CN102732199A - 一种快速渗透底部填充胶及其制备方法 - Google Patents
一种快速渗透底部填充胶及其制备方法 Download PDFInfo
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- CN102732199A CN102732199A CN2012101610369A CN201210161036A CN102732199A CN 102732199 A CN102732199 A CN 102732199A CN 2012101610369 A CN2012101610369 A CN 2012101610369A CN 201210161036 A CN201210161036 A CN 201210161036A CN 102732199 A CN102732199 A CN 102732199A
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- epoxy resin
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- 229920006305 unsaturated polyester Polymers 0.000 claims abstract description 20
- 238000003756 stirring Methods 0.000 claims abstract description 14
- 239000007822 coupling agent Substances 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 9
- 239000000049 pigment Substances 0.000 claims abstract description 6
- 239000003085 diluting agent Substances 0.000 claims abstract 3
- 230000003204 osmotic effect Effects 0.000 claims description 27
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 24
- 239000003822 epoxy resin Substances 0.000 claims description 23
- 229920000647 polyepoxide Polymers 0.000 claims description 23
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 claims description 12
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 11
- 229930185605 Bisphenol Natural products 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 8
- 238000002203 pretreatment Methods 0.000 claims description 8
- 238000010792 warming Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000012466 permeate Substances 0.000 abstract 1
- 239000000047 product Substances 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 40
- 238000000465 moulding Methods 0.000 description 7
- 230000000630 rising effect Effects 0.000 description 6
- 238000011049 filling Methods 0.000 description 4
- 235000010724 Wisteria floribunda Nutrition 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- OZCWUNHGNVXCCO-UHFFFAOYSA-N oxiran-2-ylmethyl hydrogen carbonate Chemical group OC(=O)OCC1CO1 OZCWUNHGNVXCCO-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- XFVUECRWXACELC-UHFFFAOYSA-N trimethyl oxiran-2-ylmethyl silicate Chemical compound CO[Si](OC)(OC)OCC1CO1 XFVUECRWXACELC-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
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CN201210161036.9A CN102732199B (zh) | 2012-05-23 | 2012-05-23 | 一种快速渗透底部填充胶及其制备方法 |
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CN201210161036.9A CN102732199B (zh) | 2012-05-23 | 2012-05-23 | 一种快速渗透底部填充胶及其制备方法 |
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CN102732199A true CN102732199A (zh) | 2012-10-17 |
CN102732199B CN102732199B (zh) | 2014-04-16 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103571418A (zh) * | 2013-11-12 | 2014-02-12 | 烟台德邦科技有限公司 | 一种柔性底部填充胶及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005163000A (ja) * | 2003-12-02 | 2005-06-23 | Biruken Kk | 熱硬化性樹脂透明化方法 |
CN101880515A (zh) * | 2010-06-28 | 2010-11-10 | 深圳市库泰克电子材料技术有限公司 | 一种高可靠性、低粘度的底部填充胶 |
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2012
- 2012-05-23 CN CN201210161036.9A patent/CN102732199B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005163000A (ja) * | 2003-12-02 | 2005-06-23 | Biruken Kk | 熱硬化性樹脂透明化方法 |
CN101880515A (zh) * | 2010-06-28 | 2010-11-10 | 深圳市库泰克电子材料技术有限公司 | 一种高可靠性、低粘度的底部填充胶 |
Non-Patent Citations (5)
Title |
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《2007北京国际粘接技术研讨会》 20071031 闵长春等 "底部填充胶在芯片封装中的应用" 第P39-01到P39-04页,第4部分 1-7 , * |
《中国优秀硕士学位论文全文数据库·信息科技辑》 20111231 何素敏 "一种快速流动可低温固化的底部填充胶" 第I135-342页,第1.6、2.1部分 1-7 , * |
何素敏: ""一种快速流动可低温固化的底部填充胶"", 《中国优秀硕士学位论文全文数据库·信息科技辑》, 31 December 2011 (2011-12-31) * |
徐艳萍等: "《现代化工产品配方丛书 胶粘剂》", 31 December 2001, article ""J-22-1 室温固化环氧树脂填充胶"", pages: 235-236 * |
闵长春等: ""底部填充胶在芯片封装中的应用"", 《2007北京国际粘接技术研讨会》, 31 October 2007 (2007-10-31) * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103571418A (zh) * | 2013-11-12 | 2014-02-12 | 烟台德邦科技有限公司 | 一种柔性底部填充胶及其制备方法 |
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