CN102601549B - Apparatus, method and system for determining a filling ratio of flux - Google Patents
Apparatus, method and system for determining a filling ratio of flux Download PDFInfo
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- CN102601549B CN102601549B CN201210014749.2A CN201210014749A CN102601549B CN 102601549 B CN102601549 B CN 102601549B CN 201210014749 A CN201210014749 A CN 201210014749A CN 102601549 B CN102601549 B CN 102601549B
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- solder flux
- filling rate
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- belt plate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
- B23K35/406—Filled tubular wire or rods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/44—Arrangements for executing specific programs
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- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonmetallic Welding Materials (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides an apparatus, method and system for determining a filling ratio of flux, and computer readable storage medium for recording program of determining a filling ratio of flux, which has the advantages of high calculated accuracy, excellent accuracy in detecting abnormal products and superior productivity and comprises an input part. Through the input part, the coordinates for the flux upper surface are input. The coordinates for the flux upper surface are measured immediately after the filling of a first sensor arranged above a metal band plate filled with the flux. The invention also comprises a storage part for storing the coordinates for the inner surface of the metal band plate, the quality of the metal band plate, the ratio of the flux and the allowable range for the filling of the flux; a flux cross section area calculating part for calculating the cross section area of the flux according to the coordinates for the flux upper surface and the coordinates for the inner surface of the metal band plate; a flux filling ratio calculating part for calculating the flux filling ratio according to the cross section area of the flux, the flux density and the quality of the metal band plate; and a judging part for determining the flux filling ratio to be good or bad.
Description
Technical field
The present invention relates to the solder flux filling rate decision maker that the manufacturing installation of the flux-cored wire of wire for arc welding that a kind of full-automatic or semi-automatic welding that is suitable for using uses etc. uses in the welding of mild steel, high tension steel, stainless steel or heat resisting steel etc., use the solder flux filling rate decision method of this device, solder flux filling rate decision-making system and solder flux filling rate decision procedure.
Background technology
Flux-cored wire is according to following such manufacture method manufacture.First, by metal belt plate, from the both sides bending forming of plate width direction, be U-shaped, at bending forming the inside filling flux of metal belt plate.Then, the metal belt plate that is filled with solder flux is configured as to tubulose and makes metal crust processed, afterwards, by stretching, make the thin footpath of metal crust processed to specified diameter, manufacture and form along its length jointed flux-cored wire.And, in the manufacture of such flux-cored wire, because solder flux supply unit (BF) is abnormal, the balance of metal belt plate feed speed and solder flux quantity delivered is abnormal, the abnormal vibration of equipment or material etc., produce sometimes not the part of filling flux or the part that solder flux filling rate (solder flux is with respect to the quality % of the welding wire total quality of per unit length) does not meet allowed band.Therefore, need to find and get rid of butt welding and connect quality and bring dysgenic this solder flux filling rate abnormal article, using and do not make it as product, sneak into.
At present, inspection and method for removing as solder flux filling rate abnormal article, there is following method: from the sample of the flux-cored wire intercepting specific length as product, by this sample is carried out to destructive inspection, directly measure quality, volume or the area of section etc. of solder flux, according to its value, calculate solder flux filling rate, and according to this check result, get rid of the abnormal article of solder flux filling rate.Such inspection is owing to being selective examination, so compare the problem that has poor reliability with exhaustive test.In addition, such inspection is owing to being to carry out destructive inspection by staff, so need the long activity duration, its working load is also large, and determine to produce and check abnormal reason and until the abnormal manufacture batch before correcting is rejected, also have the problem of productivity ratio step-down.
In order to address this is that, hope by checking solder flux filling rate with non-destruction and online mode, is got rid of the abnormal article of solder flux filling rate in welding wire manufacture.As the solder flux filling rate checkout gear for this object, in patent documentation 1, propose a kind of as lower device: flux-cored wire is worn in coil, utilized electromagnetic induction phenomenon to calculate solder flux filling rate, by the solder flux filling rate of calculating, detect abnormal article.
Specifically, when coil is connected with to the alternating current of high frequency, at the metal crust processed of flux-cored wire, produce induced-current because of electromagnetic induction, due to the magnetic field producing by this induced-current, the impedance of coil changes.And, in the flux-cored wire of manufacturing by stretching, while because the outside diameter of metal crust processed is limited to be stretched, so metal crust processed exists the tendency that will bloat to internal side diameter.Therefore, if the loading of solder flux is few, there is the tendency of thickening in the wall thickness of metal crust processed, if the loading of solder flux is many, the wall thickness of metal crust processed exists the tendency of attenuation.In addition, the impedance of coil at the wall thickness thickening of metal crust processed, be that solder flux filling rate can significantly reduce while declining.Therefore,, in patent documentation 1, the solder flux filling rate of flux-cored wire is calculated in the variation of the impedance by coil.
Prior art document
Patent documentation
Patent documentation 1:JP Unexamined Patent 9-239588 communique
But, the faradic variable quantity producing by aforesaid electromagnetic induction, be effective degree while being the having or not of the variable quantity of impedance of the coil solder flux in differentiating welding wire, but it can not hold solder flux filling rate quantitatively, solder flux filling rate to calculate precision low.Therefore,, although can detect the not abnormal article of filling flux, even if be filled with solder flux, also cannot detect the abnormal article that solder flux filling rate surpasses allowed band.Therefore,, in the solder flux filling rate checkout gear of patent documentation 1, exist the accuracy of detection of solder flux filling rate low, also low problem of the accuracy of detection of abnormal article.
In addition, in the solder flux filling rate checkout gear of patent documentation 1, as previously mentioned, due to solder flux filling rate to calculate precision low, so in the situation that fluxless being detected and filling product, be after stopping manufacturing installation, by the destructive inspection of the product manufactured, measure solder flux filling rate.Result is, when noting abnormalities product at every turn, need to trace back to normal product and remove abnormal article, exists fabrication yield to decline, and produces the problem of rate variance.
Summary of the invention
Therefore, the present invention proposes in order to address this is that, its problem that will solve is to provide a kind of when the manufacturing installation for flux-cored wire, solder flux filling rate to calculate precision high, the accuracy of detection of abnormal article is superior thus, and productivity ratio is superior solder flux filling rate decision maker also, use solder flux filling rate decision method and the solder flux filling rate decision-making system of this device, and solder flux filling rate decision procedure.
In order to solve described problem, the present invention relates to a kind of solder flux filling rate decision maker, its manufacturing installation that is disposed at manufacture flux-cored wire is judged solder flux filling rate, described manufacturing installation is at the inside of the metal belt plate along plate width direction bending filling flux, and this metal belt plate is configured as to tubulose manufactures flux-cored wire, it is characterized in that, solder flux filling rate decision maker possesses:
Input part, its input solder flux upper surface coordinate, this solder flux upper surface coordinate is the solder flux upper surface coordinate by the plate width direction of this metal belt plate of measuring after this solder flux is filled in the sensor of top with respect to the plate surface configuration that is filled with the metal belt plate of described solder flux at once;
Storage part, it stores the allowed band of metal belt plate inner surface coordinate, predefined metal belt plate quality, solder flux proportion and solder flux filling rate of plate width direction of the metal belt plate of the not filling flux of being measured by described sensor;
Solder flux area of section calculating section, it calculates solder flux area of section by described solder flux upper surface coordinate and described metal belt plate inner surface coordinate;
Solder flux filling rate calculating section, it carries out integration to described solder flux area of section in specific length, calculate solder flux fill volume, and this solder flux fill volume is scaled to solder flux filling quality according to described solder flux proportion, by this solder flux filling quality and described metal belt plate quality, calculate solder flux filling rate; And
Judging part, its situation that described solder flux filling rate of calculating is met to the allowed band of described solder flux filling rate is judged as well, and ungratified situation is judged as bad.
According to described structure, by sensor, measure solder flux upper surface coordinate and metal belt plate inner surface coordinate, use these surface coordinates, in solder flux area of section calculating section, calculate solder flux area of section, use this solder flux area of section to calculate solder flux filling rate in solder flux filling rate calculating section.Therefore, the solder flux filling rate of calculating is owing to being to calculate according to the such physical quantity that has a direct relation with solder flux filling rate of solder flux area of section, so compare according to the such technology that exists the physical quantity of indirect relation to infer with solder flux filling rate of the induced-current producing at welding wire like that with prior art, calculate precision and uprise, the accuracy of detection of the abnormal article of solder flux filling rate improves.Therefore, in the situation that abnormal article being detected, need not as prior art, implement the destructive inspection of product, therefore, not have the situation of the finished product rate decline causing because of destructive inspection, the productivity ratio of welding wire improves.In addition, calculating the solder flux upper surface coordinate that uses on solder flux area of section owing to being the amount of measuring after solder flux before the tubulose of metal belt plate is shaped is filled at once, therefore even in the situation that finding abnormal article, abnormal article involve narrow range, the productivity ratio of welding wire further improves.
The solder flux filling rate decision maker the present invention relates to is characterised in that, in described solder flux filling rate decision maker, at described input part, input: by fill the solder flux upper surface coordinate of the plate width direction of rear this metal belt plate of measuring with respect to the plate surface configuration that is filled with the metal belt plate of described solder flux at this solder flux in the first sensor of top at once; By fill the metal belt plate outer surface coordinate of the plate width direction of rear this metal belt plate of measuring with respect to the plate surface configuration that is filled with the metal belt plate of described solder flux at this solder flux in the second sensor of below at once, at described storage part, also store the metal belt plate area of section of the plate width direction of the metal belt plate of not filling described solder flux, in described solder flux area of section calculating section, by described solder flux upper surface coordinate and described metal belt plate outer surface coordinate, calculate total cross-sectional area, by this total cross-sectional area and described metal belt plate area of section, calculate solder flux area of section.
According to described structure, by first sensor and the second sensor, measure solder flux upper surface coordinate and metal belt plate outer surface coordinate, use these surface coordinates and be pre-stored within the metal belt plate area of section in storage part, in solder flux area of section calculating section, calculate total cross-sectional area and solder flux area of section, use this solder flux area of section to calculate solder flux filling rate in solder flux filling rate calculating section.Therefore, the solder flux filling rate of calculating due to described solder flux filling rate control device be according to have the physical quantity of direct relation with solder flux filling rate be that solder flux area of section is calculated equally, therefore solder flux filling rate to calculate precision high, the accuracy of detection of the abnormal article of solder flux filling rate improves, and the productivity ratio of welding wire improves.
In addition, owing to measuring solder flux upper surface coordinate and these two surface coordinates of metal belt plate outer surface coordinate, so be in the situation that because of the vibration in flowing etc. make metal belt plate up and down, left and right or oblique movement, can not bring impact to calculating the solder flux area of section of the movement of this metal belt plate yet.Therefore, solder flux filling rate to calculate precision high, the accuracy of detection of the abnormal article of solder flux filling rate improves.And then, same with described solder flux filling rate control device, because the adopted solder flux upper surface coordinate of calculating of solder flux filling rate and these two surface coordinates of metal belt plate outer surface coordinate are to measure after solder flux before metal belt plate is configured as tubulose is filled at once, so the productivity ratio of welding wire further improves.
The solder flux filling rate of calculating described in the described judging part of the preferred described solder flux filling rate decision maker of solder flux filling rate decision maker the present invention relates to is on this solder flux filling rate, further to add the correction value of regulation and the filling rate that obtains.
According to described structure, the solder flux filling rate in judging part is further to have added correction value and the filling rate that obtains, therefore, solder flux filling rate to calculate precision higher, the accuracy of detection of the abnormal article of solder flux filling rate further improves.
The present invention relates to a kind of solder flux filling rate decision method, it judges solder flux filling rate with described solder flux filling rate decision maker, it is characterized in that, comprising:
First step, in this step, inputs to input part by the surface coordinates of the plate width direction of the metal belt plate that is filled with described solder flux of being measured after solder flux is filled by described sensor at once, and these surface coordinates is exported to solder flux area of section calculating section;
Second step, in this step, is used in the described surface coordinates of described first step output and calculates solder flux area of section in described solder flux area of section calculating section, and this solder flux area of section is exported to solder flux filling rate calculating section;
Third step, in this step, in described solder flux filling rate calculating section, the described solder flux area of section in described second step output is carried out to integration in specific length, calculate solder flux fill volume, this solder flux fill volume is scaled to solder flux filling quality to be stored in the solder flux proportion of described storage part, by this solder flux filling quality and the metal belt plate quality that is stored in described storage part, calculate solder flux filling rate, and this solder flux filling rate is exported to described judging part;
The 4th step, in this step, at described judging part, for the described solder flux filling rate in described third step output and the allowed band that is stored in the solder flux filling rate of described storage part, compare, judge that described solder flux filling rate is good or bad, be judged as the work that stops described manufacturing installation bad in the situation that.
According to described order, the surface coordinates of the plate width direction of the metal belt plate that is filled with solder flux of being measured by sensor in first step input, use these surface coordinates to calculate solder flux area of section at second step, use this solder flux picture area to calculate solder flux filling rate at third step.Therefore, the solder flux filling rate of calculating due to be from solder flux area of section such have the physical quantity of direct relation to calculate with solder flux filling rate, so solder flux filling rate to calculate precision high, the accuracy of detection of the abnormal article of solder flux filling rate improves.Therefore, in the situation that abnormal article being detected, need not as prior art, implement the destructive inspection of product, therefore, the productivity ratio of welding wire improves.In addition, in the surface coordinates of first step input owing to being the amount of measuring after solder flux before the tubulose of metal belt plate is shaped is filled at once, even therefore in the situation that finding abnormal article, abnormal article involve narrow range, the productivity ratio of welding wire further improves.And then, for the solder flux filling rate of calculating at third step, in the 4th step, judge that it is good or bad, stop the work of manufacturing installation being judged as bad in the situation that, or search abnormal cause, therefore abnormal article involve narrow range, the productivity ratio of welding wire further improves.
The present invention relates to a kind of solder flux filling rate decision-making system, it is characterized in that possessing:
Manufacturing installation, it is at the inside of the metal belt plate along plate width direction bending filling flux, and this metal belt plate is configured as to tubulose, manufactures thus flux-cored wire;
Solder flux filling rate decision maker described in technical scheme 1 or 3, it is disposed at described manufacturing installation, judges solder flux filling rate; And
Sensor, it is disposed at described manufacturing installation, fills the surface coordinates of the plate width direction of the metal belt plate that is filled with described solder flux that is determined at afterwards described solder flux filling rate decision maker employing at once at described solder flux.
According to described structure, owing to possessing to use at solder flux, fill the solder flux filling rate decision maker that the rear surface coordinates of the plate width direction of the metal belt plate that is filled with solder flux of mensuration are at once judged solder flux filling rate, so can from surface coordinates calculate solder flux area of section such have the physical quantity of direct relation with solder flux filling rate, can calculate, judge solder flux filling rate from this solder flux area of section, so the precision of calculating of solder flux filling rate uprises, the accuracy of detection of the abnormal article of solder flux filling rate improves, and the productivity ratio of welding wire also improves.
The present invention relates to a kind of solder flux filling rate decision procedure, it is in order to judge solder flux filling rate in the manufacturing installation manufacturing flux-cored wire, the computer that possesses storage part is worked, wherein as input part, solder flux area of section calculating section, solder flux filling rate calculating section and judging part
Manufacturing installation is by the inside of the metal belt plate along plate width direction bending filling flux, and this metal belt plate is configured as to tubulose manufactures flux-cored wire;
Storage portion stores has the allowed band of predefined metal belt plate quality, solder flux proportion and solder flux filling rate;
The surface coordinates of the plate width direction of the metal belt plate that is filled with this solder flux of at once being measured after described solder flux is filled by sensor in input part input;
Solder flux area of section calculating section is used described surface coordinates to calculate solder flux area of section;
Solder flux filling rate calculating section is carried out integration to described solder flux area of section in specific length, calculate solder flux fill volume, this solder flux fill volume is scaled to solder flux filling quality according to described solder flux proportion, by this solder flux filling quality and described metal belt plate quality, calculates solder flux filling rate;
The situation that judging part meets the allowed band of described solder flux filling rate by described solder flux filling rate of calculating is judged as well, and ungratified situation is judged as bad.
According to described structure, the surface coordinates of the plate width direction of the metal belt plate that is filled with solder flux that use is measured after solder flux is filled at once, can calculate solder flux area of section such have the physical quantity of direct relation with solder flux filling rate, can use this solder flux area of section to calculate solder flux filling rate, so the precision of calculating of solder flux filling rate uprises, the accuracy of detection of the abnormal article of solder flux filling rate improves, and the productivity ratio of welding wire also improves.
Invention effect
According to the present invention, can provide a kind of when the manufacturing installation for flux-cored wire, solder flux filling rate to calculate precision high, the accuracy of detection of abnormal article is superior thus, and productivity ratio is superior solder flux filling rate decision maker also, use solder flux filling rate decision method and the solder flux filling rate decision-making system of this device, and solder flux filling rate decision procedure.
Accompanying drawing explanation
Fig. 1 means the block diagram of the structure of the solder flux filling rate decision maker the present invention relates to;
Fig. 2 (a), (b) mean the figure of the calculation method of solder flux area of section of the present invention, mean the ideograph of the real picture of surface coordinates;
Fig. 3 (a), (b) mean the figure of other calculation methods of solder flux area of section of the present invention, mean the ideograph of the real picture of surface coordinates;
Fig. 4 means the process flow of the order of the solder flux filling rate decision method the present invention relates to;
Fig. 5 (a), (b) mean the ideograph of the structure of the solder flux filling rate decision-making system the present invention relates to.
In figure
1,1A decision maker
2 input parts
3 storage parts
4 solder flux area of section calculating sections
5 solder flux filling rate calculating sections
6 judging parts
10 sensors
10a first sensor
10b the second sensor
101 metal belt plates
101A solder flux infill panel
101C flux-cored wire
102 solder flux
200 manufacturing installations
300 decision-making systems
ZF solder flux upper surface coordinate
ZMa metal belt plate inner surface coordinate
ZMb metal belt plate outer surface coordinate
The specific embodiment
Below with reference to accompanying drawing, describe the embodiment of solder flux filling rate decision maker, solder flux filling rate decision method, solder flux filling rate decision-making system and the solder flux filling rate decision procedure that the present invention relates in detail.
< solder flux filling rate decision maker >
First, for the solder flux filling rate decision maker the present invention relates to, describe.
As shown in Fig. 5 (a), (b), solder flux filling rate decision maker of the present invention is (following, be called decision maker) 1 be disposed at manufacturing installation 200 and judge solder flux filling rate, manufacturing installation 200 is by the inside filling flux 102 at the metal belt plate 101 along plate width direction bending, and this metal belt plate 101 is configured as to tubulose, manufacture flux-cored wire 101C.
At this, the quality that so-called solder flux filling rate is solder flux 102 is with respect to the percentage (quality %) of the all-mass of the flux-cored wire 101C of per unit length.
The manufacturing installation 200 that configures decision maker 1 of the present invention possesses: the first forming machine 201, and it makes metal belt plate 101 crooked on plate width direction; Solder flux filling machine 202, its in bending the inside filling flux 102 of metal belt plate 101; The second forming machine 203, it is configured as tubulose by the metal belt plate 101 (following, to be called solder flux infill panel 101A) that is filled with solder flux 102, manufactures the flux cored wire 101B that is formed with along its length seam 104; And stretching-machine 207, its external diameter by flux cored wire 101B is stretched to product diameter, thus the inside that is manufactured on the metal sheath 103 in thin footpath is filled with the flux-cored wire 101C of solder flux 102.
In addition, manufacturing installation 200 can be still possess by the flux-cored wire 101C of manufacture be rolled into coiled type coiling machine 208, coating machine with lubricator and remove the structure of machine (not shown) is shaped.
In manufacturing installation 200, the first forming machine 201 and the second forming machine 203 can use forming rolls etc., solder flux filling machine 202 can be used apron feeder, smooth auto-feeder, desk-top batcher, spring oscillating feeder (シ Application ト ロ Application Off イ mono-タ mono-) etc., stretching-machine 207 can use the stretching-machine that is connected in series with a plurality of extension sections, and wherein extension section consists of with capstan winch 206 roller die (roller dice) 204 or casement 205.
In order to calculate solder flux filling rate by decision maker 1, at manufacturing installation 200, dispose the sensor 10 of the surface coordinates of the thickness of slab direction of measuring solder flux infill panel 101A.In addition, in order to measure the surface coordinates of the thickness of slab direction of solder flux infill panel 101A after filling at solder flux 102, sensor 10 is configured between solder flux filling machine 202 and the second forming machine 203 at once.
As shown in Figure 1, the decision maker 1 of the first embodiment of the present invention be characterised in that possess input part 2, storage part 3, solder flux area of section calculating section 4, solder flux filling rate calculating section 5, judging part 6.And in the decision maker 1 of the first embodiment, 10 of sensors form (with reference to figure 5 (a), (b)) by the first sensor 10a configuring above the plate surface at solder flux infill panel 101A.Below, each structure is described.
(input part)
At input part 2, the surface coordinates (with reference to figure 2 (a)) of the solder flux upper surface coordinate ZF of the plate width direction of solder flux infill panel 101A, the curved surface of being described by the upper surface of the solder flux 102 of filling are inputted from described first sensor 10a, and this solder flux upper surface coordinate ZF is exported to solder flux area of section calculating section 4.In addition, by first sensor 10a, measure solder flux upper surface coordinate ZF and for example use laser extensometer, the thickness of slab direction of this laser extensometer from first sensor 10a to solder flux infill panel 101A is with predetermined distance or penetrate continuously laser, by the reverberation of measuring from determination object thing, carries out coordinate measuring.At solder flux upper surface coordinate ZF, plate width direction is X-axis coordinate, and thickness of slab direction is Y-axis coordinate.And solder flux upper surface coordinate ZF can be also by the external diameter of solder flux infill panel 101A, the surface coordinates in the confined scope in predefined inspection area (with reference to figure 2 (a)) such as external diameter of flux-cored wire 101C, solder flux filling rate.
The solder flux upper surface coordinate ZF of input and output as previously mentioned, is that the first sensor 10a (with reference to figure 5 (a), (b)) that is configured in top for the plate surface with respect to solder flux infill panel 101A measures soon after solder flux 102 being filled in to metal belt plate 101 inside.Therefore, as described later, the solder flux area of section of calculating from this solder flux upper surface coordinate ZF and solder flux filling rate are owing to being numerical value in the initial stage of the manufacture process of flux-cored wire 101C, therefore find solder flux filling rate abnormal article situation involve narrow range, can prevent the decline of productivity ratio.
(storage part)
At storage part 3, store: the surface coordinates (with reference to figure 2 (a)) of the metal belt plate inner surface coordinate ZMa of the plate width direction of the metal belt plate 101 of the not filling flux 102 of being measured by described first sensor 10a, the curved surface of being described by the inner surface of crooked metal belt plate 101; According to the specification of flux-cored wire 101C, application target etc. and the allowed band of predefined metal belt plate quality, solder flux proportion and solder flux filling rate, and where necessary they are exported to solder flux area of section calculating section 4, solder flux filling rate calculating section 5 and judging part 6.Specifically, metal belt plate inner surface coordinate ZMa is exported to solder flux area of section calculating section 4, metal belt plate quality and solder flux proportion are exported to solder flux filling rate calculating section 5, the allowed band of solder flux filling rate is exported to judging part 6.And metal belt plate inner surface coordinate ZMa, metal belt plate quality, solder flux proportion and solder flux filling rate are undertaken by operator etc. in advance to the input of storage part 3.In addition, same by first sensor 10a mensuration metal belt plate inner surface coordinate ZMa and described solder flux upper surface coordinate ZF.And metal belt plate inner surface coordinate ZMa, metal belt plate quality can be the amounts in the scope of predefined inspection area (with reference to figure 2 (a)) restriction.
(solder flux area of section calculating section)
In solder flux area of section calculating section 4, by the solder flux upper surface coordinate ZF from input part 2 outputs with from the metal belt plate inner surface coordinate ZMa of storage part 3 outputs, input, use this solder flux upper surface coordinate ZF and metal belt plate inner surface coordinate ZMa to calculate solder flux area of section S (with reference to figure 2 (a)), and the solder flux area of section S calculating is exported to solder flux filling rate calculating section 5.And, as shown in Fig. 2 (a), solder flux area of section S is that the area in the region between the surface coordinates (metal belt plate inner surface coordinate ZMa) of curved surface that the inner surface of the surface coordinates of the curved surface of being described by the upper surface of solder flux 102 (solder flux upper surface coordinate ZF) and crooked metal belt plate 101 is described is calculated as solder flux area of section S.
(solder flux filling rate calculating section)
In solder flux filling rate calculating section 5, by the solder flux area of section S input from 4 outputs of solder flux area of section calculating section, use this solder flux area of section S to calculate solder flux filling rate, and the solder flux filling rate of calculating is exported to judging part 6.In addition, solder flux proportion and the metal belt plate quality to 5 inputs of solder flux filling rate calculating section from storage part 3 outputs.And, solder flux filling rate is solder flux area of section S to be carried out to integration in specific length calculate solder flux fill volume, and according to solder flux proportion, this solder flux fill volume is scaled to solder flux filling quality, by this solder flux filling quality and metal belt plate quality, calculate solder flux filling rate.
The solder flux filling rate of calculating is like this owing to being to calculate according to the such physical quantity that has a direct relation with solder flux filling rate of solder flux area of section S, so it is high to calculate precision, the accuracy of detection of the abnormal article of solder flux filling rate is superior.Therefore, in the situation that abnormal article being detected, need not implement destructive inspection, therefore, not have the situation of the finished product rate decline causing because of destructive inspection, the productivity ratio of flux-cored wire 101C is superior.
(judging part)
At judging part 6, input, from the allowed band of solder flux filling rate with the solder flux filling rate of exporting from storage part 3 of 5 outputs of solder flux filling rate calculating section, is judged as well when this solder flux filling rate meets allowed band, is judged as bad when not meeting.And judging part 6 is preferably exported to judged result solder flux filling machine 202 or the control part (not shown) of manufacturing installation 200, controls the work of manufacturing installation 200.
At judging part 6, preferably from solder flux filling rate calculating section 5 solder flux filling rate output, that calculate, adding the correction value of regulation, by judging this adds whether the solder flux filling rate (revising solder flux filling rate) after correction value meets allowed band, thereby the solder flux filling rate of judgement flux-cored wire 101C is good or bad.At this, correction value is preferably carried out preliminary experiment etc. in advance, and is considering the error of solder flux proportion, set after the error that the installation of sensor causes etc. according to its result.
And, in decision maker 1 of the present invention, input part 2 can be by formations such as network services, storage part 3 can pass through the storage mediums such as ROM, RAM, HDD (hard disk) and form, and solder flux area of section calculating section 4, solder flux filling rate calculating section 5 and judging part 6 can consist of processing calculation elements such as microcomputer, PCs.
In addition, decision maker 1 of the present invention, except described structure, can also further possess display part 7.
(display part)
At display part 7, show from the solder flux upper surface coordinate ZF of input part 2 outputs and the metal belt plate inner surface coordinate ZMa exporting from storage part 3.And display part 7 can consist of display of microcomputer, PC etc. etc.By show solder flux upper surface coordinate ZF and metal belt plate inner surface coordinate ZMa on display part 7, operator etc. can confirm that solder flux 102 is to the occupied state of solder flux infill panel 101A.In addition, also can after confirming the occupied state of solder flux 102, by operator, be waited to display part 7 input checking regions, carry out the data selection of solder flux upper surface coordinate ZF and metal belt plate inner surface coordinate ZMa.
As shown in Figure 1, the decision maker 1A of the second embodiment of the present invention be characterised in that possess input part 2, storage part 3, solder flux area of section calculating section 4, solder flux filling rate calculating section 5, judging part 6.And decision maker 1A also can further possess display part 7.And, in the decision maker 1A of the second embodiment, sensor 10 by above the plate surface at solder flux infill panel 101A configuration first sensor 10a and below configuration the second sensor 10b form (with reference to figure 5 (a), (b)).Below, each structure is described.
(input part)
At input part 2, the solder flux upper surface coordinate ZF (with reference to figure 3 (a)) of the plate width direction of solder flux infill panel 101A is inputted from described first sensor 10a, and the surface coordinates (with reference to figure 3 (a)) of the metal belt plate outer surface coordinate ZMb of solder flux infill panel 101A, the curved surface of being described by the outer surface of metal belt plate 101 are inputted from described the second sensor 10b.In addition, at input part 2, solder flux upper surface coordinate ZF and metal belt plate outer surface coordinate ZMb are exported to solder flux area of section calculating section 4.And then solder flux upper surface coordinate ZF is same in the decision maker 1 of being measured solder flux upper surface coordinate ZF and being measured metal belt plate outer surface coordinate ZMb and described the first embodiment by the second sensor 10b by first sensor 10a.And solder flux upper surface coordinate ZF and metal belt plate outer surface coordinate ZMb can be also the surface coordinates in the confined scope in predefined inspection area (with reference to figure 3 (a)).
And, the solder flux upper surface coordinate ZF of input and output and metal belt plate outer surface coordinate ZMb as previously mentioned, are that the first sensor 10a that is configured in top for the plate surface with respect to solder flux infill panel 101A measures after solder flux 102 being filled in to metal belt plate 101 inside soon with the second sensor 10b (with reference to figure 5 (a), (b)) that is configured in below.Therefore, as described later, the solder flux area of section of calculating from this solder flux upper surface coordinate ZF and metal belt plate outer surface coordinate ZMb and solder flux filling rate are owing to being numerical value in the initial stage of the manufacture process of flux-cored wire 101C, therefore find solder flux filling rate abnormal article situation involve narrow range, can prevent the decline of productivity ratio.
(storage part)
At storage part 3 except the allowed band of predefined metal belt plate quality, solder flux proportion and solder flux filling rate, also store not the metal belt plate area of section S2 of the plate width direction of the metal belt plate 101 of filling flux 102 (with reference to figure 3 (b)), and where necessary they are exported to solder flux area of section calculating section 4, solder flux filling rate calculating section 5 and judging part 6.Specifically, metal belt plate area of section S2 is exported to solder flux area of section calculating section 4, metal belt plate quality and solder flux proportion are exported to solder flux filling rate calculating section 5, the allowed band of solder flux filling rate is exported to judging part 6.And metal belt plate area of section S2, metal belt plate quality, solder flux proportion and solder flux filling rate are undertaken by operator etc. in advance to the input of storage part 3.In addition, metal belt plate area of section S2, metal belt plate quality can be the amounts in the scope of predefined inspection area (with reference to figure 3 (b)) restriction.
(solder flux area of section calculating section)
In solder flux area of section calculating section 4, by the solder flux upper surface coordinate ZF from input part 2 outputs and metal belt plate outer surface coordinate ZMb input, use this solder flux upper surface coordinate ZF and metal belt plate outer surface coordinate ZMb to calculate solder flux area of section S (with reference to figure 3 (b)), and the solder flux area of section S calculating is exported to solder flux filling rate calculating section 5.In addition, the metal belt plate area of section S2 to 4 inputs of solder flux area of section calculating section from storage part 3 outputs.And, as shown in Fig. 3 (a), (b), solder flux area of section S long-pendingly using deduct metal belt plate area of section S2 from total cross-sectional area S1 after calculates as solder flux area of section S (S=S1-S2), and wherein total cross-sectional area S1 is zone definitions between the surface coordinates (solder flux upper surface coordinate ZF) of the curved surface to be described by the upper surface of solder flux 102 and the surface coordinates (metal belt plate outer surface coordinate ZMb) of the curved surface described by the outer surface of crooked metal belt plate 101.And, in Fig. 3 (a), (b), recorded total cross-sectional area S1, metal belt plate area of section S2 and solder flux area of section S in the situation that solder flux upper surface coordinate ZF, metal belt plate outer surface coordinate ZMb limit by inspection area.
The decision maker 1 of described the first embodiment, the in the situation that of common manufacture, specifically, in the situation that making metal belt plate 101 mobile with common speed, can precision be calculated solder flux area of section S well.But, in order to boost productivity, make metal belt plate 101 with the swiftly flowing situation higher than common speed under, easily produce following such problem.
In flow at high speed, on metal belt plate 101, easily produce left and right or oblique vibration.The vibration of this metal belt plate 101 can make the solder flux upper surface coordinate ZF that measured by first sensor 10a in order to calculate solder flux area of section S up and down, left and right or oblique movement.On the other hand, the metal belt plate inner surface coordinate ZMa that calculates benchmark as solder flux area of section S is the surface coordinates of being measured by the metal belt plate 101 of the state not vibrating in advance.Therefore, as shown in Fig. 2 (b), the solder flux area of section of being calculated by the decision maker 1 of the first embodiment is compared with actual solder flux area of section S, easily calculate and increased the amount of error delta S or easily calculated the amount that has reduced error delta S, the precision of calculating of the solder flux area of section of calculating easily declines.And, in Fig. 2 (b), recorded the situation that solder flux upper surface coordinate ZF is moved upward because of the vibration of metal belt plate 101.
In the decision maker 1A of the second embodiment, even in the situation that produced the vibration of foregoing metal belt plate 101, the solder flux upper surface coordinate ZF and the metal belt plate outer surface coordinate ZMb that are measured by first sensor 10a and the second sensor 10b in order to calculate solder flux area of section S can move to same direction because of the vibration of metal belt plate 101.Therefore, in the decision maker 1A of the second embodiment, on the solder flux area of section of calculating, can not produce error delta S, therefore calculate precision and uprise.
(solder flux filling rate calculating section, judging part and display part)
Solder flux filling rate calculating section 5, judging part 6 and display part 7 are because the decision maker 1 with described the first embodiment is same, so description thereof is omitted.
And, in decision maker 1A of the present invention, input part 2 can be by formations such as network services, storage part 3 can pass through the storage mediums such as ROM, RAM, HDD (hard disk) and form, solder flux area of section calculating section 4, solder flux filling rate calculating section 5 and judging part 6 can consist of processing calculation elements such as microcomputer, PCs, and display part 7 can consist of the display of microcomputer, PC etc.
< solder flux filling rate decision method >
Below, solder flux filling rate decision method of the present invention (following, to be called decision method) is described.Wherein, the structure of decision maker, sensor and manufacturing installation, describes with reference to figure 1, Fig. 5 (a), (b).
As shown in Figure 4, decision method of the present invention is the method that the solder flux filling rate decision maker 1 (1A) of the first described embodiment of use or the second embodiment is judged solder flux filling rate, and it comprises: the first step S1 of the surface coordinates of the plate width direction of input solder flux infill panel 101A; Calculate the second step S2 of solder flux area of section S; Calculate the third step S3 of solder flux filling rate F; Judgement solder flux filling rate F is the 4th good or bad step S4.
(first step)
First step S1 inputs to input part 2 by the surface coordinates of the plate width direction of the solder flux infill panel 101A being measured soon after solder flux 102 is filled by sensor 10, and its surface coordinates is exported to the operation of solder flux area of section calculating section 4.
At this, the surface coordinates of input and output are measured soon after filling at solder flux 102, therefore, as described later, the solder flux area of section S calculating from these surface coordinates and solder flux filling rate F are owing to being numerical value in the initial stage of the manufacture process of flux-cored wire 101C, therefore find solder flux filling rate F abnormal article situation involve narrow range, can prevent the decline of productivity ratio.
And in the situation that use the decision maker 1 of the first embodiment, surface coordinates are the solder flux upper surface coordinate ZF (with reference to figure 2 (a)) that measured by the first sensor 10a up of the plate surface configuration with respect to solder flux infill panel 101A.In addition, in the situation that use the decision maker 1A of the second embodiment, surface coordinates are by first sensor 10a up of the plate surface configuration with respect to solder flux infill panel 101A and are configured in solder flux upper surface coordinate ZF and the metal belt plate outer surface coordinate ZMb (with reference to figure 3 (a)) that the second sensor 10b of below measures.
(second step)
Second step S2 calculates solder flux area of section S in solder flux area of section calculating section 4 use in the surface coordinates of first step S1 output, and this solder flux area of section S is exported to the operation of solder flux filling rate calculating section 5.
In the situation that use the decision maker 1 of the first embodiment, calculating of solder flux area of section S is using solder flux upper surface coordinate ZF and (with reference to figure 2 (a)) that calculate as solder flux area of section S from the area in the region between the metal belt plate inner surface coordinate ZMa of storage part 3 outputs.In addition, in the situation that use the decision maker 1A of the second embodiment, calculate the area in the region between solder flux upper surface coordinate ZF and metal belt plate outer surface coordinate ZMb, as total cross-sectional area S1 (with reference to figure 3 (a)), by deduct the metal belt plate area of section S2 being stored in storage part 3 from this total cross-sectional area S1, thereby calculate solder flux area of section S (S=S1-S2) (with reference to figure 3 (b)).And, in Fig. 3 (a), (b), recorded solder flux upper surface coordinate ZF, metal belt plate outer surface coordinate ZMb by the total cross-sectional area S1 in the situation of procuratorial work region limits, metal belt plate area of section S2 and solder flux area of section S.
(third step)
Third step S3 uses the solder flux area of section S in second step S2 output to calculate solder flux filling rate F in solder flux filling rate calculating section 5, and this solder flux filling rate F is exported to the operation of judging part 6.
Solder flux filling rate F calculates with following (S3-1)～(S3-3) in sequence.
(S3-1) for example, every the specific length L of solder flux infill panel 101A (L=1mm) or for example, every stipulated time T (T=1sec), for example carry out first step S1 and second step, for example, until carry out specific length (75mm) or the stipulated time (60sec), use the solder flux area of section S, defined function S (L) or the S (T) that now calculate.
(S3-2) for example, with specific length (75mm) or stipulated time (60sec) function S (L) or S (T) are carried out to integration, calculate solder flux fill volume V.
(S3-3) solder flux fill volume V is scaled to solder flux filling quality F1 to be stored in the solder flux proportion of storage part 3, by this solder flux filling quality F1 and the metal belt plate quality F2 that is stored in storage part 3, by following formula (1), calculates solder flux filling rate F.
F(％)＝[F1/(F1+F2)]×100…(1)
The solder flux filling rate F calculating is like this owing to being to calculate according to the such physical quantity that has a direct relation with solder flux filling rate F of solder flux area of section S, so it is high to calculate precision, the accuracy of detection of the abnormal article of solder flux filling rate F is superior.Therefore, in the situation that abnormal article being detected, need not implement destructive inspection, therefore, not have the situation of the finished product rate decline causing because of destructive inspection, the productivity ratio of flux-cored wire 101C is superior.
(the 4th step)
The 4th step S4 is operation as follows: in judging part 6, solder flux filling rate F in third step S3 output is compared with the allowed band that is stored in the solder flux filling rate F of storage part 3, judgement solder flux filling rate F is good or bad, be judged as bad in the situation that, stop the work of manufacturing installation 200, that is, finish the judgement of solder flux filling rate F.In addition, in the 4th step S4, even be judged as being good in the situation that at solder flux filling rate F, also can be corresponding to the deviation apart from allowed band central value, be the poor of solder flux filling rate F and allowed band central value, make the control of flowing velocity increase and decrease in solder flux filling machine 202, solder flux quantity delivered or metal belt plate 101.
In the 4th step S4, preferably on the solder flux filling rate F being exported by third step S3, calculating, add the correction value of regulation, judgement has added whether the solder flux filling rate (revising solder flux filling rate) of this correction value meets allowed band, thus, the solder flux filling rate of judgement flux-cored wire 101C is good or bad.At this, correction value is preferably carried out preliminary experiment etc. in advance, and is considering the error of solder flux proportion, set after the error that the installation of sensor causes etc. according to its result.
< solder flux filling rate decision-making system >
Below, the solder flux filling rate decision-making system the present invention relates to is described.
As shown in Fig. 5 (a), (b), solder flux filling rate decision-making system of the present invention (hereinafter referred to as decision-making system) 300 is characterised in that, possess: manufacturing installation 200, it is at the inside filling flux 102 of the metal belt plate 101 along plate width direction bending, and this metal belt plate 101 is configured as to tubulose, manufacture thus flux-cored wire 101C; Decision maker 1 (1A), it is disposed at manufacturing installation 200, judges solder flux filling rate; Sensor 10, it is disposed at manufacturing installation 200, fills the surface coordinates of the plate width direction of the solder flux infill panel 101A that is determined at afterwards solder flux filling rate decision maker 1 (1A) employing at once at solder flux 102.
In decision-making system 300, when the decision maker of the first embodiment 1 is disposed to manufacturing installation 200, sensor 10 only consists of the first sensor 10a of configuration above solder flux infill panel 101A, and the surface coordinates of mensuration are solder flux upper surface coordinate ZF (with reference to figure 2 (a)).In addition, when the decision maker 1A of the second embodiment is disposed to manufacturing installation 200, sensor 10 consists of the second sensor 10b of the first sensor 10a in configuration above solder flux infill panel 101A and configuration below solder flux infill panel 101A, and the surface coordinates of mensuration are solder flux upper surface coordinate ZF and metal belt plate outer surface coordinate ZMb (with reference to figure 3 (a)).
(sensor)
In decision-making system 300, just there is no particular limitation so long as can measure the sensor of surface coordinates of solder flux infill panel 101A for the formation of sensor 10, but the laser extensometer that preferably uses laser to measure.In addition, the mensuration of 10 pairs of surface coordinates of sensor is with predetermined distance or penetrate continuously laser and measure its reverberation and carry out by the thickness of slab direction from sensor 10 to solder flux infill panel 101A.In surface coordinates, plate width direction is X-axis coordinate, and thickness of slab direction is Y-axis coordinate.And, in the situation that sensor 10 consists of first sensor 10a and the second sensor 10b, make X-axis coordinate consistent with the second sensor 10b at first sensor 10a, make 0 of Y-axis coordinate consistent with the second sensor 10b at first sensor 10a.
(manufacturing installation, decision maker)
In decision-making system 300, the details of the formation of manufacturing installation 200, decision maker 1 (1A) and aforementioned identical, therefore description thereof is omitted.
Decision-making system 300 fills owing to possessing to use at solder flux the decision maker 1 (1A) that the rear surface coordinates of the solder flux infill panel 101A of mensuration are at once judged solder flux filling rate, so can from surface coordinates calculate solder flux area of section such have the physical quantity of direct relation with solder flux filling rate, and can calculate, judge solder flux filling rate from this solder flux area of section, therefore, the precision of calculating of solder flux filling rate uprises, the accuracy of detection of the abnormal article of solder flux filling rate is superior, and the productivity ratio of flux-cored wire is also superior.
< solder flux filling rate decision procedure >
In aforementioned, for the solder flux filling rate decision maker the present invention relates to, be illustrated, but solder flux filling rate decision maker can consist of general CPU, RAM, ROM etc., can make to possess by the program module (solder flux filling rate decision procedure) working as described input part, solder flux area of section calculating section, solder flux filling rate calculating section and judging part the computer work of storage part.Below, for the solder flux filling rate decision procedure the present invention relates to, describe.
As shown in Fig. 1, Fig. 5 (a), (b), solder flux filling rate decision procedure of the present invention is in manufacturing installation 200, in order to judge solder flux filling rate, the computer that possesses storage part 3 is worked as input part 2, solder flux area of section calculating section 4, solder flux filling rate calculating section 5 and judging part 6, wherein, manufacturing installation 200 is by the inside filling flux 102 at the metal belt plate 101 along plate width direction bending, and this metal belt plate 101 is configured as to tubulose manufactures flux-cored wire 101C; Storage part 3 stores the allowed band of predefined metal belt plate quality, solder flux proportion and solder flux filling rate; The surface coordinates of the plate width direction of the solder flux infill panel 101A that input part 2 inputs are measured after solder flux 102 is filled by sensor 10 at once; Solder flux area of section calculating section 4 is used surface coordinates to calculate solder flux area of section; 5 pairs of solder flux areas of section of solder flux filling rate calculating section carry out integration in specific length, calculate solder flux fill volume, this solder flux fill volume is scaled to solder flux filling quality according to solder flux proportion, by this solder flux filling quality and metal belt plate quality, calculates solder flux filling rate; The solder flux filling rate that judging part 6 judgements are calculated judges as well in the situation that meets the allowed band of solder flux filling rate, in ungratified situation, judges as bad.In addition, solder flux filling rate decision procedure also can further make computer work as the display part 7 of the surface coordinates of the thickness of slab direction of real solder flux infill panel 101A.
In solder flux filling rate decision procedure, to inputing to sensor 10 that the surface coordinates of input part 2 measure, can be only by the first sensor 10a of configuration above solder flux infill panel 101A, be formed, also can by the first sensor 10a in configuration above solder flux infill panel 101A and below the second sensor 10b of configuration form.And, in the situation that only being formed by first sensor 10a, the surface coordinates of measuring be solder flux upper surface coordinate ZF (with reference to figure 2 (a)) in the situation that being formed by first sensor 10a and the second sensor 10b, the surface coordinates of mensuration are solder flux upper surface coordinate ZF and metal belt plate outer surface coordinate ZMb (with reference to figure 3 (a)).In addition, in order to calculate solder flux area of section in solder flux area of section calculating section 4, storage part 3 also can also store metal belt plate inner surface coordinate ZMa (with reference to figure 2 (a)) or metal belt plate area of section S2 (with reference to figure 3 (b)).
In solder flux filling rate decision procedure, the details of the structure of input part 2, solder flux area of section calculating section 4, solder flux filling rate calculating section 5, judging part 6 and display part 7 and the structure of the storage part 3 that computer possesses is due to same with described decision maker 1 (1A), therefore, description thereof is omitted.
In solder flux filling rate decision procedure, the surface coordinates of the plate width direction of the solder flux infill panel of at once measuring after using solder flux to fill, can calculate solder flux area of section such have the physical quantity of directly scraping mud with solder flux filling rate, use this solder flux area of section to calculate solder flux filling rate, therefore, the precision of calculating of solder flux filling rate uprises, and the accuracy of detection of the abnormal article of solder flux filling rate is superior, and the productivity ratio of flux-cored wire 101C is also superior.
[embodiment]
For embodiments of the invention, describe.
Use the manufacturing installation 200 shown in Fig. 5 (a) to manufacture flux-cored wire 101C.Now, by the first sensor 10a in manufacturing installation 200 configurations and the second sensor 10b, measure the surface coordinates of solder flux infill panel 101A, use this surface coordinates, by the solder flux filling rate decision maker 1A of the present invention shown in Fig. 1, calculate solder flux filling rate.And, as first sensor 10a and the second sensor 10b, adopt " the high-precision two-dimensional laser extensometer: model LJ-G " of Keyence company system.
In the present embodiment, the length 1mm every solder flux infill panel 101A carries out to the mensuration of surface coordinates for first sensor 10a and the second sensor 10b, in decision maker 1A, calculates the solder flux filling rate of amount of the length 75mm of solder flux infill panel 101A.The length that the calculating of the mensuration of such surface coordinates and solder flux filling rate proceeds to solder flux infill panel 101A is 3000mm.In addition, by preliminary experiment, correction value is set as to 0.9 quality %, is added on the solder flux filling rate of calculating.The result of the solder flux filling rate of calculating represents in table 1.
In addition, by destructive inspection, calculate the solder flux filling rate of the flux-cored wire 101C of manufacture.In flux-cored wire, its length waits approximately 4 times of length that are elongated to solder flux infill panel 101A by stretching, so destructive inspection proceeds to length every the length 300mm of flux-cored wire and reaches 12000mm.The result of the solder flux filling rate of calculating is as shown in table 1.
[table 1]
(unit: quality %)
From the result of table 1, can confirm: among decision maker 1A of the present invention, can calculate accurately with the solder flux filling rate of calculating by destructive inspection, as the approaching solder flux filling rate of the solder flux filling rate of the flux-cored wire 101C of product.In addition, confirm by the correction value of being set by preliminary experiment being added on the solder flux filling rate of calculating, can calculate accurately the solder flux filling rate closer to the solder flux filling rate of product thus.
Claims (5)
1. a solder flux filling rate decision maker, its manufacturing installation that is disposed at manufacture flux-cored wire is judged solder flux filling rate, described manufacturing installation is at the inside of the metal belt plate along plate width direction bending filling flux, and this metal belt plate is configured as to tubulose manufactures flux-cored wire
It is characterized in that, solder flux filling rate decision maker possesses:
Input part, its input solder flux upper surface coordinate, this solder flux upper surface coordinate is the solder flux upper surface coordinate by the plate width direction of this metal belt plate of measuring after this solder flux is filled in the sensor of top with respect to the plate surface configuration that is filled with the metal belt plate of described solder flux at once;
Storage part, it stores the allowed band of metal belt plate inner surface coordinate, predefined metal belt plate quality, solder flux proportion and solder flux filling rate of plate width direction of the metal belt plate of the not filling flux of being measured by described sensor;
Solder flux area of section calculating section, it calculates solder flux area of section by described solder flux upper surface coordinate and described metal belt plate inner surface coordinate;
Solder flux filling rate calculating section, it carries out integration to described solder flux area of section in specific length, calculate solder flux fill volume, and this solder flux fill volume is scaled to solder flux filling quality according to described solder flux proportion, by this solder flux filling quality and described metal belt plate quality, calculate solder flux filling rate; And
Judging part, its situation that described solder flux filling rate of calculating is met to the allowed band of described solder flux filling rate is judged as well, and ungratified situation is judged as bad.
2. solder flux filling rate decision maker as claimed in claim 1, is characterized in that,
In the input of described input part: the described sensor by the plate surface configuration of metal belt plate with respect to being filled with described solder flux in top is the solder flux upper surface coordinate of the plate width direction of this metal belt plate of measuring after this solder flux is filled of first sensor at once; By fill the metal belt plate outer surface coordinate of the plate width direction of rear this metal belt plate of measuring with respect to the plate surface configuration that is filled with the metal belt plate of described solder flux at this solder flux in the second sensor of below at once,
At described storage part, also store the metal belt plate area of section of the plate width direction of the metal belt plate of not filling described solder flux,
In described solder flux area of section calculating section, by described solder flux upper surface coordinate and described metal belt plate outer surface coordinate, calculate total cross-sectional area, by this total cross-sectional area and described metal belt plate area of section, calculate solder flux area of section.
3. solder flux filling rate decision maker as claimed in claim 1 or 2, is characterized in that,
The solder flux filling rate of calculating described in described judging part is on this solder flux filling rate, further to add the correction value of regulation and the filling rate that obtains.
4. a solder flux filling rate decision method, its right to use requires the solder flux filling rate decision maker described in 1 to judge solder flux filling rate, it is characterized in that, comprising:
First step, in this step, inputs to input part by the surface coordinates of the plate width direction of the metal belt plate that is filled with described solder flux of being measured after solder flux is filled by described sensor at once, and these surface coordinates is exported to solder flux area of section calculating section;
Second step, in this step, is used in the described surface coordinates of described first step output and calculates solder flux area of section in described solder flux area of section calculating section, and this solder flux area of section is exported to solder flux filling rate calculating section;
Third step, in this step, in described solder flux filling rate calculating section, the described solder flux area of section in described second step output is carried out to integration in specific length, calculate solder flux fill volume, this solder flux fill volume is scaled to solder flux filling quality to be stored in the solder flux proportion of described storage part, by this solder flux filling quality and the metal belt plate quality that is stored in described storage part, calculate solder flux filling rate, and this solder flux filling rate is exported to described judging part;
The 4th step, in this step, at described judging part, for the described solder flux filling rate in described third step output and the allowed band that is stored in the solder flux filling rate of described storage part, compare, judge that described solder flux filling rate is good or bad, be judged as the work that stops described manufacturing installation bad in the situation that.
5. a solder flux filling rate decision-making system, is characterized in that, possesses:
Manufacturing installation, it is at the inside of the metal belt plate along plate width direction bending filling flux, and this metal belt plate is configured as to tubulose, manufactures thus flux-cored wire;
Solder flux filling rate decision maker described in claim 1 or 3, it is disposed at described manufacturing installation, judges solder flux filling rate; And
Sensor, it is disposed at described manufacturing installation, fills the surface coordinates of the plate width direction of the metal belt plate that is filled with described solder flux that is determined at afterwards described solder flux filling rate decision maker employing at once at described solder flux.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011010275A JP5670210B2 (en) | 2011-01-20 | 2011-01-20 | Flux filling rate judging device, flux filling rate judging method, flux filling rate judging system, and flux filling rate judging program |
| JP2011-010275 | 2011-01-20 |
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| CN102601549A CN102601549A (en) | 2012-07-25 |
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| JP (1) | JP5670210B2 (en) |
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| CN105728993B (en) * | 2016-05-05 | 2019-01-15 | 苏州金品线材科技有限公司 | A kind of flux-cored wire production line and its production technology |
| CN106950144B (en) * | 2017-04-28 | 2018-05-18 | 关忆恒 | A kind of apparatus for peeling off of flux-cored wire filling rate detection |
| KR102403587B1 (en) * | 2020-05-28 | 2022-05-30 | 정조우 리서치 인스티튜트 오브 머케니컬 엔지니어링 컴퍼니 리미티드 | Controller, flux-cored wire fill rate detection method and device |
| CN112067545B (en) * | 2020-10-09 | 2024-02-27 | 郑州机械研究所有限公司 | Flux-cored wire flux continuous detection method and flux continuous detection system |
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| JPH04371393A (en) * | 1991-06-17 | 1992-12-24 | Kobe Steel Ltd | Detection of packing ratio of flux in welding wire including flux |
| JPH06180289A (en) * | 1992-12-11 | 1994-06-28 | Nippon Steel Weld Prod & Eng Co Ltd | Measuring method for powder particle packing |
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| CN101537552A (en) * | 2009-04-16 | 2009-09-23 | 武汉铁锚焊接材料股份有限公司 | Online measurement and control method and device of filling ratio of flux-cored wire forming machine |
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| JP3476169B2 (en) * | 1996-03-11 | 2003-12-10 | 日鐵住金溶接工業株式会社 | Detecting device for powder filling rate of powder filling tube |
| JP2000180416A (en) | 1998-12-18 | 2000-06-30 | Kobe Steel Ltd | Method and apparatus for measuring flux filling quantity |
| KR100425936B1 (en) * | 2001-06-11 | 2004-04-08 | 주식회사 싸이로드 | A flux filling quantity inspection device |
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2011
- 2011-01-20 JP JP2011010275A patent/JP5670210B2/en active Active
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- 2012-01-17 CN CN201210014749.2A patent/CN102601549B/en active Active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04371393A (en) * | 1991-06-17 | 1992-12-24 | Kobe Steel Ltd | Detection of packing ratio of flux in welding wire including flux |
| JPH06180289A (en) * | 1992-12-11 | 1994-06-28 | Nippon Steel Weld Prod & Eng Co Ltd | Measuring method for powder particle packing |
| CN201266106Y (en) * | 2008-10-09 | 2009-07-01 | 武汉铁锚焊接材料股份有限公司 | Filling rate on-line measurement control device of flux-cored wire forming machine |
| CN101537552A (en) * | 2009-04-16 | 2009-09-23 | 武汉铁锚焊接材料股份有限公司 | Online measurement and control method and device of filling ratio of flux-cored wire forming machine |
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| KR101327588B1 (en) | 2013-11-12 |
| CN102601549A (en) | 2012-07-25 |
| JP5670210B2 (en) | 2015-02-18 |
| JP2012148330A (en) | 2012-08-09 |
| KR20120084684A (en) | 2012-07-30 |
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