CN102590220A - Infrared nondestructive testing device - Google Patents
Infrared nondestructive testing device Download PDFInfo
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- CN102590220A CN102590220A CN2012100431037A CN201210043103A CN102590220A CN 102590220 A CN102590220 A CN 102590220A CN 2012100431037 A CN2012100431037 A CN 2012100431037A CN 201210043103 A CN201210043103 A CN 201210043103A CN 102590220 A CN102590220 A CN 102590220A
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Abstract
The invention relates to an infrared nondestructive testing device. The infrared nondestructive testing device comprises a laser modulation system, a thermal imaging system and an electronic measuring system, wherein the laser modulation system is formed by an infrared laser tube and emits infrared light to an object to be measured; the thermal imaging system adopts a CCD (Charge Coupled Device) linear array sensor, receives light signals radiated by the measuring object and further converts the light signals into electrical signals; and the electronic measuring system is formed by an MCU (Micro Controller Unit) main control circuit, receives the electrical signals output by the CCD linear array sensor and processes the electrical signals. In the invention, as the CCD linear array sensor is adopted as a light sensing device, the CCD linear array sensor has good lighting sensing effect to the infrared light, so that the infrared nondestructive testing device has the advantages of being high in sensitivity, simple in structure and convenience in detection, and being real-time and rapid, and meets the production requirements.
Description
Technical field
The present invention relates to the Non-Destructive Testing field, specifically a kind of infrared ray the cannot-harm-detection device.
Background technology
In Dynamic Non-Destruction Measurement, five kinds of different conventional sense technology are arranged usually, be respectively ray detection, ultrasound examination, EDDY CURRENT, infiltration detection, magnetic detection technique.
The different detection technology has different application and sensing range, and table 1 is simple introduction of this several method and comparative analysis.The contrast of five kinds of conventional Dynamic Non-Destruction Measurements can be found out from table 1, and conventional Dynamic Non-Destruction Measurement is respectively according to characteristics, and the scope of application also is not quite similar, and bigger limitation is also arranged simultaneously.As nonmetallic materials are detected; EDDY CURRENT and magnetic detect just powerless, and for the relatively more loose nonmetallic materials of material density, ultrasound examination is also very difficult; Although and ray detection can realize; But its device is huger again, simultaneously people and other animal is had radiation risk, as protects and improperly very easily human body is damaged.Thereby for the loose nonmetallic materials detection of density; The Detection Techniques of seeking a kind of suitable actual detected demand seem particularly important; The infrared thermal wave Dynamic Non-Destruction Measurement is exactly the Dynamic Non-Destruction Measurement that new development is got up; It can realize defectives such as the crackle that exists in metal, the nonmetal and compound substance, unsticking, hole are detected, and has noncontact, advantages such as area of detection is big, speed is fast, online detection.
The conventional Dynamic Non-Destruction Measurement contrast table of table 1
| Type of detection | Advantage | Limitation | The scope of application |
| Ray detection | Responsive to volume defect, like slag inclusion, pore, lack of penetration etc. | Cost is high, can not detect crackle and depth of defect with the ray vertical direction, and sense cycle is long, efficient is low. | Weldment, foundry goods, on-metallic article and compound substance |
| Ultrasound detection | To fast, the accurate positioning of defective resolution speed | Little and thin complex parts, the compound substance of multilayer, coarse grain material and complex-shaped structure all are difficult to detect, and speed is slow, and the cycle is long. | Weldment, forging, solvent cement joint and nonmetallic materials |
| Magnetic detects | Surface imperfection to ferromagnetic material is highly sensitive, easy and simple to handle | Can not detect non-ferrous metal, nonmetal and non-magnet material, can not the detection by quantitative defective. | The surface of magnetic material and near surface flaw |
| Infiltration detects | Simple, the highly sensitive intuitive display of equipment, can detect large-scale component and irregular part | Complex process, can only detect the surface flaws, can not detect porous material. | The surface opening defective of various non-loose materials |
| EDDY CURRENT | Automaticity is high, be prone to coupling, fast, cost is low | Can only detect nearly surface and regular shape defective | The surface of electric conductor and near surface flaw |
The infrared thermal wave Dynamic Non-Destruction Measurement is a basic theory more complicated, an application Dynamic Non-Destruction Measurement widely.Its ultimate principle is: utilize ultrared physical property to measure.Infrared ray is claimed infrared light (be divided near infrared, in infrared, far infrared, utmost point far infrared) again, and it has character such as reflection, refraction, scattering, interference, absorption.Any material, as long as itself has certain temperature (being higher than absolute zero), can both infrared radiation.So, design different types of thermal excitation source, like ultrasound wave, high energy thermolamp, hot blast, infrared laser etc. according to the architectural characteristic of different materials, defect property etc.; And it is modulated into square wave, sine wave or other wave function form; Measured material is carried out active heating, and theoretical according to infrared thermal imaging, the propagation of material surface hot broadcast signal will change; Variation according to body surface heat wave signal; Can detect testee surface red outside line energy changing through optical system, infrared-sensitive detecting element and electronic surveying change-over circuit, thereby be converted into the variation of electric signal to this variation, compare according to the data model of setting up then; Finally demonstrate measurement result; Through the on-line continuous scan mode, can in display, show with graphics mode scanning information, utilize the image software disposal system to carry out discriminatory analysis more intuitively.
Present domestic infrared thermal wave non-destructive detecting device mainly relies on external import; Like thermal infrared imager equipment, in the concrete application of this equipment, the supporting peripheral attachment device of necessary requirement is more; Use complicated; And equipment price is expensive, uses inconvenience, particularly when some requires quick real-time to detect, can not bring into play its intrinsic effect; Be difficult at home promote, thereby it is particularly important to design a kind of price Infrared Non-destructive Testing device that satisfies the production demand suitable, easy to detect, real-time.
Summary of the invention
The objective of the invention is to, overcome the deficiency of prior art, provide a kind of simple in structure, easy to detect, real-time, satisfy the Infrared Non-destructive Testing device of production demand, it is particularly useful for bar-shaped object inside stuffing density, uniformity coefficient detects.
In order to realize the foregoing invention purpose, Infrared Non-destructive Testing device of the present invention comprises the Laser Modulation system, thermal imaging system and electronic measurement system; Said Laser Modulation system is made up of the infrared laser pipe; It sends infrared light to measuring object, and said thermal imaging system adopts the CCD line array sensor, and it receives the light signal of measuring the object radiation; And further convert electric signal into; Said electronic measurement system is made up of the MCU governor circuit, and it receives the output electric signal of said CCD line array sensor, and handles.
Thermal imaging system in this pick-up unit comprises that also CCD reads sequential control circuit, and it is controlled by said MCU governor circuit, and for said CCD line array sensor drive signal is provided.Also comprise and be arranged on the infrared filter before the said CCD line array sensor and be arranged on the AD converter after the CCD line array sensor; The light signal of measuring the object radiation gets into the CCD line array sensor behind infrared filter filtering visible light; After opto-electronic conversion; The output electric signal, AD converter is digital signal output with the analog signal conversion of input.
Between this pick-up unit mid-infrared laser pipe and the said measurement object light projector camera lens is set, between said measurement object and said infrared filter, imaging lens is set.
Laser Modulation system in this pick-up unit also comprises pulse-modulated signal generator, power amplifier; Control said pulse-modulated signal generator by said MCU governor circuit the infrared emission signal is modulated, modulation signal amplifies the said infrared laser pipe of rear drive through said power amplifier.
Electronic measurement system in this pick-up unit also comprises warning and topworks, memory circuitry and communication interface circuit.
This pick-up unit also comprises display system, and it is made up of display interface circuit and display.
Because adopt among the present invention the line array CCD sensor to do sensor devices, it has good ligh-induced effect to infrared ray, so the present invention has highly sensitively, simple in structure, easy to detect, can satisfy the advantage of production demand real-time.
Description of drawings
Shown in Figure 1, be the structured flowchart of the specific embodiment of the invention;
Shown in Figure 2, be the display effect figure after the binary conversion treatment in the specific embodiment of the invention.
Embodiment
Combine accompanying drawing at present, the present invention is done a detailed description.
As shown in Figure 1, be the structured flowchart of Infrared Non-destructive Testing device of the present invention, comprise the Laser Modulation system, measure object, thermal imaging system, electronic measurement system and display system.
The Laser Modulation system comprises the infrared laser pipe, it sends infrared light to measuring object, is used for heating and measures object.Thermal imaging system adopts the CCD line array sensor, and it has good ligh-induced effect to infrared ray, and measure object and after heating, give off light signal, after the CCD line array sensor carries out opto-electronic conversion, the output electric signal.Electronic measurement system comprises the MCU governor circuit; It is modulated the infrared emission signal, and modulation signal amplifies rear drive infrared laser pipe through power amplifier, and converts light into parallel beam to object being measured irradiation heating by the light projector lens; Its surface temperature is changed; Thereby impel the material internal temperature to change, when the material internal temperature does not reach thermal equilibrium as yet, it is detected through its thermal infrared characteristic; It receives the electric signal of CCD line array sensor output simultaneously, and handles.
Thermal imaging system comprises that also CCD reads sequential control circuit, infrared filter and AD converter.Wherein CCD reads sequential control circuit and is controlled by the MCU governor circuit in the electronic measurement system, and drive signal is provided for the CCD line array sensor.At the CCD line array sensor with measure between the object and add an infrared filter, purpose is to eliminate visible light and other invalid light to the interference of CCD line array sensor, only lets useful infrared signal pass through.The analog voltage signal that can the response measurement signal changes can be from the output of CCD line array sensor, and then by AD converter the signal of analog quantity is carried out digital quantization, is convenient to information processing, noise reduction, filtering, processing, transmission, storage etc.
Electronic measurement system also comprises warning and topworks, memory circuitry and communication interface circuit.When infrared the cannot-harm-detection device detects the defective of measuring object or when damaged, report to the police and topworks will send the existence of alerting signal prompting defective, and make follow-up execution in step.Memory circuitry is stored detected digital quantization information, can be used for the real-time output of detected image.The communication interface circuit can be with the external agency of alerting signal or detected digital quantization information transmission to needs.
During measurement, the MCU governor circuit starts the infrared laser modulating system according to setup parameter, and the modulation parameter in output time and space; In the Laser Modulation system; The pulse-modulated signal generator starts, and produces modulated pulse signal according to time and the spatial parameter that the MCU governor circuit sends, and by power amplifier modulated pulse signal is carried out processing and amplifying then; And then it is luminous to promote the infrared laser pipe, for measuring object controlled Infrared Heating thermal source is provided.Simultaneously; MCU governor circuit control CCD reads sequential control circuit work; For the CCD line array sensor provides drive signal; The analog voltage signal output that changes CCD line array sensor response measurement signal is carried out digital quantization by AD converter to the signal of analog quantity then, after analog signal figure quantizes just to information processing, noise reduction, filtering, processing, transmission, storage etc.Digital signal after the quantification is read by the MCU governor circuit; And to Digital Signal Analysis, calculation process; Information stores after handle is handled simultaneously is in memory circuitry; This information data can be obtained through the communication interface circuit by external unit such as computer etc., also can be the data measured information real-time synchronously and external unit.
In the measurement and data-measuring process accomplished once, just formed set of diagrams as data, this set of image data is tomoscan data measuring object, and the size of its resolution is by how many decisions of pixel of CCD line array sensor.Through continuously scanning to being moved object; Can form tested mobile object and continuously scan picture data; Continuously tomography drawing signal data is under the cooperation of display synchronization signal; Just can in display, show picture signal easily, thus information such as convenient judgement defective locations, shape.
Adopting the mode of continuous line of rent scanning, is can when detecting, need not confirm under the situation of test article defect shape, size, system is made a response fast, so that can alerting signal be provided in time, makes things convenient for personnel to carry out other operation.
Can be clear, complete reflect inner defective to be tested really and show; Need handle quantizing numerical information; In this device; Image digitization information has been carried out binary conversion treatment, and it is more directly perceived that the image information after the process binary conversion treatment as shown in Figure 2 shows in display.
The present invention is exclusively used in bar-shaped object inside stuffing density, uniformity coefficient detects.For example, the cigarette that detects tobacco production props up inner pipe tobacco filling; Detect the interior tow filling of filter rod etc.
Claims (7)
1. an Infrared Non-destructive Testing device comprises the Laser Modulation system, thermal imaging system and electronic measurement system; Said Laser Modulation system is made up of the infrared laser pipe, and it sends infrared light to measuring object, it is characterized in that; Said thermal imaging system adopts the CCD line array sensor, and it receives the light signal of measuring the object radiation, and further converts electric signal into; Said electronic measurement system is made up of the MCU governor circuit, and it receives the output electric signal of said CCD line array sensor, and handles.
2. pick-up unit according to claim 1 is characterized in that, said thermal imaging system comprises that also CCD reads sequential control circuit, and it is controlled by said MCU governor circuit, and for said CCD line array sensor drive signal is provided.
3. pick-up unit according to claim 1 and 2; It is characterized in that; Said thermal imaging system comprises also and is arranged on the infrared filter before the said CCD line array sensor and is arranged on the AD converter after the CCD line array sensor that the light signal of measuring the object radiation gets into the CCD line array sensor behind infrared filter filtering visible light, after opto-electronic conversion; The output electric signal, AD converter is digital signal output with the analog signal conversion of input.
4. pick-up unit according to claim 3 is characterized in that, between said infrared laser pipe and said measurement object, the light projector camera lens is set, and between said measurement object and said infrared filter, imaging lens is set.
5. pick-up unit according to claim 1; It is characterized in that; Said Laser Modulation system also comprises pulse-modulated signal generator, power amplifier; Control said pulse-modulated signal generator by said MCU governor circuit the infrared emission signal is modulated, modulation signal amplifies the said infrared laser pipe of rear drive through said power amplifier.
6. pick-up unit according to claim 1 is characterized in that, said electronic measurement system also comprises warning and topworks, memory circuitry and communication interface circuit.
7. according to claim 1,2,5 or 6 arbitrary described pick-up units, it is characterized in that said pick-up unit also comprises display system, it is made up of display interface circuit and display.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103630546A (en) * | 2013-11-20 | 2014-03-12 | 江苏大学 | Rotary infrared light emitting diode (LED) array light source detection system |
| CN103630545A (en) * | 2013-11-20 | 2014-03-12 | 江苏大学 | Injection-molded blade on-line monitoring device and method based on near-infrared optical wave array |
| CN103674969A (en) * | 2014-01-14 | 2014-03-26 | 江苏大学 | Rotary injection molding blade starving failure online diagnosing device |
| CN103776838A (en) * | 2013-11-20 | 2014-05-07 | 江苏大学 | Static type cross-flow fan starved feeding fault online diagnostic device |
| CN104808082A (en) * | 2015-04-02 | 2015-07-29 | 浙江安德电器有限公司 | Thermal-imaging-based dishwasher assembly line electrical element detecting system and method |
| CN107209127A (en) * | 2015-01-09 | 2017-09-26 | 欧瑞康纺织有限及两合公司 | The method and apparatus that quality monitoring is carried out to the fiber webs of multiple melt-spuns of tow |
| CN108814558A (en) * | 2018-05-08 | 2018-11-16 | 哈尔滨商业大学 | A kind of skin neoplasin nondestructive detection system and method based on fm exciter thermal map |
| CN109884120A (en) * | 2019-04-03 | 2019-06-14 | 哈尔滨商业大学 | A kind of device and method of femtosecond laser excitation infrared thermal wave NDT titanium-aluminium alloy defect |
| CN110400311A (en) * | 2019-08-01 | 2019-11-01 | 中北大学 | High-temperature alloy surface defect characteristic extracting method based on pulse laser thermal imaging |
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| CN1546995A (en) * | 2003-12-12 | 2004-11-17 | 上海交通大学 | Active infrared CCD weld seam detecting method |
| CN101344384A (en) * | 2008-08-25 | 2009-01-14 | 苏州大学 | Depth detection method for steel surface hardening layer |
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Patent Citations (4)
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| CN1546995A (en) * | 2003-12-12 | 2004-11-17 | 上海交通大学 | Active infrared CCD weld seam detecting method |
| CN101344384A (en) * | 2008-08-25 | 2009-01-14 | 苏州大学 | Depth detection method for steel surface hardening layer |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103630546A (en) * | 2013-11-20 | 2014-03-12 | 江苏大学 | Rotary infrared light emitting diode (LED) array light source detection system |
| CN103630545A (en) * | 2013-11-20 | 2014-03-12 | 江苏大学 | Injection-molded blade on-line monitoring device and method based on near-infrared optical wave array |
| CN103776838A (en) * | 2013-11-20 | 2014-05-07 | 江苏大学 | Static type cross-flow fan starved feeding fault online diagnostic device |
| CN103630546B (en) * | 2013-11-20 | 2016-04-27 | 江苏大学 | Rotary-type infrared LED array light source detection system |
| CN103776838B (en) * | 2013-11-20 | 2016-07-20 | 江苏大学 | Silent oscillation through-flow fan blade lacks material fault on-line diagnostic device |
| CN103674969A (en) * | 2014-01-14 | 2014-03-26 | 江苏大学 | Rotary injection molding blade starving failure online diagnosing device |
| CN103674969B (en) * | 2014-01-14 | 2016-08-17 | 江苏大学 | Rotary-type injection blade lacks material fault on-line diagnostic device |
| CN107209127A (en) * | 2015-01-09 | 2017-09-26 | 欧瑞康纺织有限及两合公司 | The method and apparatus that quality monitoring is carried out to the fiber webs of multiple melt-spuns of tow |
| CN104808082A (en) * | 2015-04-02 | 2015-07-29 | 浙江安德电器有限公司 | Thermal-imaging-based dishwasher assembly line electrical element detecting system and method |
| CN108814558A (en) * | 2018-05-08 | 2018-11-16 | 哈尔滨商业大学 | A kind of skin neoplasin nondestructive detection system and method based on fm exciter thermal map |
| CN109884120A (en) * | 2019-04-03 | 2019-06-14 | 哈尔滨商业大学 | A kind of device and method of femtosecond laser excitation infrared thermal wave NDT titanium-aluminium alloy defect |
| CN110400311A (en) * | 2019-08-01 | 2019-11-01 | 中北大学 | High-temperature alloy surface defect characteristic extracting method based on pulse laser thermal imaging |
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Application publication date: 20120718 |