board.
5. method according to claim 4, is characterized in that, at screw through before described installing hole, loads screw insulating case in described installing hole.
6. method according to claim 5, is characterized in that, described screw insulating case is inserted in the through hole of insulating trip and power device.
7. method according to claim 5, is characterized in that, be provided with groove in power device draw-in groove central authorities of institute, the diameter of described groove is greater than the diameter of described screw hole.
8. method according to claim 7, is characterized in that, the diameter of the diameter of described groove and the degree of depth and described screw insulating case circle cap is suitable with thickness, so that loaded in described groove by screw insulating case circle cap.
9. an installation component for power device, is characterized in that, comprising:
With the pcb board of pilot hole;
Have the power device holddown of power device draw-in groove and PCB buckle, described PCB buckle snaps in the pilot hole of described pcb board;
Load the power device in described power device draw-in groove.
10. installation component according to claim 9, is characterized in that, also comprises:
Be used for dissipating the radiator of described power device heat;
Be arranged on the insulating trip between described power device and described radiator; And installation screw, be used for described pcb board, described power device holddown, described power device, described insulating trip and described radiator to be fixed together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110093762.7A CN102740646B (en) | 2011-04-13 | 2011-04-13 | A kind of installation method of power device and installation component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201110093762.7A CN102740646B (en) | 2011-04-13 | 2011-04-13 | A kind of installation method of power device and installation component |
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| Publication Number | Publication Date |
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| CN102740646A CN102740646A (en) | 2012-10-17 |
| CN102740646B true CN102740646B (en) | 2015-11-18 |
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| CN201110093762.7A Active CN102740646B (en) | 2011-04-13 | 2011-04-13 | A kind of installation method of power device and installation component |
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| US10553557B2 (en) | 2014-11-05 | 2020-02-04 | Infineon Technologies Austria Ag | Electronic component, system and method |
| US10192846B2 (en) | 2014-11-05 | 2019-01-29 | Infineon Technologies Austria Ag | Method of inserting an electronic component into a slot in a circuit board |
| US10064287B2 (en) | 2014-11-05 | 2018-08-28 | Infineon Technologies Austria Ag | System and method of providing a semiconductor carrier and redistribution structure |
| CN105590909A (en) * | 2016-03-21 | 2016-05-18 | 厦门科华恒盛股份有限公司 | Transistor cover and installation and fixture structure and method of transistor cover |
| CN107517560A (en) * | 2016-06-16 | 2017-12-26 | 上海安浦鸣志自动化设备有限公司 | A kind of fixing device of power tube |
| CN108281400A (en) * | 2018-02-07 | 2018-07-13 | 深圳麦格米特电气股份有限公司 | The radiator structure of power device |
| CN110610918A (en) * | 2018-06-14 | 2019-12-24 | 深圳市爱拓芯半导体技术有限公司 | Power module lead frame with buckle structure |
| CN111885850B (en) * | 2020-07-16 | 2022-01-28 | 上海无线电设备研究所 | Connecting and assembling method for F-shaped packaged power tube |
| DE102022123572A1 (en) * | 2022-09-15 | 2024-03-21 | Eberspächer Catem Gmbh & Co. Kg | Control device and electric heating device comprising such |
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| CN2884809Y (en) * | 2006-01-17 | 2007-03-28 | 斯比泰电子（深圳）有限公司 | Radiator of power element |
| CN101754625A (en) * | 2008-12-05 | 2010-06-23 | 天津市松正电动科技有限公司 | Electromobile control device |
| CN201590950U (en) * | 2009-11-27 | 2010-09-22 | 艾默生网络能源有限公司 | Circuit board and power tube installation structure thereof |
| CN202058723U (en) * | 2011-04-13 | 2011-11-30 | 福建睿能电子有限公司 | Installation assembly of power device |
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- 2011-04-13 CN CN201110093762.7A patent/CN102740646B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2404300Y (en) * | 1998-07-01 | 2000-11-01 | 深圳市华为电器股份有限公司 | Supply unit with power element and radiator |
| CN2831692Y (en) * | 2005-09-28 | 2006-10-25 | 艾默生网络能源有限公司 | Printed circuit board assembly and power source appts including the same |
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Address after: Copper Road Software Avenue Gulou District of Fuzhou city in Fujian province 350003 Software Park No. 89 C District No. 26 building three layer A Applicant after: FUJIAN RAYNEN TECHNOLOGY CO., LTD. Address before: Copper Road Software Avenue Gulou District of Fuzhou city in Fujian province 350003 Software Park No. 89 C District No. 26 Applicant before: Fujian Raynen Electronics Co., Ltd. |
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