CN102620134A - Micro wedge angle structure and production method thereof - Google Patents
Micro wedge angle structure and production method thereof Download PDFInfo
- Publication number
- CN102620134A CN102620134A CN2012101010675A CN201210101067A CN102620134A CN 102620134 A CN102620134 A CN 102620134A CN 2012101010675 A CN2012101010675 A CN 2012101010675A CN 201210101067 A CN201210101067 A CN 201210101067A CN 102620134 A CN102620134 A CN 102620134A
- Authority
- CN
- China
- Prior art keywords
- plane
- wedge
- angle
- liquid adhesive
- small angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to a micro wedge angle structure and a production method thereof. The wedge structure comprises a first and second plane (1 and 2) and a wedged adhesive layer (3), wherein the first and second plane (1 and 2) are unparallel and form a micro included angle, and the wedged adhesive layer (3) is filled and adhered between the first and second plane (1 and 2) and formed by means of curing for two or more times. The wedge angle formed by cured adhesive is formed between the two planes by means of curing for multiple times or mechanical positioning during curing, and the two planes are fixedly adhered by means of the adhesive. The formed wedge angle is simple, compact and stable, and multiple separated products can be obtained by cutting adhered components.
Description
Technical field
The present invention relates to a kind of two interplanar small angle of wedge structures and preparation method thereof.
Background technique
Between two planes, forming the small angle of wedge is the effective ways that a kind of offset surface repeatedly reflects.This small angle of wedge generally is made up of two nonparallel planes and filling medium therebetween.Stablize the accurate small angle of wedge at present and generally be through mechanical component and fix or the solid dielectric shaping operation realizes.In many application, particularly the size of element own hour because factors such as bulk and costs, these modes are all inapplicable.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of succinct, compact and stable small angle of wedge structure; Simultaneously, the present invention also provides the preparation method of said small angle of wedge structure.
For realizing goal of the invention of the present invention; The technological scheme that the present invention adopts is: a kind of small angle of wedge structure; First, second plane that comprises two small angles that are not parallel to each other and become is filled and is bonded in wedge shape glue-line between the two and is positioned at the solid-state Jiao Bao of wedge shape glue-line.
Said wedge shape glue-line is through solidifying to form more than twice or twice.
The small angle angle on two planes is through position, number of times, adhesive surface tension force and its infiltration angle on the plane of the Bond of local solidification determine in advance.
The angle of wedge of wedge shape glue-line keeps the relative angle position on two planes to realize through mechanical when solidifying.
Simultaneously, the present invention also provides a kind of preparation method of small angle of wedge structure, and it may further comprise the steps:
A, first planar horizontal is placed, annotate a certain amount of liquid adhesive, make Bond cover the part on first plane in an inclination on first plane;
B, the Bond drop of said part is solidified, form solid-state Jiao Bao;
C, on first plane and solid-state glue wrap even coating liquid adhesive and form the liquid adhesive layer;
D, second plane is covered on the liquid adhesive on first plane, through with the point of contact that solidifies the Jiao Bao and first plane surface, between first, second plane, form the angle of wedge;
The liquid adhesive that e, curing two interplanars are filled forms solid-state wedge shape glue-line, and realizes the bonding on first, second plane.
Among the step b, the thickness of said solid-state Jiao Bao is through wrapping once more injecting glue, curing at the glue that has solidified, and repeating said process repeatedly increases.
Among the step c, through being coated with liquid adhesive simultaneously on second plane to increase the total thickness of liquid adhesive layer.
Compared with prior art, the invention has the beneficial effects as follows:
The present invention proposes a kind of novel small angle of wedge structure and preparation method thereof, mechanical positioning when using Bond to pass through repeatedly to solidify or solidify forms the angle of wedge body that is formed by the Bond that solidifies at two interplanars.This moment, Bond realized that simultaneously the bonding on two planes fixes.The angle of wedge that forms like this is not only succinct, compact and stable, and can obtain the product of a plurality of separation through the assembly cutting to gummed.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Embodiment
Below in conjunction with embodiment the present invention is further described.
As shown in Figure 1,1, a kind of small angle of wedge structure, it comprises first, second plane 1,2 of two small angles that are not parallel to each other and become, fills and is bonded in wedge shape glue-line 3 between the two and be positioned at the solid-state glue bag 4 of wedge shape glue-line 3.
Said wedge shape glue-line 3 is through solidifying to form more than twice or twice.
The small angle angle on two planes is through position, number of times, adhesive surface tension force and its infiltration angle on the plane of the Bond of local solidification determine in advance.
In addition, the angle of wedge of wedge shape glue-line 3 also can keep the relative angle position on two planes to realize through mechanical when solidifying.
The invention also discloses a kind of preparation method of small angle of wedge structure, it may further comprise the steps:
A, with first plane, 1 horizontal positioned, annotate a certain amount of liquid adhesive in an inclination on first plane 1, make Bond cover the part on first plane 1; When Bond was an amount of, its drop height that on first plane 1, forms only depended on adhesive surface tension force and its at the infiltration angle on first plane 1, and what have nothing to do with the Bond that pours into.
B, the Bond drop of said part is solidified, form solid-state Jiao Bao; The thickness of said solid-state Jiao Bao is through wrapping once more injecting glue, curing at the glue that has solidified, and repeating said process repeatedly increases.
C, after needing the solid-state Jiao Bao of height in the side acquisition on first plane 1, evenly the coating liquid adhesive forms the liquid adhesive layer on first plane 1 and solid-state glue bag 4; The thickness of liquid adhesive layer can be through being coated with liquid adhesives to increase its total thickness on second plane 2 simultaneously.
D, second plane 2 is covered on the liquid adhesive on first plane (1), through with the point of contact that solidifies Jiao Bao and first plane (1) surface, between first, second plane (1,2), form the angle of wedge;
E, guaranteeing that two interplanars are full of liquid adhesive, when not having bubble or space, solidifying the liquid adhesive that two interplanars are filled, forming solid-state wedge shape glue-line, and realize the bonding of first, second plane (1,2).
Claims (7)
1. a small angle of wedge structure is characterized in that, comprises first, second plane (1,2) of two small angles that are not parallel to each other and become, fills and is bonded in wedge shape glue-line (3) between the two and be positioned at the solid-state Jiao Bao (4) of wedge shape glue-line (3).
2. small angle of wedge structure according to claim 1 is characterized in that said wedge shape glue-line (3) is through solidifying to form more than twice or twice.
3. small angle of wedge structure according to claim 1 is characterized in that, the small angle angle on two planes is through position, number of times, adhesive surface tension force and its infiltration angle on the plane of the Bond of local solidification determine in advance.
4. small angle of wedge structure according to claim 1 is characterized in that, the angle of wedge of wedge shape glue-line (3) keeps the relative angle position on two planes to realize through mechanical when solidifying.
5. the preparation method of a small angle of wedge structure is characterized in that, may further comprise the steps:
A, with first plane (1) horizontal positioned, annotate a certain amount of liquid adhesive in an inclination of first plane (1), make Bond cover the part of first plane (1);
B, the Bond drop of said part is solidified, form solid-state Jiao Bao (4);
C, go up evenly at first plane (1) and solid-state Jiao Bao (4) that the coating liquid adhesive forms the liquid adhesive layer;
D, second plane (2) are covered on the liquid adhesive on first plane (1), through with the point of contact that solidifies Jiao Bao and first plane (1) surface, between first, second plane (1,2), form the angle of wedge;
The liquid adhesive that e, curing two interplanars are filled forms solid-state wedge shape glue-line (3), and realizes the bonding of first, second plane (1,2).
6. the preparation method of small angle of wedge structure according to claim 5 is characterized in that, among the step b, the thickness of said solid-state Jiao Bao is through wrapping once more injecting glue, curing at the glue that has solidified, and repeating said process repeatedly increases.
7. the preparation method of small angle of wedge structure according to claim 5 is characterized in that, among the step c, through being coated with liquid adhesive to increase the total thickness of liquid adhesive layer in second plane (2) simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101010675A CN102620134A (en) | 2012-04-09 | 2012-04-09 | Micro wedge angle structure and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101010675A CN102620134A (en) | 2012-04-09 | 2012-04-09 | Micro wedge angle structure and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102620134A true CN102620134A (en) | 2012-08-01 |
Family
ID=46560245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101010675A Pending CN102620134A (en) | 2012-04-09 | 2012-04-09 | Micro wedge angle structure and production method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102620134A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113924422A (en) * | 2019-07-05 | 2022-01-11 | 欧姆龙株式会社 | Method for producing bonded article and bonded article |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1749810A (en) * | 2005-08-30 | 2006-03-22 | 中国工程物理研究院流体物理研究所 | Chiral liquid crystal depolarizer and its preparing method |
| US20060234067A1 (en) * | 2005-04-15 | 2006-10-19 | Klaser Technology Inc. | Laser gilding film containing curing coating and manufacture thereof |
| CN101317205A (en) * | 2005-11-29 | 2008-12-03 | 精工电子有限公司 | Process for producing display and method of laminating |
| CN101968587A (en) * | 2010-10-12 | 2011-02-09 | 友达光电股份有限公司 | Three-dimensional monitor and image display method thereof |
| CN201820036U (en) * | 2010-01-22 | 2011-05-04 | 红蝶科技(深圳)有限公司 | Wide-angle polarization spectrometer and optical projection engine using same |
-
2012
- 2012-04-09 CN CN2012101010675A patent/CN102620134A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060234067A1 (en) * | 2005-04-15 | 2006-10-19 | Klaser Technology Inc. | Laser gilding film containing curing coating and manufacture thereof |
| CN1749810A (en) * | 2005-08-30 | 2006-03-22 | 中国工程物理研究院流体物理研究所 | Chiral liquid crystal depolarizer and its preparing method |
| CN101317205A (en) * | 2005-11-29 | 2008-12-03 | 精工电子有限公司 | Process for producing display and method of laminating |
| CN201820036U (en) * | 2010-01-22 | 2011-05-04 | 红蝶科技(深圳)有限公司 | Wide-angle polarization spectrometer and optical projection engine using same |
| CN101968587A (en) * | 2010-10-12 | 2011-02-09 | 友达光电股份有限公司 | Three-dimensional monitor and image display method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113924422A (en) * | 2019-07-05 | 2022-01-11 | 欧姆龙株式会社 | Method for producing bonded article and bonded article |
| CN113924422B (en) * | 2019-07-05 | 2023-08-11 | 欧姆龙株式会社 | Method for producing bonded article, and bonded article |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205282469U (en) | Electron device and semiconductor package body | |
| WO2008136352A1 (en) | Method for bonding semiconductor wafers and method for manufacturing semiconductor device | |
| CN102545427B (en) | Permanent magnet motor and manufacture method thereof | |
| CN104637927B (en) | A kind of three-dimension packaging structure and process based on flexible base board | |
| CN102705433A (en) | Intelligent vibration absorption device combining passive damping with active damping | |
| CN103022321B (en) | Chip LED and manufacturing method thereof | |
| RU2013155923A (en) | STRUCTURED ABRASIVE PRODUCTS AND METHOD FOR PRODUCING THEM | |
| EP2211383A3 (en) | Metal bonded nanotube array | |
| CN102543899B (en) | Flexible encapsulating substrate and preparation method thereof | |
| JP2012009782A5 (en) | ||
| RU2018141189A (en) | METHOD FOR PRODUCING A LAMINATE CONTAINING TWO-COMPONENT ADHESIVE COMPOSITION WITHOUT SOLVENT, INCLUDING AN INITIED POLYOL | |
| CN108231700A (en) | Chip-packaging structure and method | |
| CN105190876A (en) | Semiconductor device and method for producing same | |
| CN108140623A (en) | A kind of fingerprint recognition module and preparation method thereof | |
| CN102620134A (en) | Micro wedge angle structure and production method thereof | |
| JP5298905B2 (en) | Manufacturing method of split permanent magnet and electric motor using the split permanent magnet | |
| TWI230426B (en) | Packaging method of integrated circuit | |
| JP2009222415A5 (en) | ||
| CN102097340A (en) | Method for manufacturing SMD (surface mounted device) by COB (chip on board) glue filling and encapsulating | |
| WO2008061101A3 (en) | Method and apparatus for localized bonding | |
| CN102956575A (en) | Package structure and manufacture method thereof | |
| CN107768395A (en) | Oversize optical image sensor chip load process and suction nozzle | |
| CN104241144A (en) | Chip plastic package structure manufacturing method | |
| CN104801190B (en) | Hollow fiber membrane cartridge encapsulating die and its application method | |
| WO2005084854A1 (en) | Hollow metallic sphere structure body, hollow metallic sphere formed body, and method of producing hollow metallic shpere structure body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120801 |