CN102680495A - Device and method for automatic optical detection - Google Patents
Device and method for automatic optical detection Download PDFInfo
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- CN102680495A CN102680495A CN2011100627349A CN201110062734A CN102680495A CN 102680495 A CN102680495 A CN 102680495A CN 2011100627349 A CN2011100627349 A CN 2011100627349A CN 201110062734 A CN201110062734 A CN 201110062734A CN 102680495 A CN102680495 A CN 102680495A
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Abstract
The invention discloses a device and a method for automatic optical detection, wherein the device comprises an image acquiring unit and an image processing unit; the image acquiring unit is used for performing stepping two-dimensional scanning movement relative to a detected circuit board, and photographing the detected circuit board once after stepping every time, wherein the sum of images acquired by the photographing every time covers the complete surface of the detected circuit board; and the image processing unit is used for seamlessly splicing the images acquired by the photographing every time into a complete image of the detected circuit board, and performing image difference analysis between the complete image acquired by the splicing and the design standards of the detected circuit board, so as to detect the apparent defects of the detected circuit board. Via the device and the method disclosed by the invention, the complete image of the detected circuit board can be acquired, so that an omni-directional accurate detection can be performed on the detected circuit board.
Description
Technical field
The present invention relates to a kind of automatic optical detection device (AOI, Automated Optical Inspector), particularly relate to a kind of automatic optical detection device and a kind of automatic optical detection method that utilizes this automatic optical detection device to realize.
Background technology
The range of application of PCB (Printed Circuit Board, printed circuit board (PCB)) is extremely extensive, all is seen everywhere in the inside such as electronic products such as mobile phone, telephone set, televisor, computer, automobile, duplicating machine, printer, air-conditionings.And at PCBA (Printed Circuit Board Assembly; The printed circuit board (PCB) assembling) in the procedure for producing; Because the element on the PCB presents the development trend of continuous microminiaturization and densification always; Therefore rely on conventional artificial visual inspection method can not go up the accurate element of layout and carry out quick, reliable and stable open defect Defect Detection, and also can't preserve accurate detection record, wherein PCB; Common defective has: Short Item, skew, wrong part, extremely anti-, short circuit, lack tin, many tin, rosin joint, edge-on, set up a monument, instead paste, breakage, many, tin sweat(ing), golden finger scratch, depression, the scratch of printed circuit board (PCB) sheet material, deficient purchase or the like.
To above-mentioned condition, the AOI device just arises at the historic moment, and it can be in the assembling process and the PCB of assembling after accomplishing carries out fast, the detection of accurate and stable, can also realize the electronization storage of testing result simultaneously and issues.The AOI device has progressively been installed for its production line in the commercial city by present most of PCB assembling processing factory, improving speed, the accuracy and reliability that product is assembled, thereby improves production capacity, promotes yield rate, reduces maintenance cost, improves processing procedure.
Present AOI device mainly comprises an image acquisition unit and a graphics processing unit.This image acquisition unit mainly comprises: the mechanical transmission mechanism of a digital camera (containing camera lens), an illuminator, an XY direction and an electrical control mechanism; After being examined on the support plate platform that PCB is fixed in this AOI device with one; This digital camera just can constantly walk in this surface of being examined PCB under driving, and under this illuminator auxiliary, is constantly taken pictures in this surface of being examined PCB.This graphics processing unit be generally one image processing software is installed computer; To be admitted to this graphics processing unit and analyze by take pictures each width of cloth image of obtaining of this image acquisition unit, and to whether having the open defect flaw in every width of cloth image detect by this image processing software.
Such detection mode is compared with the Manual Visual Inspection mode, though the speed that detects, accuracy and stable aspect great lifting has all been arranged, it still exists some comparatively significantly limitation.
In existing graphics processing unit; To treatment of picture is to utilize CPU (Central Process Unit; Central processing unit) the execution serial arithmetic realizes; Yet because serial arithmetic has the lower shortcoming of arithmetic capability natively, add existing image processing software the analytical approach of image also lacked optimization, this just caused jointly present graphics processing unit to the bulk treatment ability of image relatively a little less than.In addition; Because the resolution of digital camera is limited; Therefore in all AOI devices up to now, take pictures all to be merely able to obtain at every turn and examined the lip-deep topography of PCB, the size of each topography is by FOV (the Field of View of camera; The visual field) decision for example possibly be merely 32mm * 24mm size.Under the more weak adverse condition of the processing power of graphics processing unit, people just can't excessive demand carry out complete detection to the whole surface of being examined PCB, are examined the detection of taking pictures respectively of a plurality of regional areas that PCB is provided with element but be merely able to select.
Such selective local detection can cause following consequence:
One; Owing to only taken pictures to examining the zone that PCB is provided with element; Therefore can't detect the open defect flaw in the zone that PCB is not provided with element at all; For example in these zones, possibly exist many, tin sweat(ing), golden finger scratch, depression, the scratch of printed circuit board (PCB) sheet material, deficient purchase or the like, this has just caused detecting the appearance of blind spot.
Two; Owing to only taken pictures to examining the zone that PCB is provided with element; Therefore can't obtain to be examined the complete image of PCB; Thereby also just can't realize being examined the real-time output and the storage of the complete image of PCB, this can further cause again and can't be examined PCB and all set up corresponding retrospective complete image archives for every, brings bigger restriction and inconvenience for thus the management and control of production quality.
Three, large-sized Barcode bar code (48mm even longer) can be pasted usually by printed circuit board (PCB) assembling processor on circuit board surface, review and add up use for quality.For this length greater than the bar code of single FOV size; Current AOI device is felt simply helpless at all; Can't directly read these bar code information through the bar code reading software that is equipped with on the computer that is used for Flame Image Process, bring very large restriction thereby review for follow-up production quality.
Summary of the invention
The technical matters that the present invention will solve is only can carry out the defective that selective local detects to being examined PCB in order to overcome AOI device of the prior art; A kind of complete image that can obtain to be examined circuit board is provided, thus can be to being examined automatic optical detection device and a kind of automatic optical detection method that utilizes this automatic optical detection device to realize that circuit board carries out omnibearing accurate detection.
The present invention solves above-mentioned technical matters through following technical proposals: a kind of automatic optical detection device; It comprises an image acquisition unit and a graphics processing unit; Its characteristics are; This image acquisition unit is used for being examined circuit board with respect to one to carry out step-type two-dimensional scan and moves; All this is examined circuit board after each stepping and is carried out once photo taking, each time take pictures the image sum covering of obtaining this examined the full surface of circuit board, this graphics processing unit is used for each time taken pictures, and the image that obtains is seamless spliced is examined the complete image of circuit board for this; And will splice this complete image of obtaining and this design standards of being examined circuit board and carry out image difference and analyze, to detect the open defect that this is examined circuit board.
Preferably, this graphics processing unit adopts GPU (Graphical Process Unit, graphic process unit) to carry out concurrent operation.
Preferably; In seamless spliced process; This graphics processing unit is used for each time image that obtains of taking pictures is arranged by the actual positional relationship between the shot region according to this each time of being examined on the circuit board; Then adjacent image is carried out edge transition and shows integrating, to obtain the complete image that this is examined circuit board.
Preferably; The direction of the continuous stepping of this image acquisition unit be directions X, with the perpendicular direction of this directions X be the Y direction; And this is examined adjacent by the edge overlaid of shot region on the circuit board; This graphics processing unit all also is used at every turn after taking pictures: rotate the image that this time taken pictures and obtained; So that each time taken pictures the image that obtains when being examined each time on the circuit board and arranged by the actual positional relationship between the shot region according to this, be positioned at that each image with delegation can be along the linear proper alignment of directions X on the directions X at this graphics processing unit; Shrink the image that this time taken pictures and obtained along directions X and Y direction respectively; So that at this graphics processing unit each time taken pictures the image that obtains when being examined each time on the circuit board and arranged by the actual positional relationship between the shot region according to this, the overlapping edge between each adjacent image can be punctured into splicing line; Rotate the image that this time taken pictures and obtained; So that at this graphics processing unit each time taken pictures the image that obtains when being examined each time on the circuit board and arranged by the actual positional relationship between the shot region according to this, each the row image on the directions X can align along the Y direction each other.
Preferably, this image difference analysis comprises full plate coupling.
The present invention also aims to provide a kind of automatic optical detection method that utilizes above-mentioned automatic optical detection device to realize; Its characteristics are; This method comprises: S1, this image acquisition unit are examined circuit board with respect to this and carry out step-type two-dimensional scan and move; All this is examined circuit board after each stepping and is carried out once photo taking, each time take pictures the image sum covering of obtaining this examined the full surface of circuit board; S2, this graphics processing unit take pictures each time, and the image that obtains is seamless spliced is examined the complete image of circuit board for this; S3, this graphics processing unit will splice this complete image of obtaining and this design standards of being examined circuit board to carry out image difference and analyzes, to detect the open defect that this is examined circuit board.
Preferably, step S2 further comprises: S21, this graphics processing unit are arranged according to this each time of being examined on the circuit board each time image that obtains of taking pictures by the actual positional relationship between the shot region; S22, this graphics processing unit carry out edge transition and show integrating to adjacent image, to obtain the complete image that this is examined circuit board.
Preferably; The direction of the continuous stepping of this image acquisition unit be directions X, with the perpendicular direction of this directions X be the Y direction; And this is examined adjacent by the edge overlaid of shot region on the circuit board; After taking pictures, all further comprise among the step S1: S11, rotate the image that this time taken pictures and obtained, each image with delegation can be along the linear proper alignment of directions X on the directions X so that in step S21, be positioned at every turn; S12, shrink the image that this time taken pictures and obtained along directions X and Y direction respectively, so that the overlapping edge between each adjacent image can be punctured into splicing line in step S21; The row of each on the directions X image S13, rotates the image that this time taken pictures and obtained, so that can align along the Y direction each other in step S21.
Positive progressive effect of the present invention is: this automatic optical detection device of the present invention is through optimization and the more powerful processor of employing arithmetic capability to image processing method; Greatly promoted graphics processing unit to the treatment of picture ability; On this basis; This AOI device also carries out subregion to the whole surface of being examined circuit board takes pictures, and each width of cloth image that utilizes graphics processing unit to take pictures then to obtain carries out seamless spliced, thereby obtains the whole complete image of being examined circuit board.The acquisition of this complete image can bring following benefit:
One; Can carry out accurate full plate matching detection to being examined circuit board; Particularly to not being provided with the zone of element, thus find in time these be provided with the zones that are not provided with element in open defect flaws such as occur many, tin sweat(ing), golden finger scratch, depression, the scratch of printed circuit board (PCB) sheet material, deficient purchase.
Two, can realize being examined the real-time output and the storage of the complete image of circuit board, and examined circuit board and all set up corresponding retrospective complete image archives for every further, bring great convenience for thus the management and control of production quality.
Three; This complete image that obtains can directly reflect and sticks on the large scale bar code of being examined on the circuit board; Thereby make manufacturer directly to read these bar code information, bring great convenience review for follow-up production quality through the bar code reading software module that is equipped with on the computer that is used for Flame Image Process.
Description of drawings
Fig. 1 is the process flow diagram of this automatic optical detection method of the present invention.
Fig. 2 is first synoptic diagram of the seamless spliced process of image among the present invention.
Fig. 3 is second synoptic diagram of the seamless spliced process of image among the present invention.
Fig. 4 is the 3rd synoptic diagram of the seamless spliced process of image among the present invention.
Fig. 5 is the 4th synoptic diagram of the seamless spliced process of image among the present invention.
Fig. 6 is the 5th synoptic diagram of the seamless spliced process of image among the present invention.
Fig. 7 is the 6th synoptic diagram of the seamless spliced process of image among the present invention.
Embodiment
Provide preferred embodiment of the present invention below in conjunction with accompanying drawing, to specify technical scheme of the present invention.
This automatic optical detection device of the present invention is used for being examined circuit board to one, and for example a PCB carries out the detection of open defect flaw.Include an image acquisition unit and a graphics processing unit in this AOI device; Wherein, The modular construction of this image acquisition unit can be identical with existing image acquisition unit, and the hardware configuration of this graphics processing unit then also can be identical with existing graphics processing unit.
This image acquisition unit no longer is to be carried out optionally partial-block and take pictures examining circuit board, takes pictures but comprehensive subregion is carried out on the whole surface of being examined circuit board but in the present invention.Specifically, this image acquisition unit can under driving, examined circuit board above carry out step-type two-dimensional scan and move.Promptly; With the plane of the placement plane parallel of being examined circuit board in set an orthogonal directions X (horizontal direction among Fig. 2-7) and a Y direction (vertical direction among Fig. 2-7); This image acquisition unit is at first along the continuous stepping of directions X, and after each stepping all to below the zone within its camera of entering FOV of being examined on the circuit board carry out once photo taking, accomplished successively the delegation that is examined circuit board upper edge directions X treated taking pictures of shot region after; This image acquisition unit can move a preset line feed distance along the Y direction; Treat shot region so that its camera FOV is aimed at along the next line of directions X, and then begin, and after each stepping, all carrying out once photo taking equally along the continuous stepping of directions X; The rest may be inferred, and final the completion taken pictures to the subregion on the whole surface of being examined circuit board.In the present invention, directions X and Y direction can be exchanged, and its actual direction also can be set arbitrarily.This stepping spacing and should preset line feed distance then can carry out respective settings according to the FOV size of camera by those skilled in the art is as long as all that guarantee to be examined on the circuit board can be covered the whole surface of being examined circuit board by the shot region sum.
Owing to need carry out seamless spliced to a large amount of images in the present invention; And after splicing has obtained to be examined the complete image of circuit board; Needing that also this complete image is carried out image difference with the design standards of being examined circuit board analyzes; Therefore the serial arithmetic of adopting common CPU to carry out low speed has been difficult to guarantee the short Flame Image Process time; Especially in carrying out full plate matching detection calculating process, so preferably adopted the GPU that can carry out concurrent operation at a high speed to replace CPU carries out image processing task and follow-up matching detection task in the present invention.And in such as conventional sense calculating processes such as color extraction, color computing, brightness extraction, brightness computing, image comparison, template matches,
side-play amount angle outputs, then can adopt the optimal combination mode of GPU and CPU computing to realize.
Below will describe this automatic optical detection method of the present invention in detail based on the process flow diagram of Fig. 1, also with reference to the synoptic diagram of figure 2-7.
Whether step 101 judges whether this image acquisition unit has accomplished whole walking, promptly accomplished the subregion on the whole surface of being examined circuit board is taken pictures, if accomplish, then gets into step 102, if also accomplish, and execution in step 100 once more then.
Above-mentioned step 100-103 is described to be the testing process under the ideal situation, yet when the above-mentioned detection method of practice, but can receive the influence of many objective factors inevitably:
First; The camera of this image acquisition unit and the setting angle between the directions X are difficult to accomplish the absolute error that has no usually; As shown in Figure 2; In fact a limit that should be parallel with directions X in the FOV rectangle of camera is tending to form a small error angle a with directions X; This angle a can cause when the delegation of camera on directions X carries out stepping, taking pictures this row image that obtains all can be uniformly according to this angle a run-off the straight, and so obviously delegation's image can't ideally be realized seamless spliced.
Second; Only with present camera manufacturing technology; The pixel quality of taking pictures at the fringe region place of each FOV of camera is generally not ideal; Therefore preferably in step 100, set further: make and examined adjacent on the circuit board and always kept to a certain degree overlapped by the edge of shot region, as shown in Figures 2 and 3, but the overlapped image in this edge obviously also can't directly be used for mutual splicing.
The 3rd; Usually also be difficult to accomplish absolute mutual vertical installation between the driving mechanism of the driving mechanism of directions X and Y direction; Promptly should orthogonal directions X and the Y direction between often exist a small error angle b; As shown in Figure 5, this error angle b can cause when the next line that camera has been accomplished stepping and got into directions X along the delegation of directions X is carried out stepping and taken pictures, and in this two row, takes pictures and on the Y direction, just can form a small dislocation between the image that obtains; This small dislocation meeting is constantly accumulation between row on the directions X and row, and so obviously multirow image also can't ideally be realized seamless spliced.
Corresponding to the influence of the objective factor of above-mentioned three aspects, preferably execution in step 104-106 between step 100 and step 101.
Certainly, the execution sequence that those skilled in the art also can set-up procedure 104-106, the change of its execution sequence does not influence effect of the present invention and realizes.
The various software functions that relate among the present invention all can combine the existing software program means to realize under existing hardware condition, do not give unnecessary details so its concrete implementation procedure is not all done at this.
In sum; This automatic optical detection device of the present invention is through optimization and the more powerful processor of employing arithmetic capability to image processing method; Can obtain the whole complete image of being examined circuit board, thereby can carry out omnibearing accurate detection the whole circuit board of being examined.
Though more than described embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, protection scope of the present invention is limited appended claims.Those skilled in the art can make numerous variations or modification to these embodiments under the prerequisite that does not deviate from principle of the present invention and essence, but these changes and modification all fall into protection scope of the present invention.
Claims (8)
1. automatic optical detection device; It comprises an image acquisition unit and a graphics processing unit; It is characterized in that this image acquisition unit is used for being examined circuit board with respect to one to carry out step-type two-dimensional scan and move, and all this is examined circuit board after each stepping and carries out once photo taking; The take pictures image sum obtained of each time covers this and is examined the full surface of circuit board; This graphics processing unit is used for each time taken pictures, and the image that obtains is seamless spliced is examined the complete image of circuit board for this, and will splice this complete image of obtaining and this design standards of being examined circuit board and carry out image difference and analyze, to detect the open defect that this is examined circuit board.
2. automatic optical detection device as claimed in claim 1 is characterized in that, this graphics processing unit adopts GPU to carry out concurrent operation.
3. automatic optical detection device as claimed in claim 2; It is characterized in that; In seamless spliced process; This graphics processing unit is used for each time image that obtains of taking pictures is arranged by the actual positional relationship between the shot region according to this each time of being examined on the circuit board, then adjacent image is carried out edge transition and show integrating, to obtain the complete image that this is examined circuit board.
4. automatic optical detection device as claimed in claim 3; It is characterized in that; The direction of the continuous stepping of this image acquisition unit be directions X, with the perpendicular direction of this directions X be the Y direction; And this is examined adjacent by the edge overlaid of shot region on the circuit board, and this graphics processing unit all also is used at every turn after taking pictures:
Rotate the image that this time taken pictures and obtained; So that each time taken pictures the image that obtains when being examined each time on the circuit board and arranged by the actual positional relationship between the shot region according to this, be positioned at that each image with delegation can be along the linear proper alignment of directions X on the directions X at this graphics processing unit;
Shrink the image that this time taken pictures and obtained along directions X and Y direction respectively; So that at this graphics processing unit each time taken pictures the image that obtains when being examined each time on the circuit board and arranged by the actual positional relationship between the shot region according to this, the overlapping edge between each adjacent image can be punctured into splicing line;
Rotate the image that this time taken pictures and obtained; So that at this graphics processing unit each time taken pictures the image that obtains when being examined each time on the circuit board and arranged by the actual positional relationship between the shot region according to this, each the row image on the directions X can align along the Y direction each other.
5. like any described automatic optical detection device among the claim 1-4, it is characterized in that this image difference analysis comprises full plate coupling.
6. automatic optical detection method that utilizes automatic optical detection device as claimed in claim 1 to realize is characterized in that this method comprises:
S 1, this image acquisition unit are examined circuit board with respect to this and carry out step-type two-dimensional scan and move, all this is examined circuit board after each stepping and is carried out once photo taking, each time take pictures the image sum covering of obtaining this examined the full surface of circuit board;
S2, this graphics processing unit take pictures each time, and the image that obtains is seamless spliced is examined the complete image of circuit board for this;
S3, this graphics processing unit will splice this complete image of obtaining and this design standards of being examined circuit board to carry out image difference and analyzes, to detect the open defect that this is examined circuit board.
7. automatic optical detection method as claimed in claim 6 is characterized in that step S2 further comprises:
S21, this graphics processing unit are arranged according to this each time of being examined on the circuit board each time image that obtains of taking pictures by the actual positional relationship between the shot region;
S22, this graphics processing unit carry out edge transition and show integrating to adjacent image, to obtain the complete image that this is examined circuit board.
8. automatic optical detection method as claimed in claim 7; It is characterized in that; The direction of the continuous stepping of this image acquisition unit be directions X, with the perpendicular direction of this directions X be the Y direction; And this is examined adjacent by the edge overlaid of shot region on the circuit board, after taking pictures, all further comprises among the step S1 at every turn:
S11, rotate the image that this time taken pictures and obtained, each image with delegation can be along the linear proper alignment of directions X on the directions X so that in step S21, be positioned at;
S12, shrink the image that this time taken pictures and obtained along directions X and Y direction respectively, so that the overlapping edge between each adjacent image can be punctured into splicing line in step S21;
The row of each on the directions X image S13, rotates the image that this time taken pictures and obtained, so that can align along the Y direction each other in step S21.
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