CN102573388A - 散热型pcb板托盘 - Google Patents
散热型pcb板托盘 Download PDFInfo
- Publication number
- CN102573388A CN102573388A CN2010106006535A CN201010600653A CN102573388A CN 102573388 A CN102573388 A CN 102573388A CN 2010106006535 A CN2010106006535 A CN 2010106006535A CN 201010600653 A CN201010600653 A CN 201010600653A CN 102573388 A CN102573388 A CN 102573388A
- Authority
- CN
- China
- Prior art keywords
- heat
- tray
- pcb board
- heat dissipation
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
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Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201010600653.5A CN102573388B (zh) | 2010-12-22 | 2010-12-22 | 散热型pcb板托盘 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010600653.5A CN102573388B (zh) | 2010-12-22 | 2010-12-22 | 散热型pcb板托盘 |
Publications (2)
Publication Number | Publication Date |
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CN102573388A true CN102573388A (zh) | 2012-07-11 |
CN102573388B CN102573388B (zh) | 2015-07-15 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201010600653.5A Active CN102573388B (zh) | 2010-12-22 | 2010-12-22 | 散热型pcb板托盘 |
Country Status (1)
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CN (1) | CN102573388B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103941835A (zh) * | 2014-03-28 | 2014-07-23 | 成都绿迪科技有限公司 | 计算机机箱通风散热系统 |
CN107666820A (zh) * | 2017-09-18 | 2018-02-06 | 通鼎互联信息股份有限公司 | 线卡和通信机箱 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2482316Y (zh) * | 2001-03-01 | 2002-03-13 | 深圳市中兴通讯股份有限公司 | 功率器件安装结构 |
CN201467048U (zh) * | 2009-07-31 | 2010-05-12 | 北京青云创新科技发展有限公司 | 数字式同步转换装置 |
-
2010
- 2010-12-22 CN CN201010600653.5A patent/CN102573388B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2482316Y (zh) * | 2001-03-01 | 2002-03-13 | 深圳市中兴通讯股份有限公司 | 功率器件安装结构 |
CN201467048U (zh) * | 2009-07-31 | 2010-05-12 | 北京青云创新科技发展有限公司 | 数字式同步转换装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103941835A (zh) * | 2014-03-28 | 2014-07-23 | 成都绿迪科技有限公司 | 计算机机箱通风散热系统 |
CN107666820A (zh) * | 2017-09-18 | 2018-02-06 | 通鼎互联信息股份有限公司 | 线卡和通信机箱 |
CN107666820B (zh) * | 2017-09-18 | 2019-09-10 | 通鼎互联信息股份有限公司 | 线卡和通信机箱 |
Also Published As
Publication number | Publication date |
---|---|
CN102573388B (zh) | 2015-07-15 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518000, Guangdong Shenzhen hi tech Southern District, Haitian two road 14, software industry base, 5D block, 7, Nanshan District Applicant after: SEMPTIAN TECHNOLOGIES LTD. Address before: 518000 Guangdong Province, Shenzhen city Nanshan District District Science Park Road, building 6 storey main building Jiada Lang Applicant before: Semptian Technologies Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SEMPTIAN TECHNOLOGY CO., LTD. TO: SHENZHEN SEMPTIAN TECHNOLOGIES?CO.,?LTD. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Heat-dissipation type PCB (Printed Circuit Board) tray Effective date of registration: 20160112 Granted publication date: 20150715 Pledgee: Shenzhen SME financing Company limited by guarantee Pledgor: SEMPTIAN TECHNOLOGIES LTD. Registration number: 2016990000030 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: 518000 Guangdong city of Shenzhen province Nanshan District Guangdong streets two Haitian Road No. 14, block 5D 8 layer software industry base Patentee after: Shenzhen Hengxin data Limited by Share Ltd Address before: 518000, Guangdong Shenzhen hi tech Southern District, Haitian two road 14, software industry base, 5D block, 7, Nanshan District Patentee before: SEMPTIAN TECHNOLOGIES LTD. |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20170214 Granted publication date: 20150715 Pledgee: Shenzhen SME financing Company limited by guarantee Pledgor: Shenzhen Hengxin data Limited by Share Ltd Registration number: 2016990000030 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PM01 | Change of the registration of the contract for pledge of patent right |
Change date: 20170214 Registration number: 2016990000030 Pledgor after: Shenzhen Hengxin data Limited by Share Ltd Pledgor before: SEMPTIAN TECHNOLOGIES LTD. |