CN102534582A - 无电镀铜溶液 - Google Patents

无电镀铜溶液 Download PDF

Info

Publication number
CN102534582A
CN102534582A CN2010106048608A CN201010604860A CN102534582A CN 102534582 A CN102534582 A CN 102534582A CN 2010106048608 A CN2010106048608 A CN 2010106048608A CN 201010604860 A CN201010604860 A CN 201010604860A CN 102534582 A CN102534582 A CN 102534582A
Authority
CN
China
Prior art keywords
electroless copper
average molecular
molecular weight
copper solution
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010106048608A
Other languages
English (en)
Inventor
管静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN2010106048608A priority Critical patent/CN102534582A/zh
Publication of CN102534582A publication Critical patent/CN102534582A/zh
Pending legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)

Abstract

一种无电镀铜溶液,在该溶液中含有水溶性聚丙烯酰胺;所述水溶性聚丙烯酰胺的重均分子量至少为100000,重均分子量与数均分子量的比值至多为10。本发明通过在无电镀铜溶液中加入水溶性聚丙烯酰胺作为添加剂,首先使催化剂金属粘附于待镀敷的基材上,然后经由氮原子吸附到催化金属上,从而降低镀敷沉积速度,达到提高镀层与晶片的粘合性和均匀性的目的,具有良好的推广价值。

Description

无电镀铜溶液
技术领域
本发明涉及一种溶液,尤其是一种无电镀铜溶液。
背景技术
无电镀铜是一种全新的铜膜形成方法,有望作为目前常用溅射法和电解镀铜法的替代方法。传统的用铜无电镀敷半导体晶片时,难以获得沉积镀膜的良好粘合性,而且难以在整个基材上镀敷均匀。
因而,现有的无电镀铜技术还有待于进一步改善。 
发明内容
针对现有无电镀铜技术的不足之处,本发明的目的是提供一种无电镀铜溶液,使其有利于改善镀膜的粘合性,且实现均匀镀敷的目的。
为达到上述目的,本发明所采取的技术方案是:一种无电镀铜溶液,在该溶液中含有水溶性聚丙烯酰胺;所述水溶性聚丙烯酰胺的重均分子量至少为100000,重均分子量与数均分子量的比值至多为10。
本发明通过在无电镀铜溶液中加入水溶性聚丙烯酰胺作为添加剂,首先使催化剂金属粘附于待镀敷的基材上,然后经由氮原子吸附到催化金属上,从而降低镀敷沉积速度,达到提高镀层与晶片的粘合性和均匀性的目的,具有良好的推广价值。
具体实施方式
下面通过实施例对本发明作进一步的说明:
一种无电镀铜溶液,含水溶性聚丙烯酰胺的浓度为2克/升;所述水溶性聚丙烯酰胺的重均分子量为至少1000000,重均分子量与数均分子量的比值为至多5。

Claims (1)

1.一种无电镀铜溶液,其特征是:在该溶液中含有水溶性聚丙烯酰胺;所述水溶性聚丙烯酰胺的重均分子量至少为100000,重均分子量与数均分子量的比值至多为10。
CN2010106048608A 2010-12-25 2010-12-25 无电镀铜溶液 Pending CN102534582A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010106048608A CN102534582A (zh) 2010-12-25 2010-12-25 无电镀铜溶液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010106048608A CN102534582A (zh) 2010-12-25 2010-12-25 无电镀铜溶液

Publications (1)

Publication Number Publication Date
CN102534582A true CN102534582A (zh) 2012-07-04

Family

ID=46342573

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010106048608A Pending CN102534582A (zh) 2010-12-25 2010-12-25 无电镀铜溶液

Country Status (1)

Country Link
CN (1) CN102534582A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104862675A (zh) * 2014-02-21 2015-08-26 三菱瓦斯化学株式会社 使用化学镀液的贯通电极的形成方法
CN111825460A (zh) * 2020-07-31 2020-10-27 贵州师范学院 一种碳化硅颗粒表面高效低成本热还原镀镍的方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104862675A (zh) * 2014-02-21 2015-08-26 三菱瓦斯化学株式会社 使用化学镀液的贯通电极的形成方法
CN104862675B (zh) * 2014-02-21 2018-07-31 三菱瓦斯化学株式会社 使用化学镀液的贯通电极的形成方法
CN111825460A (zh) * 2020-07-31 2020-10-27 贵州师范学院 一种碳化硅颗粒表面高效低成本热还原镀镍的方法

Similar Documents

Publication Publication Date Title
Yabuki et al. pH-controlled self-healing polymer coatings with cellulose nanofibers providing an effective release of corrosion inhibitor
Yin et al. Effect of nickel immersion pretreatment on the corrosion performance of electroless deposited Ni–P alloys on aluminum
EP2366692A3 (en) Copper electropating bath and method
TW200811311A (en) Method for metallizing plastic surface
Yu et al. A review of recent developments in coating systems for hot-dip galvanized steel
EP2562294A3 (en) Plating bath and method
EP2366694A3 (en) Copper electropating bath and method
MY171037A (en) Painted plated-steel
US20150368806A1 (en) Method for depositing a first metallic layer onto non-conductive polymers
CN102534582A (zh) 无电镀铜溶液
RU2014117532A (ru) Кислотные очистители для металлических подложек и связанные с ними способы очистки и нанесения покрытий на металлические подложки
CN103540915B (zh) 一种聚酰亚胺表面化学镀铜的方法
Oh et al. Improved adhesion property and electromagnetic interference shielding effectiveness of electroless Cu‐plated layer on poly (ethylene terephthalate) by plasma treatment
EP2017373A3 (en) High speed method for plating palladium and palladium alloys
CN102140666A (zh) 一种粘接钕铁硼磁体涂覆方法及其制备得到的多层结构
CN102011114A (zh) 一种用于钢板处理的无磷离子化成剂
MX351403B (es) Post-enjuague basado en resina para obtener un alcance mejorado en lugares de difícil acceso de las composiciones de recubrimiento electrodepositables sobre sustratos de metal pretratados.
WO2012174424A3 (en) Single bath autodeposition coating for combination metal substrates and methods therefor
CN104694919A (zh) 钛合金激光表面合金化的方法
CN105386025B (zh) 一种热镀锌层无铬钝化剂及其配制方法
EP3565915B1 (en) Surface activated polymers
CN103602939B (zh) 一种热镀用锌合金及热镀锌方法
CN104354366A (zh) 一种耐磨金属涂层
US11499233B2 (en) Plated laminate and printed circuit board
CN108486562B (zh) 一种适用于改善热浸镀锌钢材表面耐腐蚀性能的钝化液及方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120704