CN101770593A - Multi-chip intelligent card, manufacturing method thereof and data processing method - Google Patents
Multi-chip intelligent card, manufacturing method thereof and data processing method Download PDFInfo
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- CN101770593A CN101770593A CN200910252499A CN200910252499A CN101770593A CN 101770593 A CN101770593 A CN 101770593A CN 200910252499 A CN200910252499 A CN 200910252499A CN 200910252499 A CN200910252499 A CN 200910252499A CN 101770593 A CN101770593 A CN 101770593A
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Abstract
The invention discloses a multi-chip intelligent card, a manufacturing method thereof and a data processing method and relates to the technique of an intelligent card. The multi-chip intelligent card comprises a micro control unit MCU and at least two intelligent card application chips which are connected with the MCU, wherein the MCU is arranged for acquiring a classification identification in a command after a contact point of a contact interface for communicating with a terminal receives the command sent by the terminal, sending the command to a corresponding intelligent card application card according to the correspondence between the classification identification and the intelligent card application card, and transmitting a command response to the terminal after receiving the command response from the intelligent card application card. The intelligent card application card is arranged for receiving the command transmitted by the MCU and sending the command response to the MCU after processing. A plurality of application functions are respectively realized by each intelligent card application card in the multi-chip intelligent card.
Description
Technical field
The present invention relates to smart card techniques, relate in particular to a kind of multi-chip intelligent card and manufacture method thereof and data processing method.
Background technology
Along with the development of smart card techniques, the also more and more various words of the application of smart card, majority hold many sheet smart cards, for example SIM card, mass transit card, mess card, badge etc. simultaneously.
Hold many sheet smart cards simultaneously and bring inconvenience for the user, the time regular meeting occur to need use a card, but mistake has been taken another card.Have multi-functional smart card at present and solved the problems referred to above, this smart card can be realized a plurality of functions simultaneously, for example can carry out user identity identification and by mobile communication, and function such as also can realize that simultaneously small amount payment, public transport are swiped the card greatly facilitates the user.
The present application people finds, only is packaged with a chip in the present multi-functional smart card, and its all functions all realize by this chip, and the use single-chip is realized a plurality of functions, has following shortcoming:
1. owing to use single chip to realize a plurality of functions, the storage space requirement to chip is bigger so, and single high capacity chip cost is higher;
2. the authority of telecommunications application is different with non-telecommunications application permission, when these functions realize in same chip, causes in processing procedure easily and obscures, and then authority differentiation conflict occurs;
3. many functions realize in same chip, and each application function all needs to store some data, the situation of plural application function memory collision so just may occur, cause the internal memory conflict between a plurality of application functions.
Smart card encapsulation technology at present commonly used be with chip attach to the carrier band that has hard contact; the gold thread welding is carried out in the contact of chip and the contact of carrier band; with needle tubing chip and welding gold thread are carried out the sealing protection again; be packaged into module at last and install to the card base and go up the formation smart card; but this method has, and step is more, sealing protection undercapacity; the carrier band area is limited, be difficult to control many shortcomings such as profile, thereby is difficult to carry out multicore sheet, the encapsulation of complicated circuit.
Summary of the invention
The embodiment of the invention provides a kind of multi-chip intelligent card and manufacture method and data processing method, to realize realizing a plurality of application functions of this smart card respectively by realizing the application of IC cards chip of difference in functionality in the smart card.
A kind of multi-chip intelligent card comprises: micro-control unit MCU and at least two application of IC cards chips that are connected described MCU, wherein:
Described MCU is used for, receive the order of terminal transmission in contact after by contact interface, obtain the classification logotype in the described order, and according to the corresponding relation of described classification logotype and described application of IC cards chip, described order is sent to the corresponding intelligent card application chip, and after receiving the command response that described application of IC cards chip returns, described command response is transmitted to described terminal;
Described application of IC cards chip is used for, and receives the order that described MCU transmits, and responds to described MCU return command after processing.
Corresponding a kind of data processing method comprises:
Micro-control unit MCU passes through the order of the contact receiving terminal transmission of contact interface, and obtains the classification logotype in the described order;
Described MCU is transmitted to the corresponding intelligent card application chip according to the corresponding relation of the classification logotype that is obtained and described classification logotype and application of IC cards chip with described order;
Described MCU receives the command response that intelligent card chip returns after the order that processing receives;
Described MCU sends to described terminal with the command response that receives.
Corresponding a kind of method of making multi-chip intelligent card comprises: processing substrate and injection moulding encapsulation, wherein:
Processing substrate specifically comprises: according to the logic connection layout of described multi-chip intelligent card determine each chip and contact in substrate the position and be connected, and make substrate; Each chip is fixed on the relevant position of described substrate; According to described logic connection layout, connection needs each chip of connection and the contact and corresponding chip on the connection substrate, the substrate after the formation processing;
The injection moulding encapsulation specifically comprises: the substrate after the described processing is put in the cavity body of mould, and casting resin material in described cavity body of mould, and be heating and curing.
The multi-chip intelligent card that the embodiment of the invention provides is classified by the order that a slice MCU will receive, the a plurality of chips that are used to realize difference in functionality of uniform dispatching, thereby realize using a plurality of chips in the smart card to realize different functions, because each function does not re-use the resource in the same chip, the application permission that has occurred when effectively having avoided only using a chip to realize difference in functionality is distinguished the internal memory collision problem between conflict and application.
Description of drawings
The structural representation of the multi-chip intelligent card that Fig. 1 provides for the embodiment of the invention;
One of multi-chip intelligent card contact distribution schematic diagram that Fig. 2 a provides for the embodiment of the invention;
Two of the multi-chip intelligent card contact distribution schematic diagram that Fig. 2 b provides for the embodiment of the invention;
The structural representation of the multi-chip intelligent card that Fig. 3 provides for the embodiment of the invention with SIM card function and noncontact class function;
The flow chart of data processing figure of the multi-chip intelligent card that Fig. 4 provides for the embodiment of the invention;
Fig. 5 a is in the embodiment of the invention, the board structure synoptic diagram behind the fixed chip;
Fig. 5 b is the structural representation that embodiment of the invention chips is connected with the substrate gold thread;
Fig. 5 c is the structural representation when using the mold injection resin material to make the multi-chip intelligent card shaping in the embodiment of the invention.
Embodiment
The application permission that the embodiment of the invention occurs when using a chip to realize difference in functionality in order to solve is distinguished the problem of internal memory conflict between conflict and application, a kind of multi-chip intelligent card and manufacture method and data processing method are provided, realize function corresponding by different chips, thereby avoided the problem of internal memory conflict between conflict of multi-function intelligent card application permission and application.
The embodiment of the invention provides a kind of multi-chip intelligent card and manufacture method and data processing method, by realizing the application of IC cards chip of difference in functionality in the smart card, makes this smart card have a plurality of application functions.
It generally is identical that the smart card contact of contact class application of IC cards chip distributes, 8 or 10 contacts are all arranged, so when containing the function of a plurality of contact class smart cards in the smart card, the contact class application of IC cards chip of each contact class intelligent card function correspondence can use same group of smart card contact and terminal to communicate.Therefore, the multi-chip intelligent card that the embodiment of the invention provides is by MCU (Micro-ControllerUnit, micro-control unit) comes to communicate by the contact of contact interface with terminal, the order that receiving terminal sends and classify and send to the corresponding intelligent card application chip, MCU is along with the appearance of large scale integrated circuit and development, CPU with computing machine, RAM, ROM, regularly number device and multiple I/O interface are integrated on a slice chip, the chip-scale computing machine that forms, according to control program wherein, be suitable in various application scenarios, making up control, therefore the embodiment of the invention is come the order that realizes difference in functionality is classified and transmitted by MCU, wherein, contact interface is used to realize communicating by letter of smart card and terminal room.
When using this multi-chip intelligent card, after multi-chip intelligent card receives the order of terminal transmission, at first judge according to the classification logotype in the order that receives by MCU, the order that will receive according to judged result sends to the function corresponding chip and handles again, after the function corresponding chip disposes, by MCU command response is transmitted to terminal again.
As shown in Figure 1, the multi-chip intelligent card that the embodiment of the invention provides comprises MCU101 and at least two application of IC cards chips 102 that are connected with MCU101, wherein:
MCU101, be used for after the contact by contact interface receives the order of terminal transmission, obtain the classification logotype information in the order, and according to the classification logotype of setting and the corresponding relation of application of IC cards chip, the order that receives is sent to corresponding intelligent card application chip 102, and after receiving the command response that application of IC cards chip 102 returns, directly the command response that receives is transmitted to terminal; Wherein, terminal is mobile hand-held device, server or reader device etc. such as mobile phone.
The respective pin of MCU101 is connected with the corresponding contacts of multi-chip intelligent card contact interface respectively, thereby makes MCU pass through the contact realization of multi-chip intelligent card contact interface and communicating by letter of terminal.
Application of IC cards chip 102 is used to receive the order that MCU101 transmits, and after processing to the response of MCU101 return command, application of IC cards chip 102 can be the chip in the single-chip smart card, for example the chip of SIM card chip, mass transit card etc.;
When making multi-chip intelligent card, except that communicating the needed smart card contact with terminal, owing to need import corresponding program to MCU, so corresponding M CU contact need be set realizes, be specially serial interface contact can be set, be used for the importing program, as required, the number of serial interface contact can be 2,4 or more, after the smart card encapsulation finishes, according to the function of this multi-chip intelligent card, be that MCU imports corresponding program by serial interface contact, to realize classification and the forwarding capability of MCU.
At this moment, comprise serial interface contact in the multi-chip intelligent card,, give and import corresponding program among the MCU101 according to the function of multi-chip intelligent card.
MCU judges orders the foundation of affiliated chip to set according to actual conditions, because the order of different field, function is inequality, classification logotype wherein is also inequality, so generally judge according to the classification logotype in the order.
For example, a SIM (Subscriber Identity Module is only arranged in multi-chip intelligent card, user identification module) when the core of the card sheet and a mass transit card chip, MCU can be according to the classification logotype in the order, judge that this order is that the telecommunications order also is non-telecommunications order, general telecommunications order is to start with different command bytes with non-telecommunications order, MCU promptly can this byte as classification logotype, judge that this order is be transmitted to the SIM card chip or be transmitted to the mass transit card chip; When a plurality of SIM card chip was arranged in the multi-chip intelligent card, MCU can control the SIM card chip of current use by receiving and carry out special command that terminal sends.
The multi-chip intelligent card that the embodiment of the invention provides can only comprise the function of two or more contact class application chip, the function that perhaps can only comprise two or more noncontact class application chip, the contact type intelligent card application chip comprises the antenna of a setpoint frequency, and antenna and the terminal of passing through this setpoint frequency realize the contactless communication function, wherein, the contact of contact interface comprises two noncontact points, be used to connect aerial coil, the multi-chip intelligent card that the embodiment of the invention provides can also both comprise contact class chip functions, comprised noncontact class chip functions again.
When at least two application of IC cards chips in the multi-chip intelligent card all are contact class application chip or when all being noncontact class application chip, the classification logotype that is used for judging the intelligent card chip under the order can be the user identity identification sign indicating number of order, after MCU receives the order of terminal transmission in the contact by contact interface, obtain the user identity identification sign indicating number in the order, determine the contact class chip of user identity identification sign indicating number correspondence, and order is sent to the pairing application of IC cards chip of this user identity identification sign indicating number get final product.
In at least two application of IC cards chips in the multi-chip intelligent card, existing contact class application chip, when noncontact class application chip is also arranged, can judge earlier that this order is that the telecommunications order also is non-telecommunications order, if a contact class application chip is only arranged in telecommunications order and the multi-chip intelligent card, directly this order being transmitted to this contact class application chip gets final product, if be that a noncontact class application chip is only arranged in non-telecommunications order and the multi-chip intelligent card equally, directly this order being transmitted to this noncontact class application chip gets final product, if a plurality of contact class application chips or noncontact class application chip are arranged in the multi-chip intelligent card, can further judge according to the classification logotypes such as identity code in the order, transmit this order according to judged result again.
MCU101 comprises at least one power port, power port with application of IC cards chip 102 is connected respectively, and/or MCU101 comprises that at least one input/output port is connected with the power port of application of IC cards chip 102 respectively, is 102 power supplies of application of IC cards chip; MCU101 comprises at least one synchronous asynchronous transceiver (Universal synchronous asynchronous receiver transmitter, USART) mouth, then be connected with the input/output port of application of IC cards chip 102 respectively, and/or MCU101 comprises that the port that remaps of at least one synchronous asynchronous transceiver mouth is connected with the input/output port of application of IC cards chip 102 respectively.With two application of IC cards chips 102 is example, and the power port of MCU101 can be connected with the power port of described first application of IC cards chip 102, and the input/output port of MCU101 is connected with the power port of second application of IC cards chip 102; The first usart mouth of MCU101 is connected with the input/output port of described first application of IC cards chip 102; The port that remaps of the first usart mouth of MCU101 is connected with the input/output port of second application of IC cards chip 102.
Generally, MCU101 comprises a plurality of power ports, and when connecting, the power port of at least two application of IC cards chips 102 connects the different electrical power port of MCU respectively.
Like this, MCU101 just can control the application of IC cards chip, only when its processing command of needs, make it enter duty, to save power supply, concrete implementation is: MCU101 is before the order that will receive is transmitted to corresponding intelligent card application chip 102, to be changed to operation level to power port that should application of IC cards chip 102, and after receiving the command response that this application of IC cards chip returns, will be changed to the dormancy level power port that should the application of IC cards chip.
The IO interface of each application of IC cards chip 102 can connect the interface of the input/output function of MCU, for example, and the USART replay loophole of USART mouth or MCU, and carry out signal transmission by this interface and MCU101.Be specifically as follows MCU101 by corresponding USART mouth or USART replay loophole, application of IC cards chip 102 forward commands that connect to this USART mouth also receive this USART mouth or command response that application of IC cards chip that USART replay loophole connects returns.
When MCU101 and contact intelligent card application chip communicate, the USART mouth that MCU101 can be connected with the contact type intelligent card application chip is set to high resistant, finish with the communicating by letter of contact intelligent card application chip after, the USART mouth recovery that will be connected with the contact type intelligent card application chip is normally.
At this moment, MCU101 specifically comprises: judge retransmission unit and be connected control module, wherein: judge retransmission unit, be used for the order that receiving terminal sends, according to the classification logotype in the order, order is transmitted to corresponding intelligent card application chip 102, and after receiving the command response that application of IC cards chip 102 returns, command response is transmitted to terminal;
Connect control module, be used for the application of IC cards chip communication before, the power port of intelligent card corresponding application chip is changed to operation level, after finishing with this application of IC cards chip communication, the power port of intelligent card corresponding application chip is changed to the dormancy level, when communicating by letter with the contact intelligent card application chip by the USART mouth that connects the contact intelligent card application chip, the USART that is connected with the contact type intelligent card application chip is set to high resistant, and finish with the communicating by letter of contact intelligent card application chip after, the USART mouth recovery that will be connected with the contact type intelligent card application chip is normally.
The contact distribution plan of the contact interface of a kind of multi-chip intelligent card that the embodiment of the invention provided is shown in Fig. 2 a, comprise 8 contact C1～C8, wherein, C1～C3, C5～C7, can be by the SIM card normalized definition, be connected with the MCU corresponding ports, power contact VCC connects the power input mouth of MCU101, earthing contact GND connects the grounding ports of MCU101, reset contact RST connects the reseting port of MCU101, and clock contact CLK connects the clock port of MCU101, and input and output contact IO connects the USART mouth of MCU.Wherein, C1 may be defined as power contact VCC, and C2 may be defined as reset contact RST, and C3 may be defined as clock contact CLK, and C5 may be defined as earthing contact GND, and C6 may be defined as power contact VPP, and C7 may be defined as input and output contact IO.
And C4, C8 is the noncontact point, two leading-out terminals of coil in the antenna element of connection multi-chip intelligent card.Be C4, C8, and antenna element has been formed the contact at the noncontact interface of this multi-chip intelligent card.
Certainly, this is the contact of a kind of concrete contact interface in the embodiment of the invention, can also carry out other definition to each contact in the contact of contact interface, as long as meet the SIM card normalized definition.
When comprising the contact type intelligent card application chip in the multi-chip intelligent card, the contact of contact interface comprises noncontact point C4 and the C8 in the smart card contact, is used to connect the antenna of contact type intelligent card application chip.
In the embodiment of the invention, because need be when producing multi-chip intelligent card, when MCU imports program, multi-chip intelligent card also comprises serial interface contact, connect the corresponding port that is used to the program of importing among the MCU101, a kind of distribution of serial interface contact is shown in Fig. 2 b, and the contact of the contact interface of multi-chip intelligent card can also comprise serial interface contact, multi-chip intelligent card obtains primary application program by serial interface contact, perhaps other data messages.Here, serial interface contact generally has four, is respectively GND, BOOT0, TX, RX.Earthing contact wherein can be shared with the earthing contact C5 in 8 contacts of realization and terminal communication.
If before fabrication, determined the required function of this multi-chip intelligent card, then can be in the fabrication process in MCU the importing program, after the importing program, carry out the injection moulding encapsulation of card again, can not comprise serial interface contact on the smart card that completes at last.That is: when multi-chip intelligent card in when exploitation, be configured primary application program, then the contact of the contact interface of this multi-chip intelligent card can not comprise serial interface contact.
As shown in Figure 3, be a kind of SIM card that the embodiment of the invention provides, set up a noncontact class in this SIM card and used, comprise MCU101, SIM card chip 1021, contact type intelligent card application chip 1022 in the SIM card, wherein:
MCU101 is used for the order that receiving terminal sends, and judges that this order is that the telecommunications order also is non-telecommunications order, if the telecommunications order is transmitted to the SIM card chip, if be non-telecommunications order, is transmitted to the contact type intelligent card application chip;
Noncontact class application chip 1022, be used to receive the non-telecommunications order that MCU101 transmits, after handling command response is returned to MCU101, simultaneously, noncontact class application chip 1022 also communicates by antenna element and corresponding noncontact Terminal Type, realizes corresponding contactless communication function.
When using the multi-chip intelligent card that the embodiment of the invention provides, flow chart of data processing comprises the steps: as shown in Figure 4
Step S401, MCU101 receive the order that terminal sends;
Step S402, MCU101 obtain the classification logotype in the order, and according to the corresponding relation of classification logotype and application of IC cards chip, this order are transmitted to the corresponding intelligent card application chip;
MCU101 is when judging, can directly judge the order that this order is corresponding which application of IC cards chip according to the classification logotype information in the order, whether also can compare this classification sign and the first application of IC cards chip corresponding identification earlier mates, judge whether this order is the order of the first application of IC cards chip, if not, judge by comparison whether this chip is the order of the second application of IC cards chip again, until finding the corresponding application of IC cards chip of this order.
Step S403, the application of IC cards chip 102 that receives order are carried out these orders, and are returned corresponding command response in the back that disposes to MCU101;
After step S404, MCU101 receive command response, directly the command response that receives is sent to terminal, multi-chip intelligent card has promptly been realized the application corresponding function.
Further, before the order that MCU will receive was transmitted to the corresponding intelligent card application chip, also the power port with the application of IC cards chip of the described reception order of correspondence was changed to operation level; MCU also will be changed to the dormancy level to power port that should the application of IC cards chip after receiving the command response that the application of IC cards chip returns.
In step S402, MCU is transmitted to the corresponding intelligent card application chip according to the corresponding relation of the classification logotype that is obtained and classification logotype and application of IC cards chip with order, specifically comprises:
When at least two application of IC cards chips all are contact class application chip or when all being noncontact class application chip, according to the user identity identification sign indicating number in the classification logotype that is obtained, determine the contact class chip of user identity identification sign indicating number correspondence, and order is sent to the pairing application of IC cards chip of this user identity identification sign indicating number;
When at least two application of IC cards chips are specially a contact class application chip and a noncontact class application chip, judge that the classification logotype that is obtained is that the telecommunications application identities also is non-telecommunications application identities, and when classification logotype is the telecommunications application identities, order is transmitted to contact class application chip, when classification logotype is non-telecommunications application identities, order is transmitted to noncontact class application chip.
The multi-chip intelligent card that the embodiment of the invention provides is classified by the order that a slice MCU will receive, the a plurality of chips that are used to realize difference in functionality of uniform dispatching, thereby realize using a plurality of chips in the smart card to realize different functions, because each function does not re-use the resource in the same chip, each application chip is independently worked, and then the application permission that occurs when effectively having avoided only using a chip to realize difference in functionality distinguish conflict and use between the internal memory collision problem, the profile and the connected mode that have also kept simultaneously smart card, promptly contacting the class application still realizes being connected by smart card contact and terminal, the noncontact class is used and is still communicated by correspondent frequency and terminal, and therefore the multi-chip intelligent card that terminal is made any change and can use the embodiment of the invention to provide is not provided.
At the multi-chip intelligent card of the embodiment of the invention, the embodiment of the invention is corresponding to provide a kind of method of making multi-chip intelligent card, comprises two parts of processing substrate and injection moulding encapsulation:
When carrying out processing substrate, earlier according to the logic connection layout determine each chip and contact in substrate the position and be connected, and making substrate, the layout of substrate chips and contact is determined according to the quantity and the size of each chip, make line convenient as far as possible, the thickness of substrate generally is selected between 0.12mm～0.24mm, wherein, the contact can be only for being used for the smart card contact with terminal communication, also can comprise smart card contact and the serial interface contact that is used for the program that imports to MCU, the logic connection layout is quantity and the type that the first function that will realize according to multi-chip intelligent card is determined the application of IC cards chip, draws out according to the annexation of MCU and application of IC cards chip chamber again.
Again each chip is fixed on the relevant position of substrate, shown in Fig. 5 a, can uses the mode of Reflow Soldering in the time of fixedly;
Components and parts such as resistance capacitance as if also needing in the circuit to assist also are fixed on the relevant position of substrate;
According to the logic connection layout, connection needs each chip of connection and the contact and corresponding chip, components and parts on the connection substrate, form the substrate after handling, shown in Fig. 5 b, figure is the synoptic diagram that the tie point 511 usefulness gold threads 513 with chip 512 and substrate are connected, when connecting, use the mode of gold thread welding to connect usually;
During the injection moulding encapsulation; shown in Fig. 5 c; substrate 502 after handling is put in mould 503 cavitys; have in the side direction of chip 501; casting resin material 504 in mould 503 cavitys, and be heating and curing, like this; resin material 504 had both been protected the gold thread of each chip and welding, also made multi-chip intelligent card be shaped simultaneously.
So promptly realized the making of multi-chip intelligent card.
After making finishes, if needed, the resin plate blunderbuss can also be cut to required form, because application scenario difference, required smart card shape is also inequality, for example, if this multi-chip intelligent card has the function of SIM card, this multi-chip intelligent card should use the shape that is cut to SIM card according to the good blunderbuss cutting tool blunderbuss of SIM card configuration design so, so that it can put into mobile phone.
The manufacture method of this smart card is not carried out the sealing protection owing to using heat-curable glue or UV to solidify glue; but direct casting resin material; so protection intensity is big; area occupied is little; and owing to used substrate and casting resin material; so can carry out a fairly large number of gold thread welding; owing to do not use and have mobile colloid; so profile after easier control is solidified; and do not re-use carrier band as medium; package area no longer only limits to the size of carrier band; but can be in whole card with circuit design; be more suitable for the smart card of multicore sheet, so the manufacture method of intelligent cards that the embodiment of the invention provides is applicable to have the multicore sheet; the encapsulation of the smart card of complicated circuit is made.
Obviously, those skilled in the art can carry out various changes and modification to the embodiment of the invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (15)
1. a multi-chip intelligent card is characterized in that, comprising: micro-control unit MCU and at least two application of IC cards chips that are connected described MCU, wherein:
Described MCU is used for, receive the order of terminal transmission in contact after by contact interface, obtain the classification logotype in the described order, and according to the corresponding relation of described classification logotype and described application of IC cards chip, described order is sent to the corresponding intelligent card application chip, and after receiving the command response that described application of IC cards chip returns, the contact by described contact interface is transmitted to described terminal with described command response;
Described application of IC cards chip is used for, and receives the order that described MCU transmits, and responds to described MCU return command after processing.
2. multi-chip intelligent card as claimed in claim 1, it is characterized in that, when described at least two application of IC cards chips were noncontact class application chip for contacting class application chip or described at least two application of IC cards chips, described classification logotype was specially the user identity identification sign indicating number.
3. multi-chip intelligent card as claimed in claim 1, it is characterized in that, when described at least two application of IC cards chips are a contact class application chip and a noncontact class application chip, corresponding described contact class application chip of described classification logotype and noncontact class application chip are respectively telecommunications application identities and non-telecommunications application identities.
4. multi-chip intelligent card as claimed in claim 1, it is characterized in that described MCU comprises that at least one power port is connected with the power port of described application of IC cards chip respectively and/or described MCU comprises that at least one input/output port is connected with the power port of described application of IC cards chip respectively.
5. multi-chip intelligent card as claimed in claim 4 is characterized in that, described at least two application of IC cards chips only enter duty when processing command;
Described MCU is before the order that will receive is transmitted to the corresponding intelligent card application chip, the power port of the application of IC cards chip of the described reception order of correspondence is changed to operation level, and after receiving the command response that this application of IC cards chip returns, will be changed to the dormancy level to power port that should the application of IC cards chip.
6. multi-chip intelligent card as claimed in claim 1, it is characterized in that, described MCU comprises at least one synchronous asynchronous transceiver mouth, input/output port with described application of IC cards chip is connected respectively, and/or described MCU comprises that the port that remaps of at least one synchronous asynchronous transceiver mouth is connected with the input/output port of described application of IC cards chip respectively, and described MCU remaps port to application of IC cards chip forward command and receive the command response that the application of IC cards chip returns by corresponding usart mouth and/or synchronous asynchronous transceiver mouth.
7. multi-chip intelligent card as claimed in claim 1 is characterized in that, the contact of described contact interface specifically comprises:
The power contact that is connected with the power input mouth of described MCU; The earthing contact that is connected with the grounding ports of described MCU; The reset contact that is connected with the reseting port of described MCU; The clock contact that is connected with the clock port of described MCU; And the input and output contact that is connected with the usart mouth of described MCU.
8. multi-chip intelligent card as claimed in claim 7 is characterized in that, the contact of described contact interface also comprises:
The noncontact point that connects described contactless smart card application chip antenna.
9. as claim 7 or 8 described multi-chip intelligent cards, it is characterized in that the contact of described contact interface also comprises:
The MCU contact connects the corresponding pin of described MCU respectively, is used for to described MCU importing program.
10. multi-chip intelligent card as claimed in claim 1 is characterized in that, described MCU specifically comprises:
Judge retransmission unit, be used for receiving the order that terminal sends by the contact of contact interface, obtain the classification logotype in the described order, and according to the corresponding relation of described classification logotype and described application of IC cards chip, described order is sent to the corresponding intelligent card application chip, and after receiving the command response that described application of IC cards chip returns, described command response is transmitted to described terminal;
Connect control module, be used for the application of IC cards chip communication before, the power port of the described application of IC cards chip of correspondence is changed to operation level, after finishing with this application of IC cards chip communication, the power port of the described application of IC cards chip of correspondence is changed to the dormancy level, when communicating by letter with described contact intelligent card application chip by the general input/output port that connects described contact intelligent card application chip, the general input/output port that is connected with described contact type intelligent card application chip is set to high resistant, and finish with the communicating by letter of described contact intelligent card application chip after, the general input/output port recovery that will be connected with described contact type intelligent card application chip is normally.
11. a data processing method is characterized in that, comprising:
Micro-control unit MCU passes through the order of the contact receiving terminal transmission of contact interface, and obtains the classification logotype in the described order;
Described MCU is transmitted to the corresponding intelligent card application chip according to the corresponding relation of the classification logotype that is obtained and described classification logotype and application of IC cards chip with described order;
Described MCU receives the command response that the application of IC cards chip returns after the order that processing receives;
Described MCU sends to described terminal with the command response that receives.
12. method as claimed in claim 11 is characterized in that, described MCU is transmitted to the corresponding intelligent card application chip according to the corresponding relation of the classification logotype that is obtained and described classification logotype and application of IC cards chip with described order, specifically comprises:
When described at least two application of IC cards chips all are contact class application chip or when all being noncontact class application chip, according to the user identity identification sign indicating number in the classification logotype that is obtained, determine the contact class chip of described user identity identification sign indicating number correspondence, and described order is sent to the pairing application of IC cards chip of this user identity identification sign indicating number;
When described at least two application of IC cards chips are specially a contact class application chip and a noncontact class application chip, judge that the classification logotype that is obtained is that the telecommunications application identities also is non-telecommunications application identities, and when described classification logotype is the telecommunications application identities, described order is transmitted to described contact class application chip, when described classification logotype is non-telecommunications application identities, described order is transmitted to described noncontact class application chip.
13. method as claimed in claim 11 is characterized in that, the order that described MCU will receive also comprises before being transmitted to the corresponding intelligent card application chip: the power port of the application of IC cards chip of the described reception order of correspondence is changed to operation level;
Described MCU also comprises after receiving the command response that this application of IC cards chip returns: will be changed to the dormancy level to power port that should the application of IC cards chip.
14. a method of making the described multi-chip intelligent card of claim 1 is characterized in that, comprising: processing substrate and injection moulding encapsulation, wherein:
Processing substrate specifically comprises: determine each chip and contact position and the annexation in substrate according to the logic connection layout of described multi-chip intelligent card, and make substrate; Each chip is fixed on the relevant position of described substrate; According to described logic connection layout, connect the contact on each chip and the substrate, form the substrate after handling;
The injection moulding encapsulation specifically comprises: the substrate after the described processing is put in the cavity body of mould, and casting resin material in described cavity body of mould, and be heating and curing.
15. method as claimed in claim 14 is characterized in that, described contact comprises and is used for realizing with the smart card contact of terminal communication and is used for the MCU contact of the program that imports to described MCU.
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| CN200910252499A CN101770593A (en) | 2009-12-17 | 2009-12-17 | Multi-chip intelligent card, manufacturing method thereof and data processing method |
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| CN200910252499A CN101770593A (en) | 2009-12-17 | 2009-12-17 | Multi-chip intelligent card, manufacturing method thereof and data processing method |
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| CN101770593A true CN101770593A (en) | 2010-07-07 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2012037894A1 (en) * | 2010-09-26 | 2012-03-29 | 北京握奇数据系统有限公司 | Smart chip and method for smart chip data communications |
| CN103279307A (en) * | 2013-03-26 | 2013-09-04 | 方昌銮 | Data storage method and intelligent storage card based on data storage method |
| CN106874985A (en) * | 2015-12-14 | 2017-06-20 | 北京握奇智能科技有限公司 | A kind of smart card operation device and operating method |
| CN108733487A (en) * | 2018-04-19 | 2018-11-02 | 深圳市文鼎创数据科技有限公司 | The more application management methods of Java card and Java card |
| CN109711519A (en) * | 2018-12-27 | 2019-05-03 | 江苏恒宝智能系统技术有限公司 | A kind of peripheral expansion method and fiscard based on financial chip |
| CN109784433A (en) * | 2018-12-13 | 2019-05-21 | 大唐微电子技术有限公司 | A kind of equipment and its Working mode switching method |
| CN110321725A (en) * | 2019-07-12 | 2019-10-11 | 中孚信息股份有限公司 | A kind of method and device for preventing from distorting system data and clock |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2012037894A1 (en) * | 2010-09-26 | 2012-03-29 | 北京握奇数据系统有限公司 | Smart chip and method for smart chip data communications |
| CN103279307A (en) * | 2013-03-26 | 2013-09-04 | 方昌銮 | Data storage method and intelligent storage card based on data storage method |
| CN103279307B (en) * | 2013-03-26 | 2016-04-13 | 方昌銮 | A kind of date storage method of intelligent memory card |
| CN106874985A (en) * | 2015-12-14 | 2017-06-20 | 北京握奇智能科技有限公司 | A kind of smart card operation device and operating method |
| CN108733487A (en) * | 2018-04-19 | 2018-11-02 | 深圳市文鼎创数据科技有限公司 | The more application management methods of Java card and Java card |
| CN109784433A (en) * | 2018-12-13 | 2019-05-21 | 大唐微电子技术有限公司 | A kind of equipment and its Working mode switching method |
| CN109711519A (en) * | 2018-12-27 | 2019-05-03 | 江苏恒宝智能系统技术有限公司 | A kind of peripheral expansion method and fiscard based on financial chip |
| CN109711519B (en) * | 2018-12-27 | 2022-10-25 | 江苏恒宝智能系统技术有限公司 | Financial chip-based peripheral expansion method and financial card |
| CN110321725A (en) * | 2019-07-12 | 2019-10-11 | 中孚信息股份有限公司 | A kind of method and device for preventing from distorting system data and clock |
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Application publication date: 20100707 |