CN102664230A - LED (light emitting diode) lighting device and manufacturing method thereof - Google Patents
LED (light emitting diode) lighting device and manufacturing method thereof Download PDFInfo
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- CN102664230A CN102664230A CN2012101706342A CN201210170634A CN102664230A CN 102664230 A CN102664230 A CN 102664230A CN 2012101706342 A CN2012101706342 A CN 2012101706342A CN 201210170634 A CN201210170634 A CN 201210170634A CN 102664230 A CN102664230 A CN 102664230A
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- light
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- passing board
- led chip
- emitting device
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Abstract
The invention relates to the application field of LEDs (light emitting diodes), in particular to an LED lighting device and a manufacturing method thereof. The LED lighting device comprises a light-transmitting plate, a reflecting coating, LED chip strips and a phosphor layer. The LED chip strips are connected in parallel by conductive wires by the aid of a plurality of LED chips and surround lateral edges of the light-transmitting plate, the lengths of the LED chip strips are equal to the perimeter of the edge of the light-transmitting plate, the widths of the LED chip strips are smaller than or equal to the thickness of the light-transmitting plate, the reflecting coating is arranged on the back surface of the light-transmitting plate, the phosphor layer is arranged on the front side of the light-transmitting plate, and the phosphor layer is further provided with a protection layer. By the LED lighting device, processing difficulty when the LED chips are mounted can be reduced, so that manufacturing cost of the LED lighting device is reduced.
Description
Technical field
The present invention relates to light-emitting diode (LED) applied technical field, particularly LED light-emitting device and preparation method thereof.
Background technology
The light-emitting device of application of LEDs of the prior art is as shown in Figure 4; Be to constitute mostly by led chip 5 and light-passing board 1; Wherein a plurality of led chips 5 are made into printed circuit board (PCB) (pcb board) 11 through terahertz wave quasi-optics; Dot matrix is arranged on the back side (primary flat of seeing with the human eye direction of visual lines is the front, and positive corresponding another side is the back side, and the light-passing board edge is the side) of light-passing board 1.
But when through printed circuit board (PCB) led chip being arranged on the back side of light-passing board, because of needs use terahertz wave quasi-optics manufacturing PCB plate, processing request is than higher, and difficulty is bigger.
Summary of the invention
LED light-emitting device provided by the invention, the difficulty of processing in the time of can reducing led chip and be provided with.
Technical scheme of the present invention is achieved in that the LED light-emitting device comprises: light-passing board, reflectance coating, led chip band and phosphor powder layer;
Said led chip band is formed in parallel with lead by a plurality of led chips, around the side at the edge of said light-passing board;
Said reflectance coating is arranged on the back side of said light-passing board, and said phosphor powder layer is arranged on the front of said light-passing board.
Further, in the aforesaid LED light-emitting device, in the said phosphor powder layer main component of fluorescent material be tricalcium orthophosphate ((Ca, Zn)
3(PO
4)
2: T
l), its emission wavelength is 280～350nm, peak value is 310nm.
Further, in the aforesaid LED light-emitting device, the luminous optical wavelength of said led chip is 280nm-320nm.
Further, in the aforesaid LED light-emitting device, said fluorescent material is contained in said light-passing board inside.
Further, in the aforesaid LED light-emitting device, also comprise protective layer, this protective layer is arranged on the said phosphor powder layer.
Further, the manufacturing approach of LED light-emitting device comprises:
Reflectance coating is arranged on the back side of light-passing board, phosphor powder layer is arranged on the front of said light-passing board;
Through lead a plurality of led chip parallel connections are constituted the led chip band;
With the side of said led chip band around the edge of said light-passing board.
Further, the manufacturing approach of LED light-emitting device comprises: said phosphor powder layer is arranged on the front of said light-passing board, comprises: with main component be tricalcium orthophosphate ((Ca, Zn)
3(PO
4)
2: T
l), emission wavelength is 280～350nm, peak value is the front that the phosphor powder layer of 310nm is arranged on said light-passing board.
Further, the manufacturing approach of LED light-emitting device comprises: constitute the led chip of said led chip band, luminous optical wavelength is 280nm-320nm.
Further, the manufacturing approach of LED light-emitting device comprises: at the said fluorescent material of the inner interpolation of said light-passing board.
Further, the manufacturing approach of LED light-emitting device comprises: said phosphor powder layer is provided with protective layer.
Through LED light-emitting device provided by the invention and preparation method thereof, can produce following good effect:
1. LED light-emitting device provided by the invention, the difficulty of processing in the time of can reducing the led chip installation.
The form of using the circuit board printing technology to arrange with dot matrix in the prior art is arranged on the back side of said light-passing board with led chip, but adopts the circuit board printing technology, and processing request is than higher, and difficulty is bigger.Technical scheme provided by the invention is: a plurality of led chips with lead and be unified into the led chip band, around the side at said light-passing board edge, need not used the circuit board printing technology when just led chip is arranged on the light-passing board, reduced difficulty of processing.
2. when not using the circuit board printing technology, the side that said led chip band is arranged on the printing opacity version also has the illumination effect same with prior art, and luminosity has better raising.Because the back side of printing opacity version is provided with reflectance coating; The front of light-passing board is provided with phosphor powder layer; This reflectance coating can be with concentrating reflection to give the front of printing opacity version at the ultraviolet light of the inner irregular scattering of light-passing board; This ultraviolet light is set at the fluorescent material absorption on the said front and sends visible light, can improve the luminosity of this light-emitting device.
3. LED light-emitting device provided by the present invention includes phosphor powder layer, the main component of fluorescent material be tricalcium orthophosphate ((Ca, Zn)
3(PO
4)
2: T
l), this fluorescent material is a kind of efficient powder of making healthy line lamp, is a kind of environment-friendly type fluorescent material, and its emission wavelength is 280～350nm, and peak value is 310nm.This fluorescent material discharges visible light when absorbing wavelength is the ultraviolet light of 280nm-320nm; The luminous optical wavelength of said led chip band is 280nm-320nm; This wave-length coverage is within ultraviolet wave-length coverage, and just the luminous energy that sends of led chip band is well absorbed by said phosphor powder layer.Said fluorescent powder grain can be with the light interception that total reflection takes place in light-passing board on the one hand; And then the generation refraction appears the surface of said light-passing board; Phosphor powder layer can the absorbing ultraviolet light source on the other hand, changes into visible light afterwards and sends, and then strengthened the luminosity of light-passing board.
4. when making light-passing board, can said fluorescent material be joined in the light-passing board, make the light-passing board that has fluorescent material; Perhaps said phosphor powder layer is arranged on the surface of said light-passing board, and when said phosphor powder layer is set, can said phosphor powder layer be arranged to different personalized patterns according to different individual demands.Being provided with like this improved the flexibility ratio that product uses, and manufacture difficulty is low, also can not raise the cost.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; Below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art; Obviously, the accompanying drawing in below describing only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other embodiment and accompanying drawing thereof according to these accompanying drawing illustrated embodiments.
Fig. 1 is the sketch map of a kind of embodiment of LED light-emitting device provided by the invention.
Fig. 2 is the structural representation of led chip band of a kind of embodiment of LED light-emitting device provided by the invention.
Fig. 3 is the longitudinal sectional drawing of a kind of embodiment of LED light-emitting device provided by the invention.
Fig. 4 is the sketch map of prior art.
Description of drawings: the 1-light-passing board, the 2-reflectance coating, the 3-phosphor powder layer, the 4-LED chip belt, the 5-LED chip, the 6-lead, the 7-protective layer, 8-is positive, the 9-back side, 10-side, 11-PCB plate.
Embodiment
Below will combine accompanying drawing that the technical scheme of various embodiments of the present invention is carried out clear, complete description, obviously, described embodiment only is a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are resulting all other embodiment under the prerequisite of not making creative work, the scope that all belongs to the present invention and protected.
A specific embodiment of LED light-emitting device provided by the invention is following:
As depicted in figs. 1 and 2, the LED light-emitting device comprises: light-passing board 1 and led chip band 4 (among Fig. 1 shown in the dotted line), and said led chip band 4 is formed in parallel with lead 6 by a plurality of led chips 5, around the side 10 at said light-passing board 1 edge;
The length of said led chip band 4 can equal the rim circumference of said light-passing board 1, also can only center on the part at the edge of light-passing board 1, and the width of said led chip band 4 can be less than or equal to the thickness of said light-passing board 1;
Wherein, said light-passing board 1 inside that can make visible light can pass said light-passing board 1 from the front 8 of said light-passing board 1 arrives the said back side 9.
As shown in Figure 3, the LED light-emitting device comprises: reflectance coating 2, light-passing board 1, phosphor powder layer 3 and protective layer 7.
Said reflectance coating 2 is arranged on the back side 9 of said light-passing board 1, and said phosphor powder layer 3 is arranged on the front 8 of said light-passing board 1, and said protective layer 7 is arranged on the said phosphor powder layer 3.
The main component of said phosphor powder layer 3 be tricalcium orthophosphate ((Ca, Zn)
3(PO
4)
2: T
l), its emission wavelength is 280～350nm, peak value is 310nm.This fluorescent material is a kind of efficient powder of making healthy line lamp, is environment-friendly type fluorescent material, and its emission wavelength is 280nm～350nm, and peak value is 310nm, and said led chip 5 luminous optical wavelengths are 280nm-320nm; The light that sends in the said wave-length coverage is ultraviolet light, and this ultraviolet light can be absorbed by said fluorescent material, and said fluorescent material changes into visible light and discharges after absorbing wavelength is the ultraviolet light of 280nm-320nm, and one side reaches luminous effect, environmental protection on the other hand.
Said reflectance coating 2 is arranged on the back side 9 of said light-passing board 1; The light that emits from said led chip 5 is when irregular generation scattering; Said reflectance coating 2 can be concentrated the light that projection is come and reflect the front of giving with its corresponding light-passing board 18, and said positive 8 are provided with phosphor powder layer 3, said phosphor powder layer 3 absorbing ultraviolet light; Launch visible light afterwards, can improve the luminosity of this light-emitting device.
Be provided with on the said phosphor powder layer 3 and also be provided with protective layer 7; When said phosphor powder layer 3 is arranged on said light-passing board 1 surperficial; In order to guarantee that phosphor powder layer 3 can not break away from light-passing board 1; Therefore this protective layer 7 is set, this protective layer 7 can be film class material or resinous material, for seeing through the light-transmission type material of visible light.
As shown in Figure 4; The form of using the circuit board printing technology to arrange with dot matrix in the prior art is arranged on led chip 5 on the pcb board 11, more said pcb board 11 is installed in the back side 9 of light-passing board 1, when still adopting the circuit board printing; Processing request is than higher, and difficulty is bigger.When there being a led chip 5 to break down can not be luminous the time on the light-passing board 1, a bad point can obviously appear in the surface of light-passing board 1, and this bad point can influence the attractive in appearance of light-emitting device on the one hand, can influence the luminosity of light-emitting device on the other hand.
Technical scheme provided by the present invention is: with a plurality of said leads 6 of said led chip 5 usefulness and be unified into led chip band 4; This led chip band 4 is centered around the side 10 at the edge of said light-passing board 1; Need not use the circuit board printing technology to handle, reduce difficulty of processing.And, when a led chip 5 breaks down bad point of generation, can significantly not influence the attractive in appearance and luminosity of light-emitting device like this because led chip 5 is provided with the side 10 of light-passing board 1.
And, when making said light-passing board 1, can fluorescent material be arranged on the inside of said light-passing board 1, perhaps said phosphor powder layer 3 is set directly at the front 8 of said light-passing board 1, fixing with said protective layer 7 more afterwards.
When making light-passing board, can said fluorescent material be joined in the light-passing board 1, make the light-passing board that has fluorescent material; Perhaps said phosphor powder layer 3 is arranged on the front 8 of said light-passing board 1; And, said phosphor powder layer 3 can said phosphor powder layer 3 be arranged to different personalized patterns when being set according to different individual demands; So not only improved the flexibility ratio that product uses; And manufacture difficulty is low, also can not raise the cost.
The preparation method's of a LED light-emitting device provided by the invention embodiment:
The manufacturing approach of LED light-emitting device comprises:
Through lead 6 a plurality of led chip 5 parallel connections are constituted led chip band 4; With the side 10 of said led chip band 4 around said light-passing board 1 edge.
The length of the led chip band 4 that is made up of a plurality of led chip 5 parallel connections equals the girth at the edge of said light-passing board 1; The width of said led chip band 4 is less than or equal to the thickness of said light-passing board 1, and the led chip 5 luminous optical wavelengths that constitute said led chip band 4 are 280nm-320nm.
With said phosphor powder layer 3 is arranged on the front 8 of said light-passing board 1, comprises: with main component be tricalcium orthophosphate ((Ca, Zn)
3(PO
4)
2: T
l), emission wavelength is 280～350nm, peak value is the front 8 that the phosphor powder layer 3 of 310nm is arranged on said light-passing board 1, on said phosphor powder layer 3, protective layer 7 is set.
LED light-emitting device provided by the invention, the difficulty of processing in the time of can reducing led chip and be provided with.
Various embodiment provided by the invention can make up with any-mode as required each other, the technical scheme that obtains through this combination, also within the scope of the invention.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, belong within the scope of claim of the present invention and equivalent technologies thereof if of the present invention these are revised with modification, then the present invention also comprises these changes and modification interior.
Claims (10)
1. the LED light-emitting device is characterized in that, comprising: light-passing board, reflectance coating, led chip band and phosphor powder layer;
Said led chip band is formed in parallel with lead by a plurality of led chips, around the side at the edge of said light-passing board;
Said reflectance coating is arranged on the back side of said light-passing board, and said phosphor powder layer is arranged on the front of said light-passing board.
2. LED light-emitting device according to claim 1 is characterized in that, in the said phosphor powder layer main component of fluorescent material be tricalcium orthophosphate ((Ca, Zn)
3(PO
4)
2: T
l), its emission wavelength is 280～350nm, peak value is 310nm.
3. LED light-emitting device according to claim 1 is characterized in that, the luminous optical wavelength of said led chip is 280nm-320nm.
4. LED light-emitting device according to claim 1 is characterized in that, said fluorescent material is contained in said light-passing board inside.
5. LED light-emitting device according to claim 1 is characterized in that, also comprises protective layer, and this protective layer is arranged on the said phosphor powder layer.
6. the manufacturing approach of a LED light-emitting device is characterized in that, this method comprises:
Reflectance coating is arranged on the back side of light-passing board, phosphor powder layer is arranged on the front of said light-passing board;
Through lead a plurality of led chip parallel connections are constituted the led chip band;
With the side of said led chip band around the edge of said light-passing board.
7. the manufacture method of a kind of LED light-emitting device according to claim 6 is characterized in that, said phosphor powder layer is arranged on the front of said light-passing board, comprising: with main component be tricalcium orthophosphate ((Ca, Zn)
3(PO
4)
2: T
l), emission wavelength is 280～350nm, peak value is the front that the phosphor powder layer of 310nm is arranged on said light-passing board.
8. the manufacturing approach of a kind of LED light-emitting device according to claim 6 is characterized in that, constitutes the led chip of said led chip band, and luminous optical wavelength is 280nm-320nm.
9. according to the manufacturing approach of claim 6,7 or 8 described a kind of LED light-emitting devices, it is characterized in that, at the said fluorescent material of the inner interpolation of said light-passing board.
10. according to the manufacture method of claim 6,7 or 8 described a kind of LED light-emitting devices, it is characterized in that this method comprises: said phosphor powder layer is provided with protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101706342A CN102664230A (en) | 2012-05-29 | 2012-05-29 | LED (light emitting diode) lighting device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101706342A CN102664230A (en) | 2012-05-29 | 2012-05-29 | LED (light emitting diode) lighting device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102664230A true CN102664230A (en) | 2012-09-12 |
Family
ID=46773683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101706342A Pending CN102664230A (en) | 2012-05-29 | 2012-05-29 | LED (light emitting diode) lighting device and manufacturing method thereof |
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| CN1502137A (en) * | 2000-12-28 | 2004-06-02 | ������������ʽ���� | Light emitting device |
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| US20060145172A1 (en) * | 2004-12-30 | 2006-07-06 | Jung-Chieh Su | Light emitting diode with a quasi-omnidirectional reflector |
| EP0922305B1 (en) * | 1997-05-27 | 2007-08-08 | Koninklijke Philips Electronics N.V. | Uv/blue led-phosphor device with efficient conversion of uv/blue light to visible light |
| CN101034728A (en) * | 2006-03-10 | 2007-09-12 | 东芝照明技术株式会社 | Illumination device |
| CN101806401A (en) * | 2009-02-17 | 2010-08-18 | 富士迈半导体精密工业（上海）有限公司 | Light emitting diode light source |
| CN202816940U (en) * | 2012-05-29 | 2013-03-20 | 邓崛 | LED light-emitting device |
-
2012
- 2012-05-29 CN CN2012101706342A patent/CN102664230A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0922305B1 (en) * | 1997-05-27 | 2007-08-08 | Koninklijke Philips Electronics N.V. | Uv/blue led-phosphor device with efficient conversion of uv/blue light to visible light |
| CN1502137A (en) * | 2000-12-28 | 2004-06-02 | ������������ʽ���� | Light emitting device |
| CN1787932A (en) * | 2003-05-12 | 2006-06-14 | 3M创新有限公司 | Illuminated license plate for vehicles and vehicle provided with the same |
| US20060145172A1 (en) * | 2004-12-30 | 2006-07-06 | Jung-Chieh Su | Light emitting diode with a quasi-omnidirectional reflector |
| CN101034728A (en) * | 2006-03-10 | 2007-09-12 | 东芝照明技术株式会社 | Illumination device |
| CN101806401A (en) * | 2009-02-17 | 2010-08-18 | 富士迈半导体精密工业（上海）有限公司 | Light emitting diode light source |
| CN202816940U (en) * | 2012-05-29 | 2013-03-20 | 邓崛 | LED light-emitting device |
Non-Patent Citations (1)
| Title |
|---|
| 中国大百科全书总编辑委员会: "《中国大百科全书 轻工》", 30 September 2002, 中国大百科全书出版社, article "中国大百科全书 轻工", pages: 560 * |
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Application publication date: 20120912 |