CN102568803B - SMD transformer dosing technology improves - Google Patents
SMD transformer dosing technology improves Download PDFInfo
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- CN102568803B CN102568803B CN201010618315.4A CN201010618315A CN102568803B CN 102568803 B CN102568803 B CN 102568803B CN 201010618315 A CN201010618315 A CN 201010618315A CN 102568803 B CN102568803 B CN 102568803B
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Abstract
The present invention discloses a kind of SMD transformer dosing technology and improves, and it is characterized in that: get varnish and treat potted transformer, treats the magnet ring in potted transformer with varnish parcel, with varnish lead-in wire sticked at and treat potted transformer outer casing inner wall, leave standstill, at 135 ± 10 DEG C, toast 90 ± 15 minutes; The present invention uses varnish to replace, at the bottom of RTV glue embedding current in transformer embedding field at present and black rubber seal, not only simplifying technological process, saving manufacturing cost, and make the quality of transformer finished products lighter.
Description
Technical field
The present invention relates to packaging technology field, particularly relate to a kind of SMD transformer dosing technology and improve.
Background technology
Mostly traditional transformer is to adopt vacuum-impregnated method to carry out anticorrosion damp-proof treatment to transformer.Along with the extensive use of transformer, in order to adapt to different environment, developing the technique using epoxy resin to carry out embedding and transformer is processed.Existing dosing technology is generally to treat that the device of embedding first pours into RTV glue (room temperature vulcanized silicone rubber), to toast, then pour into black glue, toast after vacuumizing, and then second time pours into black glue, toasts after vacuumizing.Although can play good embedding effect, manufacturing process is complicated, causes manufacturing cost higher, further, owing to using at the bottom of black rubber seal, therefore when Reflow Soldering, easily there is crack because temperature sharply changes in bottom, is broken by lead-in wire, affect the performance of product.
Summary of the invention
Main purpose of the present invention is to provide a kind of SMD transformer dosing technology to improve, and its processing procedure is simple, raw material is few and cheap.
In order to achieve the above object, the present invention is by the following technical solutions:
A kind of SMD transformer dosing technology improves, and wherein, gets varnish and treats potted transformer, with the magnet ring that varnish parcel is treated in potted transformer, with varnish lead-in wire sticked at and treat potted transformer outer casing inner wall, leave standstill, at 135 ± 10 DEG C, toast 90 ± 15 minutes.
Above-mentioned SMD transformer dosing technology improves, and described baking time is preferably 90 minutes.
Above-mentioned SMD transformer dosing technology improves, and wherein, described time of repose is at least 30 minutes; Be preferably 30-60 minute.
Above-mentioned SMD transformer dosing technology improves, wherein, described in treat before potted transformer embedding first preheating 1-2 hour at 80-100 DEG C; Be cooled to 50-60 DEG C afterwards.
Above-mentioned SMD transformer dosing technology improves, and wherein, the varnish after described preheating carries out stirring for 5-10 minute before embedding.
Above-mentioned SMD transformer dosing technology improves, and wherein, described varnish is drying-type.
Above-mentioned SMD transformer dosing technology improves, and wherein, described varnish is solvent-borne type.
Above-mentioned SMD transformer dosing technology improves, and wherein, the maximum operating temperature of described varnish is 130-180 DEG C; Be preferably 130-155 DEG C.
The present invention has the following advantages compared to existing technology:
1, SMD transformer dosing technology of the present invention improves, and owing to using varnish embedding to instead of existing RTV glue and black glue embedding, simplifies technological process, decreases manufacturing cost.
2, SMD transformer dosing technology of the present invention improves, and because the permeance property of varnish is good, therefore it is protecting resistance to pressing better than RTV glue.
3, SMD transformer dosing technology of the present invention improves, and because of capillarity, varnish can climb up along lead-in wire, can anchor leg and magnet ring well, and fixed effect is better than RTV glue.
4, SMD transformer dosing technology of the present invention improves, and because no longer sealing black glue, can not cause crack, breaking lead-in wire, better reliability when crossing hot blast Reflow Soldering because expanding with heat and contract with cold.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail.
Choose with a collection of SMD type network transformer treating embedding, carry out following process:
(1) beat pre-wire: by bluish-green for 39# golden red four colo(u)r streak pars intermedia leasing 5-8 joint/cm, twisted wire length 8cm, end, two ends twisted wire partial-length is 9cm;
(2) winding by hand dicyclo: bluish-green for golden red four look twisted wire parts are enclosed around 14 on magnet ring 5000uiT3.05/1.78/2.00mm, by green for reddish tone buttock line strand 5-8 joint/cm, then enclose around 10 on magnet ring 850uiT2.54/1.27/1.27mm with the green tail twisted wire of reddish tone, the spacing of two magnet rings is 2-3mm;
(3) twisted wire: by green for red tail head line, the blue head line of yellow tail plays strand apart from magnet ring 2 ± 0.5mm place, twisted wire 5-8 joint/cm respectively;
(4) kinking and whole line: each lead-in wire is twined in the corresponding PIN of shell, will separate near the lead-in wire of PIN, corresponding PIN groove is close to by each line, can not leaded unsettled phenomenon, and can not have broken string, magnet ring can not meet interior PIN;
(5) semi-finished product wicking: PIN terminal in the shell of kinking is stained with scaling powder, then immerses tin stove 2-3 second, tin furnace temperature 430 ± 20 DEG C, and the enamelled wire coat of paint twined on PIN terminal in the enclosure must destroy completely;
(6) semi-finished product cleaning: the product of wicking is put into the supersonic wave cleaning machine that clear water is housed and clean 15 minutes;
(7) baking after semi-finished product cleaning: the product after cleaning is put into 100 ± 10 DEG C of baking boxs and dries 40 minutes;
(8) magnifying glass inspection: the product dried is put under magnifying glass and checks following project:
8.1PIN pin fracture, loosen, crooked, remaining line length
8.2 lead-in wires break, are not pressed onto position
8.3 rosin joints, company's tin, tin point, tin point are large
8.4 interiors of products cannot have foreign material (as block tin, scruff, tin bits etc.)
Dirty, damaged, the outer pin tin sticky of 8.5 shells
8.6 magnet ring superelevation
(9) semi-finished product Hi-pot test: product is put into and is connected on the measurement jig of pressure-resistant testing machine, pressure-resistant machine test condition is: 800VAC1mA1Sec, during product test withstand voltage bad time voltage-withstand test chance sound a buzzer, defective products is chosen, if pressure-resistant testing machine stops High voltage output automatically after non-defective unit reaches the testing time, non-defective unit product is put into non-defective unit box;
(10) semi-finished product integration test: product is put into and is connected in the measurement jig of integrated test machine, start integrated test machine, if screen display " PASS ", be non-defective unit, non-defective unit product is put into non-defective unit box, if screen display " FAIL ", is defective products, is then chosen by defective products.
Get 200 qualified transformers after above-mentioned process, be equally divided into A, B two groups afterwards.
A group transformer is through following process:
(1) fill with RTV & baking: by RTV point on magnet ring, all magnet rings must be wrapped up by RTV and can not be poured in shell and outer PIN, will leave standstill at least 60 minutes before baking, then enter continuous tunnel furnace oven cooking cycle 105 ± 5 DEG C 35 minutes;
(2) glue is joined: after the glue cup of joining glue to be placed on electronic scale zero, pour appropriate black glue into, prepare in proportion, black glue after preparing (in about 1 minute) within the shortest time carries out uniform stirring, suggestion mixing time is 4-5 minute, the black glue be stirred is vacuumized, air gauge maximum is adjusted to-0.1, take out after exhausting 5 minutes;
(3) first time glue is filled with: down inject black glue with installing black glue cadger caddy along PIN in two rows, again black glue is evenly injected to magnet ring, until black glue covers magnet ring, about fill 2/3 of product, fill with glue product and carried out self-inspection: outer PIN, shell edge can not viscose glues, left standstill and vacuumize after 15 minutes.Air gauge maximum is adjusted to-0.08, after exhausting 5 minutes take out, then toast 100 ± 10 DEG C about 45 minutes, carry out benefit glue again, and bubble is chosen to product simultaneously, until fill, magnet ring can not have superelevation, glue face can not be too low, then uses 100 ± 10 DEG C to dry 360 ± 10 minutes, more then use 150 DEG C, toast 90 ± 5 minutes, note during baking choosing bubble, within 15 ~ 20 minutes, choose a bubble, until bubble-free produces;
(4) second time glue is filled with: down inject black glue with installing black glue cadger caddy along PIN in two rows, again to the black glue of the even injection of magnet ring, the product of having filled with glue vacuumizes, vacuumize rear alcohol sprinkling surface at every turn and make bubble-break, then repeat to vacuumize until bubble-free for this reason, product after vacuumizing carries out the outer PIN of self-inspection, shell edge can not viscose glue, leave standstill at least 5 minutes, after send to 90 ± 10 DEG C of baking ovens baking at least 360 minutes, and then with 150 ± 10 DEG C, toast and carry out aging at least 120 minutes, Reflow Soldering need be crossed in 6H after product after aging takes out from baking box.
B group transformer is through following process:
(1) varnish is filled with: by varnish point on magnet ring, the 1053 type varnishs that all magnet ring Shenzhen east brightening Materials Co., Ltd produces wrap up and can not be poured in shell and outer PIN, lead-in wire clings on outer casing inner wall by a small amount of varnish of point, 30 minutes to be left standstill before baking, enter oven cooking cycle again, toast 90 minutes at 135 DEG C.
Transformer after A, B two groups of embeddings is taken weight three times respectively, and averages, the average weight of result A group transformer is the average weight weight than B group transformer.
Transformer after A, B two groups of embeddings is crossed hot blast Reflow Soldering, and because the present invention does not re-use at the bottom of black rubber seal, when therefore crossing hot blast Reflow Soldering, bottom there will not be crack, substantially increases the reliability of product.
Reject substandard product, each 80 of the non-defective unit of A, B two groups of transformers of above-mentioned hot air reflux of learning from else's experience weldering process, carries out voltage-withstand test, after the present invention adopts varnish to substitute RTV glue, although do not use at the bottom of black rubber seal, the withstand voltage properties of product is improved significantly.
Reject substandard product, each 60 of the non-defective unit of A, B two groups of transformers after above-mentioned voltage-withstand test process of learning from else's experience, carries out constant temperature test; Reject substandard product, each 40 of the non-defective unit of A, B two groups of transformers after above-mentioned constant temperature test processes of learning from else's experience, carries out integration test, finds that above-mentioned test is all qualified.
Claims (4)
1. a SMD transformer dosing technology improves, it is characterized in that: get varnish and treat potted transformer, with varnish point to and parcel is treated in potted transformer magnet ring, with varnish lead-in wire sticked at and treat potted transformer outer casing inner wall, for anchor leg and magnet ring, leave standstill 30-60 minute under normal pressure, at 135 ± 10 DEG C, toast 90 ± 15 minutes, wherein said varnish carries out stirring for 5-10 minute before embedding.
2. SMD transformer dosing technology according to claim 1 improves, and it is characterized in that: described in treat before potted transformer embedding first preheating 1-2 hour at 80-100 DEG C; Be cooled to 50-60 DEG C afterwards.
3. SMD transformer dosing technology according to claim 1 improves, and it is characterized in that: described varnish is drying-type.
4. SMD transformer dosing technology according to claim 1 improves, and it is characterized in that: described varnish is solvent-borne type.
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| CN201010618315.4A CN102568803B (en) | 2010-12-31 | 2010-12-31 | SMD transformer dosing technology improves |
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| CN201010618315.4A CN102568803B (en) | 2010-12-31 | 2010-12-31 | SMD transformer dosing technology improves |
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| CN102568803A CN102568803A (en) | 2012-07-11 |
| CN102568803B true CN102568803B (en) | 2016-04-13 |
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| CN103971912A (en) * | 2013-02-06 | 2014-08-06 | 香港商安费诺(东亚)有限公司 | Modular filter assembly and manufacturing method thereof |
| CN103515083B (en) * | 2013-10-28 | 2016-06-08 | 自贡国铨电子有限公司 | A kind of network transformer manufacture method |
| CN109616320B (en) * | 2019-01-04 | 2021-11-23 | 绵阳高新区鸿强科技有限公司 | Network transformer preparation method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201274220Y (en) * | 2008-07-25 | 2009-07-15 | 山东达驰电气有限公司 | Dry transformer for ship |
| CN101567258A (en) * | 2009-02-12 | 2009-10-28 | 天津光电万泰克电子有限公司 | Vacuum encapsulation technology for transformer |
| CN101702370A (en) * | 2009-11-17 | 2010-05-05 | 焦海波 | Casting method of transformer or inductor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002158128A (en) * | 2000-11-20 | 2002-05-31 | Tokin Corp | Surface-mounted transformer and its manufacturing method |
| JP2006335975A (en) * | 2005-06-06 | 2006-12-14 | Hitachi Chem Co Ltd | Insulation coating, electronic part by using the same and method for producing the electronic part |
| CN101226825A (en) * | 2007-11-30 | 2008-07-23 | 上海诺玛液压系统有限公司 | Embedding mold and embedding method for coil kit in electro-hydraulic servo valve |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201274220Y (en) * | 2008-07-25 | 2009-07-15 | 山东达驰电气有限公司 | Dry transformer for ship |
| CN101567258A (en) * | 2009-02-12 | 2009-10-28 | 天津光电万泰克电子有限公司 | Vacuum encapsulation technology for transformer |
| CN101702370A (en) * | 2009-11-17 | 2010-05-05 | 焦海波 | Casting method of transformer or inductor |
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Address after: 523000 Zhenhua Industrial Zone, Qishi Town, Dongguan City, Guangdong Province Patentee after: GUANGDONG MISUN TECHNOLOGY Co.,Ltd. Address before: Zhenhua Industrial Zone, Qishi Town, Dongguan City, Guangdong Province Patentee before: Dongguan Polytron Technologies Inc. Address after: 523000 Zhenhua Industrial Zone, Qishi Town, Dongguan City, Guangdong Province Patentee after: Dongguan Polytron Technologies Inc. Address before: Zhenhua Industrial Zone, Qishi Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN MISUN TECHNOLOGY Co.,Ltd. |