CN102560366A - 镀膜件及其制造方法 - Google Patents
镀膜件及其制造方法 Download PDFInfo
- Publication number
- CN102560366A CN102560366A CN2010106162552A CN201010616255A CN102560366A CN 102560366 A CN102560366 A CN 102560366A CN 2010106162552 A CN2010106162552 A CN 2010106162552A CN 201010616255 A CN201010616255 A CN 201010616255A CN 102560366 A CN102560366 A CN 102560366A
- Authority
- CN
- China
- Prior art keywords
- plated film
- base material
- hard layer
- film spare
- percentage composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12729—Group IIA metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12778—Alternative base metals from diverse categories
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12951—Fe-base component
- Y10T428/12972—Containing 0.01-1.7% carbon [i.e., steel]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本发明提供一种镀膜件,包括基材及形成于基材表面的硬质层,该硬质层为添加有M和R的钛层,其中M为铁、钴、镍、铜、铌、铪及钽的一种或一种以上,R为钪、钇及镧系中的一种或一种以上。本发明还提供一种用以制造上述镀膜件的制造方法。
Description
技术领域
本发明涉及一种镀膜件及其制造方法。
背景技术
目前,真空镀膜技术广泛应用于航空、航天、化工、造船、通信、电子、汽车制造等工业领域。真空镀膜技术尤其是应用于电子产品的外观件时,可以使电子产品获得良好的装饰性外观和更好的质感,从而提高产品的价值。
常用的镀膜方法为磁控溅射镀膜,即在被溅射的靶材的阴极与阳极之间加一正交磁场,在高真空室内充入所需要的氩气。在电场作用下,氩气电离成正离子和电子,靶材上加有一定的负高压,从阴极发出的电子受磁场的作用与工作气体的电离几率增大,在阴极附近形成高密度的等离子体,氩气离子在洛仑兹力的作用下加速飞向靶面,以很高的速度轰击靶面,使靶上被溅射出来的原子遵循动量转换原理以较高的动能脱离靶面飞向基片淀积成膜。
然而,既使电子产品的外表具有较好的色泽,又使装饰膜具有较高的耐磨性是困难的。
发明内容
有鉴于此,有必要提供一种既具有较好的色泽又具有高耐磨性的镀膜件。
另外,还有必要提供一种上述镀膜件的制备方法。
一种镀膜件,包括基材及形成于基材表面的硬质层,该硬质层为添加有M和R的钛层,其中M为铁、钴、镍、铜、铌、铪及钽的一种或一种以上,R为钪、钇及镧系中的一种或一种以上。
一种镀膜件的制造方法,其包括如下步骤:
提供一基材及以一设有含有M、R和钛的靶材的磁控溅射镀膜机,其中M为铁、钴、镍、铜、铌、铪及钽的一种或一种以上,R为钪、钇及镧系中的一种或一种以上;
由磁控溅射镀膜机在基材表面形成硬质层,该硬质层为添加有M和R的钛层。
相较于现有技术,所述镀膜件在基材的表面沉积硬质层,该硬质层为添加有M和R的钛层,有利于使硬质层形成非晶态结构,该非晶态结构的硬质层的耐磨性较强,从而镀膜件具有较好的色泽的同时又提高了其耐磨性。
附图说明
图1为本发明较佳实施例镀膜件的剖视示意图;
图2为用以制造图1所示镀膜件的磁控溅射镀膜机的示意图。
主要元件符号说明
磁控溅射镀膜机 100
镀膜件 10
镀膜室 20
基材 11
硬质层 13
靶材 22
具体实施方式
请参阅图1,本发明一较佳实施方式的镀膜件10,其包括基材11及形成于基材11上的硬质层13,该硬质层13为添加有M和R的钛层,其中M可为铁(F e)、钴(Co)、镍(Ni)、铜(Cu)、铌(Nb)、铪(Hf)及钽(Ta)中的一种或一种以上,M优选铁或镍,R可为钪(Sc)、钇(Y)及镧系(La-Lu)中的一种或一种以上;该硬质层13中M的质量百分含量为10~49.5%,R的质量百分含量为0.5~10%。
该基材11可为不锈钢、铝合金、镁合金、玻璃或陶瓷。
该硬质层13可以磁控溅射的方式形成。该硬质层13的厚度可为500~800nm。
本发明一较佳实施方式的镀膜件10的制备方法,其包括如下步骤:
提供一基材11,该基材11可为不锈钢、铝合金、镁合金、玻璃、陶瓷或塑料,本实施例中以不锈钢为例加以说明。
将基材11除油除蜡、酸洗、中和、喷淋及慢拉后干燥,以去除基材11表面的污渍。
请一并参阅图2,对经上述处理后的基材11的表面进行氩气等离子体清洗,以进一步去除基材11表面的油污,以及改善基材11表面与后续涂层的结合力。该等离子体清洗的具体操作及工艺参数可为:将基材11放入一磁控溅射镀膜机100的镀膜室20内,将该镀膜室20抽真空至3.0×10-5Torr,然后向镀膜室20内通入流量为200~400sccm(标准状态毫升/分钟)的氩气(纯度为99.999%),并施加-200~-300V的偏压于基材11,对基材11表面进行氩气等离子体清洗,清洗时间为10~20min。
提供一靶材22,该靶材22通过粉末冶金制成。该靶材22的主要成分为钛,且还添加有M和R,其中M可为铁(Fe)、钴(Co)、镍(Ni)、铜(Cu)、铌(Nb)、铪(Hf)及钽(Ta)中的一种或一种以上,M优选铁或镍,R可为钪(Sc)、钇(Y)及镧系(La-Lu)中的一种或一种以上;靶材22中M的质量百分含量为10~49.5%,R的质量百分含量为0.5~10%。
将所述靶材22放入磁控溅射镀膜机100的镀膜室20中,采用磁控溅射法在经氩气等离子体清洗后的基材11的表面沉积一硬质层13。设置所述靶材22的功率为5~15KW,以氩气为工作气体,氩气的流量为100~400sccm,对基材11施加的偏压为-50~-200V,占空比为50%,加热使所述镀膜室20内的温度为100~200℃(即镀膜温度为100~200℃),镀膜时间为20~90min。该硬质层13为含有M和R的钛层,其中M的质量百分含量为10~49.5%,R的质量百分含量为0.5~10%。
下面通过实施例来对本发明进行具体说明。
实施例1
本实施例所使用的基材11的材质为304不锈钢。
该靶材22的主要成分为钛,且还添加有铜和钇,其中铜的质量百分含量为45%,钇的质量百分含量为8%。
溅镀硬质层13:靶材22的功率为8KW,基材11的偏压为-150V,氩气流量为150sccm,占空比为50%,镀膜室20内的温度为100℃,镀膜时间为20min。
最终获得的硬质层13中铜的质量百分含量为45%,钇的质量百分含量为8%。
实施例2
本实施例所使用的基材11的材质为6063铝合金。
该靶材22的主要成分为钛,且还添加有钴和铈(Ce),其中钴的质量百分含量为10%,铈的质量百分含量为0.5%。
溅镀硬质层13:靶材22的功率为15KW,基材11的偏压为-200V,氩气流量为400sccm,占空比为50%,镀膜室20内的温度为200℃,镀膜时间为60min。
最终获得的硬质层13中钴的质量百分含量为10%,铈的质量百分含量为0.5%。
实施例3
本实施例所使用的基材11的材质为硅酸盐玻璃。
该靶材22的主要成分为钛,且还添加有镍和钪,其中镍的质量百分含量为49.5%,钪的质量百分含量为1%。
溅镀硬质层13:靶材22的功率为5KW,基材11的偏压为-50V,氩气流量为100sccm,占空比为50%,镀膜室20内的温度为100℃,镀膜时间为90min。
最终获得的硬质层13中镍的质量百分含量为49.5%,钪的质量百分含量为1%。
将上述制得的镀膜件10进行盐雾测试和耐磨性测试,具体测试方法及结果如下:
(1)盐雾测试
采用盐雾试验机,将上述镀膜件10置于盐雾试验箱内,测试条件为:选用浓度为5%的氯化钠盐水溶液,溶液PH值调节为6.2~7.5,温度为室温。
测试结果显示,镀膜件10在经过72小时的盐雾测试后仍不会变色。
(2)耐磨性测试
采用线性耐磨耗测试仪,测试条件为:载荷为1kg,行程长度为2inch,磨耗速率为25次/min。
测试结果显示,由本发明实施例1、2、3所制备的镀膜件10经磨耗25次均未见脱落。
本发明较佳实施方式镀膜件10在基材11的表面沉积硬质层13,该硬质层13中同时添加有M与R。由于钛和M能形成非晶态结构,而添加R有助于提高钛和M的非晶形成能力,因此硬质层13容易形成非晶态结构,而非晶态结构的硬质层13具有较强的耐磨性,从而在保证镀膜件10外观装饰效果的同时又提高了其耐磨性。
Claims (10)
1.一种镀膜件,包括基材及形成于基材表面的硬质层,其特征在于:该硬质层为添加有M和R的钛层,其中M为铁、钴、镍、铜、铌、铪及钽的一种或一种以上,R为钪、钇及镧系中的一种或一种以上。
2.如权利要求1所述的镀膜件,其特征在于:所述基材为不锈钢、铝合金、镁合金、玻璃、陶瓷或塑料。
3.如权利要求1所述的镀膜件,其特征在于:所述硬质层中M的质量百分含量为10~49.5%,R的质量百分含量为0.5~10%。
4.如权利要求1所述的镀膜件,其特征在于:所述硬质层以磁控溅射的方式形成。
5.一种镀膜件的制造方法,其包括如下步骤:
提供一基材及以一设有含有M、R和钛的靶材的磁控溅射镀膜机,其中M为铁、钴、镍、铜、铌、铪及钽的一种或一种以上,R为钪、钇及镧系中的一种或一种以上;
由磁控溅射镀膜机在基材表面形成硬质层,该硬质层为添加有M和R的钛层。
6.如权利要求5所述的镀膜件的制造方法,其特征在于:其中M的质量百分含量为10~49.5%,R的质量百分含量为0.5~10%。
7.如权利要求5所述的镀膜件的制造方法,其特征在于:所述形成硬质层的工艺参数为:所述靶材的功率为5~15KW,以氩气为工作气体,氩气的流量为100~400sccm,对基材施加的偏压为-50~-200V,占空比为50%,镀膜时间为20~90min。
8.如权利要求5或7所述的镀膜件的制造方法,其特征在于:所述基材为不锈钢、铝合金、镁合金或玻璃。
9.如权利要求8所述的镀膜件的制造方法,其特征在于:所述磁控溅射的镀膜温度为100~200℃。
10.如权利要求5或7所述的镀膜件的制造方法,其特征在于:所述基材为塑料。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010106162552A CN102560366A (zh) | 2010-12-30 | 2010-12-30 | 镀膜件及其制造方法 |
US13/169,744 US8822038B2 (en) | 2010-12-30 | 2011-06-27 | Coated article and method for manufacturing coated article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010106162552A CN102560366A (zh) | 2010-12-30 | 2010-12-30 | 镀膜件及其制造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102560366A true CN102560366A (zh) | 2012-07-11 |
Family
ID=46381034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010106162552A Pending CN102560366A (zh) | 2010-12-30 | 2010-12-30 | 镀膜件及其制造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8822038B2 (zh) |
CN (1) | CN102560366A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117684134A (zh) * | 2023-12-12 | 2024-03-12 | 利兰生物科技(苏州)有限公司 | 一种镍钛合金支架生物陶瓷镀膜的制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62257649A (ja) * | 1986-05-01 | 1987-11-10 | Seiko Epson Corp | 光磁気記録媒体の製造方法 |
JPH0192359A (ja) * | 1981-08-11 | 1989-04-11 | Hitachi Ltd | 非晶質薄膜の製造方法 |
US20020192494A1 (en) * | 2001-05-22 | 2002-12-19 | Tzatzov Konstantin K. | Protective system for high temperature metal alloy products |
CN101191197A (zh) * | 2006-11-21 | 2008-06-04 | 比亚迪股份有限公司 | 一种磁控溅射离子镀方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040202890A1 (en) * | 2003-04-08 | 2004-10-14 | Kutilek Luke A. | Methods of making crystalline titania coatings |
US7419086B2 (en) * | 2003-07-14 | 2008-09-02 | Honeywell International Inc. | Low cost brazes for titanium |
GB2450933A (en) * | 2007-07-13 | 2009-01-14 | Hauzer Techno Coating Bv | Method of providing a hard coating |
GB0901687D0 (en) * | 2009-02-02 | 2009-03-11 | Teer Coatings Ltd | Multilayer coating |
-
2010
- 2010-12-30 CN CN2010106162552A patent/CN102560366A/zh active Pending
-
2011
- 2011-06-27 US US13/169,744 patent/US8822038B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0192359A (ja) * | 1981-08-11 | 1989-04-11 | Hitachi Ltd | 非晶質薄膜の製造方法 |
JPS62257649A (ja) * | 1986-05-01 | 1987-11-10 | Seiko Epson Corp | 光磁気記録媒体の製造方法 |
US20020192494A1 (en) * | 2001-05-22 | 2002-12-19 | Tzatzov Konstantin K. | Protective system for high temperature metal alloy products |
CN101191197A (zh) * | 2006-11-21 | 2008-06-04 | 比亚迪股份有限公司 | 一种磁控溅射离子镀方法 |
Also Published As
Publication number | Publication date |
---|---|
US20120171515A1 (en) | 2012-07-05 |
US8822038B2 (en) | 2014-09-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102392246B (zh) | 一种金属表面处理工艺 | |
CN107523790A (zh) | 一种AlCrSiCuN纳米多层涂层及其制备方法 | |
CN102443763B (zh) | 具有抗指纹涂层的被覆件及其制备方法 | |
CN102373428A (zh) | 涂层、具有该涂层的被覆件及该被覆件的制备方法 | |
CN102294856A (zh) | 一种装饰材料及其制备方法 | |
CN102400102A (zh) | 金属表面抗指纹处理方法及制得的金属产品 | |
CN107937873A (zh) | 碳掺杂的过渡金属硼化物涂层、碳‑过渡金属硼化物复合涂层、制备方法及应用和切削工具 | |
CN103572207A (zh) | 镀膜件及其制备方法 | |
CN102534489A (zh) | 镀膜件及其制造方法 | |
CN102686074A (zh) | 电子装置外壳及其制造方法 | |
KR20180069126A (ko) | 다층 기판 및 제조 방법 | |
CN109504947A (zh) | 一种CrN涂层、制备方法及应用 | |
CN105568222B (zh) | 真空镀膜件及其制造方法 | |
CN112359319B (zh) | 一种双周期耐磨抗菌和高韧性复合薄膜的制备方法 | |
CN102477531A (zh) | 被覆件及其制造方法 | |
CN104512065A (zh) | 一种磁控溅射制备时尚装饰材料的方法 | |
CN102345089A (zh) | 镀膜件及其制作方法 | |
CN102548308A (zh) | 壳体及其制造方法 | |
CN102560366A (zh) | 镀膜件及其制造方法 | |
CN110438461A (zh) | 一种TiBx/Cr(x=1.9~3.5)抗氧化多层涂层的制备方法 | |
US8367225B2 (en) | Coating, article coated with coating, and method for manufacturing article | |
CN102409302A (zh) | 涂层、具有该涂层的被覆件及该被覆件的制备方法 | |
CN102534504A (zh) | 壳体及其制造方法 | |
CN102400097A (zh) | 壳体及其制造方法 | |
CN102560348A (zh) | 镀膜件及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |