CN102640171A - Method for forming user identification module card - Google Patents
Method for forming user identification module card Download PDFInfo
- Publication number
- CN102640171A CN102640171A CN2010800539996A CN201080053999A CN102640171A CN 102640171 A CN102640171 A CN 102640171A CN 2010800539996 A CN2010800539996 A CN 2010800539996A CN 201080053999 A CN201080053999 A CN 201080053999A CN 102640171 A CN102640171 A CN 102640171A
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- card
- plug
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000004831 Hot glue Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims description 2
- 238000003801 milling Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000012545 processing Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 2
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a method for forming a plug-in Subscriber Identity Module (SIM) card (126), which comprises the following steps: step (a): providing a substrate card (100, 200, 300, 400, 500, 600) having dimensions that comply with the requirements of ISO 7816-1 and ISO 7816-2 and having a plurality of stepped grooves (120) on a major surface (122) of the substrate card (100, 200, 300, 400, 500, 600); step (b): embedding a SIM Integrated Circuit (IC) module (125) in each stepped recess (120); step (c): cutting a plurality of plug-in SIM cards (126) from a substrate card (100, 200, 300, 400, 500, 600); and a step (d): releasably engaging the plug-in SIM card (126) obtained in step (c) with a carrier card (136, 140) having dimensions in accordance with ISO 7816-1 and ISO 7816-2, but having a thickness of at least 0.76 mm.
Description
Technical field
The present invention relates to the formation method of subscriber identification module (SIM) card, particularly, be fit to formation method with the SIM of mobile telecommunication device (for example mobile phone) use.
Background technology
SIM is removable smart card; It has two kinds of standard sizes; The size that first kind of standard size is standard credit card (promptly; 85.60mm x 53.98mm x 0.76mm), however the more popular form (being called " plug-in SIM ") of smart card is of a size of 25mm (length) x15mm (wide) x0.76mm (thick).The key of SIM safety storing identification mobile phone service-user.SIM allows the user through SIM being removed from first mobile phone and this SIM is inserted second mobile phone and easily changes mobile phone, thereby has exempted the needs that activate second mobile phone on the network.
Summary of the invention
In context of the present invention, term " SIM " also comprises USIM (USIM) card and removable user identification module (R-UIM) card.
Such plug-in SIM is installed to before the mobile phone; Each plug-in SIM is connected with substrate card (substrate card); The international standard that the size conforms of substrate card is relevant; Given standard among the international standard ISO/IEC 7816 for example, the content of international standard ISO/IEC 7816 is herein incorporated by reference.
When needs use plug-in SIM, plug-in SIM is fractureed from separately substrate card, so remaining substrate card will be dropped.Because the size of SIM has detailed explanation with physical characteristics in relevant international standard, the machine of making and install SIM also is highly standardized, does not therefore almost have the space that changes.But, can find out that from above description abandoning separation plug-in SIM substrate card afterwards is a kind of wasting of resources.Therefore, the purpose of this invention is to provide a kind of formation method of a plurality of plug-in SIMs,, can alleviate above-mentioned shortcoming through this method; Perhaps be at least the public a kind of useful selection is provided.
According to the present invention; The formation method of a kind of plug-in type subscriber identification module (SIM) card is provided; This method comprises: step (a): substrate card is provided; The size conforms ISO 7816-1 of this substrate card and the requirement of ISO7816-2, and this substrate card has a plurality of step groove on the first type surface that is positioned at said substrate card; Step (b): in each said step groove, embed SIM integrated circuit (IC) module; Step (c): cut out a plurality of plug-in SIMs from said substrate card; And step (d): in said a plurality of plug-in SIMs that will in said step (c), obtain one with carry card and engage releasedly; Size conforms ISO 7816-1 that block this year and the requirement of ISO 7816-2, but the thickness that block this year is at least 0.76mm.
Description of drawings
Embodiment of the present invention will only be described with reference to accompanying drawing through the mode of example now, wherein:
Fig. 1 is the vertical view of the card that has 8 plug-in SIMs of first kind of embodiment according to the present invention;
Fig. 2 is the vertical view of the card that has 7 plug-in SIMs of second kind of embodiment according to the present invention;
Fig. 3 is the vertical view of the card that has 6 plug-in SIMs of the third embodiment according to the present invention;
Fig. 4 is the vertical view of the card that has 5 plug-in SIMs of the 4th kind of embodiment according to the present invention;
Fig. 5 is the vertical view of the card that has 4 plug-in SIMs of the 5th kind of embodiment according to the present invention;
Fig. 6 is the vertical view of the card that has 3 plug-in SIMs of the 6th kind of embodiment according to the present invention;
Fig. 7 is the stereographic map that is used to form the substrate card of card according to of the present invention;
Fig. 8 is the vertical view of substrate card that is formed with Fig. 7 of a plurality of step groove;
Fig. 9 is the stereographic map of the substrate card of Fig. 8;
Figure 10 is that SIM integrated circuit (IC) module is embedded into the view on the substrate card of Fig. 8;
Figure 11 is the stereographic map that embeds the substrate card of Fig. 8 that 8 SIM IC modules are arranged;
Figure 12 is the view that cuts out plug-in SIM from the card patrix of Figure 11;
Figure 13 is a view of in the pocket of one section polybag, placing the plug-in SIM that cuts out;
Figure 14 is through using the view of the step of carrying personalized (personalization) plug-in SIM of card;
Figure 15 is the stereographic map of a kind of selectable year card;
Figure 16 is the exploded perspective view that carries card of Figure 15;
Figure 17 A is the vertical view of going up the card layer that carries card of Figure 15;
Figure 17 B is the vertical view of the middle card layer that carries card of Figure 15;
Figure 17 C is the vertical view of the following card layer that carries card of Figure 15; And
Figure 18 is that carrying of Figure 15 blocked the stereographic map that engages releasedly with plug-in SIM.
Embodiment
Shown in Figure 1 is the plastic based integrated circuit board 100 that has 8 plug-in SIMs 102, and wherein all surface in contacts of plug-in SIM 102 are all in the same side of substrate card 100.The size conforms ISO/IEC 7816-1 of substrate card 100 and the requirement of ISO/IEC 7816-2, and observe GSM 11.11.
Shown in Figure 2 is the substrate card 200 that has 7 plug-in SIMs 202.Shown in Figure 3 is the substrate card 300 that has 6 plug-in SIMs 302.Shown in Figure 4 is the substrate card 400 that has 5 plug-in SIMs 402.Shown in Figure 5 is the substrate card 500 that has 4 plug-in SIMs 502.Shown in Figure 6 is the substrate card 600 that has 3 plug-in SIMs 602.Material, structure and the size of substrate card 200,300,400,500,600 is identical with substrate card 100, and unique difference is the quantity of the plug-in SIM 102,202,302,402,502,602 that had of each substrate card 100,200,300,400,500,600.
Will have hereinafter according to the formation method of a plurality of plug-in SIMs of the present invention in the example content of substrate card 100 of 8 plug-in SIMs 102 and describe.Can be understood that easily that identical method can be applied to have the substrate card of the plug-in SIM of varying number.
As shown in Figure 7, a kind of plastic based integrated circuit board 100 is provided, the size conforms ISO/IEC 7816-1 of this plastic based integrated circuit board 100 and the requirement of ISO/IEC 7816-2, and observe GSM 11.11.On a first type surface 122 of substrate card 100, be formed with 8 foursquare step groove 120 of cardinal principle through milling or injection moulding.Mid point on a long limit 104 is formed with v-depression 108, and also is formed with v-depression 110 at the mid point of a minor face 106.These v-depressions 108,110 are provided, to guarantee substrate card 100 suitable position, arrangement and direction in card input magazine (card magazine) (loading bin) (not shown) in subsequently operation and step.
On substrate card 100, form after the step groove 120, shown in figure 10, SIM integrated circuit (IC) module 125 for example is embedded in each step groove 120 separately through the mode of Hot melt adhesive tape (hot-melt tape).Shown in figure 11, when each embedding in 8 step groove 120 on the substrate card 100 has SIM IC module 125 separately, form the substrate card 100 that has 8 plug-in SIMs 102.
Then, shown in figure 12, punch press 128 cuts out a plurality of plug-in SIMs 126 that meet conventional size and dimension through the mode of cross cutting punching press (die-cut punching) from substrate card 100.In order suitably to store the plug-in SIM 126 that cuts out, the one section polybag 130 that has a plurality of pockets 132 is provided, each pocket 132 is used to deposit a plug-in SIM that cuts out 126.
For the personalization of the plug-in SIM 126 realizing cutting out, shown in figure 14, each plug-in SIM 126 is embedded in the groove 134 on the first type surface 145 that carries card 136.The size of carrying card 136 also meets the requirement of ISO/IEC 7816-1 and ISO/IEC 7816-2, but the thickness that carries card 136 can for example can be 1mm greater than 0.76mm.The size and dimension that carries the groove 134 of card 136 is suitable for holding plug-in SIM 126.
In addition, be similar to above-mentioned substrate card 100, carrying card 136 is conventional rectangular shapes, has two relative long limits 138 and two relative minor faces 139.Each long limit 138 is vertical and be adjacent to two minor faces 139, and each minor face 139 is vertical and be adjacent to two long limits 138.Mid point on a long limit 138 is formed with v-depression 141; And the mid point at a minor face 139 also is formed with v-depression 143.These v-depressions 141,143 are provided, with guarantee to carry card 136 (with its plug-in SIM that engages releasedly 126) suitable position, arrangement and direction in personalized operation subsequently.
Then, with carry plug-in SIM 126 that card 136 engages releasedly through the personalization of card personalization machine.After this operation, personalized plug-in SIM 126 removes from the groove 134 that carries card 136.
A kind of selectable be used for according to the method for the invention to carry card shown in figure 15 and represent with 140 usually.The size of carrying card 140 also meets the requirement of ISO/IEC 7816-1 and ISO/IEC 7816-2, but thickness is greater than 0.76mm.Shown in figure 16, carry card 140 and have upward card layer 142, the middle card layer 144 that fixedly secures each other and block layer 146 down.
More clearly shown in Figure 17 A to Figure 17 C:
(1) goes up the hole 148 of blocking layer 142 and have length a, for example 23.1mm.Hole 148 has the end that a width is the broad of b (for example 15.6mm), and the narrower end that width is c (for example 12.6mm).The width c of the narrower end in hole 148 is significantly less than the width 15mm of plug-in SIM 126.
(2) hole 150 of card layer 144 has length d in, 25.1mm for example, and this length d is greater than the length a in the hole 148 of last card layer 142, and is a bit larger tham the length 25mm of plug-in SIM 126.It is that the end and the width of the broad of e (for example 15.4mm) is the narrower end of f (for example 15.1mm) that hole 150 has width.The width e in hole 150 and width f are a bit larger tham the width 15mm of plug-in SIM 126.Middle card layer 144 has the thickness of 0.76mm.Can find out that the size and dimension in the hole 150 of middle card layer 144 is suitable for holding whole plug-in SIM 126.
(3) hole 152 of card layer 146 has length g down, for example 9.5mm (length g is significantly less than the length 25mm of plug-in SIM 126) and width h, for example 13.6mm (width h is significantly less than the width 15mm of plug-in SIM 126).
When last card layer 142, middle card layer 144 and down card layer 146 fixedly secure each other and make that going up card layer 142 is arranged on the card layer 144 and card layer 144 blocks layer 146 a last time under being positioned at; Hole 148, hole 150 and hole 152 are interconnected (shown in figure 15), and the thickness that carries card 140 that so forms is greater than 0.76mm.
When the carrying card 140 and engage releasedly of formation like this with plug-in SIM 126; Plug-in SIM 126 must carry card 140 on slide with respect to card layer 142 on this on the card layer 142; The end of the broad through hole 148 in the entering in the hole 150 of card layer 144, rests in play on the card layers 146 then.This be plug-in SIM 126 can with carry the sole mode that card 140 engages.
When plug-in SIM 126 engages with a year card 140 so releasedly, shown in figure 18.
(1) part of the top major surface 160 of plug-in SIM 126 (surface in contact 162 that comprises the SIM IC module 125 of plug-in SIM 126) is exposed in the external environment condition through last hole 148 of blocking layer 142.This allows plug-in SIM 126 perhaps to be carried out other processing by the personalization of card personalization machine;
(2) part of the opposite bottom major surface (not shown) of plug-in SIM 126 is exposed in the external environment condition through the hole 152 of blocking layer 146 down, for example, and identification number on the bottom major surface mark of permission plug-in SIM 126;
(3) part of the first type surface of facing with the second card layer 144 of the top major surface 160 of plug-in SIM 126 and last card layer 142 contacts; And
(4) part of the first type surface of facing with the second card layer 144 of the bottom major surface of plug-in SIM 126 and following card layer 146 contacts.
When card personalization step or other procedure of processings are accomplished, the hole 150 that plug-in SIM 126 can be through card layer 144 during plug-in SIM 126 is skidded off and the hole 148 of last card layer 142 and remove from carrying card 140.This is that plug-in SIM 126 can be from carrying the sole mode that card 140 removes.
Through above-mentioned layout, particularly carry the structure of card 140, plug-in SIM 126 can:
(1) easily engages with a year card 140;
(2) carried card 140 safety and carried, with experience card personalization step and/or other procedure of processings; And
(3) after personalized and/or processing, easily remove from carrying card 140.
Though it should be understood that does not all have to show in Figure 15 to Figure 18, the mid point on a long limit 156 of carrying card 140 is formed with v-depression and also is formed with v-depression at year mid point of a minor face 158 of card 140.These v-depressions are provided, with guarantee to carry card 140 (with its plug-in SIM that engages releasedly 126) suitable position, arrangement and direction in personalized operation.
It should be understood that the above example that the present invention can realize of only having set forth,, can make multiple modification and/or change these examples under the prerequisite of spirit of the present invention.
Should also be understood that for the sake of clarity and some characteristic of the present invention described in independent embodiment, can in single embodiment, the mode with combination provide.On the contrary, for the sake of brevity and the various features of the present invention described in single embodiment, also can provide separately or provide with the mode of any suitable time combination.
Claims (20)
1. a plug-in type subscriber identification module (SIM) is blocked the formation method of (126), and this method comprises:
Step (a): substrate card (100,200,300,400,500,600) is provided; The size conforms ISO 7816-1 of this substrate card and the requirement of ISO 7816-2, and this substrate card has a plurality of step groove (120) on the first type surface (122) that is positioned at said substrate card;
Step (b): in each said step groove, embed subscriber identification module integrated circuit (IC) module (125);
Step (c): cut out a plurality of plug-in type subscriber identify module cards (126) from said substrate card; And
Step (d): in said a plurality of plug-in type subscriber identify module cards that will in said step (c), obtain one with carry card (136) and engage releasedly; Size conforms ISO 7816-1 that block this year and the requirement of ISO 7816-2, but the thickness that block this year is at least 0.76mm.
2. method according to claim 1 is characterized in that, said substrate card has two relative long limits (104) and two relative minor faces (106).
3. method according to claim 2; It is characterized in that; This method is further comprising the steps of: on the cardinal principle mid point on a said long limit of said substrate card, form first groove (108), and on the cardinal principle mid point of a said minor face of said substrate card, form second groove (110).
4. any described method in requiring according to aforesaid right is characterized in that said a plurality of step groove form on the said first type surface of said substrate card through milling or injection moulding.
5. any described method in requiring according to aforesaid right is characterized in that said step (b) realizes through the mode of Hot melt adhesive tape.
6. any described method in requiring according to aforesaid right is characterized in that said step (c) realizes through the cross cutting Sheet Metal Forming Technology.
7. any described method in requiring according to aforesaid right; It is characterized in that this method is further comprising the steps of: provide in bag (130) that has a plurality of pockets (132) and said a plurality of plug-in type subscriber identify module cards that will in said step (c), obtain at least one to leave in the said pocket.
8. any described method in requiring according to aforesaid right; It is characterized in that; Jig had two relative long limits (138) and two relative minor faces (139) in said year; And the cardinal principle mid point on a said long limit is provided with the 3rd groove (141), and the cardinal principle mid point of a said minor face is provided with the 4th groove (143).
9. any described method in requiring according to aforesaid right is characterized in that this method is further comprising the steps of: through the card personalization machine personalized with blocked the said plug-in type subscriber identify module card that engages in said year.
10. method according to claim 9 is characterized in that, this method is further comprising the steps of: said plug-in type subscriber identify module card is removed from said year card.
11., it is characterized in that card comprised a plurality of card layers that fixedly secure each other (142,144,146) in said year according to any described method in the aforesaid right requirement.
12. method according to claim 11 is characterized in that, card comprised the first card layer (142), the second card layer (144) and the 3rd card layer (146) that fixedly secures each other at least in said year.
13. method according to claim 12 is characterized in that, the said first card layer comprises first hole (148), and the said second card layer comprises second hole (150), and said the 3rd card layer comprises the 3rd hole (152).
14. method according to claim 13 is characterized in that, the size and dimension in the size and dimension in said first hole, said second hole and the size and dimension in said the 3rd hole are differing from each other.
15., it is characterized in that said first hole, second hole and the 3rd hole are interconnected according to claim 13 or 14 described methods.
16. according to any described method in the claim 13 to 15; It is characterized in that; When said plug-in type subscriber identify module card and said year card when engaging releasedly; Outside said first hole of at least a portion of first first type surface (160) of said plug-in type subscriber identify module card through the said first card layer is exposed to, and outside said the 3rd hole of at least a portion of the second opposite first type surface of said plug-in type subscriber identify module card through said the 3rd card layer be exposed to.
17. according to any described method in the claim 12 to 16; It is characterized in that; When said plug-in type subscriber identify module card and said year card when engaging releasedly; At least a portion of first first type surface of said plug-in type subscriber identify module card contacts with the first type surface of the said first card layer, and at least a portion of the second opposite first type surface of said plug-in type subscriber identify module card contacts with the first type surface of said the 3rd card layer.
18., it is characterized in that the size and dimension in said second hole of the said second card layer is suitable for holding whole said plug-in type subscriber identify module card according to any described method in the claim 13 to 17.
19., it is characterized in that said plug-in type subscriber identify module card can only engage releasedly and can only remove from said year card through the mode of sliding with said year card through the mode of sliding according to any described method in the aforesaid right requirement.
20., it is characterized in that the thickness of said year card is greater than 0.76mm according to any described method in the aforesaid right requirement.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| HK09111197A HK1144145A2 (en) | 2009-11-30 | 2009-11-30 | Method of forming subscriber identity module cards |
| HK09111197.9 | 2009-11-30 | ||
| PCT/CN2010/074836 WO2011063653A1 (en) | 2009-11-30 | 2010-06-30 | Method of forming subscriber identity module cards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102640171A true CN102640171A (en) | 2012-08-15 |
Family
ID=43513571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800539996A Pending CN102640171A (en) | 2009-11-30 | 2010-06-30 | Method for forming user identification module card |
Country Status (4)
| Country | Link |
|---|---|
| CN (1) | CN102640171A (en) |
| HK (1) | HK1144145A2 (en) |
| IN (1) | IN2012DN03916A (en) |
| WO (1) | WO2011063653A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201222265Y (en) * | 2008-07-11 | 2009-04-15 | 第一美卡事业股份有限公司 | Improved SIM card structure |
| WO2009080126A1 (en) * | 2007-12-26 | 2009-07-02 | Oberthur Card Systems Limited | A method for manufacturing a plurality of plug-in cards from a card body. |
| CN201315074Y (en) * | 2008-10-28 | 2009-09-23 | 深圳市中兴集成电路设计有限责任公司 | Card base plate for SIM card |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100424721C (en) * | 2006-11-22 | 2008-10-08 | 凤凰微电子（中国）有限公司 | Method for fabricating and packaging chips and elements to smart card with plastic package technique |
-
2009
- 2009-11-30 HK HK09111197A patent/HK1144145A2/en not_active IP Right Cessation
-
2010
- 2010-06-30 IN IN3916DEN2012 patent/IN2012DN03916A/en unknown
- 2010-06-30 WO PCT/CN2010/074836 patent/WO2011063653A1/en active Application Filing
- 2010-06-30 CN CN2010800539996A patent/CN102640171A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009080126A1 (en) * | 2007-12-26 | 2009-07-02 | Oberthur Card Systems Limited | A method for manufacturing a plurality of plug-in cards from a card body. |
| CN201222265Y (en) * | 2008-07-11 | 2009-04-15 | 第一美卡事业股份有限公司 | Improved SIM card structure |
| CN201315074Y (en) * | 2008-10-28 | 2009-09-23 | 深圳市中兴集成电路设计有限责任公司 | Card base plate for SIM card |
Non-Patent Citations (1)
| Title |
|---|
| 郝歧峰 等: "基于SIM卡卡基不同制作工艺的研究", 《包装工程》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011063653A1 (en) | 2011-06-03 |
| HK1144145A2 (en) | 2011-01-28 |
| IN2012DN03916A (en) | 2015-09-04 |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120815 |