CN201315074Y - Card base plate for SIM card - Google Patents
Card base plate for SIM card Download PDFInfo
- Publication number
- CN201315074Y CN201315074Y CNU2008202128692U CN200820212869U CN201315074Y CN 201315074 Y CN201315074 Y CN 201315074Y CN U2008202128692 U CNU2008202128692 U CN U2008202128692U CN 200820212869 U CN200820212869 U CN 200820212869U CN 201315074 Y CN201315074 Y CN 201315074Y
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- Prior art keywords
- sim card
- card
- hole
- substrate
- sim
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Abstract
The utility model relates to a card base plate for an SIM card. A through hole used for the SIM card to insert is hollowed on the card base plate; and a shielding layer at least large enough to cover the through hole is arranged on the bottom surface of the card base plate and is an engineering plastic hard plate or a film. The surface of the shielding layer facing the through hole is coated with an adhesive agent capable of pasting the SIM card. The inserted SIM card can be produced in batch and tested by using the production and test device of a card type SIM card in the prior art by means of the card base plate, so that a novel device is not required to be purchased to solve the production and the test operation problems of the inserted SIM card encapsulated by SIP.
Description
[technical field]
The utility model relates to the record carrier that uses together with equipment in the electric digital data processing field, particularly harder SIM (user identification module) the chucking card substrate close, that embed easily of order encapsulation quality.
[background technology]
The application of SIM card is increasingly extensive, and its function is constantly variation also.The prior art SIM card comprises card form SIM card and embedded SIM card; The card form SIM card is commonly called as the kilocalorie SIM card, and the SIM card of this form meets the ISO7816 standard of relevant IC-card, similar IC-card; The embedded SIM card is commonly called as the lesser calorie SIM card, and its size has only 25 millimeters * 15 millimeters, be semipermanent be encased in card in the mobile device; Domestic popular pattern is the lesser calorie SIM card at present.Kilocalorie SIM card and lesser calorie SIM card are applicable to dissimilar gsm mobile telephones respectively, and what early stage mobile phone such as mobile phones such as the GC87C of Motorola, 308C were used is the kilocalorie SIM card, and the mobile phone of new production at present all uses the lesser calorie SIM card basically.
Along with the continuous variation of SIM card product function in the communications field and the continuous increase of function, and SYSTEMIN PACKAGE encapsulation (system in package, abbreviation SIP encapsulation) technology reaches its maturity, in order to satisfy the demand that SIM card flash memory (flash) capacity is increased, and can be by the demand of SIM card realization in order to satisfy more telecommunication services such as mobile phone cipher, mobile-phone payment etc., existing single-chip SIM card can't satisfy the support to these power demands, the SIM card product that multiple employing SIP encapsulation technology is produced occurred.
The SIP encapsulation process is different from the production run of traditional SIM card fully.Traditional SIM card production run is by COB (chip on board, integrated chip on the plate with single S IM the core of the card sheet; It is a kind of packaged type, directly the nude film of chip is tied to and deceives glue on the plate then and fix) mode be pressed in the card base of PVC sheet material, program is downloaded and tested follow-up indispensable link is that whole kilocalorie card is operated, and again the card base punching of PVC sheet material is generated lesser calorie at last.And the SIM card that the SIP encapsulation technology is produced is that a plurality of discrete components are potted directly in the SIM card lesser calorie, so after encapsulation is finished is exactly the form of lesser calorie SIM card, also to finish the link that downloads in batches with batch testing in the production procedure of back, at this moment existing equipment just cannot be operated the lesser calorie SIM card, and then price is very expensive to buy board equipment again.How utilizing the existing equipment of producing the card form SIM card to come embedded SIM is sticked into capable production test operation, is current urgency problem to be solved.
[utility model content]
The technical problems to be solved in the utility model is to avoid above-mentioned the deficiencies in the prior art part and card substrate that a kind of SIM card is provided, can use the production of prior art card form SIM card and testing apparatus to produce and test the embedded SIM card in batches by this card substrate, thereby needn't purchase new equipment and produce and the test operation problem with regard to the embedded SIM card that has solved the SIP encapsulation.
The technical scheme that the utility model solve the technical problem employing is:
A kind of card substrate of SIM card is provided, comprises that hollow out is useful on the through hole that embeds described SIM card on the described card substrate, described card substrate bottom surface is provided with the barrier bed that will cover described through hole at least.
Described barrier bed is hard sheet of engineering plastics or film.Described barrier bed has the tackifier that can cling described SIM card towards the surface-coated of described through hole.
Compare with prior art, its beneficial effect of the card substrate of the utility model SIM card is:
Only need the SIM card of SIP encapsulation is embedded in the through hole of described card substrate, just can use the production and the testing apparatus of prior art card form SIM card to produce and test the embedded SIM card in batches, just as batch process and test card chip SIM card, thereby needn't purchase production of embedded SIM card and the test operation problem that new equipment has just solved the SIP encapsulation.
[description of drawings]
Fig. 1 is that the master of the card substrate embodiment one of the utility model SIM card looks synoptic diagram;
Fig. 2 is the cross-sectional schematic along A-A among Fig. 1;
Fig. 3 is that the master of the card substrate embodiment two of described SIM card looks synoptic diagram;
Fig. 4 is the cross-sectional schematic along B-B among Fig. 3.
[embodiment]
Below in conjunction with each accompanying drawing the utility model is described in further detail.
Embodiment one:
Referring to Fig. 1 and Fig. 2, a kind of card substrate of SIM card, hollow out is useful on the through hole 15 that embeds described SIM card on the described card substrate 10, and this SIM card is exactly the embedded SIM card, is commonly called as the lesser calorie SIM card; Described card substrate 10 bottom surfaces are provided with the barrier bed 20 that will cover described through hole 15 at least.In the present embodiment, the shape of described through hole 15 is the same with the shape of described SIM card, and the profile size of the size of this through hole 15 and described SIM card is adaptive.In SIM card embedding (not drawing among the figure) described through hole 15 of SIP encapsulation, just can use the existing equipment of producing the card form SIM card come that embedded SIM is sticked into capable production test and operate by described card substrate.The effect of barrier bed 20 is, prevents in production run, is embedded in when described SIM card on described card substrate 10 through holes 15 is ejected by probe to drop.The size of barrier bed 20 must cover described through hole 15, also can cover whole card substrate 10 bottom surfaces.
Described barrier bed 20 is hard sheet of engineering plastics or film.Described barrier bed 20 has the tackifier that can cling described SIM card towards the surface-coated of described through hole 15.The SIM card of SIP encapsulation embeds in the described through hole 15, and is clung by tackifier on the described barrier bed 20, and the SIM card that is arranged on the card substrate 10 can not dropped in the process of upset.
The size of described through hole 15 must make described SIM card embed interference fit in it.Can guarantee in production run, be arranged in that SIM card on the described card substrate 10 can not ejected by probe easily and can not drop in the process of upset.
Have through hole 25 at the position that embeds described SIM card on the described barrier bed 20, so that on the card body that is embedded in the SIM card on the described card substrate 10, print sequence number in process of production.
Embodiment two:
Referring to Fig. 3 and Fig. 4, basic identical with embodiment one, different is, the size of through hole 15 and shape in order to distinguish mutually with embodiment one, are arranged on through hole on the card substrate 10 with label 15 ' indicate.Described through hole 15 ' size bigger slightly than described SIM card physical dimension, through hole 15 ' concrete shape unrestricted, but this through hole 15 ' at least one pair of medial surface in opposite directions is provided with at least one pair of restriction protrusion 19, and this is adaptive with the profile size of described SIM card to restriction protrusion 19 distance each other.Around at through hole 15 ' medial surface, respectively be provided with two pairs of restriction protrusion 19, restriction protrusion 19 distance each other is adaptive with described SIM card everywhere, embedding as SIM card as described in restriction protrusion 19 distance each other must make everywhere has interference fit in it, guaranteeing, be arranged in that SIM card on the described card substrate 10 can not ejected by probe easily and can not drop in the process of upset in production run.
The above embodiment has only expressed preferred implementation of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim; Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection domain of the present utility model; Therefore, all equivalents and modifications of being done with the utility model claim scope all should belong to the covering scope of the utility model claim.
Claims (8)
1. the card substrate of a SIM card is characterized in that:
Described card substrate (10) is gone up hollow out and is useful on the through hole (15 or 15 ') that embeds described SIM card, and described card substrate (10) bottom surface is provided with the barrier bed (20) that will cover described through hole (15 or 15 ') at least.
2. the card substrate of SIM card according to claim 1 is characterized in that:
Described barrier bed (20) is hard sheet of engineering plastics or film.
3. the card substrate of SIM card according to claim 2 is characterized in that:
Described barrier bed (20) has the tackifier that can cling described SIM card towards the surface-coated of described through hole (15 or 15 ').
4. the card substrate of SIM card according to claim 1 is characterized in that:
The shape of described through hole (15) is the same with the shape of described SIM card, and the size of this through hole (15) and the profile size of described SIM card are adaptive.
5. the card substrate of SIM card according to claim 4 is characterized in that:
The size of described through hole (15) must make described SIM card embed interference fit in it.
6. the card substrate of SIM card according to claim 1 is characterized in that:
The size of described through hole (15 ') is bigger slightly than described SIM card physical dimension, at least one pair of medial surface in opposite directions of this through hole (15 ') is provided with at least one pair of restriction protrusion (19), and this is adaptive with the profile size of described SIM card to restriction protrusion (19) distance each other.
7. the card substrate of SIM card according to claim 6 is characterized in that:
Two restriction protrusion (19) distance each other must make described SIM card embed on described through hole (15 ') medial surface interference fit in it.
8. according to the card substrate of each described SIM card of claim 1-7, it is characterized in that:
Described barrier bed (20) is gone up at the position that embeds described SIM card and is had through hole (25), so that print sequence number in process of production on the card body that is embedded in the SIM card on the described card substrate (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202128692U CN201315074Y (en) | 2008-10-28 | 2008-10-28 | Card base plate for SIM card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202128692U CN201315074Y (en) | 2008-10-28 | 2008-10-28 | Card base plate for SIM card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201315074Y true CN201315074Y (en) | 2009-09-23 |
Family
ID=41126871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202128692U Expired - Lifetime CN201315074Y (en) | 2008-10-28 | 2008-10-28 | Card base plate for SIM card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201315074Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011063653A1 (en) * | 2009-11-30 | 2011-06-03 | Intercard Limited | Method of forming subscriber identity module cards |
-
2008
- 2008-10-28 CN CNU2008202128692U patent/CN201315074Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011063653A1 (en) * | 2009-11-30 | 2011-06-03 | Intercard Limited | Method of forming subscriber identity module cards |
| CN102640171A (en) * | 2009-11-30 | 2012-08-15 | 金达制咭有限公司 | Method for forming user identification module card |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: GUOMING TECHNOLOGY CO., LTD. Free format text: FORMER NAME: ZHONGXING INTEGRATED CIRCUIT DESIGN CO. LTD., SHENZHEN CITY |
|
| CP03 | Change of name, title or address |
Address after: Three, three, 2 Software Park, 518057 hi tech Zone, Nanshan District hi tech Zone, Guangdong, Shenzhen Province, three Patentee after: Nationz Technologies Inc. Address before: 518057, three, 2 Software Park, hi tech Zone, Shenzhen, Guangdong Province, three, three Patentee before: Zhongxing Integrated Circuit Design Co., Ltd., Shenzhen City |
|
| CX01 | Expiry of patent term |
Granted publication date: 20090923 |
|
| CX01 | Expiry of patent term |