CN102672340B - Gold wire ball ultrasonic welding process directly performed on aluminum product - Google Patents
Gold wire ball ultrasonic welding process directly performed on aluminum product Download PDFInfo
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- CN102672340B CN102672340B CN201210171049.4A CN201210171049A CN102672340B CN 102672340 B CN102672340 B CN 102672340B CN 201210171049 A CN201210171049 A CN 201210171049A CN 102672340 B CN102672340 B CN 102672340B
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Abstract
The invention discloses a gold wire ball ultrasonic welding process directly performed on an aluminum product. The cleaning treatment of the aluminum product, namely the chemical treatment of the aluminum product, is firstly performed as follows: alkaline corrosion treatment or decontamination treatment: soaking the aluminum product in an alkaline liquid and removing the greasy dirt and an attached oxidation layer from the surface so as to expose the pure aluminum product base material from an aluminum production welding surface; acid corrosion treatment or brightening treatment: washing the aluminum production after being subjected to the alkaline corrosion treatment, and soaking in an acidic liquid at the normal temperature, carrying out pitting corrosion treatment on the aluminum product welding surface to form a microscopic honeycomb shape, washing the aluminum product and soaking in acidic liquid for chemical polishing; and after chemical treatment, directly welding gold wires on the aluminum production welding surface by using an ultrasonic gold wire ball welding machine. The process provided by the invention realizes the direct welding on the aluminum product by the gold wire ball, so that the welding of an integrated circuit is free from the constraints of a silver film and a gold film, thereby greatly reducing the gold wire ball ultrasonic welding cost, and expanding the application field of the integrated circuit.
Description
(1) technical field:
The present invention relates to circuit welding procedure, be specially one and directly on aluminium, carry out spun gold ball ultrasonic welding process.
(2) background technology:
Ultrasonic gold wire bonder is according to ultrasonic wave tribology principle, by ultrasonic wave frictional vibration, under certain hour and pressure-acting, make spun gold and metal surface produce plastic deformation, reach reliable contact, two kinds of metals form metallic bond under atomic affinity effect, thereby realize the welding of spun gold lead-in wire.
Due to the property of spun gold welding, can only have silver and gold with the metal that spun gold firmly welds, and the welding of spun gold on other metals is all unreliable, metallic bond easily comes off, and causes circuit to break down and causes electrical equipment malfunctioning.
Ultrasonic wave spun gold solder technology is used extensively in the manufacture of high-power LED energy-saving lamp, and the support of high-power LED energy-saving lamp is the matrix of circuit welding.The conventional copper stent of support of early stage LED electricity-saving lamp, for obtaining good welding effect, adheres to silverskin or golden film in the solder side of copper stent conventionally; For reducing costs, mainly to be convenient to heat radiation, later stage LED energy-saving lamp support frame adopts aluminum frame, and as welding substrate, (conventional substrate is the aluminium of making by fine aluminium or alloy aluminum, aluminium base mechanical strength is high, radiating effect is good, moulding is easy), need on aluminum frame, adhere to silverskin equally or golden film welds; Along with the continuous variation of LED electricity-saving lamp function, aluminum frame is developed to labyrinth by single simple structure, tradition adheres to silverskin or golden membrane process is replaced by silver-plated film on aluminum frame substrate or golden membrane process gradually because not meeting industrialization production, due to the electroplating technology complexity of silverskin or golden film coating, silverskin or golden film coating cost are high, causing the price of the relevant electric equipment products of LED electricity-saving lamp can not to be in any more, is the obstacle that this electric appliances product can not be popularized civilian and further research and development.
(3) summary of the invention:
For simplifying welding procedure, reduce production costs, the present invention proposes one and directly on aluminium, carry out spun gold ball ultrasonic welding process.
The present invention directly carries out spun gold ball ultrasonic welding process on aluminium, and difference is to comprise two large work steps:
The first work step is the cleaning of aluminium, is the chemical treatment of aluminium.
What 1, first carry out is caustic corrosion, also claims decontamination processing, and method is that aluminium is soaked in 80 degree～100 degree akaline liquids, the oxide layer of removing surface and oil contaminant and adhering to, thus make aluminium solder side expose pure aluminium matrix.
What 2, then carry out is acid corrosion, also claims brightening processing, and method is after the aluminium washing after caustic corrosion, to be soaked in normal temperature acidic liquid, aluminium solder side is carried out to pit corrosion, to form the envelope nest shape of microcosmic.
3, by the aluminium washing after acid corrosion.
The second work step is ultrasonic bonding, directly welds spun gold ball with ultrasonic gold wire bonder on aluminium solder side.Described aluminium chemical treatment final purpose is the envelope nest shape that forms microcosmic at aluminium solder side, improves the coefficient of friction of ultrasonic bonding, thereby realizes the direct welding of spun gold on aluminium.
Described aluminium chemical treatment also comprises chemical polishing, and method is to spend in acidic liquids being soaked in 90 degree～110 after the aluminium washing of brightening processing before welding, further improves brightening effect, meets welding aluminium appearance requirement.
The material of described aluminium is pure aluminum or aluminum alloy, and through above-mentioned processing, pure aluminum or aluminum alloy aluminium all can be used as spun gold ball ultrasonic bonding matrix.
Advantage of the present invention:
The present invention directly carries out spun gold ball ultrasonic welding process and has realized the directly welding on aluminium of spun gold ball on aluminium, having solved people wants to solve and long-term indeterminable problem, make the circuit welding of high-power LED energy-saving lamp break away from the constraint of silverskin and golden film, greatly reduce spun gold ball ultrasonic bonding cost, expanded the application of high-power LED energy-saving lamp.
(4) detailed description of the invention:
Below technical scheme of the present invention is described further:
The present invention directly carries out cleaning and two work steps of the welding of spun gold ball on aluminium solder side that spun gold ball ultrasonic welding process is divided into aluminium on aluminium.First carrying out the cleaning of aluminium, be the chemical treatment of aluminium, is three steps.
1, first carry out caustic corrosion, also claim decontamination processing, method is that aluminium is soaked in 80 degree～100 degree akaline liquids, the oxide layer of removing surface and oil contaminant and adhering to, thereby make aluminium solder side expose pure aluminium matrix, can grasp soak time by aluminium variable color degree.
Described akaline liquid can adopt conventional NaOH (NaOH) solution.
2, carry out acid corrosion again, also claim brightening processing, method is after the aluminium washing after caustic corrosion, to be soaked in normal temperature acidic liquid, aluminium solder side is carried out to pit corrosion, to form the envelope nest shape of microcosmic, can determine soak time by the shinny degree of aluminium.
3, finally carry out chemical polishing, method is after the aluminium washing of brightening processing, to be soaked in 90 degree～110 degree acidic liquids, after brightness is unchanged, to complete immersion.
Then be ultrasonic bonding, directly weld spun gold ball with ultrasonic gold wire bonder on aluminium solder side, weld interval and pressure arrange routinely.
Described aluminium can be selected fine aluminium material or alloy aluminium, for keeping certain mechanical strength, conventionally adopts alloy aluminium as welding matrix.
In the applicant unit, some conventional different trade mark alloy aluminiums are carried out to soldering test, all obtained good welding result, proved that the technology of the present invention is practical.
The adopted alloy aluminium trade mark of doing experiment is: 2319,3003,5005,5052,5154,5657,6005,6061,6101,6463.
Claims (3)
1. directly on aluminium, carry out spun gold ball ultrasonic welding process, it is characterized in that comprising two large work steps:
1., the cleaning of aluminium, be the chemical treatment of aluminium;
A, first carry out caustic corrosion, also claim decontamination processing, method is that aluminium is soaked in 80 degree～100 degree akaline liquids, the oxide layer of removing surface and oil contaminant and adhering to, thus make aluminium solder side expose pure aluminum substrate;
B and then carry out acid corrosion, also claims brightening processing, and method is after the aluminium washing after caustic corrosion, to be soaked in normal temperature acidic liquid, aluminium solder side is carried out to pit corrosion, to form the envelope nest shape of microcosmic;
C, by the aluminium washing after acid corrosion;
2., ultrasonic bonding, on aluminium solder side, directly weld spun gold ball with ultrasonic gold wire bonder.
2. the spun gold ball ultrasonic welding process that directly carries out on aluminium according to claim 1, it is characterized in that: the chemical treatment of described aluminium also comprises chemical polishing, method is will after the aluminium washing of brightening processing, to be soaked in 90 degree～110 degree acidic liquids before welding.
3. the spun gold ball ultrasonic welding process that directly carries out on aluminium according to claim 1 and 2, is characterized in that: the material of described aluminium is pure aluminum or aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210171049.4A CN102672340B (en) | 2012-05-29 | 2012-05-29 | Gold wire ball ultrasonic welding process directly performed on aluminum product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210171049.4A CN102672340B (en) | 2012-05-29 | 2012-05-29 | Gold wire ball ultrasonic welding process directly performed on aluminum product |
Publications (2)
| Publication Number | Publication Date |
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| CN102672340A CN102672340A (en) | 2012-09-19 |
| CN102672340B true CN102672340B (en) | 2014-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210171049.4A Expired - Fee Related CN102672340B (en) | 2012-05-29 | 2012-05-29 | Gold wire ball ultrasonic welding process directly performed on aluminum product |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111434803B (en) * | 2019-01-15 | 2022-08-26 | 广东长盈精密技术有限公司 | Surface treatment method of aluminum alloy material and application thereof |
| CN111434804B (en) * | 2019-01-15 | 2022-07-19 | 广东长盈精密技术有限公司 | Surface treatment method of aluminum alloy material and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4375008A (en) * | 1979-05-04 | 1983-02-22 | Siemens Aktiengesellschaft | Method for encapsulating components with cases and an encapsulation provided by the method |
| CN1147150A (en) * | 1995-07-14 | 1997-04-09 | 松下电器产业株式会社 | Electrode structure, forming method and mounting body for semiconductor device, and semiconductor device |
| CN101279401B (en) * | 2008-05-28 | 2010-08-04 | 北京有色金属研究总院 | Pressure welding method of large-area target material |
| CN101967641A (en) * | 2010-09-17 | 2011-02-09 | 江门市安诺特炊具制造有限公司 | Honeycomb hole surface treatment technology before spraying aluminum cooking utensils |
-
2012
- 2012-05-29 CN CN201210171049.4A patent/CN102672340B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4375008A (en) * | 1979-05-04 | 1983-02-22 | Siemens Aktiengesellschaft | Method for encapsulating components with cases and an encapsulation provided by the method |
| CN1147150A (en) * | 1995-07-14 | 1997-04-09 | 松下电器产业株式会社 | Electrode structure, forming method and mounting body for semiconductor device, and semiconductor device |
| CN101279401B (en) * | 2008-05-28 | 2010-08-04 | 北京有色金属研究总院 | Pressure welding method of large-area target material |
| CN101967641A (en) * | 2010-09-17 | 2011-02-09 | 江门市安诺特炊具制造有限公司 | Honeycomb hole surface treatment technology before spraying aluminum cooking utensils |
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| CN102672340A (en) | 2012-09-19 |
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