CN102676045A - 耐电晕放电性绝缘清漆组合物和具有由其形成的绝缘层的绝缘电线 - Google Patents
耐电晕放电性绝缘清漆组合物和具有由其形成的绝缘层的绝缘电线 Download PDFInfo
- Publication number
- CN102676045A CN102676045A CN2012100684971A CN201210068497A CN102676045A CN 102676045 A CN102676045 A CN 102676045A CN 2012100684971 A CN2012100684971 A CN 2012100684971A CN 201210068497 A CN201210068497 A CN 201210068497A CN 102676045 A CN102676045 A CN 102676045A
- Authority
- CN
- China
- Prior art keywords
- insulating varnish
- nmp
- solvent
- corona
- compsn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
- C08L1/08—Cellulose derivatives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
- C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
- C08L39/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/45—Anti-settling agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
本发明涉及一种耐电晕放电性绝缘清漆组合物和具有由其形成的绝缘层的绝缘电线。具体而言,本发明公开了一种绝缘清漆组合物,所述组合物包含以下成分:有机硅溶胶,其在含有N-甲基-2-吡咯烷酮作为主要成分的溶剂中包含被分散剂包被的二氧化硅;和聚酰胺酰亚胺树脂,其分散在含有N-甲基-2-吡咯烷酮作为主要成分的溶剂中。由其中均匀分散有二氧化硅无机绝缘颗粒的所述绝缘清漆组合物形成的绝缘层具有优异的耐电晕放电性,由此防止绝缘体击穿。
Description
相关申请的交叉引用
本申请要求2011年3月17日递交的韩国专利申请第10-2011-0023934号的优先权,出于所有目的通过引用将其全部内容并入本文中。
技术领域
本发明的示例性实施方式涉及耐电晕放电性绝缘清漆组合物和具有由该组合物形成的绝缘层的绝缘电线。
背景技术
电晕放电是由绝缘电线或绝缘电缆的绝缘体中产生的小裂纹处集中的电场引起的放电。电晕放电可以使绝缘性质恶化,这可能导致绝缘体劣化并最终导致绝缘体击穿。特别是,在发动机等中所使用的线圈(或变压器)的情形中、更具体而言在具有通过使用绝缘清漆涂布导体并随后固化而形成的涂层的漆包电线的情形中,在电线(涂层)内部或之间可能会发生电晕放电,并且会因带电粒子碰撞所引起的涂层分解而产生热,由此导致绝缘体击穿。
近来,在具有节能用变频器(inverter)电机的系统中因电压浪涌所引起的过载而倾向于越来越多地发生电晕放电,导致绝缘体击穿。
为抑制电晕放电,已经提出了提供一种漆包电线的方案,所述漆包电线具有下述绝缘体,所述绝缘体通过将如二氧化硅或二氧化钛等无机绝缘颗粒分散在含有溶解于有机溶剂中的耐热性树脂的溶液中而形成。无机绝缘颗粒可以防止电晕放电的发生,并且可以改善导热性、降低热膨胀和提高漆包电线的强度。
在此情况中,用于将二氧化硅的无机绝缘颗粒分散在耐热性树脂中的已知方法包括将二氧化硅粉末直接添加至耐热性树脂中和混合硅溶胶与耐热性树脂等。硅溶胶比二氧化硅颗粒更容易与耐热性树脂混合,因而可以造就含有高度分散的二氧化硅的绝缘清漆。为此目的,硅溶胶必须具有与耐热性树脂的高混溶性。当将溶解在溶剂中的聚酰胺酰亚胺树脂用作耐热性树脂溶液时,该溶剂可以包括N-甲基-2-吡咯烷酮(NMP)、N,N-二甲基甲酰胺(DMF)和N,N-二甲基乙酰胺(DMAc)等。通常,使用的是过量NMP和少量DMF或烷基苯的混合溶剂。
当将二氧化硅粉末添加至溶解在NMP中的聚酰胺酰亚胺树脂中时,二氧化硅凝聚,从而生成具有低分散性二氧化硅的绝缘清漆。此外,当混合硅溶胶与溶解在NMP中的聚酰胺酰亚胺树脂时,二氧化硅凝聚,从而生成具有低分散性二氧化硅的绝缘清漆。在此情况中,硅溶胶通常指分散在醇类有机溶剂中的二氧化硅,并具有与溶解在NMP中的聚酰胺酰亚胺树脂的低混溶性。
当具有低分散性二氧化硅的绝缘清漆被用于形成绝缘层时,所获得的绝缘层具有较低的耐电晕放电性。在有限的条件下,二氧化硅在该绝缘清漆中的分散性可以暂时得到改善,但是绝缘清漆在长期存储、稳定性和再现性等方面可能存在问题。
作为解决方案,已经提出了下述方案:将通过使二氧化硅粉末分散在γ-丁内酯中产生的硅溶胶与溶解在γ-丁内酯中的聚酰胺酰亚胺树脂混合。在此情况中,溶解在γ-丁内酯中的聚酰胺酰亚胺树脂可以通过下述繁琐的操作获得,该操作包括通过使用乙醇从溶解在NMP中的聚酰胺酰亚胺树脂中提取聚酰胺酰亚胺树脂,并将提取的聚酰胺酰亚胺树脂溶解在γ-丁内酯中。此外,与NMP相比,γ-丁内酯对聚酰胺酰亚胺树脂具有更低的溶解性。
发明内容
本发明意在解决上述问题,因此,本发明的一个目的是提供在二氧化硅与聚酰胺酰亚胺树脂之间具有优异混溶性的绝缘清漆组合物,和使用该组合物的绝缘电线。
为实现本发明的目的,在本发明的一个方面中,提供了一种耐电晕放电性绝缘清漆组合物,所述组合物包含:有机硅溶胶,所述有机硅溶胶分散在含有N-甲基-2-吡咯烷酮(NMP)作为主要成分的溶剂中;和聚酰胺酰亚胺树脂,所述聚酰胺酰亚胺树脂溶解在含有NMP作为主要成分的溶剂中。
在本发明的另一个方面中,提供了由以下绝缘清漆组合物形成的绝缘层,所述绝缘清漆组合物包含:有机硅溶胶,所述有机硅溶胶分散在含有NMP作为主要成分的溶剂中并被分散剂包被;和聚酰胺酰亚胺树脂,所述聚酰胺酰亚胺树脂溶解在含有NMP作为主要成分的溶剂中。
在此情况中,含有NMP作为主要成分的溶剂可以包含80重量%~100重量%的NMP,并可以与如二甲苯和高沸点芳香族溶剂等其他溶剂混合。
有机硅溶胶可以是被分散剂包被的二氧化硅,并且所述分散剂可以是选自由聚乙烯基吡咯烷酮、聚乙烯亚胺、聚丙烯酸酯、羧甲基纤维素、聚丙烯酰胺、聚氧化乙烯和聚氧化丙烯组成的组中的至少一种,并可以具有5,000~1,000,000的分子量。
所述分散剂的含量可以为10重量份~1,000重量份/100重量份二氧化硅。
有益效果
由本发明的绝缘清漆组合物(含有均匀分散于其中的二氧化硅无机绝缘颗粒)形成的绝缘层具有优异的耐电晕放电性,由此防止绝缘体击穿。
附图说明
图1是由实施例1中获得的绝缘清漆组合物形成的绝缘层的透射电子显微镜(TEM)图像。
图2是由比较例1中获得的绝缘清漆组合物形成的绝缘层的TEM图像。
具体实施方式
下面详细描述本发明。
本发明的耐电晕放电性绝缘清漆组合物可以包含分散在含有N-甲基-2-吡咯烷酮(NMP)作为主要成分的溶剂中的有机硅溶胶和溶解在含有NMP作为主要成分的溶剂中的聚酰胺酰亚胺树脂。此处,含有NMP作为主要成分的溶剂可以只包含NMP,或者包含NMP与其他溶剂的组合。
如上所述,本发明的特征在于,本发明可以通过将聚酰胺酰亚胺树脂和有机硅溶胶分散在含有NMP的同一溶剂中而改善混溶性。
当含有NMP的溶剂为混合溶剂时,NMP的含量优选为混合溶剂的80重量%~100重量%,并且其余部分可以包括二甲苯和高沸点芳香族溶剂等。
有机硅溶胶可以指分散在NMP或混合溶剂中并被分散剂包被的胶态二氧化硅。在此情况中,二氧化硅可以具有1nm~100nm的平均粒径。
分散剂可以单独或组合包含下述物质:胺类聚合物,如聚乙烯基吡咯烷酮和聚乙烯亚胺;具有羧酸酯基的烃类聚合物,如聚丙烯酸酯和羧甲基纤维素;聚丙烯酰胺;聚氧化乙烯或聚氧化丙烯。在此情况中,分散剂可以优选具有5,000~1,000,000的分子量。此外,分散剂的含量可以优选为10重量份~1,000重量份/100重量份二氧化硅。当该含量低于10重量份时,将不足以抑制二氧化硅的凝聚。当该含量超过1,000重量份时,将难以提取被分散剂包被的二氧化硅。
此外,本发明提供了一种绝缘电线,所述绝缘电线具有通过使用上述耐电晕放电性绝缘清漆组合物涂布导体随后进行固化而形成的绝缘层。
实施例
下面,为更好地理解而将详细描述本发明的各优选实施例。然而,本发明的实施例可以进行多种方式的改进,并且不应将这些实施例解释为限制本发明的范围。提供本发明的实施例以使本领域普通技术人员可以更好地了解本发明。
<实施例1>:耐电晕放电性绝缘清漆组合物1
为制备本发明的耐电晕放电性绝缘清漆组合物,先制得有机硅溶胶;具体而言,使100g二氧化硅和10g分散剂在水中反应以使用该分散剂处理二氧化硅的表面,并提取被该分散剂包被的二氧化硅并将其溶解在200g NMP中,以获得有机硅溶胶。
将50g所获得的有机硅溶胶与100g(25%的不挥发性物质)溶解在NMP中的聚酰胺酰亚胺树脂混合,以产生本发明的绝缘清漆组合物。
<实施例2>:耐电晕放电性绝缘清漆组合物2
以与实施例1相同的方式制备耐电晕放电性绝缘清漆组合物,不同的是使用了利用100g二氧化硅和100g分散剂制得的有机硅溶胶。
<实施例3>:耐电晕放电性绝缘清漆组合物3
以与实施例1相同的方式制造耐电晕放电性绝缘清漆组合物,不同的是使用了利用100g二氧化硅和1,000g分散剂制得的有机硅溶胶。
<比较例1>
将100g二氧化硅溶解在乙醇中以制得硅溶胶。将50g所获得的硅溶胶与100g(25%的不挥发性物质)溶解在NMP中的聚酰胺酰亚胺树脂混合,以制备比较例1的绝缘清漆组合物。
<实验例1>:分散性的评价
为评价二氧化硅在本发明的耐电晕放电性绝缘清漆组合物中的分散性,将由实施例1中获得的绝缘清漆组合物形成的绝缘层的透射电子显微镜(TEM)图像显示在图1中。为进行比较,将由比较例1中获得的绝缘清漆组合物形成的绝缘层的TEM图像显示在图2中。
由图1和图2的结果发现,本发明实施例1的绝缘清漆组合物不具有二氧化硅凝聚,而比较例1的绝缘清漆组合物则具有显著的二氧化硅凝聚。也就是说,本发明由于二氧化硅优异的分散性而可以具有优异的耐电晕放电性。
虽然已在上文中描述了本发明,但应了解,上述详细描述和具体实施例在指出本发明的优选实施方式同时仅以示例的方式给出,因为通过该详细描述,本发明实质和范围内的各种变化和改进对本领域技术人员都将是显而易见的。
Claims (13)
1.一种耐电晕放电性绝缘清漆组合物,所述组合物包含:
有机硅溶胶,所述有机硅溶胶分散在含有N-甲基-2-吡咯烷酮(NMP)作为主要成分的溶剂中;和
聚酰胺酰亚胺树脂,所述聚酰胺酰亚胺树脂溶解在含有NMP作为主要成分的溶剂中。
2.如权利要求1所述的耐电晕放电性绝缘清漆组合物,
其中,所述含有NMP的溶剂包含80重量%~100重量%的NMP。
3.如权利要求2所述的耐电晕放电性绝缘清漆组合物,
其中,所述含有NMP的溶剂包含二甲苯或高沸点芳香族溶剂。
4.如权利要求2所述的耐电晕放电性绝缘清漆组合物,
其中,所述有机硅溶胶含有被分散剂包被的二氧化硅。
5.如权利要求4所述的耐电晕放电性绝缘清漆组合物,
其中,所述分散剂为选自由聚乙烯基吡咯烷酮、聚乙烯亚胺、聚丙烯酸酯、羧甲基纤维素、聚丙烯酰胺、聚氧化乙烯和聚氧化丙烯组成的组中的至少一种。
6.如权利要求5所述的耐电晕放电性绝缘清漆组合物,
其中,所述分散剂具有5,000~1,000,000的分子量。
7.如权利要求6所述的耐电晕放电性绝缘清漆组合物,
其中,所述分散剂的含量为10重量份~1,000重量份/100重量份所述二氧化硅。
8.一种绝缘电线,所述绝缘电线具有由绝缘清漆组合物形成的绝缘层,所述绝缘清漆组合物包含:
有机硅溶胶,所述有机硅溶胶在含有NMP作为主要成分的溶剂中包含被分散剂包被的二氧化硅;和
聚酰胺酰亚胺树脂,所述聚酰胺酰亚胺树脂溶解在含有NMP作为主要成分的溶剂中。
9.如权利要求8所述的绝缘电线,
其中,含有NMP的所述溶剂包含80重量%~100重量%的NMP。
10.如权利要求9所述的绝缘电线,
其中,含有NMP的所述溶剂包含二甲苯或高沸点芳香族溶剂。
11.如权利要求9所述的绝缘电线,
其中,所述分散剂为选自由聚乙烯基吡咯烷酮、聚乙烯亚胺、聚丙烯酸酯、羧甲基纤维素、聚丙烯酰胺、聚氧化乙烯和聚氧化丙烯组成的组中的至少一种。
12.如权利要求11所述的绝缘电线,
其中,所述分散剂具有5,000~1,000,000的分子量。
13.如权利要求12所述的绝缘电线,
其中,所述分散剂的含量为10重量份~1,000重量份/100重量份所述二氧化硅。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110023934A KR20120106076A (ko) | 2011-03-17 | 2011-03-17 | 내 코로나 방전성 절연 도료 조성물 및 이를 도포하여 형성된 절연 피막을 포함하는 절연 전선 |
KR10-2011-0023934 | 2011-03-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102676045A true CN102676045A (zh) | 2012-09-19 |
Family
ID=46808620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012100684971A Pending CN102676045A (zh) | 2011-03-17 | 2012-03-15 | 耐电晕放电性绝缘清漆组合物和具有由其形成的绝缘层的绝缘电线 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20120234575A1 (zh) |
KR (1) | KR20120106076A (zh) |
CN (1) | CN102676045A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105017959A (zh) * | 2015-08-11 | 2015-11-04 | 国网山东省电力公司临沂供电公司 | 电缆电线用绝缘漆 |
CN114746366A (zh) * | 2020-11-04 | 2022-07-12 | 日产化学株式会社 | 分散在含氮溶剂中的含铝硅溶胶、和树脂组合物 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102444418B1 (ko) * | 2015-09-25 | 2022-09-16 | 한국전기연구원 | 내마모성, 부착성, 내열성 및 내부식성을 향상시킨 절연코팅제 |
JP6661993B2 (ja) * | 2015-11-19 | 2020-03-11 | 日立金属株式会社 | 耐部分放電性塗料および絶縁電線 |
CN111883306B (zh) * | 2020-08-10 | 2022-06-07 | 成都航天凯特机电科技有限公司 | 一种高温漆包线及制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6372358B1 (en) * | 2000-08-23 | 2002-04-16 | Cts Corporation | Covercoat composition for electronic components |
US6441083B1 (en) * | 1999-06-11 | 2002-08-27 | Nippon Shokubai Co., Ltd. | Polyamidic acid-containing and fine particles-dispersed composition and production process therefor |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4495321A (en) * | 1983-12-19 | 1985-01-22 | Atlantic Richfield Company | Polyimide and/or polyamide-imide compositions in mixed solvents |
JP3496636B2 (ja) * | 2000-02-16 | 2004-02-16 | 日立電線株式会社 | 耐部分放電性エナメル線用塗料及び耐部分放電性エナメル線 |
-
2011
- 2011-03-17 KR KR1020110023934A patent/KR20120106076A/ko not_active Application Discontinuation
-
2012
- 2012-03-07 US US13/413,695 patent/US20120234575A1/en not_active Abandoned
- 2012-03-15 CN CN2012100684971A patent/CN102676045A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6441083B1 (en) * | 1999-06-11 | 2002-08-27 | Nippon Shokubai Co., Ltd. | Polyamidic acid-containing and fine particles-dispersed composition and production process therefor |
US6372358B1 (en) * | 2000-08-23 | 2002-04-16 | Cts Corporation | Covercoat composition for electronic components |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105017959A (zh) * | 2015-08-11 | 2015-11-04 | 国网山东省电力公司临沂供电公司 | 电缆电线用绝缘漆 |
CN114746366A (zh) * | 2020-11-04 | 2022-07-12 | 日产化学株式会社 | 分散在含氮溶剂中的含铝硅溶胶、和树脂组合物 |
CN114746366B (zh) * | 2020-11-04 | 2024-03-15 | 日产化学株式会社 | 分散在含氮溶剂中的含铝硅溶胶、和树脂组合物 |
Also Published As
Publication number | Publication date |
---|---|
KR20120106076A (ko) | 2012-09-26 |
US20120234575A1 (en) | 2012-09-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101525517B (zh) | 耐局部放电的漆包线用涂料和耐局部放电的漆包线 | |
JP4542463B2 (ja) | 耐部分放電性絶縁塗料、絶縁電線、及びそれらの製造方法 | |
CN102676045A (zh) | 耐电晕放电性绝缘清漆组合物和具有由其形成的绝缘层的绝缘电线 | |
CN102732146B (zh) | 绝缘清漆组合物以及使用该绝缘清漆组合物的绝缘线 | |
CN102206464B (zh) | 绝缘涂料以及使用该绝缘涂料的绝缘电线 | |
EP3321941B1 (en) | Electrical insulating resin composition for partial-discharge resistance | |
CN105542476A (zh) | 一种高电绝缘强度的导热硅橡胶及其制备方法 | |
CN105295651B (zh) | 一种高耐蚀性防腐涂料及其制备方法 | |
CN101017714B (zh) | 具有局部放电耐抗性的绝缘电线 | |
KR101391235B1 (ko) | 무기 나노필러, 이를 포함하는 에나멜 와이어, 및 상기 에나멜 와이어의 제조방법 | |
CN105601912A (zh) | 一种自修复超分子绝缘材料及其制备方法 | |
Kikuchi et al. | Development of polyamide‐imide/silica nanocomposite enameled wire | |
JP4131168B2 (ja) | 耐部分放電性絶縁塗料及び絶縁電線 | |
CN107312603A (zh) | 一种绝缘消弧纳米材料改性变压器油及其制备方法 | |
CN106188601A (zh) | 环氧树脂材料制品及其制备方法 | |
CN103910973A (zh) | 高电压机器用绝缘树脂材料和使用其的高电压机器 | |
JP6661993B2 (ja) | 耐部分放電性塗料および絶縁電線 | |
CN104592885B (zh) | 变压器用漆包线漆 | |
CN104616743B (zh) | 干式电力变压器用高疏水性漆包线 | |
JP2013151686A (ja) | 耐部分放電性エナメル線用塗料及び耐部分放電性エナメル線 | |
US8927630B2 (en) | Inorganic nanofiller, partial discharge resistant enameled wire including the same, and preparing method of the enameled wire | |
WO2020240823A1 (ja) | 電気絶縁樹脂組成物、及び電気絶縁体 | |
KR20120111256A (ko) | 표면처리된 실리카를 포함하는 내 코로나 방전성 절연 도료 조성물 및 이를 도포하여 형성된 절연 피막을 포함하는 절연 전선 | |
WO2008000104A1 (en) | Nano-composite dielectrics | |
CN110317503A (zh) | 一种导电涂料及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120919 |