CN102574237A - 使用等离子、活性或还原气体的气氛来清洁铜引线的系统和方法 - Google Patents

使用等离子、活性或还原气体的气氛来清洁铜引线的系统和方法 Download PDF

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CN102574237A
CN102574237A CN2010800465742A CN201080046574A CN102574237A CN 102574237 A CN102574237 A CN 102574237A CN 2010800465742 A CN2010800465742 A CN 2010800465742A CN 201080046574 A CN201080046574 A CN 201080046574A CN 102574237 A CN102574237 A CN 102574237A
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wire
pipe
gas
plasma
bonding wire
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P·L·休
W·赖斯
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Linde GmbH
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Linde GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
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    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
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Abstract

本发明涉及一种方法和设备(100)，用于在引线接合工艺中使用引线(20)之前、采用等离子、活性或还原气体对来自接合引线(20)的氧化物进行清洁。

Description

使用等离子、活性或还原气体的气氛来清洁铜引线的系统和方法
发明领域
本发明涉及用于对电子器件互连和包装中所使用的引线接合工艺的接合引线进行清洁的方法和设备。
发明背景
引线接合是利用引线框或衬底上的外部引导件使集成电路(芯片)或其它电子元件上的端子之间进行互连的基本方法。此外，引线接合可用于将集成电路连接于其它的电子器件或其它集成电路，以及用于将多个引线框、衬底或印刷电路板连接在一起。引线接合提供成本有效且挠性的互连方法，并且由此用在大多数的电子器件制造中。
引线接合方法分成两个主要种类；即，球形接合和楔形接合，其中引线使用热量、压力或超声能量的组合方式而在两个端部处附连于电子元件，以实现紧密的接合或焊接。引线接合中使用的引线具有从15μm至数百μm范围内的直径，并且最初主要由金、银或铝制成。然而，考虑到成本节省，铜或铜合金引线的使用日益普遍。
然而，铜或铜合金引线的使用产生显著的问题，即铜会变得易于被迅速氧化。形成在引线上的所产生氧化物污染或氧化物层通常会影响接合粘度并且增大接触电阻。此外，由于氧化物的存在，会不利于所希望的紧密接合。这会是芯线分离和由包装应力产生氧化物污染或氧化物层的原因。因此，当在引线接合方法中使用铜或铜合金引线时，处理结果有时是不稳定且不恒定的。引线在附连于接合器时还具有有限的贮藏寿命和短暂的使用寿命。
因此，本领域存在如下需求：用于对引线接合方法中使用的接合引线进行清洁的方法进行改进。
发明概述
本发明提供用于对来自接合引线的氧化物和其它污染物进行清洁的设备和方法，其中避免了与现有技术方法相关的缺点。具体地说，本发明提供一种使用等离子、活性或还原气体来作为引线接合工艺的一部分对接合引线进行清洁的设备和方法。
附图简介
图1是根据本发明一实施例的接合引线清洁设备的示意图。
图2是示出了并未由根据本发明的方法处理过的铜引线的示例的放大视图。
图3是示出了已由根据本发明的方法处理过的铜引线的示例的放大视图。
发明详述
本发明提供用于对来自引线接合工艺中使用的接合引线的氧化物或其它污染物进行清洁的改进设备和方法。本发明提供用于在将引线用在引线接合步骤中之前、使用等离子、活性或还原气体对接合器内的接合引线进行清洁的方法和设备。
参见图1，将更详细地描述本发明。图1是根据本发明的用于使用等离子、活性或还原气体来清洁接合引线的设备的示意图。具体地说，图1示出了设备100，该设备100具有线卷10，且该线卷10通过毛细管30将线股20供给至引线接合处理40。存储在线卷中或者作为线股馈送至引线接合处理的引线会变得被氧化并且需要清洁，以避免上述与接合相关的问题。
根据本发明，线股20暴露于用于清洁带有氧化物的引线的等离子、活性或还原气体的气氛。为了容纳等离子或活性气体气氛，提供其中通有引线的管子。如图1所示，管子50A或50B可沿着线股20从线卷10至毛细管30的路径进行安装。具体地说，管子可如图1所示的管子50A那样位于线卷10附近，或者管子可如图1所示的管子50B那样位于毛细管30附近。或者，管子可沿着线股20的路径位于任何其它位置处，或者可提供多个管子，例如可既使用管子50A又使用管子50B。用于容纳清洁其它的管子可由任何合适的材料制成，例如玻璃、塑料、陶瓷、介电材料或抗等离子侵蚀的其它材料。
等离子、活性或还原气体可在管子外部产生或激活，然后充填到管子中，或者可作为气体引入管子且然后在管子内激活。具体地说，气体或等离子可由任何已知的产生方法在管子外部产生，然后通过“T”或“Y”型连接部、经过管子侧部或进入管子的一个端部或两个端部而引入管子。气体或等离子产生器可具有任何已知类型，或者是包括那些在kHz、MHz或GHz范围内工作的产生器。此外，可使用微波类型的发生器。或者，气体可引入管子，然后可由诸如势垒放电(barrier discharge)方法之类的任何已知等离子产生技术在管子内产生等离子或激活气体。
用于等离子的气体可以是氢、氩、氮、氧或一种或多种上述气体的混合物。根据本发明的一些尤其有用的气体混合物是带有高达10％氢的氩和带有高达10％氢的氮。可在室温下或者可从室温将温度加热至高达900℃来引入等离子。管子内的气体压力应低于1巴。较佳的是，等离子气体以小于2Sm/hr的流动速率流动通过管子。
本发明的设备和方法提供若干优点。具体地说，氧化物和其它污染物可在引线接合之前容易地且安全地从引线中移除。这允许使用事先被污染的引线，即已超龄的引线以及已存储在不当条件下的引线。通过使用本发明的设备和方法，可消除对于引线的最低寿命控制的需求。此外，通过使用已使用本发明的设备和方法进行清洁的引线，所产生的接合更加可靠且恒定，产生较高的接合质量、较大的处理窗口、较低的接合接触电阻以及较佳的可靠性能。
已实施了对于本发明设备和方法的测试，并得到下文所述的结果。所执行的测试使用两个不同的等离子源，即VarigonTM气体(可从琳德集团(Linde AG)得到的带有5％氢的氩)和成形气体(带有5％氢的氮)。此外，测试两个不同的操作模式。测试运行1-4使用DBE等离子源，该等离子源包含带有彼此隔离的两个外部电极的玻璃毛细管并且具有15kHz电源。通过T部件在玻璃毛细管的上端注入等离子气体。玻璃毛细管的相对端部具有减小的直径。测试运行5-7使用CPM等离子源，该等离子源包含玻璃毛细管和内部金属毛细管并且具有1MHz的电源，且玻璃毛细管带有有孔外电极，而内部金属毛细管与将要在低电势下进行清洁的引线进行接触。将等离子气体注入到两个毛细管之间。
测试运行1。Varigon气体在8标况升/分钟(slm)下注入毛细管，且一个电极设置在高压上，而第二电极设置在低压上。产生等离子并且毫无问题地进行接合工艺。
测试运行2。Varigon气体在8slm下注入毛细管，且两个电极都设置在高压上，而待清洁的引线施加有低压。接合工艺受影响并且需要进一步优化。
测试运行3。成形气体在1slm下注入毛细管，且两个电极都设置在高压上，而待清洁的引线施加有低压。虽然等离子产生，但接合工艺受影响并且需要进一步优化。
测试运行4。成形气体在1slm下注入毛细管，且一个电极设置在高压上，而第二电极设置在低压上。产生等离子并且毫无问题地进行接合工艺。
测试运行5。Varigon气体在5slm下注入到沿着冷却空气至电源的毛细管之间。带孔电极设置在高电势上，而金属毛细管和引线设置在低电势上。产生等离子并且毫无问题地进行接合工艺。
测试运行6。并不使用内部毛细管。Varigon气体在5slm下注入通过玻璃毛细管，且有孔电极设置在高电势上，而引线设置在低电势上。产生等离子并且毫无问题地进行接合工艺。
测试运行7。并不使用内部毛细管。成形气体在5slm下注入通过玻璃毛细管，且有孔电极设置在高电势上，而引线设置在低电势上。产生等离子并且毫无问题地进行接合工艺。
上述测试示出等离子源可定位在接合头部上，且电气操作模式并不影响接合机器的操作。此外，接合引线既不受到毛细管又不受到等离子的危害，且接合工艺可在等离子产生的同时进行。等离子源DBE和CPM都可利用Varigon气体或成形气体操作。
图2和3清楚地示出了本发明的清洁优点。具体地说，图2示出并未由本发明处理的接合引线，并且清楚地示出呈现为沿着引线表面的黑点的显著的氧化物污染。图3示出在本发明的等离子处理之后的接合引线，其中已移除氧化物，且引线表面非常干净。
如上所述，本发明提供各个优点，包括在引线接合之前从引线中容易地且安全地移除氧化物，产生更可靠且恒定的引线接合。此外，几乎任何引线可通过本发明的方法进行处理，然后用在引线接合工艺中，包括已被污染的、超龄的或存储在不当条件下的引线。
应当理解，这里所述的实施例仅是示例性的，且本领域的技术人员可进行变型和修改而不偏离本发明的精神和范围。所有这些变型和修改都意指包括在这里所述的本发明范围内。此外，由于本发明的各种实施例可组合地提供所希望的结果，因而所披露的所有实施例并非必要的替代方案。

Claims (20)

1.一种用于清洁接合引线的系统，包括：
接合引线的线卷；
引线接合设备；
毛细管馈送件，所述毛细管馈送件用于将所述接合引线馈送至所述引线接合设备；
所述接合引线的延伸部，所述延伸部从所述线卷行进至所述毛细管馈送件；以及
用于封闭的装置，所述用于封闭的装置用于将所述接合引线的延伸部的至少一部分封闭在等离子、活性或还原气体的气氛中。
2.如权利要求1所述的系统，其特征在于，所述用于封闭的装置包括管子。
3.如权利要求2所述的系统，其特征在于，还包括两个电极，所述电极位于所述管子的外表面上，且所述电极彼此隔离。
4.如权利要求2所述的系统，其特征在于，还包括有孔电极和金属毛细管，所述有孔电极位于所述管子的外表面上，而所述金属毛细管将尺寸设计成装配在所述管子内。
5.如权利要求2所述的系统，其特征在于，所述管子由玻璃、塑料、陶瓷、介电材料或其它抗等离子侵蚀的材料制成。
6.如权利要求1所述的系统，其特征在于，所述接合引线是金、银、铝、铜或铜合金引线。
7.如权利要求1所述的系统，其特征在于，所述等离子气氛是氢、氩、氮、氧或一种或多种上述气体的混合物。
8.一种对用于引线接合工艺的接合引线进行清洁的方法，包括：
使所述接合引线从供给线卷延伸至毛细管馈送件，进入引线接合过程；
沿着所述接合引线的延伸部的至少一部分、在所述线卷和所述毛细管馈送件之间建立等离子、活性或还原气体的气氛；以及
在所述等离子气氛中清洁所述接合引线。
9.如权利要求8所述的系统，其特征在于，所述接合引线是金、银、铝、铜或铜合金引线。
10.如权利要求8所述的方法，其特征在于，所述等离子气氛是氢、氩、氮、氧或一种或多种上述气体的混合物。
11.如权利要求8所述的方法，其特征在于，建立气体气氛包括提供管子并且在所述管子内提供所述气体气氛，且所述管子将所述接合引线的延伸部的一部分封闭。
12.如权利要求11所述的方法，其特征在于，所述管子由玻璃、塑料、陶瓷、介电材料或其它抗等离子侵蚀的材料制成。
13.如权利要求11所述的方法，其特征在于，在所述管子内提供所述气体气氛包括将从外部源产生的气体注入所述管子。
14.如权利要求13所述的方法，其特征在于，注入气体包括通过与所述管子相关联的T或Y型连接部来注入所述气体。
15.如权利要求13所述的方法，其特征在于，注入气体包括通过所述管子的一个端部或两个端部来注入所述气体。
16.如权利要求8所述的方法，其特征在于，在所述管子内提供所述气体气氛包括将所述气体注入所述管子并且激励所述管子内部的气体。
17.如权利要求16所述的方法，其特征在于，注入气体包括通过与所述管子相关联的T或Y型连接部来注入所述气体。
18.如权利要求16所述的方法，其特征在于，注入气体包括通过所述管子的一个端部或两个端部来注入所述气体。
19.如权利要求8所述的方法，其特征在于，所述气体气氛是氩和氢的混合物。
20.如权利要求8所述的方法，其特征在于，所述气体气氛是氮和氢的混合物。
CN2010800465742A 2009-10-16 2010-10-14 使用等离子、活性或还原气体的气氛来清洁铜引线的系统和方法 Pending CN102574237A (zh)

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