CN102722605A - 电路的验证方法和半导体器件的模拟方法 - Google Patents
电路的验证方法和半导体器件的模拟方法 Download PDFInfo
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103792478A (zh) * | 2014-02-24 | 2014-05-14 | 东南大学 | 一种绝缘栅双极型晶体管直流特性的仿真方法 |
CN106774767A (zh) * | 2016-12-16 | 2017-05-31 | 算丰科技(北京)有限公司 | 串联供电芯片和系统、虚拟数字币挖矿机、及服务器 |
CN107679311A (zh) * | 2017-09-26 | 2018-02-09 | 上海华虹宏力半导体制造有限公司 | 存储器ip模块寄生参数的提取方法 |
CN110442983A (zh) * | 2019-08-09 | 2019-11-12 | 慧讯圆成电子科技(南通)有限公司 | 集成电路系统物理版图生成方法、装置、设备及存储介质 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103792478A (zh) * | 2014-02-24 | 2014-05-14 | 东南大学 | 一种绝缘栅双极型晶体管直流特性的仿真方法 |
CN103792478B (zh) * | 2014-02-24 | 2016-03-23 | 东南大学 | 一种绝缘栅双极型晶体管直流特性的仿真方法 |
CN106774767A (zh) * | 2016-12-16 | 2017-05-31 | 算丰科技(北京)有限公司 | 串联供电芯片和系统、虚拟数字币挖矿机、及服务器 |
CN107679311A (zh) * | 2017-09-26 | 2018-02-09 | 上海华虹宏力半导体制造有限公司 | 存储器ip模块寄生参数的提取方法 |
CN110442983A (zh) * | 2019-08-09 | 2019-11-12 | 慧讯圆成电子科技(南通)有限公司 | 集成电路系统物理版图生成方法、装置、设备及存储介质 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140411 |
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Effective date of registration: 20140411 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: Zuchongzhi road in Pudong Zhangjiang hi tech park Shanghai city Pudong New Area No. 1399 201203 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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