CN102738055B - Flip chip packaging system and raise clamp thereof - Google Patents
Flip chip packaging system and raise clamp thereof Download PDFInfo
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- CN102738055B CN102738055B CN201110092212.3A CN201110092212A CN102738055B CN 102738055 B CN102738055 B CN 102738055B CN 201110092212 A CN201110092212 A CN 201110092212A CN 102738055 B CN102738055 B CN 102738055B
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- circuit board
- fixture
- flexible circuit
- lower clamp
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
The invention discloses a raise clamp which includes a clamp device which can be clamped at the periphery of a position to be engaged of a flexible circuit board. The clamp device comprises an upper clamp and a lower clamp. The upper clamp is provided with a first anti interference groove which makes room for a high temperature engagement head stroke, and a lower clamp is provided with a second anti interference groove which makes room for an engagement platform stroke. The raise clamp provided by the invention can clamp the periphery of the position to be engaged of the flexible circuit board so as to fix the periphery of the position to be engaged of the flexible circuit board. When engaging a pin on a chip and a pin on the flexible circuit board, since the periphery of the position to be engaged of the flexible circuit board is fixed by the raise clamp, a vertical height of the position is not changed, only the engagement position in the center is raised, a space between the periphery of the corresponding chip and the flexible circuit board is enlarged, and short circuit caused by the contact of a test pad at the periphery of the chip and the pin of the flexible circuit board can be effectively avoided. And the invention also provides a flip chip packaging system with the above raise clamp.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation, particularly a kind of chip package system and choose high fixture.
Background technology
Along with the increase of the integration of integrated circuit, the encapsulation technology of chip is also more and more diversified, reduce chip package volume because flip chip bonding techniques has and shorten the advantages such as signal transmission path, be widely used in chip package field at present, the packaging body that wherein such as chip size structure fills, chip directly attaches the kenels such as encapsulation and multi-chip module encapsulation, all can utilize flip chip bonding techniques to reach the object of packaged chip.
As shown in Figure 1, before covering brilliant combination, the below of flexible circuit board 3 is supported by engagement platform 4, and chip 2 is engaged pressure head 1 by high temperature and adsorbs heating.As shown in Figure 2, during chip bonding, first flexible circuit board 3 is withstood in engagement platform 4 rising, and then high temperature joint pressure head 1 presses down with chip 2, and the pin 21 of chip 2 is joined together with the pin 31 of flexible circuit board.
As shown in Figure 3, the product after existing chip package, because pin 21 thickness of chip 2 is generally 15um, so the gap engaged between the edge of rear chip 2 and the pin 31 of flexible circuit board 3 also only has about 15um, as the S in Fig. 3 is about 15um.
As shown in Figure 4, after the cutting of full wafer wafer, the edge of single chips 2 is not very smooth in ideal.There is the testing cushion 22 be connected with internal wiring at the edge of every chips 2, can be cut open during cutting, but can not excise completely, can find that the partial test pad 22 remained as shown in Figure 4 tilts.Because the gap engaged between the edge of rear chip 2 and the pin 31 of flexible circuit board 3 is very little, this testing cushion 22 is easily caused to snap into the pin 31 of flexible circuit board 3 and cause short circuit.
In sum, the pin after chip package in flexible circuit board and chip are very close, and the chip edge after cutting has testing cushion and remains and tilt, as contacted will be short-circuited with the pin of flexible circuit board.
How avoiding the testing cushion of chip edge contact with the pin of flexible circuit board and be short-circuited, is those skilled in the art's problem demanding prompt solutions.
Summary of the invention
In view of this, the invention provides one and choose high fixture, contact with the pin of the testing cushion with flexible circuit board of avoiding chip edge and be short-circuited.
Present invention also offers a kind of chip package system, so that the flexible circuit board with chip join place is chosen height, increase the spacing of chip edge and flexible circuit board, prevent the testing cushion of chip edge from contacting with the pin of flexible circuit board and being short-circuited.
For achieving the above object, the invention provides following technical scheme:
One chooses high fixture, for the chip package of flexible circuit board, comprise the grip device that can be folded in around flexible circuit board position to be joined, this grip device comprises fixture and lower clamp, described upper fixture is provided with abdicates the first anti-interference groove that high temperature engages ram travel, and described lower clamp is provided with the second anti-interference groove abdicating engagement platform stroke.
Preferably, choose in high fixture above-mentioned, described first anti-interference groove is by the dovetail groove of top to bottom convergent;
Described second anti-interference groove is by the dovetail groove of bottom to top convergent.
Preferably, choose in high fixture above-mentioned, described upper fixture is fixed on upper substrate by several first bar holes on it;
Described lower clamp is fixed on infrabasal plate by several second bar holes on it.
Preferably, choose in high fixture above-mentioned, the position that described upper fixture is corresponding with described second bar hole is provided with the pilot hole passed for spanner.
Preferably, choose in high fixture above-mentioned, the bottom of described upper fixture has the compression platform compressing flexible circuit board, and this compression platform area is less than the area of described upper clamp base.
Preferably, choose in high fixture above-mentioned, described compression platform and described upper fixture are integral type structure.
Preferably, choose in high fixture above-mentioned, the end face of described lower clamp is dismountable to be provided with and the steel disc compressing flexible circuit board.
Preferably, choose in high fixture above-mentioned, described steel disc is fixed on described lower clamp by screw, and four angles of described lower clamp are provided with the screw hole with described screw fit.
Preferably, choose in high fixture above-mentioned, described lower clamp is provided with at least two reference columns, and described steel disc is provided with the location hole with described reference column adaptation.
A kind of chip package system, the high temperature comprised for holding chip engages pressure head and the engagement platform for jack-up flexible circuit board, also comprises and as above chooses high fixture described in any one.
As can be seen from above-mentioned technical scheme, provided by the inventionly choose high fixture and comprise the grip device that can be folded in around flexible circuit board position to be joined, this grip device is made up of upper fixture and lower clamp, and is realized the object of stepping up around flexible circuit board position to be joined by the clamping power of upper fixture and lower clamp.Upper fixture is provided with abdicates the first anti-interference groove that high temperature engages ram travel, high temperature is avoided to engage pressure head when pressing down and upper holder contacts and interfering, lower clamp is provided with the second anti-interference groove abdicating engagement platform stroke, contacts and interferes when avoiding engagement platform is pressed with lower clamp.By above-mentioned setting, provided by the inventionly choose high fixture and can clamp around the position to be joined of flexible circuit board, thus be fixed around the position to be joined of flexible circuit board.When pin on chip engages with the pin in flexible circuit board, engagement platform is to the bonding station of flexible circuit board upwards jack-up, now fixed owing to choosing high fixture near the position to be joined of flexible circuit board, therefore it is vertically highly constant, middle bonding station is only had to be chosen height, the spacing of the edge of corresponding chip and flexible circuit board (namely not chosen high position) is extended, thus can effectively avoid the testing cushion of chip edge contact with the pin of flexible circuit board and be short-circuited.
In preferred version of the present invention, the position corresponding with the second bar hole on lower clamp at upper fixture arranges pilot hole, when this pilot hole has been used for fixing lower clamp, assembly tool (as spanner) from then on penetrates in hole, to lock the screw on lower clamp.The spacing avoided between fixture and lower clamp is too little, and cannot carry out the drawback of locking from screws many between upper fixture and lower clamp.
In another preferred version of the present invention, the bottom of upper fixture has the compression platform compressing flexible circuit board, and this compression platform area is less than the area of described upper clamp base.This compression platform contacts with flexible circuit board pin face, due to area design less by compressing platform, reducing the contact area of itself and flexible circuit board, reducing the probability damaging flexible circuit board pin after clamping face is stained with foreign matter.
Chip package system provided by the invention above-mentionedly chooses high fixture owing to adopting, therefore there is above-mentioned corresponding technique effect equally, chip package system provided by the invention is adopted to carry out chip package, flexible circuit board with chip join place can be chosen height, increase the spacing of chip edge and flexible circuit board, prevent the testing cushion of chip edge from contacting with the pin of flexible circuit board and being short-circuited.
Accompanying drawing explanation
Fig. 1 is the structural representation before existing chip package system in package;
Structural representation when Fig. 2 is existing chip package system in package;
Fig. 3 is the structural representation after chip and flexible circuit board encapsulate;
Fig. 4 be have the chip of testing cushion and flexible circuit board encapsulate after structural representation;
Fig. 5 be expect the chip that obtains and flexible circuit board encapsulate after structural representation;
The structural representation of the chip package system that Fig. 6 provides for the embodiment of the present invention;
The vertical view of the upper fixture that Fig. 7 provides for the embodiment of the present invention;
The front view of the upper fixture that Fig. 8 provides for the embodiment of the present invention;
The vertical view of the lower clamp that Fig. 9 provides for the embodiment of the present invention;
The front view of the lower clamp that Figure 10 provides for the embodiment of the present invention;
The structural representation choosing the driving arrangement of high fixture that Figure 11 provides for the embodiment of the present invention;
Structural representation before the chip package system in package that Figure 12 embodiment of the present invention provides;
Structural representation during the chip package system in package that Figure 13 provides for the embodiment of the present invention;
The chip package system that Figure 14 provides for the embodiment of the present invention choose high fixture separately after structural representation.
Embodiment
Core of the present invention is to provide one to choose high fixture, contacts and be short-circuited with the pin of the testing cushion with flexible circuit board of avoiding chip edge.
Another core of the present invention is to provide a kind of chip package system, so that the flexible circuit board with chip join place is chosen height, increases the spacing of chip edge and flexible circuit board, prevents the testing cushion of chip edge from contacting with the pin of flexible circuit board and being short-circuited.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 5, Fig. 5 be expect the chip that obtains and flexible circuit board encapsulate after structural representation.
The testing cushion that chip 2 margin residual after cutting also tilts contacts with the pin 31 of flexible circuit board 3 and is short-circuited, and more effective method is the spacing expanding chip edge and flexible circuit board.As shown in Figure 5, flexible circuit board 3 is designed to centre provoke and (provokes in the middle of so-called, be construed as the position engaged with the pin 21 of chip 2 to be provoked) shape, what can make around the position to be joined of this flexible circuit board 3 is vertically highly lower, thus expand the spacing of chip edge and flexible circuit board 3, pull open the distance of the testing cushion of chip 2 edge and the pin 31 of flexible circuit board 3 accordingly, thus can effectively avoid testing cushion contact with the pin 31 of flexible circuit board 3 and be short-circuited.
In order to realize centre in Fig. 5 by the shape of flexible circuit board 3 of provoking, the invention provides one and choosing high fixture, choose high fixture below by specific embodiment be described in detail provided by the invention.
Refer to Fig. 6-Figure 10, the structural representation of the chip package system that Fig. 6 provides for the embodiment of the present invention; The vertical view of the upper fixture that Fig. 7 provides for the embodiment of the present invention; The front view of the upper fixture that Fig. 8 provides for the embodiment of the present invention; The vertical view of the lower clamp that Fig. 9 provides for the embodiment of the present invention; The front view of the lower clamp that Figure 10 provides for the embodiment of the present invention.
Provided by the inventionly choose high fixture, for the chip package of flexible circuit board 3, comprise the grip device that can be folded in around flexible circuit board position to be joined, in order to ensure that grip device can be folded in around the joint place of flexible circuit board 3 and chip 1, can be " mouth " font face by the faying face of grip device and flexible circuit board, and can ensure that chip 1 can be passed to be bonded in flexible circuit board 3 by this " mouth " font faying face.
When flexible circuit board 3 and chip 2 bond package, grip device clamps around the position to be joined of flexible circuit board 3; After flexible circuit board 3 and chip 2 engage, grip device unclamps flexible circuit board 3, so that packaged product is sent out bonding land, and carries out the bond package of next flexible circuit board.
Every sleeve clamp device comprises fixture 5 and lower clamp 6, and upper fixture 5 and lower clamp 6 drive by driving arrangement and move round about, such as, can drive fixture 5 and lower clamp 6 relative motion, to realize the clamping to flexible circuit board 3; Fixture 5 and lower clamp 6 also can be driven to do from motion, and to realize unclamping flexible circuit board 3, what be convenient to flexible circuit board 3 sends out bonding land.It should be noted that, upper fixture 5 and lower clamp 6 are clamped in around the bonding station of flexible circuit board 3, so upper fixture 5 and lower clamp 6 are square shape structure with the contact-making surface of flexible circuit board 3, and have the hole passed for chip 1 between the contact-making surface of upper fixture 5 and flexible circuit board 3.There is between the contact-making surface of lower clamp 6 and flexible circuit board 3 hole passed for engagement platform 4.
Wherein, the driving arrangement of every sleeve clamp device can adopt two cylinders respectively, is driven the motion of upper fixture 5 and lower clamp 6 respectively, control the clamping of grip device and unclamp action by two cylinders.The driving arrangement of grip device also can adopt cam to drive upper fixture 5 and lower clamp 6, can arrange two cams on same driving shaft, and can be consistent by the profile design of two cams, but the stroke of two cams need be designed on the contrary.The cam contrary by above-mentioned two strokes drives upper fixture 5 and lower clamp 6 respectively, can realize the reverse motions of fixture 5 and lower clamp 6.By rotating driveshaft (driving this driving shaft to rotate by motor), can realize the rotation of two cams on it, the revolution that driving shaft rotates at every turn is half figure (180 °), can realize the clamping of grip device and unclamp action.
In current chip package system, flexible circuit board 3 generally needs engagement platform 4 by its upwards jack-up, chip 2 generally needs high temperature joint pressure head 1 to hold heating, and presses down with chip 2, and the pin 21 of chip 2 is joined together with the pin 31 of flexible circuit board 3.
As shown in Figure 7, because high temperature engages pressure head 1 when moving downward, its edge may move interference with the top end face of upper fixture 5, and the present invention is provided with and abdicates the first anti-interference groove 51 that high temperature engages pressure head 1 stroke on upper fixture 5.As shown in Figure 10, due to engagement platform 4 move upward time, its edge may move interference with the bottom end face of lower clamp 6, and the present invention is provided with the second anti-interference groove 64 abdicating engagement platform 4 stroke on lower clamp 6.
Known by foregoing description, provided by the inventionly choose high fixture and comprise the grip device that can be folded in around flexible circuit board 3 position to be joined, this grip device is made up of upper fixture 5 and lower clamp 6, and is realized the object of stepping up around flexible circuit board 3 position to be joined by the clamping power of upper fixture 5 and lower clamp 6.Upper fixture 5 is provided with abdicates the first anti-interference groove 51 that high temperature engages pressure head 1 stroke, avoid high temperature to engage when pressure head 1 presses down contact with upper fixture 5 and interfere, lower clamp 6 is provided with the second anti-interference groove 64 abdicating engagement platform 4 stroke, contacts and interferes when avoiding engagement platform 4 is pressed with lower clamp 6.
By above-mentioned setting, provided by the inventionly choose high fixture and can clamp around the position to be joined of flexible circuit board 3, thus the surrounding of flexible circuit board 3 position to be joined is fixed.When pin 21 on chip 2 engages with the pin 31 in flexible circuit board 3, the bonding station upwards jack-up of engagement platform 4 pairs of flexible circuit board 3, now fixed owing to choosing high fixture around the position to be joined of flexible circuit board 3, therefore it is vertically highly constant, middle bonding station is only had to be chosen height, the edge of corresponding chip 2 and the spacing of flexible circuit board 3 (namely not chosen high position) extended, after high temperature joint pressure head 1 leaves with engagement platform 4, on, lower clamp is opened, joint completes, choose high pin 31 and be fixed to structure as shown in Figure 5.Thus can effectively avoid the testing cushion at chip 2 edge contact with the pin 31 of flexible circuit board 3 and be short-circuited.
Because the temperature that high temperature engages pressure head 1 is higher general at about 400 DEG C, during joint, high temperature engages pressure head 1 and presses down meeting by supreme for heat conduction fixture 5, in order to avoid flexible circuit board 3 is scalded in the temperature distortion of upper fixture 5 and high temperature conduction, upper fixture 5 needs has certain thickness and rigidity.Therefore in order to ensure that upper fixture 5 has certain thickness and rigidity, the first anti-interference groove 51 on upper fixture 5 is designed to by the dovetail groove of top to bottom convergent.Top by the first anti-interference groove 51 can engage the Position Design that pressure head 1 interferes with high temperature be larger opening, and it is adjoint the closer to bottom, engage the probability that pressure head 1 interferes with high temperature lower, arbitrarily the first anti-interference groove 51 is designed to by the dovetail groove of top to bottom convergent.It can also effectively prevent from engaging between pressure head 1 with high temperature moving interference under in guarantee, fixture 5 has the prerequisite of certain rigidity and thickness.In like manner, the second anti-interference groove 64 is designed to by the dovetail groove of bottom to top convergent.
Upper fixture 5 is fixed on upper substrate by several first bar holes 53 on it, and lower clamp 6 is fixed on infrabasal plate by several second bar holes 63 on it.Upper fixture 5 and lower clamp 6 being individually fixed on upper substrate and infrabasal plate, is for the ease of the driving to upper fixture 5 and lower clamp 6.The fixing hole (i.e. the first bar hole 53) of upper fixture 5, being designed to bar hole is for the ease of regulating the correspondence position with lower clamp 6.The fixing hole (i.e. the second bar hole 63) of lower clamp 6, being designed to bar hole is conveniently corresponding with upper fixture 5 adjustment equally.Preferably the second bar hole 63 can be made U-shaped structure.
As shown in figure 11, the structural representation choosing the driving arrangement of high fixture that provides for the embodiment of the present invention of Figure 11.
For the form of actuated by cams fixture, and specially devise upper substrate 8 and infrabasal plate 9, upper fixture 5 is fixed on upper substrate 8 by its non-working surface (i.e. upper surface), and lower clamp 6 is fixed on infrabasal plate 9 by its non-working surface (i.e. lower surface).Upper substrate 8 and infrabasal plate 9 are L shape, and namely the two has the flanging of one and cam touch-control.The first cam 73 be connected on driving shaft 71 is identical with the shape of the second cam 72, and just its stroke is contrary.Position shown in Figure 11 is, the extreme lower position of the second cam 72 contacts with infrabasal plate 9, and now lower clamp 6 is in extreme lower position.The extreme higher position of the first cam 73 contacts with upper substrate 8, now goes up fixture 5 and is in extreme higher position, therefore goes up fixture 5 and lower clamp 6 is in releasing orientation.When needs clamp flexible circuit board, only need on the basis of state shown in Figure 11, driving shaft 71 rotates 180 °.After driving shaft 71 rotates 180 °, the extreme higher position of the second cam 72 contacts with infrabasal plate 9, and now lower clamp 6 is in extreme higher position.The extreme lower position of the first cam 73 contacts with upper substrate 8, now goes up fixture 5 and is in extreme lower position, therefore goes up fixture 5 and lower clamp 6 is in clamped condition.
When installing lower clamp 6, spanner can be locked fixed screw between upper substrate 8 and infrabasal plate 9.But the spacing between upper substrate 8 and infrabasal plate 9 is less, be unfavorable for that spanner operates between.As shown in Figure 7, for the ease of the installation of lower clamp fixed screw, be provided with the pilot hole 52 passed for spanner in the position that upper fixture 5 is corresponding with the second bar hole 63.
The position corresponding with the second bar hole 63 on lower clamp 6 at upper fixture 5 arranges pilot hole 52, and when this pilot hole 52 is for fixing lower clamp 6, assembly tool (as spanner) from then on penetrates in hole, to lock the screw on lower clamp 6.The spacing avoided between fixture 5 and lower clamp 6 is too little, and cannot from the drawback of locking screw between upper fixture 5 and lower clamp 6.
Upper fixture 5 contacts with the pin face of flexible circuit board 3, if contact-making surface is too much, and after contact-making surface is stained with foreign matter, the probability of damage flexible circuit board 3 pin will be very high, so need during design can keep fixture 5 firmly simultaneously, the contact area of reduction and flexible circuit board 3 as far as possible.
As shown in Figure 8, the present invention is provided with the compression platform 54 compressing flexible circuit board 3 in the bottom of upper fixture 5, this compression platform 54 area is less than the area bottom fixture 5.This compression platform 54 is integral type structure with upper fixture 5, it acts as the bottom of fixture 5, for contacting with flexible circuit board.This compression platform 54 contacts with the pin face of flexible circuit board 3, due to area design less by compressing platform 54, reducing the contact area of itself and flexible circuit board 3, reducing the probability damaging flexible circuit board pin after clamping face is stained with foreign matter.
Because upper fixture 5 is the rigidity with high strength, so in order to make the pressure distribution of grip device holding flexible circuit board even, lower clamp 6 needs to have certain elastic deformation. adopt stalloy more applicable.Upper and lower fixture Long-Time Service, what matching easily went wrong should be lower clamp 6, and the present invention is provided with and the steel disc compressing flexible circuit board 3 the end face of lower clamp 6 is dismountable.
Because lower clamp 6 is in order to have certain elastic deformation, and adopt stalloy as its main material, therefore repeatedly unclamping with in clamping process, the top of lower clamp 6 and the contact-making surface of flexible circuit board easily deform, and impact uses.The present invention, being provided with and the steel disc compressing flexible circuit board 3 of top side detachable of lower clamp 6, when after the steel disc distortion being arranged on lower clamp 6 top, only needing the steel disc changed herein, without the need to changing whole lower clamp 6, reducing maintenance cost.
Steel disc is fixed on lower clamp 6 by screw, and four angles of lower clamp 6 are provided with the screw hole 62 with screw fit.In order to avoid when the screw at locking screw nail 62 place, the drawback of screw turns followed by steel disc, and lower clamp 6 is provided with at least two reference columns 61, and steel disc is provided with the location hole with reference column 61 adaptation.When installing steel disc, first the location hole on steel disc is aimed at the reference column 61 on lower clamp 6, positioned by the particular location of two reference columns to steel disc, preferred reference column 61 is arranged on the diagonal angle of lower clamp 6.By coordinating of the reference column 61 on lower clamp 6 and the location hole on steel disc, limit when screwing screw, the degree of freedom of rotation followed by steel disc, and when preventing the holding screw of stubborn steel disc, steel disc is subjected to displacement.
Refer to Figure 12-Figure 14, the structural representation before the chip package system in package that Figure 12 embodiment of the present invention provides; Structural representation during the chip package system in package that Figure 13 provides for the embodiment of the present invention; The chip package system that Figure 14 provides for the embodiment of the present invention choose high fixture separately after structural representation.
Chip package system provided by the invention, comprises high temperature for holding chip 2 and engages pressure head 1 and the engagement platform 4 for jack-up flexible circuit board 3, wherein, also comprises and chooses high fixture as above described in embodiment.
As shown in figure 12, during work, first clamp flexible circuit board 3 by closed for upper and lower fixture.As shown in figure 13, then, high temperature engages pressure head 1 and presses down, and engagement platform 4 is upwards pushed up and exceeded the plane at former flexible circuit board 3 place, utilizes mechanical stress and temperature, makes to choose high pin sizing.As shown in figure 14, after high temperature joint pressure head 1 leaves with engagement platform 4, the upper and lower fixture of clamping flexible circuit board 3 is opened, and joint completes, and chooses high pin and is finalized.
Chip package system provided by the invention above-mentionedly chooses high fixture owing to adopting, therefore there is above-mentioned corresponding technique effect equally, chip package system provided by the invention is adopted to carry out chip package, flexible circuit board 3 with chip 2 joint can be chosen height, increase the spacing of chip 2 edge and flexible circuit board 3, prevent the testing cushion at chip 2 edge from contacting with the pin of flexible circuit board 3 and being short-circuited.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (9)
1. choose high fixture for one kind, for the chip package of flexible circuit board, it is characterized in that, comprise the grip device that can be folded in around flexible circuit board position to be joined, this grip device comprises fixture (5) and lower clamp (6), described upper fixture (5) is provided with abdicates the first anti-interference groove (51) that high temperature engages ram travel, and described lower clamp (6) is provided with the second anti-interference groove (64) abdicating engagement platform stroke, described first anti-interference groove (51) is by the dovetail groove of top to bottom convergent, described second anti-interference groove (64) is by the dovetail groove of bottom to top convergent, described upper fixture (5) is fixed on upper substrate (8) by its non-working surface, described lower clamp (6) is fixed on infrabasal plate (9) by its non-working surface, described upper substrate (8) and described infrabasal plate (9) are L shape, driving shaft (71) is provided with contrary the first cam (73) of stroke and the second cam (72), described first cam (73) contacts with the flanging of described upper substrate (8) away from described upper fixture (5), described second cam (72) contacts with the flanging of described infrabasal plate (9) away from described lower clamp (6).
2. choose high fixture as claimed in claim 1, it is characterized in that, described upper fixture (5) is fixed on upper substrate by several first bar holes (53) on it;
Described lower clamp (6) is fixed on infrabasal plate by several second bar holes (63) on it.
3. choose high fixture as claimed in claim 2, it is characterized in that, described upper fixture (5) position corresponding with described second bar hole (63) is provided with the pilot hole (52) passed for spanner.
4. choose high fixture as claimed in claim 1, it is characterized in that, the bottom of described upper fixture (5) has the compression platform (54) compressing flexible circuit board, and this compression platform (54) area is less than the area of described upper fixture (5) bottom.
5. choose high fixture as claimed in claim 4, it is characterized in that, described compression platform (54) and described upper fixture (5) are integral type structure.
6. as described in any one of claim 1-4, choose high fixture, it is characterized in that, the end face of described lower clamp (6) is dismountable to be provided with and the steel disc compressing flexible circuit board.
7. choose high fixture as claimed in claim 6, it is characterized in that, described steel disc is fixed on described lower clamp (6) by screw, and four angles of described lower clamp (6) are provided with and the screw hole of described screw fit (62).
8. choose high fixture as claimed in claim 6, it is characterized in that, described lower clamp (6) is provided with at least two reference columns (61), and described steel disc is provided with the location hole adaptive with described reference column (61).
9. a chip package system, the high temperature comprised for holding chip engages pressure head (1) and the engagement platform (4) for jack-up flexible circuit board, it is characterized in that, also comprises and choose high fixture as described in any one of claim 1-8.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110092212.3A CN102738055B (en) | 2011-04-13 | 2011-04-13 | Flip chip packaging system and raise clamp thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110092212.3A CN102738055B (en) | 2011-04-13 | 2011-04-13 | Flip chip packaging system and raise clamp thereof |
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| CN102738055A CN102738055A (en) | 2012-10-17 |
| CN102738055B true CN102738055B (en) | 2015-07-01 |
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| CN101842888A (en) * | 2007-11-01 | 2010-09-22 | 夏普株式会社 | Semiconductor mounting apparatus and semiconductor mounting method |
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| JP4634227B2 (en) * | 2005-06-02 | 2011-02-16 | 芝浦メカトロニクス株式会社 | Electronic component mounting apparatus and mounting method |
| JP4860494B2 (en) * | 2007-01-18 | 2012-01-25 | 富士通株式会社 | Manufacturing method of electronic device |
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| CN101842888A (en) * | 2007-11-01 | 2010-09-22 | 夏普株式会社 | Semiconductor mounting apparatus and semiconductor mounting method |
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