CN110610918A - Power module lead frame with buckle structure - Google Patents
Power module lead frame with buckle structure Download PDFInfo
- Publication number
- CN110610918A CN110610918A CN201810612604.XA CN201810612604A CN110610918A CN 110610918 A CN110610918 A CN 110610918A CN 201810612604 A CN201810612604 A CN 201810612604A CN 110610918 A CN110610918 A CN 110610918A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- buckle
- power module
- detain
- buckles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
A power module lead frame with a buckle structure relates to the technical field of power module lead frames. It contains lead frame, buckle, the buckle contain and detain body, straight handle, detain and grab, two straight handle fixed connection respectively are in the left and right sides of detaining the body, the corresponding outside of two straight handles is provided with respectively to detain and grabs, two buckles fixed connection respectively are in the left and right sides of lead frame, have through the fashioned buckle both ends of mould and detain and grab, can not produce the skew because of the atress when module package, improve the uniformity of product yield and electric property, need not to use the blotter, the automation of the lead frame packing of being convenient for.
Description
Technical Field
The invention relates to the technical field of power module lead frames, in particular to a power module lead frame with a buckle structure.
Background
The power module has wide application in the fields of motor drive, power electronics, and the like including air conditioners, washing machines, and the like. The power module consists of a driving circuit and a power chip. The driving circuit part is often welded on a PCB, and the power chip is welded on a power chip base island of the lead frame. In one lead frame design, the driving circuit PCB board may be connected by a snap of the lead frame.
According to the lead frame A1 with the buckle A2 in the figure 1, as the buckle A2 is perpendicular to the main plane of the whole lead frame A1, the size of the buckle A2 in the Z-axis direction after being punched by a die is larger than that of a PCB fixing hole, the PCB is well fixed on the lead frame A1, and the phenomenon that the PCB is stressed to generate deflection when a module is packaged is avoided.
When the lead frame A1 is stacked in a package according to the prior art of FIG. 2, a plastic cushion A3 with a thickness slightly larger than the dimension of the latch A2Z axis of the lead frame is added in the middle of the lead frame, so that the latches A2 on the upper and lower lead frames A1 do not contact when stacked.
This scheme has increased the packaging material finished product of lead frame, also increases the automatic degree of difficulty of lead frame packing simultaneously, and the automation degree of difficulty when the lead frame uses also increases in addition.
Disclosure of Invention
The invention aims to provide a power module lead frame with a buckle structure aiming at the defects and shortcomings of the prior art, the two ends of a buckle formed by a die are provided with buckle catches, the deviation caused by stress is avoided when the module is packaged, the consistency of the product yield and the electrical property is improved, a cushion pad is not needed, and the automation of lead frame packaging is facilitated.
In order to achieve the purpose, the invention adopts the following technical scheme: it contains lead frame 1, buckle 2 contain buckle body 21, straight handle 22, detain and grab 23, two straight handle 22 fixed connection respectively are in the left and right sides of detaining body 21, two corresponding outsides of straight handle 22 are provided with respectively to detain and grab 23, two buckle 2 fixed connection respectively are in the left and right sides of lead frame 1.
The two buckles 2 are respectively perpendicular to the plane of the lead frame 1.
The two buckles 2 correspond to each other in the X-axis position on the lead frame 1.
The two buckles 2 are buckles formed by the die in a stamping mode.
The two clasps 23 are larger than the PCB fixing holes.
The working principle of the invention is as follows: two buckles 2 that use mould stamping forming are fixed connection respectively in the left and right sides of lead frame 1, and are provided with two buckles on two buckles 2 and grab 23, and the PCB board is grabbed 23 direct card on lead frame 1 through two buckles on two buckles 2, can not produce the skew because of the atress when module package, improves product yield and electric property's uniformity.
After the technical scheme is adopted, the invention has the beneficial effects that: the buckle both ends through mould shaping have the knot to grab, can not produce the skew because of the atress when module package, improve the uniformity of product yield and electric property, need not to use the blotter, the automation of the lead frame packing of being convenient for.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of a prior art clasp A2;
FIG. 2 is a prior art lead frame A1 package stack;
FIG. 3 is a schematic structural view of the clip 2 of the present invention;
fig. 4 is a top view of the clip 2 of the present invention.
Description of reference numerals: the lead frame comprises a lead frame 1, a buckle 2, a buckle body 21, a straight handle 22 and a buckle grab 23.
Detailed Description
Referring to fig. 1 to 4, the technical solution adopted by the present embodiment is: it contains lead frame 1, buckle 2 contain buckle body 21, straight handle 22, detain and grab 23, two straight handle 22 fixed connection respectively are in the left and right sides of detaining body 21, two corresponding outsides of straight handle 22 are provided with respectively to detain and grab 23, two buckle 2 fixed connection respectively are in the left and right sides of lead frame 1.
The two buckles 2 are respectively vertical to the plane of the lead frame 1; the two buckles 2 correspond to each other in the X axial position on the lead frame 1; the two buckles 2 are formed by die in a stamping way; the two clasps 23 are larger than the PCB fixing holes.
The working principle of the invention is as follows: two buckles 2 that use mould stamping forming are fixed connection respectively in the left and right sides of lead frame 1, and are provided with two buckles on two buckles 2 and grab 23, and the PCB board is grabbed 23 direct card on lead frame 1 through two buckles on two buckles 2, can not produce the skew because of the atress when module package, improves product yield and electric property's uniformity.
After the technical scheme is adopted, the invention has the beneficial effects that: the buckle both ends through mould shaping have the knot to grab, can not produce the skew because of the atress when module package, improve the uniformity of product yield and electric property, need not to use the blotter, the automation of the lead frame packing of being convenient for.
The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent substitutions made by those skilled in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (5)
1. The utility model provides a take power module lead frame of buckle structure which characterized in that: it contains lead frame (1), buckle (2) contain and detain body (21), straight handle (22), detain and grab (23), two straight handle (22) fixed connection respectively are in the left and right sides of detaining body (21), the corresponding outside of two straight handle (22) is provided with respectively to detain grabs (23), two buckle (2) fixed connection respectively are in the left and right sides of lead frame (1).
2. The power module lead frame with the snap structure as claimed in claim 1, wherein: the two buckles (2) are respectively vertical to the plane of the lead frame (1).
3. The power module lead frame with the snap structure as claimed in claim 1, wherein: the X axial positions of the two buckles (2) on the lead frame (1) correspond to each other.
4. The power module lead frame with the snap structure as claimed in claim 1, wherein: the two buckles (2) are formed by die punching.
5. The power module lead frame with the snap structure as claimed in claim 1, wherein: the size of the two buckling claws (23) is larger than that of the PCB fixing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810612604.XA CN110610918A (en) | 2018-06-14 | 2018-06-14 | Power module lead frame with buckle structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810612604.XA CN110610918A (en) | 2018-06-14 | 2018-06-14 | Power module lead frame with buckle structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110610918A true CN110610918A (en) | 2019-12-24 |
Family
ID=68887498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810612604.XA Pending CN110610918A (en) | 2018-06-14 | 2018-06-14 | Power module lead frame with buckle structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110610918A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2411577Y (en) * | 2000-02-03 | 2000-12-20 | 亿光电子工业股份有限公司 | Packaged cooling device for light-emitting diode |
| CN201877569U (en) * | 2010-10-22 | 2011-06-22 | 中兴通讯股份有限公司 | Support for fixing internal antenna of communication terminal and communication terminal |
| CN102740646A (en) * | 2011-04-13 | 2012-10-17 | 福建睿能电子有限公司 | Installation method of power device and installation assembly |
| CN203367241U (en) * | 2013-06-05 | 2013-12-25 | 吉林华微斯帕克电气有限公司 | Power module PCB installation structure and power module |
-
2018
- 2018-06-14 CN CN201810612604.XA patent/CN110610918A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2411577Y (en) * | 2000-02-03 | 2000-12-20 | 亿光电子工业股份有限公司 | Packaged cooling device for light-emitting diode |
| CN201877569U (en) * | 2010-10-22 | 2011-06-22 | 中兴通讯股份有限公司 | Support for fixing internal antenna of communication terminal and communication terminal |
| CN102740646A (en) * | 2011-04-13 | 2012-10-17 | 福建睿能电子有限公司 | Installation method of power device and installation assembly |
| CN203367241U (en) * | 2013-06-05 | 2013-12-25 | 吉林华微斯帕克电气有限公司 | Power module PCB installation structure and power module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191224 |
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| WD01 | Invention patent application deemed withdrawn after publication |