CN103383367A - Method for scanning type thermal conduction line temperature detection of workpiece shallow cracks - Google Patents
Method for scanning type thermal conduction line temperature detection of workpiece shallow cracks Download PDFInfo
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- CN103383367A CN103383367A CN2013102935485A CN201310293548A CN103383367A CN 103383367 A CN103383367 A CN 103383367A CN 2013102935485 A CN2013102935485 A CN 2013102935485A CN 201310293548 A CN201310293548 A CN 201310293548A CN 103383367 A CN103383367 A CN 103383367A
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Abstract
Relating to a defect detection method, in particular to a method for nondestructive defect detection of workpiece shallow cracks, the invention provides a method for scanning type thermal conduction line temperature detection of workpiece shallow cracks. The method includes the steps of: disposing a laser and an infrared thermal imager above the front of a to-be-detected workpiece respectively; letting a high power laser beam scan a straight line rapidly on the front of the workpiece; arranging a measuring line parallel to the laser scanning line in the thermal imager, detecting the temperature rise curve at the site simultaneously, detecting a maximum value, and determining whether cracks exist between the laser scanning line and the measuring line according to the maximum value. With a wide application area, the method provided in the invention not only can achieve a high detection rate on the shallow cracks of the workpiece, and also can determine the depth of the cracks according to the temperature difference of line temperature low temperature points, thereby drawing a three-dimensional graph of the cracks. The detection method is visible and nondestructive, has no need of an intermediate medium during detection, has no adverse effect on the workpiece, and can acquire a visible and accurate detection result.
Description
Technical field
The present invention relates to a kind of defect inspection method, relate in particular to the method for the shallow surface check of a kind of harmless defects detection workpiece.
Background technology
In element part, modal defective is crackle, pore, slag inclusion etc.The reason that defective produces is diversified, mainly contains following several:
The first, the defective that is produced by starting material in the fabrication phase;
The second, the defective that the processing and manufacturing stage produces;
The 3rd, the defective that equipment in use occurs.
Check that these defectives use nondestructive determination usually,, want to judge that these defectives are harmful or harmless all difficults.Fail to judge in case produce, will cause very large threat and serious consequence to the production safety operation.
Existing defective technology mainly contains following several method:
1, detection method of eddy
This method utilizes the eddy current crack detector to carry out.When its principle was detector contact crackle, the impedance that makes probe coil weakened and obtains variation on voltage, namely demonstrates respective value or send chimes of doom on the instrument calibration dish.Can also utilize equally eddy-current method to measure the depth value of crackle.The method can't detect nonmetal and non-ferromagnetic metal.
2, X-ray detection X method
In monitoring of equipment, χ, the gamma-rays that is easy to penetrating material commonly used.When ray is penetrating in the object process, owing to being absorbed and scattering, make remitted its fury, the degree of its decay is relevant with the kind of object thickness, material character and ray, and therefore when object had pore equal-volume defective, ray just easily passed through.Otherwise, if when being mixed with the foreign matter that absorbs ray and being mingled with, ray just be difficult to by.Object with the radiation exposure of even intensity detects makes the ray sensitization on photographic plat that sees through, and determines defect kind, size and distribution situation by the observation to egative film, estimates the extent of injury of defective according to corresponding standard.But this method expense is higher, and the operator is had harm.
3, ultrasonic testing
This method is to utilize the high-frequency ultrasonic of emission (1～10MHz) is injected into the inside of detected material, as run into inherent vice the ultrasound wave of a part of incident be reflected or decay at fault location, then after receiving, amplifies again probe, determined position and the size thereof of defective by the waveform that shows, then come the extent of injury of assessment according to corresponding standard.The method needs intermediate medium, and detection technique requires high, and the defective pattern is described low precision.
Summary of the invention
Detect the crack technology existence for existing surface shallow table micro-crack is difficult to the accurate defective that detects, the invention provides a kind of method that scan-type lines of thermal conduction temperature detector is surveyed the shallow surface check of workpiece.
The method step of the shallow surface check of scan-type lines of thermal conduction temperature detector survey workpiece of the present invention is as follows:
Be respectively arranged with a laser instrument and thermal infrared imager above test specimen to be measured front; One high-power laser beam is scanned straight line fast on the test specimen front; A slotted line with the laser scanning line parallel is set in thermal imaging system, detects simultaneously temperature rise curve herein, detect mxm., judge according to mxm. between laser scanning line and slotted line, whether workpiece has crackle.
This method has the following advantages:
1, this method application surface is wide, and metal, nonmetal, compound substance etc. are all applicable, only needs to adjust corresponding laser and measurement parameter.
2, this detection method not only has higher recall rate to the shallow surface check on workpiece, under the support of experimental data, can determine according to the temperature difference of the low warm spot of line temperature the depth of crackle, can draw thus the three-dimensional plot of crackle.
3, this detection method is easy to be directly perceived, and harmless, testing process need not intermediate medium, and workpiece is had no adverse effects, and testing result is intuitively accurate.
4, to compare advantage with " the harmless crack detection method of dot matrix heat conduction thermometric " be that detection efficiency significantly improves to this method, but under equal conditions, relatively required laser power wants large.
Description of drawings
Fig. 1 is shallow surface check detection method schematic diagram of the present invention, wherein 1: test specimen to be measured, 2: laser instrument, 3: thermal infrared imager, 2-1: laser scanning line, 3-1: infrared measurement of temperature line;
Fig. 2 is that shallow surface check detects principle schematic, wherein 1: test specimen to be measured, 2-1: laser scanning line, 3-1: infrared measurement of temperature line, 4: detection zone for the first time, 5: detection zone for the second time, 6: detection zone for the third time, 7: shallow surface check;
Fig. 3 is that shallow surface check detected temperatures shows curve synoptic diagram (detection zone for the first time);
Fig. 4 is that shallow surface check detected temperatures shows curve synoptic diagram (detection zone for the second time);
Fig. 5 is that shallow surface check detected temperatures shows curve synoptic diagram (detection zone for the third time);
Fig. 6 is for reducing the crack shape principle schematic, 3-1-1: n by the temperature curve shape
1Inferior measuring position, 3-1-2: n
2Inferior measuring position, 3-1-3: n
3Inferior measuring position, 3-1-4: n
4Inferior measuring position, 3-1-5: n
5Inferior measuring position, 3-1-6: n
6Inferior measuring position, 3-1-7: n
7Inferior measuring position;
Fig. 7 is n
1The temperature logs of inferior measurement;
Fig. 8 is n
2The temperature logs of measuring;
Fig. 9 is n
3The temperature logs of measuring;
Figure 10 is n
4The temperature logs of measuring;
Figure 11 is n
5The temperature logs of measuring;
Figure 12 is n
6The temperature logs of measuring;
Figure 13 is n
7The temperature logs of measuring;
Figure 14 detects figure according to the workpiece crack that Fig. 7-13 draws.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is further described; but do not limit to so; every technical solution of the present invention is modified or is equal to replacement, and not breaking away from the spirit and scope of technical solution of the present invention, all should be encompassed in protection scope of the present invention.
Scan-type lines of thermal conduction anneal crack line detection method of the present invention, step is as follows:
As shown in Figure 1, be respectively arranged with a laser instrument 2 and thermal infrared imager 3 above test specimen to be measured 1 front; One high-power laser beam is scanned straight line fast on the test specimen front; An Infrared survey line 3-1 parallel with laser scanning line 2-1 is set thermal infrared imager 3 is interior, detects simultaneously line temperature temperature rise curve herein, the detection mxm..
Different for the workpiece situation, its power demand is also different, and the most basic requirement is will be within 1 second, makes that the workpiece place's of being scanned temperature rise is the highest will be reached higher than room temperature 20-200 ℃, and the decline of too low temperature rise meeting accuracy of detection causes the undetected of fine crack.
When between laser scanning line and slotted line during the workpiece flawless, its heat conduction is evenly good, its line temperature curve temperature rise is evenly normal, when between laser scanning line and slotted line, workpiece has crackle, because heat conduction is obstructed, so its line temperature curve is no longer straight line, due to the obstruction of crackle, on its corresponding position, low warm spot can appear.As shown in Fig. 2-14.Workpiece is divided into some sweep traces, first try scanning with laser beam on workpiece, then n millimeter place establishes a slotted line after workpiece upper tracer in the thermal imaging system form, after having detected article one line, workpiece movable m millimeter, then carry out second scanning, measure, in whole workpiece sensing process, the slotted line relative position of the sweep trace of laser instrument and thermal imaging system remains unchanged.Scan successively and detect each line temperature and record, connect each line temperature and hang down the warm spot position and can draw workpiece crack detection figure.Distance between slotted line and sweep trace, scanning times is few, and efficient is high, depending on workpiece sensing requirement height, generally also can be first greatly apart from Rough Inspection, examining again after discovery line temperature abnormality is namely shortened spacing, in the exceptions area duplicate detection.Undetected for preventing fully vertical crackle with sweep trace, need workpiece rotating 90 is spent, then repeat above-mentioned scanning testing process and get final product.
The linear temperature measurement is the function that existing middle and high end thermal imaging system generally has, and a word laser line generator is the laser instrument that can launch an even straight line.In this method, laser instrument can adopt general laser instrument, also can adopt a high-power word laser line generator, and what point of a word laser line generator and general laser instrument emission was different is the laser instrument that can launch an even straight line, need not scanning.Thermal imaging system generally needs the middle and high end thermal imaging system, and its real-time thermal map frame frequency is more than 30 hertz, and frame frequency is higher, and pixel is higher, and its accuracy of detection is higher.
Claims (6)
1. scan-type lines of thermal conduction temperature detector is surveyed the method for the shallow surface check of workpiece, it is characterized in that described method step is as follows:
Be respectively arranged with a laser instrument and thermal infrared imager above test specimen to be measured front; One high-power laser beam is scanned straight line fast on the test specimen front; A slotted line with the laser scanning line parallel is set in thermal imaging system, detects simultaneously temperature rise curve herein, detect mxm., judge according to mxm. between laser scanning line and slotted line, whether workpiece has crackle.
2. scan-type lines of thermal conduction temperature detector according to claim 1 is surveyed the method for the shallow surface check of workpiece, it is characterized in that described laser instrument is general laser instrument or a word laser line generator.
3. scan-type lines of thermal conduction temperature detector according to claim 1 is surveyed the method for the shallow surface check of workpiece, it is characterized in that described thermal imaging system is the middle and high end thermal imaging system, and its real-time thermal map frame frequency is more than 30 hertz.
4. scan-type lines of thermal conduction temperature detector according to claim 1 is surveyed the method for the shallow surface check of workpiece, it is characterized in that in described testing process, workpiece is divided into some sweep traces, scan successively and detect each line temperature and record, connect each line temperature and hang down the warm spot position and can draw workpiece crack detection figure.
5. scan-type lines of thermal conduction temperature detector according to claim 4 is surveyed the method for the shallow surface check of workpiece, it is characterized in that in whole workpiece sensing process, the slotted line relative position of the sweep trace of laser instrument and thermal imaging system remains unchanged.
6. according to claim 1 or 4 described scan-type lines of thermal conduction temperature detectors are surveyed the method for the shallow surface check of workpiece, it is characterized in that described workpiece crack defective determination methods is as follows: when between laser scanning line and slotted line during the workpiece flawless, its line temperature curve is a straight line; When between laser scanning line and slotted line, workpiece had crackle, its line temperature curve was not straight line, occurred low warm spot on crackle corresponding position.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103837493A (en) * | 2014-03-14 | 2014-06-04 | 云南电力试验研究院（集团）有限公司电力研究院 | Combined overhead conductor defect detection method |
| CN105628739A (en) * | 2015-12-25 | 2016-06-01 | 黑龙江科技大学 | Robot laser infrared nondestructive testing device for large workpiece and flaw detection method |
| CN109211974A (en) * | 2018-08-07 | 2019-01-15 | 哈尔滨商业大学 | Thermal insulation layer construction debonding defect pulsed femtosecond laser pumping infrared thermal wave detection device and method |
| CN110044963A (en) * | 2019-04-22 | 2019-07-23 | 西安交通大学 | A kind of hot grid scanning calorimeter imaging nondestructive inspection method |
| CN113916937A (en) * | 2021-08-24 | 2022-01-11 | 中国人民解放军陆军装甲兵学院 | Crack detection method, crack detection device, electronic equipment and storage medium |
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| CN102183545A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | Infrared temperature measurement detection method for detecting solder joint reliability of circuit board |
| CN202486043U (en) * | 2012-03-15 | 2012-10-10 | 华东师范大学 | System for detecting microcrack of silicon chip |
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Patent Citations (3)
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| US5705821A (en) * | 1996-11-07 | 1998-01-06 | Sandia Corporation | Scanning fluorescent microthermal imaging apparatus and method |
| CN102183545A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | Infrared temperature measurement detection method for detecting solder joint reliability of circuit board |
| CN202486043U (en) * | 2012-03-15 | 2012-10-10 | 华东师范大学 | System for detecting microcrack of silicon chip |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103837493A (en) * | 2014-03-14 | 2014-06-04 | 云南电力试验研究院（集团）有限公司电力研究院 | Combined overhead conductor defect detection method |
| CN103837493B (en) * | 2014-03-14 | 2017-01-18 | 云南电力试验研究院（集团）有限公司电力研究院 | Combined overhead conductor defect detection method |
| CN105628739A (en) * | 2015-12-25 | 2016-06-01 | 黑龙江科技大学 | Robot laser infrared nondestructive testing device for large workpiece and flaw detection method |
| CN109211974A (en) * | 2018-08-07 | 2019-01-15 | 哈尔滨商业大学 | Thermal insulation layer construction debonding defect pulsed femtosecond laser pumping infrared thermal wave detection device and method |
| CN110044963A (en) * | 2019-04-22 | 2019-07-23 | 西安交通大学 | A kind of hot grid scanning calorimeter imaging nondestructive inspection method |
| CN110044963B (en) * | 2019-04-22 | 2021-01-19 | 西安交通大学 | Thermal grid scanning thermal imaging nondestructive testing method |
| CN113916937A (en) * | 2021-08-24 | 2022-01-11 | 中国人民解放军陆军装甲兵学院 | Crack detection method, crack detection device, electronic equipment and storage medium |
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Application publication date: 20131106 |