CN102549786B - 具有补偿转换元件的发光二极管和相应的转换元件 - Google Patents

具有补偿转换元件的发光二极管和相应的转换元件 Download PDF

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Publication number
CN102549786B
CN102549786B CN201080043653.8A CN201080043653A CN102549786B CN 102549786 B CN102549786 B CN 102549786B CN 201080043653 A CN201080043653 A CN 201080043653A CN 102549786 B CN102549786 B CN 102549786B
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CN
China
Prior art keywords
light
emitting diode
luminescent material
conversion element
phosphor
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Expired - Fee Related
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CN201080043653.8A
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English (en)
Chinese (zh)
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CN102549786A (zh
Inventor
多米尼克·艾泽特
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Publication of CN102549786A publication Critical patent/CN102549786A/zh
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7734—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
CN201080043653.8A 2009-07-29 2010-06-29 具有补偿转换元件的发光二极管和相应的转换元件 Expired - Fee Related CN102549786B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009035100.0 2009-07-29
DE102009035100A DE102009035100A1 (de) 2009-07-29 2009-07-29 Leuchtdiode und Konversionselement für eine Leuchtdiode
PCT/EP2010/059180 WO2011012388A1 (de) 2009-07-29 2010-06-29 Leuchtdiode mit kompensierendem konversionselement und entsprechendes konversionselement

Publications (2)

Publication Number Publication Date
CN102549786A CN102549786A (zh) 2012-07-04
CN102549786B true CN102549786B (zh) 2015-07-15

Family

ID=42794696

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080043653.8A Expired - Fee Related CN102549786B (zh) 2009-07-29 2010-06-29 具有补偿转换元件的发光二极管和相应的转换元件

Country Status (7)

Country Link
US (1) US20120126275A1 (enExample)
EP (1) EP2460192A1 (enExample)
JP (1) JP2013500596A (enExample)
KR (1) KR20120039044A (enExample)
CN (1) CN102549786B (enExample)
DE (1) DE102009035100A1 (enExample)
WO (1) WO2011012388A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011100710A1 (de) * 2011-05-06 2012-11-08 Osram Opto Semiconductors Gmbh Konversionselement für Leuchtdioden und Herstellungsverfahren
TWI473303B (zh) * 2011-09-07 2015-02-11 國立中央大學 A way to reduce the LED color temperature and color coordinates drift
DE102011114192A1 (de) * 2011-09-22 2013-03-28 Osram Opto Semiconductors Gmbh Verfahren und Vorrichtung zur Farbortsteuerung eines von einem Licht emittierenden Halbleiterbauelement abgestrahlten Lichts
DE102011085645B4 (de) * 2011-11-03 2014-06-26 Osram Gmbh Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls
DE102013211634A1 (de) 2013-06-20 2014-12-24 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Konversionselements
WO2015074603A1 (zh) * 2013-11-25 2015-05-28 四川新力光源股份有限公司 提高led光源良率的方法、荧光粉及led光源
KR101580739B1 (ko) 2014-06-05 2015-12-28 엘지전자 주식회사 발광 장치
KR20170069240A (ko) * 2014-10-01 2017-06-20 코닌클리케 필립스 엔.브이. 조절가능한 방출 스펙트럼을 갖는 광원
CN111363360A (zh) * 2020-04-17 2020-07-03 南京众慧网络科技有限公司 一种新型有机硅封装的高亮度led灯

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1938870A (zh) * 2004-03-10 2007-03-28 吉尔科有限公司 用于led的磷光体及其混合物
US20070104861A1 (en) * 2005-11-09 2007-05-10 Hsing Chen White light LED production method
US20080036364A1 (en) * 2006-08-10 2008-02-14 Intematix Corporation Two-phase yellow phosphor with self-adjusting emission wavelength
US20090095966A1 (en) * 2007-10-10 2009-04-16 Cree, Inc. Multiple conversion material light emitting diode package and method of fabricating same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US7311858B2 (en) * 2004-08-04 2007-12-25 Intematix Corporation Silicate-based yellow-green phosphors
JP2008135725A (ja) * 2006-10-31 2008-06-12 Toshiba Corp 半導体発光装置
JP4466757B2 (ja) * 2007-04-18 2010-05-26 三菱化学株式会社 蛍光体、蛍光体含有組成物、発光装置、照明装置、画像表示装置、及び窒素含有化合物
US20120181919A1 (en) * 2008-08-27 2012-07-19 Osram Sylvania Inc. Luminescent Ceramic Composite Converter and Method of Making the Same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1938870A (zh) * 2004-03-10 2007-03-28 吉尔科有限公司 用于led的磷光体及其混合物
US20070104861A1 (en) * 2005-11-09 2007-05-10 Hsing Chen White light LED production method
US20080036364A1 (en) * 2006-08-10 2008-02-14 Intematix Corporation Two-phase yellow phosphor with self-adjusting emission wavelength
US20090095966A1 (en) * 2007-10-10 2009-04-16 Cree, Inc. Multiple conversion material light emitting diode package and method of fabricating same

Also Published As

Publication number Publication date
JP2013500596A (ja) 2013-01-07
WO2011012388A1 (de) 2011-02-03
EP2460192A1 (de) 2012-06-06
CN102549786A (zh) 2012-07-04
KR20120039044A (ko) 2012-04-24
DE102009035100A1 (de) 2011-02-03
US20120126275A1 (en) 2012-05-24

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Granted publication date: 20150715

Termination date: 20190629