CN202816940U - LED light-emitting device - Google Patents
LED light-emitting device Download PDFInfo
- Publication number
- CN202816940U CN202816940U CN 201220246007 CN201220246007U CN202816940U CN 202816940 U CN202816940 U CN 202816940U CN 201220246007 CN201220246007 CN 201220246007 CN 201220246007 U CN201220246007 U CN 201220246007U CN 202816940 U CN202816940 U CN 202816940U
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- China
- Prior art keywords
- light
- led
- emitting device
- led chip
- passing board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to the technical field of LEDs, particularly to an LED light-emitting device. The device comprises a light-penetrable plate, a reflective coating, LED chip belts and a fluorescent powder layer; the LED chip belts are formed by a plurality of LED chips parallelly connected through leads and surround side faces of edges of the light-penetrable plate; and the lengths of the LED chip belt equal to the perimeters of the edges of the light-penetrable plate, the widths of the LED chip belts are smaller than or equal to the thickness of the light-penetrable plate, the reflective coating is arranged on a back side of the light-penetrable plate, the fluorescent powder layer is arranged on a front side of the light-penetrable plate, and a protective layer is arranged on the fluorescent powder layer. The LED light-emitting device provided by the utility model can lower processing difficulty in mounting of an LED chip and reduce manufacture cost of a product.
Description
Technical field
The utility model relates to light-emitting diode (LED) applied technical field, particularly LED light-emitting device.
Background technology
The light-emitting device of application LED of the prior art as shown in Figure 4, to be consisted of by led chip 5 and light-passing board 1 mostly, wherein a plurality of led chips 5 are made into printed circuit board (PCB) (pcb board) 11 by terahertz wave quasi-optics, dot matrix is arranged on the back side of light-passing board 1, and (primary flat of seeing take the human eye direction of visual lines is as positive, positive corresponding another side is the back side, and the light-passing board edge is the side).
But when by printed circuit board (PCB) led chip being arranged on the back side of light-passing board, make pcb board because needs use terahertz wave quasi-optics, processing request is higher, and difficulty is larger.
The utility model content
The LED light-emitting device that the utility model provides, the difficulty of processing in the time of can reducing led chip and arrange.
The technical solution of the utility model is achieved in that the LED light-emitting device comprises: light-passing board, reflectance coating, led chip band and phosphor powder layer;
Described led chip band is formed in parallel with wire by a plurality of led chips, around the side at the edge of described light-passing board;
Described reflectance coating is arranged on the back side of described light-passing board, and described phosphor powder layer is arranged on the front of described light-passing board.
Further, in the aforesaid LED light-emitting device, the main component of fluorescent material is tricalcium orthophosphate ((Ca, Zn) in the described phosphor powder layer
3(PO
4)
2: T
1), its emission wavelength is 280～350nm, peak value is 310nm.
Further, in the aforesaid LED light-emitting device, the luminous optical wavelength of described led chip is 280nm-320nm.
Further, in the aforesaid LED light-emitting device, described fluorescent material is contained in described light-passing board inside.
Further, in the aforesaid LED light-emitting device, also comprise protective layer, this protective layer is arranged on the described phosphor powder layer.
LED light-emitting device that provides by the utility model and preparation method thereof can produce following good effect:
1. the LED light-emitting device that provides of the utility model, the difficulty of processing in the time of can reducing led chip and install.
The form of using the circuit board printing technology to arrange with dot matrix in the prior art is arranged on the back side of described light-passing board with led chip, but adopts the circuit board printing technology, and processing request is higher, and difficulty is larger.The technical scheme that the utility model provides is: with a plurality of led chips with wire and be unified into the led chip band, side around described light-passing board edge, do not need when namely led chip is arranged on the light-passing board to use the circuit board printing technology, reduced difficulty of processing.
2. when not using the circuit board printing technology, the side that described led chip band is arranged on the printing opacity version also has the illumination effect same with prior art, and luminosity has better raising.Because the back side of printing opacity version is provided with reflectance coating, the front of light-passing board is provided with phosphor powder layer, this reflectance coating can will concentrate reflection to the front of printing opacity version at the ultraviolet light of the inner irregular scattering of light-passing board, this ultraviolet light is arranged on the fluorescent material absorption on the described front and sends visible light, can improve the luminosity of this light-emitting device.
3. LED light-emitting device provided by the utility model includes phosphor powder layer, and the main component of fluorescent material is tricalcium orthophosphate ((Ca, Zn)
3(PO
4)
2: T
l), this fluorescent material is a kind of efficient powder of making healthy line lamp, is a kind of environment-friendly type fluorescent material, and its emission wavelength is 280～350nm, and peak value is 310nm.This fluorescent material discharges visible light when absorbing wavelength is the ultraviolet light of 280nm-320nm, the luminous optical wavelength of described led chip band is 280nm-320nm, this wave-length coverage is within ultraviolet wave-length coverage, and namely the luminous energy that sends of led chip band is well absorbed by described phosphor powder layer.The light interception of total reflection can will occur in described fluorescent powder grain in light-passing board on the one hand, and then the generation refraction appears the surface of described light-passing board, phosphor powder layer can the absorbing ultraviolet light source on the other hand, changes into afterwards visible light and sends, and then strengthened the luminosity of light-passing board.
4. when making light-passing board, described fluorescent material can be joined in the light-passing board, make the light-passing board with fluorescent material; Perhaps described phosphor powder layer is arranged on the surface of described light-passing board, and when described phosphor powder layer is set, can described phosphor powder layer be arranged to different personalized patterns according to different individual demands.Arranging like this improved the flexibility ratio that product uses, and manufacture difficulty is low, also can not raise the cost.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in below describing only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawing illustrated embodiments other embodiment and accompanying drawing thereof.
The schematic diagram of a kind of embodiment of the LED light-emitting device that Fig. 1 provides for the utility model.
The structural representation of the led chip band of a kind of embodiment of the LED light-emitting device that Fig. 2 provides for the utility model.
The longitudinal sectional drawing of a kind of embodiment of the LED light-emitting device that Fig. 3 provides for the utility model.
Fig. 4 is the schematic diagram of prior art.
Description of drawings: the 1-light-passing board, the 2-reflectance coating, the 3-phosphor powder layer, the 4-LED chip belt, the 5-LED chip, the 6-wire, the 7-protective layer, 8-is positive, the 9-back side, 10-side, 11-PCB plate.
Embodiment
Below with reference to accompanying drawing the technical scheme of each embodiment of the utility model is carried out clear, complete description, obviously, described embodiment only is a part of embodiment of the present utility model, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are resulting all other embodiment under the prerequisite of not making creative work, all belong to the scope that the utility model is protected.
A specific embodiment of the LED light-emitting device that the utility model provides is as follows:
As depicted in figs. 1 and 2, the LED light-emitting device comprises: among light-passing board 1 and led chip band 4(Fig. 1 shown in the dotted line), described led chip band 4 is formed in parallel with wire 6 by a plurality of led chips 5, around the side 10 at described light-passing board 1 edge;
The length of described led chip band 4 can equal the rim circumference of described light-passing board 1, also can only center on the part at the edge of light-passing board 1, and the width of described led chip band 4 can be less than or equal to the thickness of described light-passing board 1;
Wherein, described light-passing board 1 inside that can make visible light can pass from the front 8 of described light-passing board 1 described light-passing board 1 arrives the described back side 9.
As shown in Figure 3, the LED light-emitting device comprises: reflectance coating 2, light-passing board 1, phosphor powder layer 3 and protective layer 7.
Described reflectance coating 2 is arranged on the back side 9 of described light-passing board 1, and described phosphor powder layer 3 is arranged on the front 8 of described light-passing board 1, and described protective layer 7 is arranged on the described phosphor powder layer 3.
The main component of described phosphor powder layer 3 is tricalcium orthophosphate ((Ca, Zn)
3(PO
4)
2: T
l), its emission wavelength is 280～350nm, peak value is 310nm.This fluorescent material is a kind of efficient powder of making healthy line lamp, is environment-friendly type fluorescent material, and its emission wavelength is 280nm～350nm, and peak value is 310nm, and described led chip 5 luminous optical wavelengths are 280nm-320nm; The light that sends in the described wave-length coverage is ultraviolet light, and this ultraviolet light can be absorbed by described fluorescent material, and described fluorescent material changes into visible light and discharges after absorbing wavelength is the ultraviolet light of 280nm-320nm, reaches on the one hand luminous effect, on the other hand environmental protection.
Described reflectance coating 2 is arranged on the back side 9 of described light-passing board 1, the light that emits from described led chip 5 is when irregular generation scattering, the light that described reflectance coating 2 can be come projection concentrates reflection to the front 8 of the light-passing board 1 corresponding with it, described positive 8 are provided with phosphor powder layer 3, described phosphor powder layer 3 absorbing ultraviolet light, launch afterwards visible light, can improve the luminosity of this light-emitting device.
Be provided with on the described phosphor powder layer 3 and also be provided with protective layer 7; when described phosphor powder layer 3 is arranged on described light-passing board 1 surperficial; in order to guarantee that phosphor powder layer 3 can not break away from light-passing board 1; therefore this protective layer 7 is set; this protective layer 7 can be film class material or resinous material, for seeing through the light-transmission type material of visible light.
As shown in Figure 4, the form of using the circuit board printing technology to arrange with dot matrix in the prior art is arranged on led chip 5 on the pcb board 11, more described pcb board 11 is installed in the back side 9 of light-passing board 1, but when adopting the circuit board printing, processing request is higher, and difficulty is larger.When there being a led chip 5 to break down can not be luminous the time on the light-passing board 1, the surface of light-passing board 1 can a bad point obviously occur, and this bad point can affect the attractive in appearance of light-emitting device on the one hand, can affect on the other hand the luminosity of light-emitting device.
The various embodiment that the utility model provides can be as required in any way mutually combination, the technical scheme that obtains by this combination is also in scope of the present utility model.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also comprises these changes and modification interior.
Claims (4)
1. the LED light-emitting device is characterized in that, comprising: light-passing board, reflectance coating, led chip band and phosphor powder layer;
Described led chip band is formed in parallel with wire by a plurality of led chips, around the side at the edge of described light-passing board;
Described reflectance coating is arranged on the back side of described light-passing board, and described phosphor powder layer is arranged on the front of described light-passing board.
2. LED light-emitting device according to claim 1 is characterized in that, the main component of fluorescent material is tricalcium orthophosphate ((Ca, Zn) in the described phosphor powder layer
3(PO
4)
2: T
l), its emission wavelength is 280～350nm, peak value is 310nm.
3. LED light-emitting device according to claim 1 is characterized in that, the luminous optical wavelength of described led chip is 280nm-320nm.
4. LED light-emitting device according to claim 1 is characterized in that, also comprises protective layer, and this protective layer is arranged on the described phosphor powder layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220246007 CN202816940U (en) | 2012-05-29 | 2012-05-29 | LED light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220246007 CN202816940U (en) | 2012-05-29 | 2012-05-29 | LED light-emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202816940U true CN202816940U (en) | 2013-03-20 |
Family
ID=47875778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220246007 Expired - Fee Related CN202816940U (en) | 2012-05-29 | 2012-05-29 | LED light-emitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202816940U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102664230A (en) * | 2012-05-29 | 2012-09-12 | 邓崛 | LED (light emitting diode) lighting device and manufacturing method thereof |
-
2012
- 2012-05-29 CN CN 201220246007 patent/CN202816940U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102664230A (en) * | 2012-05-29 | 2012-09-12 | 邓崛 | LED (light emitting diode) lighting device and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20140529 |