CN102702748A - Heat-conducting polyphenylene sulfide and polyamide composite material - Google Patents

Abstract

The invention relates to a heat-conducting polyphenylene sulfide and polyamide composite material, which comprises the following components in parts by weight: 30-50 parts of polyphenylene sulfide, 20-30 parts of polyamide, 20-40 parts of heat-conducting filler, 10-20 parts of glass fiber, 10-15 parts of epoxy resin, 0.5-1 part of antioxidant and 0.2-1 part of lubricant. By using a melt blending method, the preparation method comprises the following steps of: weighing each component according to the content of the formula and then placing in a high-speed mixer to uniformly mix; and extruding and granulating through a double-screw extruder. According to the heat-conducting polyphenylene sulfide and polyamide composite material, the heat conduction performance and the mechanical property of the polyphenylene sulfide can be synergistically improved, the heat conduction efficiency of the heat-conducting filler in the composite material is increased, the preparation process is simplified, and the material cost is reduced while good heat conduction performance and mechanical property of the material are kept.

Description

A kind of thermal conductivity polyphenylene sulfide and polyamide compoiste material

Technical field

The invention belongs to the polymer composite field, it is compound to be specifically related to a kind of thermal conductivity polyphenylene sulfide and polymeric amide

Material.

Background technology

Polyphenylene sulfide (PPS) claims polyphenylene sulphide again, (inferior) phenyl thioether that gathers the Asia.PPS has good heat-resisting, corrosion-resistant, radiation resistance, itself has fire-retardant self-extinguishing simultaneously; Its link configuration unit is very simple, and firm monomer is given the at high temperature very high intensity of material, rigidity retention rate, and stronger crystallization trend and bigger percent crystallinity are arranged.Simultaneously also because on the PPS main chain a large amount of phenyl ring are arranged, and percent crystallinity is very high, makes its elongation at break low, and the toughness shock resistance is also relatively poor, and PPS costs an arm and a leg in addition, to a certain degree limit its application.Particularly in recent years along with the progress of industrial technology; Have relatively high expectations to the heat conductivility of material in many fields, for example, electric field is badly in need of adopting highly heat-conductive material to distribute a large amount of heats that produce in the unicircuit; Make electronic devices and components steady operation under suitable temperature, increase the service life.

Often need add a large amount of fillers in order to reach high heat-conducting property, this can reduce especially shock strength of composite materials property greatly, reduces the mechanical stability of product, and inevitably causes the deterioration of processing characteristics.In order to make the thermal conductive polymer material obtain actual application, be cost to reduce the matrix material heat conductivility again often, must limit the heat conductivility and the use properties of thermally conductive material like this.

Summary of the invention

The object of the present invention is to provide a kind of thermal conductivity polyphenylene sulfide and polyamide compoiste material, can work in coordination with the heat conductivility and the mechanical property that improve polyphenylene sulfide.

For realizing above-mentioned purpose, the technical scheme that the present invention takes is:

A kind of thermal conductivity polyphenylene sulfide and polyamide compoiste material, in weight part, it consists of:

30 ~ 50 parts of polyphenylene sulfides

20 ~ 30 parts of polymeric amide

20 ~ 40 parts of heat conductive fillers

10 ~ 20 parts in spun glass

10 ~ 15 parts of epoxy resin

0.5 ~ 1 part in oxidation inhibitor

0.2 ~ 1 part of lubricant

Said polymeric amide is PA66;

Said heat conductive filler is nano-MgO and Al ₂O ₃In a kind of;

Said spun glass is process process silane resin acceptor kh-550 surface-treated alkali-free glass fiber;

Said epoxy resin is a kind of among bisphenol A type epoxy resin E-44, E-51 or the E-54;

Said oxidation inhibitor is one or more the mixture in antioxidant 1010, oxidation inhibitor 168, antioxidant 1076 or the oxidation inhibitor 2921;

Described lubricant is one or more the mixture among two amine hydroxybenzene lubricant EBO of silicone powder, ethylene or the ethylene bis stearamide class EBS.

Preparing method of the present invention adopts melt-blending process: take by weighing by formulation content and put into high-speed mixer after each component and mix, through the twin screw extruder extruding pelletization, extrusion temperature is 250 ~ 320 ℃.

Among the present invention, because PA 66 is more approaching with the SP of PPS, the better effects if so two kinds of matrix resins at high temperature dissolve each other.

Spun glass can combine better the mechanical property of strongthener through the silane resin acceptor kh-550 surface treatment among the present invention with the matrix resin interface.

Among the present invention epoxy resin in extrusion process can with the end group-NH2 of PA and-COOH reaction; And can react with end group-SH of PPS; Just can PA66 and PPS molecular chain be coupled together, thus the consistency of raising PPS and PA66, and then the mechanical property of raising blend alloy.On the other hand, the epoxide group in the epoxy resin can also increase the interface cohesive force of PPS and PA66 through reaction, reduces IT, reduces particle diameter of dispersing phase simultaneously, thereby makes alloy material reach heat-conducting effect preferably.

The invention has the beneficial effects as follows, improved the heat transfer efficiency of heat conductive filler in matrix material, simplified preparation technology, when keeping material good heat-conducting and mechanical property, reduced material cost.

Embodiment

Below in conjunction with embodiment the present invention is explained further details:

Embodiment 1 ~ 3

Material name	Proportioning 1 (weight part)	Proportioning 2 (weight part)	Proportioning 3 (weight part)
				Polyphenylene sulfide	30	40	50
Polymeric amide	30	25	20
				Heat conductive filler	20	30	40
Spun glass	10	15	20
				Epoxy resin	10	12	15
Oxidation inhibitor	0.5	0.8	1
				Lubricant	0.2	0.6	1

The preparation method adopts melt-blending process: take by weighing by formulation content and put into high-speed mixer after each component and mix, through the twin screw extruder extruding pelletization, wherein extrusion temperature is 310 ℃.

The foregoing description 1 ~ 3 is carried out performance test (testing standard adopts ASTM), and the result is as shown in the table:

Performance	Embodiment 1	Embodiment 2	Embodiment 3
				Flexural strength (MPa)	175	182	185
Tensile strength (MPa)	115	118	126
				Notched Izod impact strength (J/m)	57	65	62
Elongation at break (%)	9.3	8.2	6.9
				Thermal conductivity (W/ (m.k))	0.92	1.01	1.14

Claims (1)

1. thermal conductivity polyphenylene sulfide and polyamide compoiste material is characterized in that in weight part, it consists of:

30 ~ 50 parts of polyphenylene sulfides

20 ~ 30 parts of polymeric amide

20 ~ 40 parts of heat conductive fillers

10 ~ 20 parts in spun glass

10 ~ 15 parts of epoxy resin

0.5 ~ 1 part in oxidation inhibitor

0.2 ~ 1 part of lubricant

Said polymeric amide is PA66;

Said heat conductive filler is nano-MgO and Al ₂O ₃In a kind of;

Said spun glass is process process silane resin acceptor kh-550 surface-treated alkali-free glass fiber;

Said epoxy resin is a kind of among bisphenol A type epoxy resin E-44, E-51 or the E-54;

Said oxidation inhibitor is one or more the mixture in antioxidant 1010, oxidation inhibitor 168, antioxidant 1076 or the oxidation inhibitor 2921;

Described lubricant is one or more the mixture among two amine hydroxybenzene lubricant EBO of silicone powder, ethylene or the ethylene bis stearamide class EBS.