CN103104781A - Current lead insulative sealing coupling head under ultralow temperature vacuum - Google Patents

Current lead insulative sealing coupling head under ultralow temperature vacuum Download PDF

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Publication number
CN103104781A
CN103104781A CN201310023337XA CN201310023337A CN103104781A CN 103104781 A CN103104781 A CN 103104781A CN 201310023337X A CN201310023337X A CN 201310023337XA CN 201310023337 A CN201310023337 A CN 201310023337A CN 103104781 A CN103104781 A CN 103104781A
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China
Prior art keywords
material filling
penetration pipe
low temperature
temperature vacuum
epoxy resin
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CN201310023337XA
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Chinese (zh)
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CN103104781B (en
Inventor
马香莲
章学华
孙志和
施锦
何超峰
黄倩
韩锐
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Huazhong University of Science and Technology
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Vacree Technologies Co Ltd
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Publication of CN103104781B publication Critical patent/CN103104781B/en
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Abstract

The invention discloses a current lead insulative sealing coupling head under ultralow temperature vacuum. The current lead insulative sealing coupling head comprises a material filling barrel and a lead passing tube, wherein the lead passing tube is sleeved in the material filling barrel from an opening at the bottom end of the material filling barrel, a measuring lead penetrates into the lead passing tube from an opening at the top end of the material filling barrel, a connecting flange is mounted on the lead passing tube, and potting compound materials are filled in the material filling barrel and the lead passing tube and composed of epoxy resin, 650 curing agents and filler cement powder in a mixing mode. The current lead insulative sealing coupling head is convenient to mount, dismount, maintain and repair, has good insulative sealing performance, and fills the blank that under low-temperature vacuum, the measuring lead can not be movably connected.

Description

Current feed insulated enclosure connecting joint under a kind of ultra low temperature vacuum
Technical field
The present invention relates to current feed joint field, be specially the current feed insulated enclosure connecting joint under a kind of ultra low temperature vacuum.
Background technique
Cryostat is all double layer constructions of content device and outer container, cryogenic liquide is housed: such as liquid nitrogen (196 ℃), liquid hydrogen (253 ℃), liquid helium (269 ℃) in inner container, soak a vacuum cavity in the cryogenic liquide of inner container, be cryogenic liquide outside this vacuum cavity, inboard vacuum environment.Put sensor at the vacuum cavity lining and collect various required test datas.Draw outside vacuum cavity measuring, to pass cryogenic liquide and draw in the thermostat process, how to accomplish to guarantee that the degree of vacuum under low temperature environment collects test data simultaneously in vacuum chamber, be individual technological difficulties.At present, there is the method for kind of design to be: by the flanged surface welding of vacuum tube and inner chamber body, to measure lead-in wire and draw by vacuum tube.This kind design deficiency is: because vacuum tube is that bottom contact cryogenic liquide is in low temperature environment, top is along with high gradually away from the Low Temperature Liquid surface temperature, become stepped, heat will go between by measurement and pass to low temperature from high temperature like this, hot conduction phenomenon appears, finally cause the larger steam output of cryogenic liquide, the data of sensor acquisition simultaneously are unstable, inaccurate, even can't collect the cryogenic temperature when truly doing experiment.
Summary of the invention
The object of the invention is exactly in order to make up the defective of prior art, current feed insulated enclosure under a kind of ultra low temperature vacuum connecting joint is provided, solved under cryogenic vacuum and guided to outside cavity measuring, avoided simultaneously going between by measurement due to the different meeting of each layer temperature environment hot conduction phenomenon has occured, guarantee to reach required low temperature test environment, have stability, and under cryogenic vacuum, good sealing and insulating properties are arranged.
In order to achieve the above object, the technical solution adopted in the present invention is:
current feed insulated enclosure connecting joint under a kind of ultra low temperature vacuum, it is characterized in that: include the material filling cylinder, described material filling cylinder is presented thick lower narrow stepped, and material filling cylinder top, the bottom is made as respectively nozzle, also comprise penetration pipe, described penetration pipe is inserted in to the material filling cylinder from material filling cylinder bottom nozzle, have and measure lead-in wire and penetrate penetration pipe and pass from the penetration pipe bottom from material filling cylinder top nozzle, on described penetration pipe, adpting flange is installed, described material filling cylinder, exuberant in penetration pipe have a potting compound, described potting compound is 618 epoxy resin by model, 650 curing agent, the bulking agent cement flour mixes, in potting compound, the best proportioning ratio of each component is: epoxy resin, curing agent is pressed the weight ratio of 1:0.65, cement flour is pressed epoxy resin, curing agent both total amount 30%.
Current feed insulated enclosure connecting joint under described a kind of ultra low temperature vacuum, it is characterized in that: the lower end surface of described adpting flange is provided with annular boss.
Current feed insulated enclosure connecting joint under described a kind of ultra low temperature vacuum is characterized in that: be equipped with several bolts hole in described adpting flange.
Current feed insulated enclosure connecting joint under described a kind of ultra low temperature vacuum, it is characterized in that: when being installed on vacuum cavity, the flange that the flanged surface with described adpting flange matches is stretched out in welding on the flanged surface of vacuum cavity, the upper-end surface of the flange on vacuum cavity is provided with the annular groove that matches with described adpting flange annular boss, adopt the sealing of indium silk between described annular boss and annular groove, adopt the brass Bolt Connection between the flange on adpting flange and vacuum cavity.
Current feed insulated enclosure under described a kind of ultra low temperature vacuum connects joint, it is characterized in that: described penetration pipe adopts German alloy silver tube, and the junction end face that penetration pipe contacts with potting compound is polished into cutting edge shape.
Current feed insulated enclosure connecting joint under described a kind of ultra low temperature vacuum is characterized in that: described embedding cylinder adopts polytetrafluoroethylmaterial material.
Current feed insulated enclosure under described a kind of ultra low temperature vacuum connects joint, it is characterized in that: described potting compound prepares by following manufacturing process:
At first the heating ring epoxy resins is approximately 50 ℃, and the cement flour of the amount of getting ready is sneaked into epoxy resin, at 50 ℃ of temperature, and fully at the uniform velocity equidirectional stirring, cement flour will toast before mixing, and guarantees drying, a nothing knot grain phenomenon; The cement flour that stirs and the mixture of epoxy resin naturally cool to the curing agent that adds the amount of getting ready after normal temperature, at the uniform velocity equidirectional stirring, and after it was fully mixed, the standing a bit of time to be allowing the air entrapment emersion, obtained potting compound after will bubble discharging.
Advantage of the present invention is:
(1) each component material of potting compound is the common material that arrives on the market, and is harmless to health, good economy performance, and cost is low.
(2) the embedding cylinder adopts polytetrafluoroethylmaterial material, and teflon is not stained with mutually with epoxy resin, gets the surface and removes conveniently; Under teflon low temperature, shrinkage is large, and the enclasping force of generation is large, and this enclasping force inwardly is beneficial to holds the sealing that penetration pipe improves joint tightly.
(3) Placement of flange has realized connection alive, is convenient to install, dismantle maintenance, repair.
(4) the present invention can be in the lower use of minimum temperature liquid helium (269 ℃), has good insulated enclosure, the flange-type bolt connects, facilitate installation and removal, maintain and repair methods has been filled up and has been measured at low temperatures lead-in wire without the blank that is flexibly connected, and adopts simultaneously special proportioning mode, common epoxy resin is made, and is cheap.
Description of drawings
Fig. 1 is structural representation of the present invention.
Fig. 2 is the example that the present invention is installed on thermostat.
Embodiment
As shown in Figure 1 and Figure 2.current feed insulated enclosure under a kind of ultra low temperature vacuum connects joint, include the material filling cylinder 1 of polytetrafluoroethylmaterial material, material filling cylinder 1 is presented thick lower narrow stepped, and material filling cylinder 1 top, the bottom is made as respectively nozzle, also comprise penetration pipe 2, penetration pipe 2 is inserted in to material filling cylinder 1 from material filling cylinder 1 bottom nozzle, have and measure lead-in wire 3 and penetrate penetration pipe 2 and pass from penetration pipe 2 bottoms from material filling cylinder 1 top nozzle, adpting flange 5 is installed on penetration pipe 2, material filling cylinder 1, exuberant in penetration pipe 2 have a potting compound 4, potting compound is 618 epoxy resin by model, 650 curing agent, the bulking agent cement flour mixes, in potting compound, the best proportioning ratio of each component is: epoxy resin, curing agent is pressed the weight ratio of 1:0.65, cement flour is pressed epoxy resin, curing agent both total amount 30%.
In potting compound of the present invention, the epoxy resin easily be full of cracks at low temperatures that curing agent is many after solidifying, poor in flexibility.Curing agent has lacked the cure cycle prolongation, does not perhaps solidify, even solidified crisply at low temperatures, can not satisfy sealing.Cement flour plays the effect of bulking agent, strengthen intensity, but it can not be too many, and it is very crisp that many epoxy resin become, and can not very little, lack easy be full of cracks.
The lower end surface of adpting flange 5 is provided with annular boss 6.
Be equipped with several bolts hole 7 in adpting flange 5.
The flange 9 that the flanged surface with adpting flange 5 matches is stretched out in welding on the flanged surface of vacuum cavity 8, the upper-end surface of the flange 9 on vacuum cavity 8 is provided with the annular groove that matches with annular boss 6, adopt the sealing of indium silk between annular boss 6 and annular groove, adopt the brass Bolt Connection between the flange 9 on adpting flange 5 and vacuum cavity 8.
Penetration pipe 2 adopts German alloy silver tube, and the end that penetration pipe 2 contacts with potting compound 4 is polished into cutting edge shape.
Measure lead-in wire 3 and can require to select according to the client measurement lead-in wire of different-diameter, different radicals to thermal leakage ratio.
Potting compound preparation process of the present invention is:
Approximately 50 ℃ of first heating ring epoxy resins are sneaked into epoxy resin to the cement flour of the amount of getting ready, at 50 ℃ of temperature, fully stir.Cement flour will toast before mixing, and guarantees drying, a nothing knot grain phenomenon (cement flour is more thin better, preferably selects 〉=200 orders).The cement flour that stirs and the mixture of epoxy resin naturally cool to the curing agent that adds the amount of getting ready after normal temperature, at the uniform velocity equidirectional stirring, and after it is fully mixed, the standing a bit of time.Quiescence time is appropriate and decide, when measuring the half cup into Disposable paper cup standing about 2 minutes, allows the air entrapment emersion, the eliminating bubble.The vacuumizing and exhausting that can adopt with good conditionsi steeps.
The process of potting compound embedding of the present invention is:
Embedding front connector penetration pipe inwall hacking is beneficial to the adhesion of epoxy resin; Joint, measuring lead-in wire all must be clean with alcohol wash, uses after baking.
The measurement lead-in wire required joint is bundled into a branch of with gummed paper tapes, tie up a little about the 100mm place, this is for reserving weld length, and this length is got length in the situation that do not affect leakage heat as far as possible, if after welding unsuccessfully, can cut off, again welding in use has breakage herein simultaneously, also can cut off, again welding, this just gives the chance of having reserved later on rectification.Be all on the market contact pin type, bad if a certain pin welds, be difficult to remedy.
After electric drier heats 50 ℃ of left and right to measurement lead-in wire embedding section, stopped heating, evenly coat epoxy resin in measurement leading wire heating section fast, use simultaneously the flange of electric drier heated sealant joint, after joint heat, measuring lead-in wire from there being an end of tying up to penetrate in the penetration pipe of joint, the position is to the place of tying up of exposing gummed paper tapes.After threading is completed, tying up the place, blocking the lower end of penetration pipe with aluminium foil or linen-cotton dry goods, making wire harness placed in the middle as far as possible.Because the epoxy resin of glue has mobility, can be along with Action of Gravity Field flow out when pouring into, so block the aperture from the penetration pipe bottom; Simultaneously due to Action of Gravity Field, the measurement of attachment band epoxy resins lead-in wire bundle can slowly sink, and causes the length in reserve of upper end to shorten, and also is unfavorable for the embedding of epoxy resin and the embedding curing after good simultaneously, so wire harness will be fastened firmly with adhesive tape with penetration pipe.
After fixing wire harness, beginning injection ring epoxy resins.Can use the injection needle tubing.Epoxy resin first injects penetration pipe, the embedding cylinder that reinjects after fully being full of, and the continuous flange position of heated coupling in the embedding process increases the mobility of epoxy resin, makes more closely knitly, reduces bubble.
In the embedding process, each is measured lead-in wire separately, can not touch mutually or tactile wall; Clamp joint with vice simultaneously, the up and down minor impact several times, makes the epoxy resin of injection more closely knit stably.
About 40 minutes of the mixed operable time of epoxy resin and curing agent, after 40 minutes, epoxy resin and curing agent enter the Procuring phase, and all embedding work will be completed in these 40 minutes.
After embedding finishes, continue heated coupling about 10 minutes, the bubble of fully inside being hidden is driven out of.In the process of heating, constantly there is the bubble emersion surperficial, to note will using these bubbles of punctures this moment, the time of natural explosion is long.Do not need heating after 10 minutes, continue to puncture the bubble of emersion.After half an hour, joint is moved on to the place of safety, unmanned touching, spontaneous curing.To treat rigorous rocking in moving process without proper respect.In the process of spontaneous curing, be interrupted and pay close attention to joint and have or not extremely.
The use equipment drawing of joint of the present invention is as Fig. 2.
The present invention is used under low temperature (4.2K liquid helium temperature), vacuum pressure environment and insulated enclosure, and the lead-in wire radical can reach 1 ~ 60, and is fixed according to customer demand.

Claims (7)

1. the current feed insulated enclosure connecting joint under a ultra low temperature vacuum, it is characterized in that: include the material filling cylinder, described material filling cylinder is presented thick lower narrow stepped, and material filling cylinder top, the bottom is made as respectively nozzle, also comprise penetration pipe, described penetration pipe is inserted in to the material filling cylinder from material filling cylinder bottom nozzle, have and measure lead-in wire and penetrate penetration pipe and pass from the penetration pipe bottom from material filling cylinder top nozzle, on described penetration pipe, adpting flange is installed, described material filling cylinder, exuberant in penetration pipe have a potting compound, described potting compound is 618 epoxy resin by model, 650 curing agent, the bulking agent cement flour mixes, in potting compound, the best proportioning ratio of each component is: epoxy resin, curing agent is pressed the weight ratio of 1:0.65, cement flour is pressed epoxy resin, curing agent both total amount 30%.
2. the current feed insulated enclosure connecting joint under a kind of ultra low temperature vacuum according to claim 1, it is characterized in that: the lower end surface of described adpting flange is provided with annular boss.
3. the current feed insulated enclosure connecting joint under a kind of ultra low temperature vacuum according to claim 1, is characterized in that: be equipped with several bolts hole in described adpting flange.
4. the current feed insulated enclosure connecting joint under a kind of ultra low temperature vacuum according to claim 2, it is characterized in that: when being installed on vacuum cavity, the flange that the flanged surface with described adpting flange matches is stretched out in welding on the flanged surface of vacuum cavity, the upper-end surface of the flange on vacuum cavity is provided with the annular groove that matches with described adpting flange annular boss, adopt the sealing of indium silk between described annular boss and annular groove, adopt the brass Bolt Connection between the flange on adpting flange and vacuum cavity.
5. the current feed insulated enclosure under a kind of ultra low temperature vacuum according to claim 1 connects joint, it is characterized in that: described penetration pipe adopts German alloy silver tube, and the junction end face that penetration pipe contacts with potting compound is polished into cutting edge shape.
6. the current feed insulated enclosure connecting joint under a kind of ultra low temperature vacuum according to claim 1, is characterized in that: described embedding cylinder employing polytetrafluoroethylmaterial material.
7. the current feed insulated enclosure under a kind of ultra low temperature vacuum according to claim 1 connects joint, it is characterized in that: described potting compound prepares by following manufacturing process:
At first the heating ring epoxy resins is approximately 50 ℃, and the cement flour of the amount of getting ready is sneaked into epoxy resin, at 50 ℃ of temperature, and fully at the uniform velocity equidirectional stirring, cement flour will toast before mixing, and guarantees drying, a nothing knot grain phenomenon; The cement flour that stirs and the mixture of epoxy resin naturally cool to the curing agent that adds the amount of getting ready after normal temperature, at the uniform velocity equidirectional stirring, and after it was fully mixed, the standing a bit of time to be allowing the air entrapment emersion, obtained potting compound after will bubble discharging.
CN201310023337.XA 2013-01-22 2013-01-22 Current lead insulative sealing coupling head under ultralow temperature vacuum Expired - Fee Related CN103104781B (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104251367A (en) * 2014-08-18 2014-12-31 中国科学院高能物理研究所 Vacuum isolation device for ultralow-temperature fluid transmission pipelines
CN104953351A (en) * 2015-05-06 2015-09-30 华中科技大学 Sealing connector under low-temperature vacuum
CN106092328A (en) * 2016-06-06 2016-11-09 中国电子科技集团公司第十研究所 The protection of the outer lead of a kind of Infrared Detectors and fixing means
CN109827719A (en) * 2019-03-21 2019-05-31 中国地震局地震研究所 A kind of device for detecting leak rate for low temperature multilead connector
CN109861144A (en) * 2019-04-09 2019-06-07 重庆大学 Test piece box pin-insertion-type lead connector
CN110034525A (en) * 2019-03-28 2019-07-19 合肥工业大学 Pressure vessel sensor extraction wire sealing device and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002051209A1 (en) * 2000-12-20 2002-06-27 Pyrotenax Cables, Ltd. Termination coupling for mineral insulated cable

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002051209A1 (en) * 2000-12-20 2002-06-27 Pyrotenax Cables, Ltd. Termination coupling for mineral insulated cable

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104251367A (en) * 2014-08-18 2014-12-31 中国科学院高能物理研究所 Vacuum isolation device for ultralow-temperature fluid transmission pipelines
CN104251367B (en) * 2014-08-18 2016-03-30 中国科学院高能物理研究所 A kind of very low temperature flow transfer line vacuum separation device
CN104953351A (en) * 2015-05-06 2015-09-30 华中科技大学 Sealing connector under low-temperature vacuum
CN106092328A (en) * 2016-06-06 2016-11-09 中国电子科技集团公司第十研究所 The protection of the outer lead of a kind of Infrared Detectors and fixing means
CN109827719A (en) * 2019-03-21 2019-05-31 中国地震局地震研究所 A kind of device for detecting leak rate for low temperature multilead connector
CN109827719B (en) * 2019-03-21 2024-06-25 中国地震局地震研究所 Leakage rate detection device for low-temperature multi-lead connector
CN110034525A (en) * 2019-03-28 2019-07-19 合肥工业大学 Pressure vessel sensor extraction wire sealing device and method
CN109861144A (en) * 2019-04-09 2019-06-07 重庆大学 Test piece box pin-insertion-type lead connector

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CB03 Change of inventor or designer information

Inventor after: Chen Liang

Inventor after: Ma Xianglian

Inventor after: Zhang Xuehua

Inventor after: Sun Zhihe

Inventor after: Shi Jin

Inventor after: He Chaofeng

Inventor after: Huang Qian

Inventor after: Han Rui

Inventor before: Ma Xianglian

Inventor before: Zhang Xuehua

Inventor before: Sun Zhihe

Inventor before: Shi Jin

Inventor before: He Chaofeng

Inventor before: Huang Qian

Inventor before: Han Rui

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Effective date of registration: 20170828

Address after: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037

Co-patentee after: Vacree Technologies Co., Ltd.

Patentee after: Huazhong University of Science and Technology

Address before: 230088 No. 189 Haitang Road, hi tech Zone, Anhui, Hefei

Patentee before: Vacree Technologies Co., Ltd.

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Granted publication date: 20150422

Termination date: 20190122

CF01 Termination of patent right due to non-payment of annual fee