CN102666097B - Decoration film for insert molding, insert molded article, method for producing decoration film for insert molding - Google Patents
Decoration film for insert molding, insert molded article, method for producing decoration film for insert molding Download PDFInfo
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- CN102666097B CN102666097B CN201080058931.7A CN201080058931A CN102666097B CN 102666097 B CN102666097 B CN 102666097B CN 201080058931 A CN201080058931 A CN 201080058931A CN 102666097 B CN102666097 B CN 102666097B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0015—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
Abstract
Provided are an insert molded article having no crack or peeling generated on its exterior, and a decoration film for insert molding for such an article, as well as a method for producing the film so that the color and the brilliance of the film can be widely varied depending on the viewing angle. The decoration film for insert molding comprises a transparent resin film provided on one side thereof with a decoration layer, and is formed in a manner so that the decoration layer is located on the main body side of the resin molded article to be obtained by the insert molding, wherein the decoration layer is configured by laminating dielectric layers to have a thickness of 50 nm to 800 nm, and the decoration layer has a compressive stress of 250 MPa to 350 MPa.
Description
Technical field
The present invention relates to the insertion shaping decorating film of the external packing for coated with resin formed products, insert the manufacture method of formed products and insertion shaping decorating film.
Background technology
In order to the decoration of the outer surface of the resin forming product of mobile phone etc., carry out the setting of the film that color and taste etc. changes according to viewing angle.Have, have the method (referenced patent document 1 and patent document 2) of adding pearl pigment in film.
But, in patent document 1 and patent document 2 the interpolation pearl pigment of institute's motion method in, the addition of pearl pigment is restricted, and therefore, the scope of the color of reflectivity etc. is restricted, and therefore produces and cannot become the such problem of the decoration look of expectation.
In order to solve this problem, having in patent document 3 and patent document 4, by evaporation, the film be made up of dielectric material being carried out the stacked method adjusting optical characteristics.
But, the film that the method for institute's motion in by patent document 3 or patent document 4 is obtained actual insert be shaped in use time, there is film and occur to peel off such problem.
Prior art document
Patent document
Patent document 1: JP No. 3862814 publication
Patent document 2: JP 2007-16056 publication
Patent document 3: JP 2002-350610 publication
Patent document 4: JP 2009-108220 publication
Summary of the invention
The problem that invention will solve
Therefore, the object of the present invention is to provide do not crack in external packing, the insertion formed products peeled off and the insertion shaping decorating film for it, provide simultaneously for this film can make color and taste, brightness according to viewing angle manufacture method variable in a wide range.
For solving the means of problem
In order to solve above-mentioned problem, the present inventor etc. concentrate on studies, and found that following solution.
Namely, the insertion shaping decorating film of the present application, as as described in the first aspect of the application, for possessing decorative layer in the one side side of transparent resin film, being shaped and the mode of resin forming product main body side that obtains and the insertion shaping decorating film that is formed by inserting so that described decorative layer is placed on, it is characterized in that, above-mentioned decorative layer is formed to make all thickness reach the mode layered dielectric layer of 50nm ~ 800nm, makes the compression stress of above-mentioned decorative layer be 250MPa ~ 350MPa.
Invent described in a second aspect of the present invention, it is characterized in that, in the insertion shaping decorating film described in a first aspect of the present invention, above-mentioned transparent resin film is made up of the resin of the polyethylene-based or polyolefin of thickness 50 μm ~ 200 μm.
Invention described in a third aspect of the present invention, is characterized in that, in the insertion shaping decorating film described in of the present invention first or second aspect, possesses the hard conating of thickness 0.5 μm ~ 10 μm in the face contrary with above-mentioned decorative layer of above-mentioned transparent resin film.
Invention described in a fourth aspect of the present invention, it is characterized in that, in the insertion shaping decorating film according to any one of first ~ third aspect of the present invention, above-mentioned decorative layer is the layer having been undertaken alternately laminated by the silicon dioxide layer of thickness 5nm ~ 200nm and niobium pentoxide layer.
In addition, insertion formed products of the present invention, as described in a fifth aspect of the present invention, is characterized in that, possesses the insertion shaping decorating film according to any one of first ~ fourth aspect of the present invention.
In addition, the manufacture method of insertion shaping decorating film of the present invention, as as described in a sixth aspect of the present invention, for the one side side at transparent resin film possesses decorative layer, the manufacture method of the insertion shaping decorating film be formed in the mode of the main body side above-mentioned decorative layer being placed on the resin forming product obtained by inserting shaping, it is characterized in that, make into film pressure and be that 0.5Pa ~ 1.0Pa sputters metallic atom and film forming is after the metal atomic layer of thickness 5nm ~ 200nm on above-mentioned transparent resin film, carry out being oxidized and forming dielectric layer, the film forming repeating above-mentioned dielectric layer forms above-mentioned decorative layer with stacked above-mentioned dielectric layer, the compression stress of above-mentioned decorative layer is made to be 250MPa ~ 350MPa.
Invention described in a seventh aspect of the present invention, it is characterized in that, in the manufacture method of the insertion shaping decorating film of a sixth aspect of the present invention, above-mentioned transparent resin film is made up of the resin of the polyethylene-based or polyolefin of thickness 50 μm ~ 200 μm, be provided with the hard conating of thickness 0.5 μm ~ 10 μm in the face contrary with above-mentioned decorative layer, the thickness of above-mentioned decorative layer is 50nm ~ 800nm.
Invention described in a eighth aspect of the present invention, it is characterized in that, in the manufacture method of the insertion shaping decorating film described in the of the present invention 6th or the 7th, the silicon dioxide layer of the thickness 5nm ~ 200nm as above-mentioned dielectric layer and niobium pentoxide layer carried out alternately laminated and forms above-mentioned decorative layer, temperature when each dielectric layer is sputtered is less than 80 DEG C, making the rate of film build of silicon dioxide layer be
and make the rate of film build of niobium pentoxide layer be 1.0 ~
The effect of invention
According to insertion shaping decorating film of the present invention, can prevent from mobile phone stripping, crackle appear in the outer surface of the resin forming product being representative.In addition, stripping when inserting shaping, crackle can also be prevented.And then manufacturing method according to the invention, can obtain color and taste, brightness range broadly can being formed desired insertion shaping decorating film.
Accompanying drawing explanation
Fig. 1 is the device profile for illustration of manufacture method of the present invention.
Fig. 2 is the profile of the insertion shaping film of embodiment 1.
Fig. 3 (a) is the chart of the dependence of angle of the film representing embodiment 1, and (b) is the chromatic diagram of same embodiment.
Fig. 4 (a) is the chart of the dependence of angle of the film representing embodiment 2, and (b) is the chromatic diagram of same embodiment.
Fig. 5 is the one-tenth film pressure-compression stress of the film representing embodiment 1 and has carried out the chart of evaluation of injection moulding with film.
Detailed description of the invention
Insertion shaping decorating film of the present invention, uses in the insertion of known (in such as patent document 1 grade disclosed) is shaped, forming shaped product when ester moulding and being integrated.
This insertion shaping decorating film, possesses and folds the different multilayer dielectric layer of refractive index on one side side (main body side contrary from the face side of the formed products) upper strata of transparent resin film and the decorative layer formed.Each dielectric layer is formed by the sputtering of metallic atom and the homoatomic oxidation that has been sputtered, and the thickness of decorative layer entirety becomes 50nm ~ 800nm and compression stress becomes 250MPa ~ 350MPa.By the thickness of this decorative layer entirety and the combination of compression stress, can prevent insert be shaped time, formed products thereafter use time decorative layer in crackle, stripping.This is owing to finding: be peeling lower than closing force during 250MPa is not enough lower than 50nm or compression stress at thickness, because thickness becomes excessive more than stress when 350MPa, shaping more than 800nm or compression stress and cracks.
Above-mentioned transparent resin film, for transparent and even translucent, as long as insert be shaped time not easily Yin Re and flexible to be just not particularly limited, such as, can by the Polyester of polyvinyl chloride, amorphism or low-crystalline or polypropylene-based, polybutylene terephthalate (PBT) system, do not stretch or low stretching ethylene-vinyl alcohol system etc. resin form, wherein, from the viewpoint of optical characteristics, be preferably formed the resin of ethene system or polyolefin.In addition, its thickness is also not particularly limited, is preferably formed to 20 μm ~ about 500 μm.This is because thickness is lower than workability difficulties such as operation tasks when 20 μm, during more than 500 μm, rigidity becoming too high, can not follow machining shape when being shaped, therefore cracking.And then, in order to improve the adaptation as the decorative layer inserting formed products, even if be particularly preferably the scope of 50 μm ~ 200 μm in the above range.
It should be noted that, the hard conating of preferred thickness setting 0.5 μm ~ 10 μm on the face contrary with decorative layer of transparent resin film.This is because the surface of inserting formed products can be protected.In addition, because the thickness of hard conating becomes insufficient lower than the protection on the surface of transparent resin film when 0.5 μm, more than 10 μm time fully cannot obtain by the solidification of heating or radioactive ray realize, become and easily cause adhesion.In addition, the material of hard conating, such as, can use the material of silane system, radiation-curable etc., but the material of preferred radiation-curable, wherein preferably ultra-violet solidified material.
Dielectric layer, can from such as wanting to select the metal oxide of the angle of reflection, colourity etc. that obtain expectation.Such as when alternately laminated low-index layer and high refractive index layer, the silicon compound of refractive index less than 1.5 can be used as SiO
2deng as low-index layer, use the niobium oxide of refractive index more than 2.0 as Nb
2o
5, titanium compound is as TiO
2deng as high refractive index layer.In these metal oxides, preferably select SiO
2and Nb
2o
5.This is because it is the material that crystallization conversion temperature is high, optical Response is low.
For the thickness of each dielectric layer, as long as the scope that the thickness of dielectric layer entirety becomes the 50nm ~ 800nm of above-mentioned explanation is just not particularly limited, but the thickness of each dielectric layer is preferably 5nm ~ 200nm.Because thickness controls difficulty lower than the optics of dielectric layer each during 5nm, uprise more than industrial production cost during 200nm.
Above-mentioned insertion shaping decorating film, be configured in shaping dies when inserting and being shaped, inject in mould acrylic resin, acrylonitrile butadiene styrene resin, polystyrene resin, ethylene vinyl acetate (エ チ レ Application acidifying PVC ニ Le) resin, polycarbonate resin, nylon resin etc. shaping resin forming shaped product form and be integrated.It should be noted that, insert shaping decorating film self and can be processed into three-dimensional in advance, also can be deformed in shaping dies by injection pressure.
Then, the manufacture method for insertion shaping decorating film of the present invention is described with reference to Fig. 1.
For the film formation device showing section in FIG, central authorities in cylindric vacuum chamber 1 are configured for the cylindric rotary body 3 of supporting substrate 2, and the inner circumferential along chamber 1 configures the 1st sputter area 4, ion gun 5, the 2nd sputter area 6 and the 3rd sputter area 7 successively.In vacuum chamber 1, although do not illustrate, be connected with vavuum pump, can be exhausted in same chamber 1.
1st ~ 3rd sputter area 4,6,7, being formed by sputtered film material on base material 2, in each region 4,6,7, being provided with the gas introduction port (not shown) for importing sputter gas near base material 2.In addition, in each region 4,6,7, respectively to be provided with the mode of cylindric rotary body 3 subtend the negative electrode 11 ~ 13 having installed target 8 ~ 10.These negative electrodes 11 ~ 13, in order to drop into electric power to target 8 ~ 10, although do not illustrate, are connected to direct current or AC power.
In addition, in base material 2 side in each region 4,6,7, be respectively equipped with gate (シ ャ ッ タ ー) 14 ~ 16, optionally open gate 14 ~ 16 during film forming in each region 4,6,7.
Ion gun 5, for the metallic atom oxidation by film forming in each region 4,6,7, be provided with oxygen introducing port to import oxygen therein, general formula is provided with magnetic circuits.In order to produce microwave excited plasma from this magnetic circuits, importing window via microwave and connecting the waveguide pipe of the outside of vacuum chamber 1 and the inside microwave antenna of vacuum chamber 1.
According to above-mentioned formation, 1st metal is carried out film forming with the thickness about monoatomic layer by the 1st sputter area 4 by base material 2, rotational circle tubular rotary body 3, undertaken being oxidized by ion gun 5 and form the 1st metal oxide film (the 1st dielectric layer), further rotate cylindric rotary body 3, by the 2nd sputter area 6, the 2nd metal is carried out film forming with the thickness about monoatomic layer, rotational circle tubular rotary body 3, undertaken being oxidized by ion gun 5 and form the 2nd metal oxide film (the 2nd dielectric layer), alternately repeat above operation, the decorating film of the dielectric layer that base material 2 formed stacked multilayer.Need making of explanation, when sputtering 3 kinds of metallic atoms, can carry out utilizing the sputtering of the 3rd film-forming region 7 and utilizing the oxidation of ion gun 5 in the same manner as the 1st film-forming region 4, the 2nd film-forming region 6.It should be noted that, about so-called monoatomic layer, refer to the scope for thickness 5nm ~ 200nm on film thickness.
According to said method, color and taste, the brightness of expectation can be given to decorating film.
In addition, in the above-mentioned methods, during the sputtering of metal material and oxidation time one-tenth film pressure be 0.5Pa ~ 1.0Pa.Because becoming film pressure lower than the compression stress of decorative layer during 0.5Pa more than 350MPa, crack when inserting and being shaped, peel off; Become less than 250MPa in one-tenth film pressure more than the compression stress of decorative layer during 1.0Pa, closing force is not enough, is peeling.
In the above-mentioned methods, when using silicon atom and niobium atom as metallic atom, temperature when preferably making these sputter is less than 80 DEG C, and (it should be noted that, lower limit is the temperature producing plasma in oxidation afterwards.)。Because can film forming be the film of the thickness of uniform monatomic left and right at high speed.It should be noted that, the rate of film build in this situation can at random adjust, such as, if Nb
2o
5, be then
at SiO
2when, be then
deng.
Embodiment
Then, the insertion shaping decorating film for embodiments of the invention is described.
It should be noted that, in the examples below, be mainly not particularly described condition, then under following condition, carry out film forming.
(1) base material
Be used in thickness 100 μm, width 500mm, length 1000mm the one side of transparent resin film of polyethylene be provided with the base material of the hard conating of thickness 1 μm.
(2) membrance casting condition of dielectric layer
In the present embodiment, as dielectric layer, film forming is SiO
2and Nb
2o
5.
A) SiO
2membrance casting condition
Target: Si
Power supply: DC power supply
Oxidation source: ion gun
Film-forming temperature: room temperature
Negative electrode drops into electric power: 6w/cm
2
Ar flow: 500sccm
O
2flow: 100sccm
b)Nb
2O
5
Target: Si
Power supply: DC power supply
Oxidation source: ion gun
Film-forming temperature: room temperature
Negative electrode drops into electric power: 5w/cm
2
Ar flow: 500sccm
O
2flow: 300sccm
(embodiment 1)
Using the device illustrated in above-mentioned embodiment, is 8.0 × 10 by decompression in the vacuum chamber 1 of same device
-4pa, general formula are importing Ar to the first sputter area 4, in this state, drop into electric power to negative electrode 11, as shown in Figure 2, the one side repeated at base material 2 is the operation of Nb film by spatter film forming and cylindric rotary body 3 is rotated and the operation that be oxidized by Nb film by ion gun 5, the Nb of formation thickness 87.0nm
2o
5film (dielectric layer) 17.Then, 8.0 × 10 are adjusted to by vacuum chamber 1
-4pa, general formula import Ar to sputter area 6, drop into electric power to negative electrode 12, are the Si film of thickness 100.0nm by spatter film forming.Then, cylindric rotary body 3 is selected, by ion gun 5, Nb film is oxidized, form SiO
2film (dielectric layer) 18.And, thereon with Nb
2o
5the film forming of film 17 similarly film forming is the Nb of thickness 87.0nm
2o
5film (dielectric layer) 19.
Then, at Nb
2o
5film 19 is coated with the ink (セ イ コ ー ア De バ Application ス Inc. WO7 (RX002)) of carbamate system 2 solution curing type by serigraphy with thickness 3 μm, is formed as decorating film 20 and insert shaping film.
(embodiment 2)
From substrate side successively alternately laminated 7 layers of Nb similarly to Example 1
2o
5film and SiO
2film is decorating film finally by the ink film forming identical with embodiment 1.
Each thickness, forms Nb successively from substrate side
2o
5film (17.00nm), SiO
2film (164.00nm), Nb
2o
5film (40.00nm), SiO
2film (76.50nm), Nb
2o
5film (100.00nm), SiO
2film (53.50nm), Nb
2o
5film (49.00nm).
For the insertion shaping film obtained in embodiment 1 and 2, be shown in Fig. 3 and Fig. 4 by relative to the reflection characteristic of incidence angle of light and chromatic diagram that incide film.From these: by adjusting stacked number and thickness according to viewing angle for color and taste, brightness, arbitrary decorating film can be formed.
Then, the one-tenth film pressure of each dielectric film of embodiment 1 is changed, as shown in the transverse axis of Fig. 5, the compression stress making decorating film is the insertion shaping film of the total 11 of 0.4Pa ~ 2.0Pa scope.
With injection moulding device, be 50 degree and drying condition 80 degree by mold temperature set, together with the insertion shaping film and the PMMA resin that obtain (Mitsubishi レ イ ヨ ンShe Inc. ACRYPETVRL40-001), manufacture injection-molded article.
Its result, as shown in Figure 5, is in the insertion shaping film of the scope of 0.5Pa ~ 1.0Pa in one-tenth film pressure, does not have crackle, stripping, beyond this scope, confirm crackle, stripping.
The explanation of symbol
1 cylindric vacuum chamber
2 base materials
3 cylindric rotary bodies
4,6,7 the 1st ~ 3rd sputter area
5 ion guns
8 ~ 10 targets
11 ~ 13 negative electrodes
14 ~ 16 gates
17 ~ 19 dielectric layers
20 ink layeies
21 hard conatings
Claims (10)
1. one kind is inserted shaping decorating film, it is for possessing decorative layer, being shaped and the mode of the main body side of resin forming product that obtains and the insertion shaping decorating film that is formed by inserting to be placed on by described decorative layer in the one side side of transparent resin film, it is characterized in that, described decorative layer is formed to make all thickness reach the mode layered dielectric layer of 50nm ~ 800nm, makes the compression stress of described decorative layer be 250MPa ~ 350MPa.
2. insertion shaping decorating film according to claim 1, is characterized in that, described transparent resin film is made up of the resin of the polyolefin of thickness 50 μm ~ 200 μm.
3. insertion shaping decorating film according to claim 1, is characterized in that, described transparent resin film is made up of the polyethylene-based resin of thickness 50 μm ~ 200 μm.
4. insertion shaping decorating film according to claim 1, is characterized in that, possesses the hard conating of thickness 0.5 μm ~ 10 μm in the face contrary with described decorative layer of described transparent resin film.
5. insertion shaping decorating film according to claim 1, is characterized in that, described decorative layer is the layer having been undertaken alternately laminated by the silicon dioxide layer of thickness 5nm ~ 200nm and niobium pentoxide layer.
6. insert a formed products, it is characterized in that possessing insertion shaping decorating film according to claim 1.
7. one kind is inserted the manufacture method of shaping decorating film, it is for possess decorative layer in the one side side of transparent resin film, the manufacture method of the insertion shaping decorating film be formed in the mode of the main body side described decorative layer being placed on the resin forming product obtained by inserting shaping, it is characterized in that, make into film pressure and be that 0.5Pa ~ 1.0Pa sputters metallic atom and film forming is after the metal atomic layer of thickness 5nm ~ 200nm on described transparent resin film, carry out being oxidized and forming dielectric layer, the film forming repeating described dielectric layer forms described decorative layer with stacked described dielectric layer, the compression stress of described decorative layer is made to be 250MPa ~ 350MPa.
8. the manufacture method of insertion shaping decorating film according to claim 7, it is characterized in that, described transparent resin film is made up of the resin of the polyolefin of thickness 50 μm ~ 200 μm, the face contrary with described decorative layer is provided with the hard conating of thickness 0.5 μm ~ 10 μm, and the thickness of described decorative layer is 50nm ~ 800nm.
9. the manufacture method of insertion shaping decorating film according to claim 7, it is characterized in that, described transparent resin film is made up of the polyethylene-based resin of thickness 50 μm ~ 200 μm, the face contrary with described decorative layer is provided with the hard conating of thickness 0.5 μm ~ 10 μm, and the thickness of described decorative layer is 50nm ~ 800nm.
10. the manufacture method of insertion shaping decorating film according to claim 7, it is characterized in that, the silicon dioxide layer of the thickness 5nm ~ 200nm as described dielectric layer and niobium pentoxide layer carried out alternately laminated and forms described decorative layer, temperature when each dielectric layer is sputtered is less than 80 DEG C, making the rate of film build of silicon dioxide layer be
and make the rate of film build of niobium pentoxide layer be
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2009295924 | 2009-12-25 | ||
JP2009-295924 | 2009-12-25 | ||
PCT/JP2010/007475 WO2011077738A1 (en) | 2009-12-25 | 2010-12-24 | Decoration film for insert molding, insert molded article, method for producing decoration film for insert molding |
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CN102666097A CN102666097A (en) | 2012-09-12 |
CN102666097B true CN102666097B (en) | 2015-03-04 |
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JP (1) | JP5497790B2 (en) |
CN (1) | CN102666097B (en) |
TW (1) | TWI454361B (en) |
WO (1) | WO2011077738A1 (en) |
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JPWO2017090498A1 (en) * | 2015-11-24 | 2018-10-04 | コニカミノルタ株式会社 | Method for producing gas barrier film |
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- 2010-12-24 CN CN201080058931.7A patent/CN102666097B/en active Active
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EP0995571A1 (en) * | 1998-02-27 | 2000-04-26 | Nissha Printing Co., Ltd. | Sheet for in-mold decorating and in-mold decorated article |
CN101236263A (en) * | 2007-02-01 | 2008-08-06 | 甘国工 | High light transmittance ratio glass display protection panel and LCD device using same |
WO2009008278A1 (en) * | 2007-07-11 | 2009-01-15 | Kimoto Co., Ltd. | Resin molded article using film for insert molding |
JP2009075324A (en) * | 2007-09-20 | 2009-04-09 | Toppan Printing Co Ltd | Optical thin film laminated body |
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CN102666097A (en) | 2012-09-12 |
TW201139107A (en) | 2011-11-16 |
WO2011077738A1 (en) | 2011-06-30 |
JP5497790B2 (en) | 2014-05-21 |
TWI454361B (en) | 2014-10-01 |
JPWO2011077738A1 (en) | 2013-05-02 |
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