CN102605396A - Application of ultrasonic waves in electroplating process - Google Patents
Application of ultrasonic waves in electroplating process Download PDFInfo
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- CN102605396A CN102605396A CN2012101128658A CN201210112865A CN102605396A CN 102605396 A CN102605396 A CN 102605396A CN 2012101128658 A CN2012101128658 A CN 2012101128658A CN 201210112865 A CN201210112865 A CN 201210112865A CN 102605396 A CN102605396 A CN 102605396A
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- ultrasonic
- electroplating process
- ultrasonic waves
- cathode
- crystal
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Abstract
The invention provides an application of ultrasonic waves in an electroplating process. In the electroplating process, an ultrasonic amplitude transformer extends into electroplating liquid for continuous ultrasonic treatment with an ultrasonic power of 400-600 W. The ultrasonic application provided by the invention has the technical effects as follows: the concentrations of metal ions which are close to a cathode are balanced by increasing the current density due to ultrasonic stirring, so that no leakage of the metal ions which are close to the cathode is caused, and the concentration polarization is reduced; and hydrogen on the surface of the cathode is easy to overflow by improving the light intensity, so that the quantity of spurs and needle holes are reduced, and a plated layer with thinner and uniform crystallization grains is obtained. The ultrasonic waves are applied to ultrathin coil foil preparation, so that the surface of a copper foil is flatter, compact and uniform in thickness, the combination between the surface of the copper foil and a base body is good, and the quality of the plated layer is effectively improved. Furthermore, the generation rate of the crystal can be accelerated due to the introduction of the ultrasonic waves, so as to prevent coalescence from occurring. Meanwhile, the structure of the crystal can be modified, so as to improve the properties of the crystal product.
Description
Technical field
The present invention relates to a kind of hyperacoustic application, relate in particular to the application of a kind of UW in electroplating process.
Background technology
Common stirring action in the electroplating process; Move, rotate stirring, mechanical stirring and hand mixing mode etc. such as circulate like negative electrode, all can only reduce near the thickness of the diffusion layer negative electrode to a certain extent, its stirring action can not directly arrive electrode surface; Thereby; Still have certain thickness diffusion layer to exist near the electrode surface, the solution in the diffusion layer remains immobilized, and convection current does not take place.
Summary of the invention
The object of the present invention is to provide the application of a kind of UW in electroplating process, ultrasonic vibration and cavitation phenomenon are equivalent to plating bath has been applied a thundering extremely intensive stirring action.The intense impact ripple that cavitation phenomenon produces acts near the diffusion layer the electrode; Produce the intensive stirring action, this effect has reached electrode surface, makes diffusion layer almost not exist; Improve the effective concentration of metals ion in the electroplate liquid greatly, quickened electrodeposition process.
The present invention realizes like this, in electroplating process, ultrasonic amplitude transformer is stretched into lasting supersound process in the electroplate liquid, and ultrasonic power is 400W～600W.
Technique effect of the present invention is: when adopting ultrasonic stirring, can increase current density, make near the concentration of metal ions of negative electrode balanced, not cause near the metals ion of negative electrode to lack, reduce concentration polarization; Improve luminance brightness, and make the hydrogen of cathode surface be easy to overflow, reduce burr and pin hole, obtain more tiny, the uniform coating of crystalline particle.Using ultrasound ripple in the extra thin copper foil preparation makes copper foil surface more smooth, fine and close, and thickness is even, and is good with matrix bond, improved quality of coating effectively.In addition, hyperacoustic inducing one can be accelerated the crystalline growth velocity, prevents the generation of coalescence, can also change the crystalline structure simultaneously, thereby improves the performance of crystalline product.
Embodiment
Embodiment 1
The present invention realizes like this, in electroplating process, ultrasonic amplitude transformer is stretched into lasting supersound process in the electroplate liquid, and ultrasonic power is 400W.
Embodiment 2
The present invention realizes like this, in electroplating process, ultrasonic amplitude transformer is stretched into lasting supersound process in the electroplate liquid, and ultrasonic power is 500W.
Embodiment 3
The present invention realizes like this, in electroplating process, ultrasonic amplitude transformer is stretched into lasting supersound process in the electroplate liquid, and ultrasonic power is 600W.
Claims (1)
1. the application of UW in electroplating process is characterized in that in electroplating process, ultrasonic amplitude transformer stretched into continue supersound process in the electroplate liquid, and ultrasonic power is 400W～600W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101128658A CN102605396A (en) | 2012-04-18 | 2012-04-18 | Application of ultrasonic waves in electroplating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101128658A CN102605396A (en) | 2012-04-18 | 2012-04-18 | Application of ultrasonic waves in electroplating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102605396A true CN102605396A (en) | 2012-07-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101128658A Pending CN102605396A (en) | 2012-04-18 | 2012-04-18 | Application of ultrasonic waves in electroplating process |
Country Status (1)
| Country | Link |
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| CN (1) | CN102605396A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103643269A (en) * | 2013-11-11 | 2014-03-19 | 江西省首诺铜业有限公司 | Process of ultrasonic wave electroplating of copper foil |
| CN103882483A (en) * | 2014-04-11 | 2014-06-25 | 集美大学 | Device and method for making high-reflectance microprism working mold |
| CN106011962A (en) * | 2016-07-13 | 2016-10-12 | 中南大学 | TSV electroplating method and TSV electroplating system under action of ultrasonic outfield |
| CN110791789A (en) * | 2019-11-26 | 2020-02-14 | 湖州努特表面处理科技有限公司 | Ultrasonic wave integrated silver plating method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101122044A (en) * | 2007-05-16 | 2008-02-13 | 深圳清华大学研究院 | Nickel-base composite coat containing nano diamond and ultrasound wave auxiliary preparation method thereof |
| CN101392394A (en) * | 2008-10-10 | 2009-03-25 | 中南大学 | Method for electrodepositing chromium and chromium alloy composite coating through ultrasound-pulse for trivalent chromium plating liquid system |
-
2012
- 2012-04-18 CN CN2012101128658A patent/CN102605396A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101122044A (en) * | 2007-05-16 | 2008-02-13 | 深圳清华大学研究院 | Nickel-base composite coat containing nano diamond and ultrasound wave auxiliary preparation method thereof |
| CN101392394A (en) * | 2008-10-10 | 2009-03-25 | 中南大学 | Method for electrodepositing chromium and chromium alloy composite coating through ultrasound-pulse for trivalent chromium plating liquid system |
Non-Patent Citations (5)
| Title |
|---|
| 何龙等: ""超声波在电镀技术中应用"", 《电镀与精饰》, vol. 33, no. 7, 31 July 2011 (2011-07-31), pages 29 - 34 * |
| 方小红: ""超声波电镀镍及镍基复合镀层的研究进展"", 《材料保护》, vol. 41, no. 5, 31 May 2008 (2008-05-31), pages 58 - 61 * |
| 曹凤国: "《超声加工技术》", 31 January 2005, article "超声加工技术", pages: 171 * |
| 王秦生等: ""超声波强化电镀过程及改善镀层质量的机理"", 《金刚石与磨料磨具工程》, no. 4, 31 August 2003 (2003-08-31), pages 32 - 2 * |
| 程敬泉等: ""超声波在电化学中的应用"", 《电镀与精饰》, vol. 27, no. 1, 31 January 2005 (2005-01-31) * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103643269A (en) * | 2013-11-11 | 2014-03-19 | 江西省首诺铜业有限公司 | Process of ultrasonic wave electroplating of copper foil |
| CN103882483A (en) * | 2014-04-11 | 2014-06-25 | 集美大学 | Device and method for making high-reflectance microprism working mold |
| CN103882483B (en) * | 2014-04-11 | 2016-06-15 | 集美大学 | High reflectance microprism Working mould preparation facilities and its preparation method |
| CN106011962A (en) * | 2016-07-13 | 2016-10-12 | 中南大学 | TSV electroplating method and TSV electroplating system under action of ultrasonic outfield |
| CN110791789A (en) * | 2019-11-26 | 2020-02-14 | 湖州努特表面处理科技有限公司 | Ultrasonic wave integrated silver plating method |
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Application publication date: 20120725 |