CN102629656A - 一种具有高散热效果的led封接结构及其封接方法 - Google Patents
一种具有高散热效果的led封接结构及其封接方法 Download PDFInfo
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- CN102629656A CN102629656A CN2012100678542A CN201210067854A CN102629656A CN 102629656 A CN102629656 A CN 102629656A CN 2012100678542 A CN2012100678542 A CN 2012100678542A CN 201210067854 A CN201210067854 A CN 201210067854A CN 102629656 A CN102629656 A CN 102629656A
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CN201210067854.2A CN102629656B (zh) | 2012-03-15 | 2012-03-15 | 一种具有高散热效果的led封接结构及其封接方法 |
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CN201210067854.2A CN102629656B (zh) | 2012-03-15 | 2012-03-15 | 一种具有高散热效果的led封接结构及其封接方法 |
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CN102629656A true CN102629656A (zh) | 2012-08-08 |
CN102629656B CN102629656B (zh) | 2014-12-24 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104925740A (zh) * | 2014-03-19 | 2015-09-23 | 中芯国际集成电路制造(上海)有限公司 | 一种利用激光退火改善热键合质量的方法 |
CN110943153A (zh) * | 2018-09-25 | 2020-03-31 | 山东浪潮华光光电子股份有限公司 | 一种改善led焊线电极可辨识度的处理方法 |
WO2021077538A1 (zh) * | 2019-10-21 | 2021-04-29 | 深圳市华星光电半导体显示技术有限公司 | Led显示面板的制备方法 |
WO2022000385A1 (zh) * | 2020-07-01 | 2022-01-06 | 重庆康佳光电技术研究院有限公司 | 显示面板的制作方法、显示面板及显示装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101050066A (zh) * | 2007-05-11 | 2007-10-10 | 华中科技大学 | 一种硅/玻璃激光局部键合方法 |
JP2009064939A (ja) * | 2007-09-06 | 2009-03-26 | Siix Corp | 表面実装用回路基板及び表面実装用回路基板の形成方法、並びに表面実装形電子部品の実装方法 |
US20090296368A1 (en) * | 2008-05-27 | 2009-12-03 | Ramer David P | Solid state lighting using quantum dots in a liquid |
CN101798054A (zh) * | 2010-05-10 | 2010-08-11 | 北京广微积电科技有限公司 | 微机电器件的晶圆级真空封装方法 |
CN202633386U (zh) * | 2012-03-15 | 2012-12-26 | 苏州晶品光电科技有限公司 | 一种具有高散热效果的led封接结构 |
-
2012
- 2012-03-15 CN CN201210067854.2A patent/CN102629656B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101050066A (zh) * | 2007-05-11 | 2007-10-10 | 华中科技大学 | 一种硅/玻璃激光局部键合方法 |
JP2009064939A (ja) * | 2007-09-06 | 2009-03-26 | Siix Corp | 表面実装用回路基板及び表面実装用回路基板の形成方法、並びに表面実装形電子部品の実装方法 |
US20090296368A1 (en) * | 2008-05-27 | 2009-12-03 | Ramer David P | Solid state lighting using quantum dots in a liquid |
CN101798054A (zh) * | 2010-05-10 | 2010-08-11 | 北京广微积电科技有限公司 | 微机电器件的晶圆级真空封装方法 |
CN202633386U (zh) * | 2012-03-15 | 2012-12-26 | 苏州晶品光电科技有限公司 | 一种具有高散热效果的led封接结构 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104925740A (zh) * | 2014-03-19 | 2015-09-23 | 中芯国际集成电路制造(上海)有限公司 | 一种利用激光退火改善热键合质量的方法 |
CN104925740B (zh) * | 2014-03-19 | 2017-06-16 | 中芯国际集成电路制造(上海)有限公司 | 一种利用激光退火改善热键合质量的方法 |
CN110943153A (zh) * | 2018-09-25 | 2020-03-31 | 山东浪潮华光光电子股份有限公司 | 一种改善led焊线电极可辨识度的处理方法 |
CN110943153B (zh) * | 2018-09-25 | 2021-04-06 | 山东浪潮华光光电子股份有限公司 | 一种改善led焊线电极可辨识度的处理方法 |
WO2021077538A1 (zh) * | 2019-10-21 | 2021-04-29 | 深圳市华星光电半导体显示技术有限公司 | Led显示面板的制备方法 |
US11393947B2 (en) | 2019-10-21 | 2022-07-19 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of fabricating light-emitting diode display panel |
WO2022000385A1 (zh) * | 2020-07-01 | 2022-01-06 | 重庆康佳光电技术研究院有限公司 | 显示面板的制作方法、显示面板及显示装置 |
US12040431B2 (en) | 2020-07-01 | 2024-07-16 | Chongqing Konka Photoelectric Technology Research Institute Co., Ltd. | Method for manufacturing display panel, display panel, and display apparatus |
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CN102629656B (zh) | 2014-12-24 |
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Owner name: SUZHOU JINGPIN ADVANCED MATERIALS CO., LTD. Free format text: FORMER NAME: SUZHOU JINGPIN PHOTOELECTRIC TECHNOLOGY CO., LTD. |
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Address after: Wujiang District of Suzhou City, Jiangsu province 215200 Lili town FENHU Road No. 558 Patentee after: SUZHOU JINGPIN ADVANCED MATERIALS Co.,Ltd. Address before: 215211, Jiangsu, Suzhou province Wujiang Fen Lake Economic Development Zone, Lake Road, No. 558 research and development, building 2, 3 Patentee before: SUZHOU JINGPIN OPTOELECTRONICS Inc. |
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