CN102570001A - 天线 - Google Patents

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CN102570001A
CN102570001A CN2011103191986A CN201110319198A CN102570001A CN 102570001 A CN102570001 A CN 102570001A CN 2011103191986 A CN2011103191986 A CN 2011103191986A CN 201110319198 A CN201110319198 A CN 201110319198A CN 102570001 A CN102570001 A CN 102570001A
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antenna
chamber
bwa
aforementioned
substrate
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马逾钢
孙晓兵
张亚琼
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Sony Corp
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Sony Corp
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Abstract

本发明提供了一种天线，该天线包括：设置用于与IC上的信号端口连接的IC接合带、基板接合焊盘、连接在IC接合带与基板接合焊盘之间的接合引线天线(BWA)，以及在所述基板接合焊盘附近的谐振腔。本发明的天线改善了天线辐射的一致性和/或辐射的方向性。

Description

天线
技术领域
本发明涉及一种天线，具体而不仅仅涉及用于毫米波(MMW)信号的接合引线天线(bond wire antenna，BWA)。
背景技术
MMW天线通常形成在印刷电路板(PCB)或其它固体基板上。由于所用材料的缘故，在MMW频带中商业PCB基板的损耗正切会较高。为了提高效率，可以采用在低损耗材料的特殊工艺，例如在玻璃(氧化铝)上的微机电系统(MEMS)工艺。但是这种工艺比较复杂并且成本较高。
另外，从IC晶片到天线所在的基板之间的MMW信号耦合也会导致额外的损耗。虽然可以将天线直接设计在IC晶片内(片上天线)以避免部分耦合损耗并大大缩小尺寸，但由于晶片的高损耗正切，片上天线的辐射效率很低。
另一种可选方法是在IC晶片的信号端口上使用具有一定长度及形状的接合引线，以便将接合引线用作天线。由于接合引线在空中，所以IC晶片和PCB基板的损耗对天线的影响很小。这种类型的天线被称为接合引线天线(BWA)。
参考文献[1]中提出了一种单端馈入BWA。该设计中，整个天线装置位于IC芯片上。它限于单端馈入应用，并且要求IC晶片的顶层上具有接地平面(ground plane)。所述接地平面几乎与整个IC晶片的尺寸一样大，这并不会不可行。而且，因为BWA要在接地平面以上接合，所以必须严格控制接地平面上方的接合引线的拱起高度。否则，辐射效率、中心频率和辐射方向图会受到影响。
参考文献[2]中提出了一种差分馈入三角形环路天线。这是BWA与on-PCB天线(PCB上天线)的结合。所述环路的一边是PCB基板，而另外两边是通过接合引线构建的。由于PCB基板上的迹线，所述天线的性能取决于PCB基板的损耗正切、介电常数等等。这更像是on-PCB天线而不是BWA。
参考文献[3]中公开了一种差分馈入偶极子BWA。其具有窄带宽以及位于IC晶片下面的金属贴片。
参考文献[5]及参考文献[6]中描述了两种类型的BWA(圆极化以及线极化)。然而，在先前结构中的天线辐射可能会受到周围材料的影响。所述辐射方向图会不够平滑。这可能导致在发射器(Tx)与接收器(Rx)之间形成易波动的相对位置(sensitive relative position)，从而小的位置误差可能造成性能损失。
参考文献：
[1].Niharika Varanasi，Byunghoo Jung，and Dimitrios Peroulis，“On-ChipBond-wire Antennas on CMOS-grade Silicon Substrates”IEEE Antennas andPropagation Society International Symposium，2008.AP-S 2008.
[2].Toshiba Group，“Corporate Research and Development”2008.
[3].Tsai；Chi Taou，Ricardo A.，“Antenna Structure for Integrated CircuitDie Using Bond Wire”.US patent application 20080291107.
[4].Rofougaran；Ahmadreza，“Integrated Circuit with Antenna Structureand Methods for Use Therewith”.US patent application 20090009408.
[5].Yugang Ma，Xiaobing Sun，“An antenna.”Singapore patent application200907835-3.
[6].Yugang Ma，Kenich Kawasaki，“An antenna and a method ofmaanufacturing.”Singapore patent application 200907908-8.
[7].Zhuowen Sun and P.Fay“A Dielectric-filled Cavity-backed DipoleAntenna for Microwave/Millimeter-wave Applications”Microwave SymposiumDigest，2006.IEEE MTT-S International.
[8]Guo Qing Luo；Ling Ling Sun；“Circularly polarized antenna based ondual-mode circular SIW cavity.”ICMMT 2008Proceedings.
发明内容
总体而言，本发明提出了一种毗邻BWA的一端的谐振腔。其具有如下优点：改善了天线辐射的一致性和/或辐射的方向性。可以减少天线辐射方向图的旁瓣以及其它不需要的峰，所以本发明可以适用于双天线双工应用，其中两个天线彼此靠近并且天线之间的隔离度很大。BWA可以用于集成电路(IC)封装中的射频辐射器/检测器中。与基板结合在一起的腔可以用来控制MMW通信系统中的辐射。它还可以用于其它射频频带。天线可以结构紧凑，例如小于0.6mm长度(就60GHz的中心频率而言)，并且具有宽的带宽，例如大于15GHz(就60GHz的中心频率而言)。
BWA可具有两个接合引线臂，并且接合引线臂的一端位于IC晶片的信号端口上，而另一端分别位于基板的接合焊盘上。在所述BWA下方，基板中具有腔。除了一侧具有BWA开口之外，该腔是由金属壁环绕的腔体。该腔含有电介质材料、或者不含任何物质(真空)、或者含有空气。可以根据腔的谐振频率确定天线中心频率。
双腔式BWA结构可以用于双工应用，其中两个矩形腔式BWA彼此靠近放置。双腔式BWA的谐振频率可以相同，也可以不同。
腔的形状可以是梯形，当IC晶片区域拥挤时梯形可能较为合适。
腔的形状可以是梯形并且靠近基板边缘的壁可以开口(这可能适于IC晶片区域拥挤的情况)，目标方向可以是水平方向。
腔可以是与基板结合在一起的腔或者金属槽。
接合引线天线包括以间隔角并列设置的两根接合引线，并且所述腔的一个或多个尺寸由所述间隔角决定。
本发明的第一点具体说明中，提供了根据技术方案1所述的天线。可以根据技术方案2-12中的任一项实施具体实施方式。
附图说明
为了使本发明能够被充分理解并且易于产生实际效果，现在仅通过非限制性的示例来说明，下面结合示意性附图描述具体实施方式，其中：
图1(a)是现有技术的宽带BWA的立体图；
图1(b)是图1(a)中BWA的辐射方向图；
图2(a)是根据一个具体实施例的腔式BWA的立体图；
图2(b)是图2(a)中的腔式BWA的截面图；
图2(c)是图2(a)中腔式BWA的辐射方向图；
图3(a)是根据另一个具体实施例的60GHz+80GHz矩形腔式BWA的俯视图；
图3(b)是图3(a)中腔式BWA的损耗以及串扰的曲线图；
图3(c)图3(a)中腔式BWA的截面图；
图3(d)是图3(a)中腔式BWA的辐射方向图；
图4是60GHz+80GHz梯形腔式BWA的平面图；
图5是另一种60GHz+80GHz梯形腔式BWA的平面图；
图6是一种60GHz+60GHz腔式BWA的平面图；
图7是天线测量装置的示意图；
图8是测得的天线增益与频率的关系图；
图9(a)是测得的垂直天线的辐射方向图；
图9(b)是测得的水平天线的辐射方向图；
图10(a)是现有技术的无腔的双BWA的立体图；
图10(b)是图10(a)中BWA的天线之间隔离度的曲线图；
图11(a)是带有腔的双BWA的立体图；以及
图11(b)是图11(a)中BWA的天线之间隔离度的曲线图。
具体实施方式
图2(a)和图2(b)展示了根据具体实施例的腔式BWA 100。两根接合引线102在IC晶片106的同一信号端口104处接合，另一端则分别在基板110上的独立的接合焊盘108处接合，并且腔112正好位于接合焊盘108的下面。此处，所述腔是指除一侧开口外由金属壁环绕的三维的电介质、空气或真空区域。腔112可以是与基板结合在一起的腔(参考文献[8])。与基板结合在一起的腔由两个金属层中间夹有电介质基板(例如，印刷电路板：PCB)制成。在腔部，其中一个金属层被刻蚀。所述被刻蚀的区域是腔的孔。围绕该孔的边缘有竖直的金属壁。所述金属壁可以由连接顶部金属层与底部金属层的对准的通孔制成。孔的尺寸以及腔112的体积可以取决于工作时的中心频率波长。例如，对于60GHz的中心频率，腔的半径可以是3mm，厚度可以是0.8mm，填充材料的介电常数可以是3.7。波长越大，腔的孔及体积越大。腔112的高度还可以取决于信号波长。最好使腔的厚度大于或者等于中心信号频率的1/4波长。图2(c)展示了腔式BWA的辐射方向图200，我们可以看到腔式BWA可以具有比图1(b)更平滑的辐射方向图。图2(a)中的腔112的形状是半圆柱形。它也可以是其它形状，比如矩形等。腔112的体积可以确定腔式BWA的中心频率。
图3展示了60GHz+80GHz双腔式BWA的例子。图3具有两个独立的矩形腔式BWA。两个BWA300、302相互靠得很近地设置。由于形成天线辐射的腔根本上设置为从基板向上，因此与无腔式相比，两腔式BWA的隔离度被提高。将图10中现有的双BWA的天线之间隔离度与图11中的双腔式BWA的天线之间隔离度进行比较，可以看到新的双腔式BWA结构将隔离度改善了约4dB。此处，IC晶片上信号端口的间距是0.33mm，以及两个腔式BWA的间距是0.33mm。从图3(b)可以看到，60GHz以及80GHz腔式BWA的回波损耗带宽＞15GHz。从图3(d)可以看到，腔式BWA的最大辐射方向是从基板向上。
图4展示了梯形60GHz+80GHz腔式BWA，其具有与图3(b)以及图3(d)相同的性能。注意，图4中的接合焊盘400被覆盖。在这种变型中，靠近IC晶片的腔的边比较小。该形状在下述情形下是有用的：IC晶片区域中的部件以及引线迹线拥挤，因此只有较小的空间允许腔式BWA连接。
图5是60GHz+80GHz腔式BWA的另一种变型。在此，就每个BWA而言，靠近基板边缘的腔壁500中的一个被去除。这种变型可以控制每个BWA的辐射方向朝向基板的前方。
图6是制得的60GHz+60GHz双腔式BWA的照片。在所述BWA馈入端口处附有矢量的探针(probe of the vector)。它用于信号馈入以及测量。
图7展示了用于图6中BWA的天线测量装置。它包括用于在不同的方向(辐射方向图)测试天线增益的旋转臂、矢量网络分析仪、标准喇叭天线、待测天线等等。
图8展示了图6中60GHz腔式BWA的测得增益与频率性能的关系的例子。可以看到天线频率响应是宽的。从50GHz到676Hz，天线增益差＜3dBi。
图9展示了所测得的图6中606Hz腔式BWA的辐射方向图。可以看到，最大天线增益清晰，并且朝着向上的方向。
尽管在具体实施方式中描述了各种具体实施例，但本领域技术人员应当理解，在不脱离本发明要求保护的范围内，还可以在设计的细节、结构和/或操作方面进行很多改变。

Claims (12)

1.一种天线，包括：
IC接合带，配置为与IC上的信号端口连接，
基板接合焊盘，
连接在IC接合带与所述基板接合焊盘之间的接合引线天线，以及
在所述基板接合焊盘附近的谐振腔。
2.如权利要求1所述的天线，其中所述腔的形状从包括半圆柱、立方体、梯形棱柱以及它们的任意组合的集合中选择。
3.如权利要求1或2所述的天线，其中所述腔是与基板结合在一起的腔或金属槽。
4.如权利要求3所述的天线，其中所述腔形成于基板中，所述基板具有夹在两个金属层之间的电介质，并且所述腔具有金属壁。
5.如前述权利要求中任一项所述的天线，进一步包括第二接合引线天线以及靠近所述第二接合引线天线的第二谐振腔。
6.如前述权利要求中任一项所述的天线，其中所述腔的壁是开口的并且设置为在水平面内引导辐射。
7.如前述权利要求中任一项所述的天线，其中所述腔从含有电介质、空气和真空的集合中选择。
8.如前述权利要求中任一项所述的天线，其中所述腔的高度大于或等于中心信号频率波长的1/4。
9.如前述权利要求中任一项所述的天线，其中所述腔的体积大体上与中心频率波长成比例。
10.如权利要求9所述的天线，其中所述接合引线天线包括以间隔角并列设置的两根接合引线，并且所述腔的一个或多个尺寸由所述间隔角决定。
11.如前述权利要求中任一项所述的天线，其中所述基板接合焊盘之间是隔开或者重叠的。
12.如前述权利要求中任一项所述的天线，所述天线配置为发射毫米波信号。
CN2011103191986A 2010-10-28 2011-10-19 天线 Pending CN102570001A (zh)

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