CN102564287B - 利用晶圆台测量晶圆的膜厚度的方法 - Google Patents
利用晶圆台测量晶圆的膜厚度的方法 Download PDFInfo
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- CN102564287B CN102564287B CN201110421573.8A CN201110421573A CN102564287B CN 102564287 B CN102564287 B CN 102564287B CN 201110421573 A CN201110421573 A CN 201110421573A CN 102564287 B CN102564287 B CN 102564287B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000002184 metal Substances 0.000 claims description 48
- 230000005693 optoelectronics Effects 0.000 claims description 7
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 238000012546 transfer Methods 0.000 claims description 2
- 229910052755 nonmetal Inorganic materials 0.000 abstract 2
- 238000009423 ventilation Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 137
- 230000001105 regulatory effect Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
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CN201110421573.8A CN102564287B (zh) | 2011-12-15 | 2011-12-15 | 利用晶圆台测量晶圆的膜厚度的方法 |
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CN201110421573.8A CN102564287B (zh) | 2011-12-15 | 2011-12-15 | 利用晶圆台测量晶圆的膜厚度的方法 |
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CN102564287A CN102564287A (zh) | 2012-07-11 |
CN102564287B true CN102564287B (zh) | 2014-07-16 |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104097118A (zh) * | 2013-04-02 | 2014-10-15 | 盛美半导体设备(上海)有限公司 | 无应力抛光集成装置 |
CN106441093A (zh) * | 2016-09-07 | 2017-02-22 | 齐泰兴精工科技(苏州)有限公司 | 一种汽车零部件孔位校验装置 |
CN106338236A (zh) * | 2016-09-28 | 2017-01-18 | 天津华海清科机电科技有限公司 | 膜厚度测量装置及具有其的用于制造晶片的系统 |
CN110102491A (zh) * | 2019-05-06 | 2019-08-09 | 山东泓瑞光电科技有限公司 | 一种led晶片自动分选机用焊接台组件 |
CN110364448B (zh) * | 2019-07-24 | 2024-03-22 | 麦峤里(上海)半导体科技有限责任公司 | 晶圆导电薄膜加工系统 |
CN111132539A (zh) * | 2020-01-17 | 2020-05-08 | 安徽博微长安电子有限公司 | 一种手动点胶贴片机无损贴装凝胶盒中芯片的工装及方法 |
CN112729096A (zh) * | 2020-12-30 | 2021-04-30 | 清华大学 | 一种用于化学机械抛光的金属膜厚测量装置 |
CN113188433B (zh) * | 2021-06-30 | 2021-09-28 | 江苏振宁半导体研究院有限公司 | 半导体材料器件直径测量装置 |
CN114188261B (zh) * | 2021-10-20 | 2022-12-20 | 扬州思普尔科技有限公司 | 一种无尘晶圆装卸台 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101660896A (zh) * | 2009-09-23 | 2010-03-03 | 中国电子科技集团公司第四十五研究所 | 基于红外光学干涉法的半导体晶圆膜厚检测装置 |
CN102175133A (zh) * | 2011-02-25 | 2011-09-07 | 清华大学 | 全局金属膜厚度测量装置 |
CN102270597A (zh) * | 2011-08-16 | 2011-12-07 | 清华大学 | 用于晶圆交换装置的晶圆托架组件和晶圆交换装置 |
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US20040207395A1 (en) * | 2002-04-08 | 2004-10-21 | Moshe Sarfaty | Eddy current-capacitance sensor for conducting film characterization |
US7448250B2 (en) * | 2005-06-20 | 2008-11-11 | Immobiliengesellschaft Helmut Fischer Gmbh & Co. Kg | Calibration standard |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN101660896A (zh) * | 2009-09-23 | 2010-03-03 | 中国电子科技集团公司第四十五研究所 | 基于红外光学干涉法的半导体晶圆膜厚检测装置 |
CN102175133A (zh) * | 2011-02-25 | 2011-09-07 | 清华大学 | 全局金属膜厚度测量装置 |
CN102270597A (zh) * | 2011-08-16 | 2011-12-07 | 清华大学 | 用于晶圆交换装置的晶圆托架组件和晶圆交换装置 |
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Inventor after: Lu Xinchun Inventor after: Zhao Dewen Inventor after: Li Hongkai Inventor after: Zhao Qian Inventor after: Yu Qiang Inventor after: Qu Zilian Inventor after: He Yongyong Inventor before: Lu Xinchun Inventor before: Zhao Dewen Inventor before: Li Hongkai Inventor before: Zhao Qian Inventor before: Yu Qiang Inventor before: Qu Zilian Inventor before: He Yongyong |
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