CN102544259A - LED light spot improving method - Google Patents
LED light spot improving method Download PDFInfo
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- CN102544259A CN102544259A CN201110445591XA CN201110445591A CN102544259A CN 102544259 A CN102544259 A CN 102544259A CN 201110445591X A CN201110445591X A CN 201110445591XA CN 201110445591 A CN201110445591 A CN 201110445591A CN 102544259 A CN102544259 A CN 102544259A
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- grain size
- powder
- fluorescent powder
- led light
- light spot
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Abstract
The invention discloses an LED light spot improving method, which includes the following steps of a, selecting: selecting a support with the cup depth of 0.46+/-0.02mm and the cup mouth angle of 135 degrees and selecting fluorescent powder with the grain size of 17-19 mu m and fluorescent powder with the grain size of 4-5 mu m for matching; and b, dispensing adhesive: dispensing yellow fluorescent adhesive to form a semi-spherical structure and form two surfaces approximately parallel to each other with a lens. By matching of the fluorescent powder with the grain size of 17-19 mu m and the fluorescent powder with the grain size of 4-5 mu m, luminous flux can be improved effectively by the LED light sport improving method, and further, the fluorescent powder with the grain size of 4-5 mu m substitutes for diffusion powder, the problems of large light spot difference and fast attenuation of products, caused by combination of three kinds of powder different in chemical property, are avoided. Besides, the luminous area is enlarged by dispensing the yellow fluorescent adhesive to form the semi-spherical structure.
Description
Technical field
The present invention relates to a kind of LED, relate in particular to a kind of LED hot spot improvement method.
Background technology
At present, in the LED Packaging Industry, for the hot spot that obtains and bigger luminous flux; Use the fluorescent material of particle diameter mostly, cooperate spread powder again, the antisolvent precipitation powder as 17-19um; But spread powder and antisolvent precipitation powder can reduce luminous flux; If it is stricter that the client requires hot spot, only so that spread powder is continued to add, hot spot improves still that luminous flux reduces and decays excessive like this; In addition, the chemical property various combination of three kinds of powder can produce following problem together: stir inequality in the process that stir (1), cause same batch of material hot spot to differ greatly; (2) the spread powder xanthochromia that is heated influences colour temperature, the decay of expedite product in the aging process.
Summary of the invention
The object of the present invention is to provide a kind of LED hot spot improvement method, combine the problem that hot spot difference is big, the product decay is fast of generation to solve three kinds of efflorescence different in kinds.
The objective of the invention is to realize through following technical scheme:
A kind of LED hot spot improvement method may further comprise the steps:
A, select materials: select the dark 0.46 ± 0.02mm of being of cup, the rim of a cup angle is the support of 135 degree, and selects the fluorescent material of particle diameter 17-19um and particle diameter 4-5um to arrange in pairs or groups each other;
B, some glue: become the dome-type structure with the yellow fluorescent glue point, form approximately parallel two faces with lens.
Beneficial effect of the present invention does; Said LED hot spot improvement method is arranged in pairs or groups through the fluorescent material of selecting particle diameter 17-19um and particle diameter 4-5um each other, effectively improves luminous flux, and the fluorescent material of 4-5um replaces spread powder; The problem that hot spot difference is big, the product decay is fast of having avoided the chemical property various combination of three kinds of powder together to produce; In addition, yellow fluorescent glue is put into the dome-type structure, increased light-emitting zone.
Description of drawings
With embodiment the present invention is further explained with reference to the accompanying drawings below.
The LED encapsulating structure sketch map of Fig. 1 for adopting LED hot spot improvement method of the present invention to process;
Fig. 2 is the supporting structure sketch map of LED encapsulating structure of the present invention.
Among the figure:
1, yellow fluorescent glue; 2, lens.
Embodiment
Please referring to figs. 1 through shown in 2, in present embodiment, a kind of LED hot spot improvement method may further comprise the steps:
A, select materials: select the dark 0.46 ± 0.02mm of being of cup, the rim of a cup angle is the support of 135 degree, and selects the fluorescent material of particle diameter 17-19um and particle diameter 4-5um to arrange in pairs or groups each other;
B, some glue: become the dome-type structure with 1 of yellow fluorescent glue, form approximately parallel two faces with lens 2.
Said LED hot spot improvement method is arranged in pairs or groups through the fluorescent material of selecting particle diameter 17-19um and particle diameter 4-5um each other; Effectively improve luminous flux; And the fluorescent material of 4-5um replaces spread powder, the problem that hot spot difference is big, the product decay is fast of having avoided the chemical property various combination of three kinds of powder together to produce, in addition; 1 of yellow fluorescent glue is become the dome-type structure, increased light-emitting zone.
Above embodiment has just set forth basic principle of the present invention and characteristic; The present invention is not limited by the foregoing description; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various variations and change, and these variations and change all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.
Claims (1)
1. LED hot spot improvement method is characterized in that: may further comprise the steps:
A, select materials: select the dark 0.46 ± 0.02mm of being of cup, the rim of a cup angle is the support of 135 degree, and selects the fluorescent material of particle diameter 17-19um and particle diameter 4-5um to arrange in pairs or groups each other;
B, some glue: become the dome-type structure with the yellow fluorescent glue point, form approximately parallel two faces with lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110445591XA CN102544259A (en) | 2011-12-28 | 2011-12-28 | LED light spot improving method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110445591XA CN102544259A (en) | 2011-12-28 | 2011-12-28 | LED light spot improving method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102544259A true CN102544259A (en) | 2012-07-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110445591XA Pending CN102544259A (en) | 2011-12-28 | 2011-12-28 | LED light spot improving method |
Country Status (1)
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| CN (1) | CN102544259A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102945919A (en) * | 2012-10-22 | 2013-02-27 | 厦门多彩光电子科技有限公司 | Method for improving problem of light spots of high-power light-emitting diode (LED) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040135163A1 (en) * | 2003-01-13 | 2004-07-15 | Hsing Chen | Pink light emitting diode |
| CN101319137A (en) * | 2007-11-22 | 2008-12-10 | 王元成 | Fluorescent powder, preparation and white radiation LED light source using the fluorescent powder thereof |
| CN101560390A (en) * | 2009-05-21 | 2009-10-21 | 中国科学院长春光学精密机械与物理研究所 | Yellow fluorescent powder based on blue light excitation and application thereof |
| CN102185087A (en) * | 2011-05-10 | 2011-09-14 | 深圳市光核光电科技有限公司 | High-power LED (Light Emitting Diode) encapsulating structure |
-
2011
- 2011-12-28 CN CN201110445591XA patent/CN102544259A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040135163A1 (en) * | 2003-01-13 | 2004-07-15 | Hsing Chen | Pink light emitting diode |
| CN101319137A (en) * | 2007-11-22 | 2008-12-10 | 王元成 | Fluorescent powder, preparation and white radiation LED light source using the fluorescent powder thereof |
| CN101560390A (en) * | 2009-05-21 | 2009-10-21 | 中国科学院长春光学精密机械与物理研究所 | Yellow fluorescent powder based on blue light excitation and application thereof |
| CN102185087A (en) * | 2011-05-10 | 2011-09-14 | 深圳市光核光电科技有限公司 | High-power LED (Light Emitting Diode) encapsulating structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102945919A (en) * | 2012-10-22 | 2013-02-27 | 厦门多彩光电子科技有限公司 | Method for improving problem of light spots of high-power light-emitting diode (LED) |
| CN102945919B (en) * | 2012-10-22 | 2015-04-22 | 厦门多彩光电子科技有限公司 | Method for improving light spots of high-power light-emitting diode (LED) |
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Application publication date: 20120704 |