CN104788955A - Heat-conducting resin composition - Google Patents
Heat-conducting resin composition Download PDFInfo
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- CN104788955A CN104788955A CN201510183305.5A CN201510183305A CN104788955A CN 104788955 A CN104788955 A CN 104788955A CN 201510183305 A CN201510183305 A CN 201510183305A CN 104788955 A CN104788955 A CN 104788955A
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- China
- Prior art keywords
- parts
- resin
- heat
- resin composition
- bisphenol
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses heat-conducting resin composition and belongs to the field of resin. The heat-conducting resin composition is prepared from the following components in parts by weight: 100 parts of polyphenylene sulfide resin, 35-46 parts of bisphenol S resin, 50-80 parts of silicon nitride with the particle size being 0.1 micron, 10-15 parts of tin alloy with the melting point being 350 DEG C, 1-5 parts of a silane coupling agent KH560, 5-20 parts of bismaleimide, 5-20 parts of triphenyl phosphate and 1-3 parts of polyethylene wax. The bisphenol S resin, silicon nitride with the particle size being 0.1 micron, the tin alloy with the melting point being 300 DEG C, the silane coupling agent KH560, bismaleimide, triphenyl phosphate and the polyethylene wax are added on the basis of matrix resin, so that the prepared heat-conducting resin composition has relatively high heat conductivity coefficient.
Description
Technical field
The invention belongs to resin art, particularly relate to a kind of heat-conductive resin composition.
Background technology
In recent years, especially in Electrical and Electronic field of components, the resin material of the high thermal conductivity of highly corrosion resistant, easily machine-shaping starts to replace traditional metal materials to be used as thermally conductive material, but the thermal conductivity of this resin material is lower, need to improve its thermal conductivity, just can better apply with electrically, in the field such as electronic unit.
Summary of the invention
The invention provides a kind of heat-conductive resin composition, this heat-conductive resin composition thermal conductivity is high.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is:
It is made up of the component of following parts by weight:
Tin alloy 10 parts ~ 15 parts, silane coupling agent KH560 1 part ~ 5 parts, bismaleimides 5 parts ~ 20 parts, triphenyl phosphite 5 parts ~ 20 parts and polyethylene wax 1 part ~ 3 parts that the silicon nitride 50 parts ~ 80 parts that polyphenylene sulfoether resin 100 parts, bisphenol S type resin 35 parts ~ 46 parts, particle diameter are 0.1 micron, fusing point are 350 DEG C.
In technique scheme, technical scheme is more specifically: tin alloy 10 parts, silane coupling agent KH560 3 parts, bismaleimides 10 parts, triphenyl phosphite 5 parts and polyethylene wax 3 parts that the silicon nitride 80 parts that polyphenylene sulfoether resin 100 parts, bisphenol S type resin 35 parts, particle diameter are 0.1 micron, fusing point are 350 DEG C;
Further, polyphenylene sulfoether resin 100 parts, bisphenol S type resin 46 parts, the particle diameter silicon nitride 50 parts that is 0.1 micron, fusing point be 350 DEG C tin alloy 12 parts, silane coupling agent KH560 1 part, bismaleimides 20 parts, triphenyl phosphite 15 parts and polyethylene wax 1 part;
Further, polyphenylene sulfoether resin 100 parts, bisphenol S type resin 40 parts, the particle diameter silicon nitride 65 parts that is 0.1 micron, fusing point be 350 DEG C tin alloy 15 parts, silane coupling agent KH560 5 parts, bismaleimides 5 parts, triphenyl phosphite 20 parts and polyethylene wax 2 parts.
Owing to adopting technique scheme, the present invention has following beneficial effect:
The present invention is by the basis of matrix resin, tin alloy, silane coupling agent KH560, bismaleimides, triphenyl phosphite and polyethylene wax that the silicon nitride that interpolation bisphenol S type resin, particle diameter are 0.1 micron, fusing point are 350 DEG C, thus make the heat-conductive resin composition obtained have higher thermal conductivity.
Embodiment
Below in conjunction with specific examples, the invention will be further described:
Embodiment 1
This heat-conductive resin composition is made up of following component:
The tin alloy 100g that the silicon nitride 800g that polyphenylene sulfoether resin 1000g, bisphenol S type resin 350g, particle diameter are 0.1 micron, fusing point are 350 DEG C, silane coupling agent KH560 30g, bismaleimides 100g, triphenyl phosphite 50g and polyethylene wax 30g.
Its preparation method is: said components stirred.
The thermal conductivity of the heat-conductive resin composition that the present embodiment obtains is 16W/(mk).
Embodiment 2
This heat-conductive resin composition is made up of following component:
The tin alloy 120g that the silicon nitride 500g that polyphenylene sulfoether resin 1000g, bisphenol S type resin 460g, particle diameter are 0.1 micron, fusing point are 350 DEG C, silane coupling agent KH560 10g, bismaleimides 200g, triphenyl phosphite 150g and polyethylene wax 10g.
Its preparation method is: said components stirred.
The thermal conductivity of the heat-conductive resin composition that the present embodiment obtains is 16.5W/(mk).
Embodiment 3
This heat-conductive resin composition is made up of following component:
The tin alloy 150g that the silicon nitride 650g that polyphenylene sulfoether resin 1000g, bisphenol S type resin 400g, particle diameter are 0.1 micron, fusing point are 350 DEG C, silane coupling agent KH560 50g, bismaleimides 50g, triphenyl phosphite 200g and polyethylene wax 20g.
Its preparation method is: said components stirred.
The thermal conductivity of the heat-conductive resin composition that the present embodiment obtains is 17W/(mk).
Claims (4)
1. a heat-conductive resin composition, is characterized in that being made up of the component of following parts by weight:
Tin alloy 10 parts ~ 15 parts, silane coupling agent KH560 1 part ~ 5 parts, bismaleimides 5 parts ~ 20 parts, triphenyl phosphite 5 parts ~ 20 parts and polyethylene wax 1 part ~ 3 parts that the silicon nitride 50 parts ~ 80 parts that polyphenylene sulfoether resin 100 parts, bisphenol S type resin 35 parts ~ 46 parts, particle diameter are 0.1 micron, fusing point are 350 DEG C.
2. heat-conductive resin composition according to claim 1, is characterized in that: tin alloy 10 parts, silane coupling agent KH560 3 parts, bismaleimides 10 parts, triphenyl phosphite 5 parts and polyethylene wax 3 parts that the silicon nitride 80 parts that polyphenylene sulfoether resin 100 parts, bisphenol S type resin 35 parts, particle diameter are 0.1 micron, fusing point are 350 DEG C.
3. heat-conductive resin composition according to claim 1, is characterized in that: tin alloy 12 parts, silane coupling agent KH560 1 part, bismaleimides 20 parts, triphenyl phosphite 15 parts and polyethylene wax 1 part that the silicon nitride 50 parts that polyphenylene sulfoether resin 100 parts, bisphenol S type resin 46 parts, particle diameter are 0.1 micron, fusing point are 350 DEG C.
4. heat-conductive resin composition according to claim 1, is characterized in that: tin alloy 15 parts, silane coupling agent KH560 5 parts, bismaleimides 5 parts, triphenyl phosphite 20 parts and polyethylene wax 2 parts that the silicon nitride 65 parts that polyphenylene sulfoether resin 100 parts, bisphenol S type resin 40 parts, particle diameter are 0.1 micron, fusing point are 350 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510183305.5A CN104788955A (en) | 2015-04-17 | 2015-04-17 | Heat-conducting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510183305.5A CN104788955A (en) | 2015-04-17 | 2015-04-17 | Heat-conducting resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104788955A true CN104788955A (en) | 2015-07-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510183305.5A Pending CN104788955A (en) | 2015-04-17 | 2015-04-17 | Heat-conducting resin composition |
Country Status (1)
| Country | Link |
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| CN (1) | CN104788955A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106366659A (en) * | 2016-08-30 | 2017-02-01 | 广西梧州通轩林产化学有限公司 | Heat conducting resin compound |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4528346A (en) * | 1982-09-17 | 1985-07-09 | Dainippun Ink and Chemicals, Inc. | Resin composition |
| CN102464883A (en) * | 2010-11-16 | 2012-05-23 | 比亚迪股份有限公司 | Heat-conducting resin composition and preparation method thereof |
| CN102702748A (en) * | 2012-06-15 | 2012-10-03 | 昆山聚威工程塑料有限公司 | Heat-conducting polyphenylene sulfide and polyamide composite material |
| CN102993751A (en) * | 2012-12-03 | 2013-03-27 | 鹤山丽得电子实业有限公司 | High-thermal-conductivity and high-strength insulating PPS (polyphenylene sulfite) composite material and preparation method for same |
| CN103013119A (en) * | 2012-12-03 | 2013-04-03 | 合肥杰事杰新材料股份有限公司 | Low-cost modified polyphenylene sulfide composition and preparation method thereof |
| JP2013173811A (en) * | 2012-02-23 | 2013-09-05 | Toray Ind Inc | Resin composition, molding material and method for producing the same |
-
2015
- 2015-04-17 CN CN201510183305.5A patent/CN104788955A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4528346A (en) * | 1982-09-17 | 1985-07-09 | Dainippun Ink and Chemicals, Inc. | Resin composition |
| CN102464883A (en) * | 2010-11-16 | 2012-05-23 | 比亚迪股份有限公司 | Heat-conducting resin composition and preparation method thereof |
| JP2013173811A (en) * | 2012-02-23 | 2013-09-05 | Toray Ind Inc | Resin composition, molding material and method for producing the same |
| CN102702748A (en) * | 2012-06-15 | 2012-10-03 | 昆山聚威工程塑料有限公司 | Heat-conducting polyphenylene sulfide and polyamide composite material |
| CN102993751A (en) * | 2012-12-03 | 2013-03-27 | 鹤山丽得电子实业有限公司 | High-thermal-conductivity and high-strength insulating PPS (polyphenylene sulfite) composite material and preparation method for same |
| CN103013119A (en) * | 2012-12-03 | 2013-04-03 | 合肥杰事杰新材料股份有限公司 | Low-cost modified polyphenylene sulfide composition and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 吴兰峰 等: "聚苯硫醚/环氧树脂共混体系的结构流变学", 《中国塑料》 * |
| 王晓坡 等: "粘接聚苯硫醚膜室温固化耐高温环氧胶黏剂", 《化学与黏合》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106366659A (en) * | 2016-08-30 | 2017-02-01 | 广西梧州通轩林产化学有限公司 | Heat conducting resin compound |
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| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150722 |