CN102573326B - The repair method reprocessed for circuit board and repair workstation - Google Patents
The repair method reprocessed for circuit board and repair workstation Download PDFInfo
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- CN102573326B CN102573326B CN201110452315.6A CN201110452315A CN102573326B CN 102573326 B CN102573326 B CN 102573326B CN 201110452315 A CN201110452315 A CN 201110452315A CN 102573326 B CN102573326 B CN 102573326B
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- 230000008439 repair process Effects 0.000 title claims abstract description 101
- 238000000034 method Methods 0.000 title claims abstract description 43
- 229910000679 solder Inorganic materials 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 238000012958 reprocessing Methods 0.000 claims abstract description 32
- 230000008569 process Effects 0.000 claims abstract description 27
- 230000007547 defect Effects 0.000 abstract description 10
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 9
- 230000008901 benefit Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 235000004443 Ricinus communis Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention is applicable to maintenance of equipment technical field, discloses a kind of repair method of reprocessing for circuit board and repair workstation.Above-mentioned repair method comprises the following steps, and arranges a sealable work chamber, and this work chamber vacuum degree is adjustable; In work chamber, arrange the manipulator part with heating unit, described manipulator part is controlled by the operation bench be arranged at outside work chamber; Repair piece to be positioned in work chamber and process is vacuumized to work chamber, and then operating operation bench the heating unit on manipulator part is heated the solder joint on repair piece, thus described repair piece is reprocessed.Above-mentioned repair workstation comprises the work chamber being connected with vacuum generator, is provided with manipulator part in work chamber, and work chamber is outside equipped with the operation bench that can manipulate described manipulator part.Repair method provided by the invention and repair workstation, can ensure the defects such as repair piece solder joint leaving no air bubbles inside, cavity, reliability is high.
Description
Technical field
The invention belongs to maintenance of equipment technical field, particularly relate to a kind of repair method of reprocessing for circuit board and repair workstation.
Background technology
At present, such as PCBA (Printed Circuit Board Assembly, finished circuit board) or other circuit boards, when needing to reprocess, as repair piece, it all reprocesses in open repair workstation, and the mode mainly adopting infrared heating or Hot-blast Heating or infrared heating to mix with Hot-blast Heating when reprocessing melts the solder joint on repair piece.Open platform in the process of reprocessing repair piece easily cause the defects such as solder joint cavity, bubble, thus easily causes solder joint failure, and then cause repair piece reliability to reduce.During the components and parts particularly needing bonding area larger when reprocessing, because bonding area is large, more easily there is the defects such as solder joint cavity, bubble, repair piece reprocess after reliability low.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art, provide a kind of repair method of reprocessing for circuit board and repair workstation, reprocess rear solder joint inside have the problem of the defect such as bubble, cavity to solve repair piece, raising repair piece reprocess after reliability.
The invention provides a kind of repair method reprocessed for circuit board, said method comprising the steps of:
One sealable work chamber is set, and this work chamber vacuum degree is adjustable;
In described work chamber, arrange the manipulator part with heating unit, described manipulator part is controlled by the operation bench be arranged at outside described work chamber, and can reprocess operation to repair piece;
Repair piece to be positioned in work chamber and process is vacuumized to work chamber, and then operating operation bench the heating unit on manipulator part is heated the solder joint on repair piece, thus described repair piece is reprocessed.
Present invention also offers a kind of repair workstation of reprocessing for circuit board, described repair workstation comprises the work chamber that can be used for accommodating repair piece, described work chamber is connected with the vacuum generator of adjustable described work chamber vacuum degree, the manipulator part can reprocessing operation to repair piece is provided with in described work chamber, described manipulator part comprises the heating unit for heating the solder joint on repair piece, and described work chamber is outside equipped with the operation bench that can manipulate described manipulator part.
A kind of repair method of reprocessing for circuit board provided by the invention and repair workstation, it has the adjustable work chamber of vacuum degree by arranging, and the manipulator part can reprocessing operation to repair piece is set in work chamber, make repair piece vacuum or close to the environment of vacuum under weld, the bubble at solder joint place is overflowed because of solder joint external vacuum, solve in prior art and reprocess rear solder joint existence cavity, the problem of the defects such as bubble, even the solder joint that bonding area is larger, also can ensure to reprocess rear solder joint leaving no air bubbles inside, the defects such as cavity, ensure that the validity of solder joint, improve repair piece reprocess after reliability.
Accompanying drawing explanation
Fig. 1 is the floor map of a kind of repair workstation of reprocessing for circuit board that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Shown in figure 1, a kind of repair method reprocessed for circuit board that the embodiment of the present invention provides, comprise the following steps: a sealable work chamber 100 is set, and this work chamber 100 vacuum degree is adjustable, the manipulator part 200 with heating unit is set in work chamber 100, described manipulator part 200 is controlled by the operation bench 300 be arranged at outside described work chamber 100, and can reprocess operation to repair piece 900; Repair piece 900 can be PCBA (Printed Circuit Board Assembly, finished circuit board) or other circuit boards, the present invention is applicable to need butt welding point to carry out heating to realize the welding of components and parts or the various occasion of dismounting and various circuit board.When repair piece 900 is reprocessed, first repair piece 900 to be positioned in work chamber 100 and process is vacuumized to work chamber 100, and then operate operation bench 300 to control manipulator part 200, heating unit on manipulator part 200 heats the solder joint on repair piece 900, melt to make solder joint, realize welding or the dismounting of components and parts on repair piece, thus realize reprocessing described repair piece.Particularly, the vacuum generator 400 pairs of work chambers 100 being connected to work chamber 100 can be arranged vacuumize.By work chamber 100 is carried out vacuumizing process, can effectively by air exclusion, in work chamber 100, air pressure is very low, if there is bubble etc. in solder joint, bubble overflows from solder joint under the effect of solder joint external vacuum, solves a difficult problem for prior art, in rework process, even if the region that bonding area is larger, solder joint also there will not be the defect such as bubble, cavity, effectively improves the reliability of repair piece 900.
Further, described method also comprises, and outside described work chamber 100, arrange monitor, monitor can be fixed on operation bench 300.In described work chamber 100, arrange camera 500, image can be sent on described monitor by camera 500 in real time.The operating personnel of work chamber 100 outside can monitor the working condition of repair piece 900 and manipulator part 200 in real time by monitor and camera 500.Can by operation bench 300 control the rotation direction of camera 500, luffing angle, focusing from etc. so that more clearly monitor the working condition of repair piece 900 and manipulator part 200, thus provide reference for the operation of operating personnel.Certainly, camera 500 also can be fixed in work chamber 100 and alignment settings region, also belongs to protection scope of the present invention.
The embodiment of the present invention, according to above-mentioned repair method, provides a kind of repair workstation of reprocessing for circuit board, can be used for reprocessing repair piece 900 such as PCBA etc.As shown in Figure 1, above-mentioned repair workstation comprises the work chamber 100 that can be used for accommodating repair piece 900, described work chamber 100 is connected with the vacuum generator 400 of adjustable work chamber 100 vacuum degree, vacuum generator 400 can vacuumize process to work chamber 100, and the air pressure vacuumized can regulate according to actual conditions, such as, when need weld the solder joint of larger area, can the air pressure vacuumized be set to lower, to improve the vacuum degree of work chamber 100, thus reach preferably welding effect, ensure the reliability of welding; When the solder joint that bonding area is very little, the air pressure vacuumized can be arranged get Lve Gao, the vacuum degree now in work chamber 100 is lower, thus can shorten and vacuumize the required time, under the prerequisite ensureing quality of welding spot, effectively improves the efficiency of reprocessing.The manipulator part 200 can reprocessing operation to repair piece 900 is provided with in described work chamber 100, described manipulator part 200 comprises the heating unit for heating the solder joint on repair piece 900, described work chamber 100 is outside equipped with the operation bench 300 that can manipulate described manipulator part 200, operation bench 300 can set the kinematic parameter reprocessing parameter, manipulator part 200, and the parameter etc. of heating unit on manipulator part 200.Manipulator part 200 is for carrying out Repair to repair piece 900, and it is two-dimentional or three-dimensional mobile that it can make one dimension in work chamber 100, to weld the solder joint of diverse location.Heating unit on manipulator part 200, for melting solder joint, can realize welding or the dismounting of components and parts on repair piece, reprocesses operation to carry out replacing components and parts etc. to repair piece 900.After work chamber 100 is vacuumized, heating unit butt welding point heats, in the process that solder joint melts, because the air pressure of work chamber 100 is low, the air of solder joint inside will overflow, thus whole welding region is covered by scolding tin, can ensure the defect such as bubble-free, cavity in solder joint inside, thus ensure that the validity of solder joint, substantially increase repair piece 900 reprocess after reliability.
Particularly, as shown in Figure 1, described manipulator part 200 also comprises the mobilizable mechanical arm, the vacuum suction unit for mobile repair piece 900 that are manipulated by operation bench 300, described mechanical arm is movably set in described work chamber 100, and described vacuum suction unit and heating unit are arranged on described mechanical arm.It is two-dimentional or three-dimensional mobile that mechanical arm can make one dimension in work chamber 100.Vacuum suction unit is used for being adsorbed by repair piece 900 and moving to desired location.After vacuum generator 400 pairs of work chambers 100 vacuumize process or when vacuumizing, the heating unit on manipulator part 200 will heat solder joint corresponding on repair piece 900.The vacuum degree of work chamber 100 can adjust as required.By such design, operating personnel also easily can control the manipulator part 200 in work chamber 100 by operation bench 300 in work chamber 100 outside, manipulator part 200 is substituted and manually completes reclamation work, improve the degree of automation and the precision of reclamation work, reduce the labour intensity of operating personnel.
Particularly, described heating unit be infrared emittance or/and laser is first-class, can select according to actual conditions, also can select other parts with heating function or equipment be used as heating unit be solder joint heating, all belong to protection scope of the present invention.
Particularly, work chamber 100 is provided with hatch door or hatchcover, repair piece 900 put into work chamber 100 or to take out repair piece 900 from work chamber 100.Hatch door, hatchcover place can be provided with sealing strip.
Further, as shown in Figure 1, described work chamber 100 is outside equipped with monitor, is provided with camera 500 in described work chamber 100, and image can be sent on described monitor by camera 500 in real time.The operating personnel of work chamber 100 outside can by the situation of monitor and camera 500 real time inspection repair piece 900 and manipulator part 200.Can by operation bench 300 control the rotation direction of camera 500, luffing angle, focusing from etc. so that more clearly check the situation of repair piece 900 and manipulator part 200, thus provide reference for operating personnel.Certainly, camera 500 also can be fixed in work chamber 100 and alignment settings region, also belongs to protection scope of the present invention.
Particularly, as shown in Figure 1, described monitor is arranged at described operation bench 300 place, so that operating personnel watch the screen of monitor.
Particularly, as shown in Figure 1, described work chamber 100 is provided with transparent region, at least one place, outside operating personnel intuitively clearly observe the working condition of repair piece 900 in work chamber 100 and manipulator part 200 by transparent region.
More specifically, transparent region can be transparent observation window 110.Outside operating personnel intuitively clearly check the working condition of repair piece 900 in work chamber 100 and manipulator part 200 by observation window 110.Observation window 110 can offer one or more, or also whole work chamber 100 can be designed to adopt transparent material to make.
More specifically, if offer an observation window 110, it can be positioned at and operation bench 300 side place in opposite directions, and it is inner that operating personnel just can watch work chamber 100 through observation window 110 at operating desk place.Astrodome also can offer two or more, to ensure in work chamber 100 well-lighted while, also handled easily personnel more clear, more fully observe working condition in work chamber.
Particularly, all be connected by cable between operation bench 300 with manipulator part 200, between monitor with camera 500, cable is through the side-walls of work chamber 100, and work chamber 100 is provided with hermetically-sealed construction in the cable place of wearing, and seals cable by fluid sealant etc. through place.
Particularly, as shown in Figure 1, described repair workstation also comprises host platform 600, described work chamber 100 is arranged on described host platform 600, be provided with main process equipment in described host platform 600, this main process equipment can be computer etc., stores relevant driving and control program in it.Described main process equipment is connected with vacuum generator 400 with operation bench 300, manipulator part 200 respectively, main process equipment for receive operation bench 300 set reprocess parameter, and reprocess parameter accordingly for being performed reprocessing in parameter that operation bench 300 sets by described driving and control program driving device hand unit 200 and vacuum generator 400, namely with manipulator part 200 with vacuum generator 400 is each self-correspondingly reprocesses parameter, to reprocess repair piece 900.Reprocess the vacuum degree of reprocessing parameter, work chamber 100 that parameter includes but not limited to manipulator part 200, the reprocessing parameter and can comprise the action of vacuum suction unit on the track of the manipulator motion on manipulator part 200 and original position, mechanical arm, the temperature etc. of heating unit of described manipulator part 200.
Further, camera 500 and monitor all can be connected on main process equipment, main process equipment can control camera 500 and monitor, and for the image of acquisition camera 500 and image is sent to monitor, by receiving the setting of operation bench to the parameter of camera and monitor, main process equipment can control parameters such as the picture of the focal length of camera 500, orientation and monitor, shading value, contrast, colors.
Further, can also arrange memory in main process equipment, memory can be hard disk etc., reprocesses video recording, so that review rework process for storing.
Particularly, host platform 600 can be set to movable type, can arrange castor in the lower end of host platform 600, installs easily or moves to the place of setting, efficiently, reliably reprocess service for client provides with the repair workstation embodiment of the present invention provided.Operation bench 300 can be connected on main process equipment, and manipulator part 200, camera 500 etc. also can be connected to main process equipment.
More specifically, as shown in Figure 1, described operation bench 300 is arranged at one end of described host platform 600, and described vacuum generator 400 is arranged at the other end of described host platform 600 and is communicated in described work chamber 100 by exhaust tube 410.So that the operation of operating personnel, the noise effect operating personnel produced when avoiding vacuum generator 400 to work as far as possible.
A kind of repair method of reprocessing for circuit board that the embodiment of the present invention provides and repair workstation, its by make repair piece 900 vacuum or close to the environment of vacuum under weld, the bubble at solder joint place is overflowed because of solder joint external vacuum, solve solder joint when reprocessing in prior art and there is the problem of the defects such as cavity, bubble, even the solder joint that bonding area is larger, also can ensure the defects such as spot area leaving no air bubbles inside, cavity, product is solved due to cavity, problem that the reliability that causes of bubble is low after reprocessing.And the repair workstation that the embodiment of the present invention provides, it is primarily of the parts such as work chamber 100, operation bench 300, vacuum generator 400 composition being built-in with manipulator part 200, this modular design, assembling mode, have easy to assembly, be convenient to the advantages such as maintenance, think that client provides the service of reprocessing in time, efficiently, and improve the reliability of repair piece 900.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement or improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. for the repair method that circuit board is reprocessed, it is characterized in that, said method comprising the steps of:
One sealable work chamber is set, and this work chamber vacuum degree is adjustable, described work chamber is connected with the vacuum generator of adjustable work chamber vacuum degree, and described vacuum generator can vacuumize process to work chamber, and the air pressure vacuumized can regulate according to actual conditions;
In described work chamber, arrange the manipulator part with heating unit, described manipulator part is controlled by the operation bench be arranged at outside described work chamber, and can reprocess operation to repair piece; Outside described work chamber, arrange monitor, in described work chamber, arrange camera, image can be sent to described monitor by described camera in real time; By operation bench control the rotation direction of camera, luffing angle, focusing from;
Repair piece to be positioned in work chamber and process is vacuumized to work chamber, and then operate operation bench the heating unit on manipulator part is heated the solder joint on repair piece, described operation bench reprocesses the kinematic parameter of parameter, described manipulator part for setting, and the parameter of heating unit on described manipulator part, described manipulator part can be done three-dimensional mobile in work chamber, to weld the solder joint of diverse location, thus described repair piece is reprocessed.
2. a repair workstation of reprocessing for circuit board, it is characterized in that, described repair workstation comprises the work chamber that can be used for accommodating repair piece, described work chamber is provided with hatch door or hatchcover, described work chamber is connected with the vacuum generator of vacuum degree in adjustable described work chamber, described vacuum generator can vacuumize process to work chamber, and the air pressure vacuumized can regulate according to actual conditions, the manipulator part can reprocessing operation to described repair piece is provided with in described work chamber, described manipulator part comprises the heating unit for heating the solder joint on repair piece, described work chamber is outside equipped with the operation bench that can manipulate described manipulator part, described operation bench is used for setting and reprocesses parameter, the kinematic parameter of described manipulator part, and the parameter of heating unit on described manipulator part, described work chamber is outside equipped with monitor, in described work chamber, camera is set, image can be sent to described monitor by described camera in real time, described manipulator part can be done three-dimensional mobile in work chamber, to weld the solder joint of diverse location, described repair workstation also comprises host platform, described work chamber is arranged on described host platform, main process equipment is provided with in described host platform, described main process equipment is connected with vacuum generator with described operation bench, manipulator part respectively, for receive the setting of described operation bench reprocess parameter and for drive described manipulator part and vacuum generator perform described in reprocess in parameter and reprocess parameter accordingly.
3. the repair workstation of reprocessing for circuit board as claimed in claim 2, it is characterized in that, described manipulator part also comprises the mobilizable mechanical arm, the vacuum suction unit for mobile repair piece that are manipulated by described operation bench, and described vacuum suction unit and heating unit are arranged on described mechanical arm.
4. the repair workstation of reprocessing for circuit board as claimed in claim 3, it is characterized in that, described heating unit is that infrared emittance is or/and laser head.
5. the repair workstation of reprocessing for circuit board as claimed in claim 4, it is characterized in that, described monitor is arranged at described operation bench place.
6. the repair workstation of reprocessing for circuit board according to any one of claim 2 to 4, is characterized in that, described work chamber has the region that a place is transparent at least, and described transparent region is for observing the working condition in the work chamber of work chamber.
7. the repair workstation of reprocessing for circuit board according to any one of claim 2 to 4, it is characterized in that, described repair workstation also comprises host platform, described work chamber is arranged on described host platform, main process equipment is provided with in described host platform, described main process equipment is connected with vacuum generator with described operation bench, manipulator part respectively, for receive the setting of described operation bench reprocess parameter and for drive described manipulator part and vacuum generator perform described in reprocess in parameter and reprocess parameter accordingly.
8. the repair workstation of reprocessing for circuit board as claimed in claim 7, it is characterized in that, described operation bench is arranged at one end of described host platform, and described vacuum generator is arranged at the other end of described host platform and is connected with described work chamber by exhaust tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110452315.6A CN102573326B (en) | 2011-12-29 | 2011-12-29 | The repair method reprocessed for circuit board and repair workstation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110452315.6A CN102573326B (en) | 2011-12-29 | 2011-12-29 | The repair method reprocessed for circuit board and repair workstation |
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| Publication Number | Publication Date |
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| CN102573326A CN102573326A (en) | 2012-07-11 |
| CN102573326B true CN102573326B (en) | 2015-09-23 |
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| CN201110452315.6A Expired - Fee Related CN102573326B (en) | 2011-12-29 | 2011-12-29 | The repair method reprocessed for circuit board and repair workstation |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104599986A (en) * | 2014-12-12 | 2015-05-06 | 南通富士通微电子股份有限公司 | Rework method of products with cold joint in flip chip |
| CN106793543A (en) * | 2016-12-14 | 2017-05-31 | 利亚德电视技术有限公司 | Rework equipments |
| CN109865735B (en) * | 2019-03-21 | 2020-01-10 | 张雨璠 | Waste circuit board recovery device |
| CN112888190A (en) * | 2021-01-22 | 2021-06-01 | 国营芜湖机械厂 | Method for reliably dismounting large-area grounding plug-in module of high-frequency circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101080962A (en) * | 2004-11-29 | 2007-11-28 | 希脱鲁尼克斯公司 | Thermal attach and detach methods and systems for surface-mounted components |
| CN201360395Y (en) * | 2009-02-24 | 2009-12-09 | 西安中科麦特电子技术设备有限公司 | BGA precise visual bonding and welding repair system |
| CN102059448A (en) * | 2010-12-20 | 2011-05-18 | 中国电子科技集团公司第三十八研究所 | Device for welding microwave circuit base plate based on vacuum directed radiation |
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Effective date of registration: 20171114 Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Patentee after: Huawei terminal (Dongguan) Co.,Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: HUAWEI DEVICE Co.,Ltd. |
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Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: Huawei terminal (Dongguan) Co.,Ltd. |
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Granted publication date: 20150923 |