CN102517615A - Sn-Ag alloy electroplate liquid - Google Patents
Sn-Ag alloy electroplate liquid Download PDFInfo
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- CN102517615A CN102517615A CN2011104246990A CN201110424699A CN102517615A CN 102517615 A CN102517615 A CN 102517615A CN 2011104246990 A CN2011104246990 A CN 2011104246990A CN 201110424699 A CN201110424699 A CN 201110424699A CN 102517615 A CN102517615 A CN 102517615A
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- China
- Prior art keywords
- acid
- plating liquid
- alloy plating
- sulfonic acid
- silver
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Abstract
The invention discloses Sn-Ag alloy electroplate liquid, which is composed of the following ingredients: a soluble Sn2+ compound, an Ag+ compound, sulfuric acid or sulfonic acid, a Bi3+ or/and Cu2+ ternary alloy composition metal salt, a luster-coating agent, a surfactant and an oxidant. The ferro-nickel alloy electroplate liquid provided by the invention is stable for a long time during the storage and application process; the Sn-Ag alloy electroplate liquid disclosed by the invention has the advantages that the obtained plating layer is white, dense and smooth, the nickel content is 11-13%, and good corrosion resistance is obtained, after electroplating by the Sn-Ag alloy electroplate liquid.
Description
Technical field
The invention belongs to the electroplate liquid field, be specifically related to a kind of Sn-Ag alloy plating liquid.
Background technology
Because there are environmental issues such as polluted underground water in Pb, relevant department is strengthening Pb is contained the use control of goods, and wherein, the solder that contains Pb gains a special interest, and has proposed to use the requirement of Pb-free solder.Lower with fusing point in the Pb-free solder coating, thermal fatigue resistance Sn-Ag alloy system coating preferably is a main flow, comprising being that purpose, the Sn-Ag that adds Bi or Cu grade in an imperial examination 3 elements are ternary alloy to reduce fusing point.Ag in the Sn-Ag alloy electroplating bath in past
+With [Ag (CN)
2]
-The form of complex ion exists, Ag
+Stably be present in the plating bath, Ag is with the Sn eutectoid, yet in cyanide-free plating bath, if Ag
+Instability will cause Ag in the plating bath
+With Sn
2+Between redox reaction, when separating out Ag, Sn
2+Be oxidized to Sn easily
4+Throw out influences the stability of plating bath significantly.In addition, because Ag is significantly different with the deposition potential of Sn, if Ag
+Instability is preferentially separated out Ag at first, and eutectoid when being difficult to realize Ag and Sn.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of permanent stability that have, and coated surface coating tool white is fine and close, good light property, leveling property and solidity to corrosion are arranged, and lower-cost Sn-Ag alloy plating liquid.
For solving the problems of the technologies described above, the technical scheme that the present invention adopted is: a kind of Sn-Ag alloy plating liquid, its material is formed as follows: solubility Sn
2+Compound, Ag
+Compound, sulfuric acid or sulfonic acid, Bi
3+Or/and Cu
2+Ternary alloy composition metal-salt, brightening agent, tensio-active agent and oxygenant.
Said solubility Sn
2+Compound is selected from following at least a: the inferior tin of methanesulfonic, the inferior tin of ethane sulfonic acid, the inferior tin of propane sulfonic acid, stannous sulfate, tin protochloride, the inferior tin of glucono-, stannous citrate, the inferior tin of lactic acid; With Sn
2+The mass concentration of counting it is 10～60g/L,
Said Ag
+Compound is selected from following at least a: utilized as silver methane sulfonate, ethane sulfonic acid silver, propane sulfonic acid are silver-colored, Sulfuric acid disilver salt, Silver monochloride, glucono-silver, silver citrate, silver lactate, silver suboxide; With Ag
+The mass concentration of counting it is 0.1～10g/L.
Said Bi
3+Or/and Cu
2+Ternary alloy composition metal-salt is selected from following at least a: bismuth chloride, bismuth iodide, bismuth sulfate, methylsulfonic acid bismuth, glucono-bismuth, bismuth citrate, cupric chloride, copper sulfate, copper methane sulfonate, copper gluconate, Cuprocitrol; With Bi
3+Or/and Cu
2+The mass concentration of counting it is 0.01～50g/L.
Said sulfonic acid is selected from following at least a: methylsulfonic acid, ethyl sulfonic acid, propanesulfonic acid, fourth sulfonic acid, penta sulphonic acid chloride propane sulfonic acid, toluenesulphonic acids, cresol sulfonic acid; The mass concentration of acid is 80～300g/L.
Said brightening agent is selected from following at least a: polyoxyethylene glycol, Z 150PH, Vilaterm, adjoin pyrrolidone, phenylformic acid acetone, methyl phenyl ketone, formaldehyde, valeral, salicylic aldehyde, Vanillin; Concentration 7～the 50g/L of said brightening agent.
Said tensio-active agent is selected from following at least a: methyl alcohol, ethanol, Virahol, vinyl carbinol, octyl phenol, nonylbenzene phenol, naphthyl alcohol, β-Nai Fen, oleic acid, laurostearic acid, Triple Pressed Stearic Acid, n-Laurylamine, stearic phthalein amine, coco amine; Said surfactant concentrations 1～30g/L.
Said anti-Sn
2+Oxygenant is selected from following at least a: agent has Resorcinol, Resorcinol, pyrocatechol, phenol, pyrogallol, Phloroglucinol monomethyl ether, Sorbitol Powder, L-xitix; The mass concentration of said oxidation inhibitor is 3～8g/L.
Said nickel-iron alloy plating liquid current density is 2～40A/dm
2
Said nickel-iron alloy plating liquid temp is 20～25 ℃.
Beneficial effect of the present invention: nickel-iron alloy plating liquid provided by the present invention deposit with use medium-term and long-term stable; After adopting Sn-Ag alloy plating liquid disclosed by the invention to electroplate, the coating white of acquisition is fine and close, smooth; Nickel content has solidity to corrosion preferably 11 ~ 13%.
Embodiment
Embodiment 1
A kind of Sn-Ag alloy plating liquid, its material is formed as follows: SnSO
4With Sn
2+The mass concentration of counting it is 20g/L; Ag
2SO
4With Ag
+The mass concentration of counting it is 4g/L; The methylsulfonic acid bismuth is with Bi
3+The mass concentration of counting it is 20g/L; Sulfonic acid, its mass concentration are 120g/L; Brightening agent: Z 150PH, its concentration 11g/L; Tensio-active agent laurostearic acid, both mixtures of Triple Pressed Stearic Acid, total concn is 18g/L; Oxidation inhibitor is a Resorcinol, and its mass concentration is 5g/L.
Said nickel-iron alloy plating liquid current density is 2～40A/dm
2Said nickel-iron alloy plating liquid temp is 20～25 ℃.After the Sn-Ag alloy plating liquid plating with above-mentioned configuration, the coating white of acquisition is fine and close, and smooth, nickel content has solidity to corrosion preferably 11 ~ 13%.
Embodiment 2
A kind of Sn-Ag alloy plating liquid, its material is formed as follows: the inferior tin mixture of tin protochloride and methanesulfonic, with Sn
2+The mass concentration of counting it is 60g/L; Ethane sulfonic acid is silver-colored, propane sulfonic acid is silver-colored and the silver-colored three's mixture of glucono-, Ag
+The mass concentration of counting it is 9g/L; Cupric chloride and Cuprocitrol mixture are with Cu
2+The mass concentration of counting it is 30g/L; Said sulfonic acid is toluenesulphonic acids and cresols sulphur mixture, and the sulfonic acid mass concentration is 90g/L; Said brightening agent is the mixture that valeral, salicylic aldehyde and Vanillin are formed, and the brightening agent total concn is 25g/L; Said tensio-active agent is the mixture that β-Nai Fen and n-Laurylamine are formed, and its total concn is 28g/L; Said oxidation inhibitor is the mixture what L-xitix of Sorbitol Powder is formed, and its total concn is 8g/L.
Said nickel-iron alloy plating liquid current density is 2～40A/dm
2Said nickel-iron alloy plating liquid temp is 20～25 ℃.After the Sn-Ag alloy plating liquid plating with above-mentioned configuration, the coating white of acquisition is fine and close, and smooth, nickel content has solidity to corrosion preferably 11 ~ 13%.
Claims (10)
1. Sn-Ag alloy plating liquid, its material is formed as follows: solubility Sn
2+Compound, Ag
+Compound, sulfuric acid or sulfonic acid, Bi
3+Or/and Cu
2+Ternary alloy composition metal-salt, brightening agent, tensio-active agent and oxygenant; State solubility Sn
2+Compound is with Sn
2+The mass concentration of counting it is 10～60g/L; Said Ag
+Compound is with Ag
+The mass concentration of counting it is 0.1～10g/L; Said Bi
3+Or/and Cu
2+Salt is with Bi
3+Or/and Cu
2+The mass concentration of counting it is 0.01～50g/L; Said sulfonic acid mass concentration is 80～300g/L; Concentration 7～the 50g/L of said brightening agent; Said surfactant concentrations 1～30g/L; The mass concentration of said oxidation inhibitor is 3～8g/L.
2. a kind of Sn-Ag alloy plating liquid according to claim 1 is characterized in that said solubility Sn
2+Compound is selected from following at least a: the inferior tin of methanesulfonic, the inferior tin of ethane sulfonic acid, the inferior tin of propane sulfonic acid, stannous sulfate, tin protochloride, the inferior tin of glucono-, stannous citrate, the inferior tin of lactic acid.
3. a kind of Sn-Ag alloy plating liquid according to claim 1 is characterized in that said Ag
+Compound is selected from following at least a: utilized as silver methane sulfonate, ethane sulfonic acid silver, propane sulfonic acid are silver-colored, Sulfuric acid disilver salt, Silver monochloride, glucono-silver, silver citrate, silver lactate, silver suboxide.
4. a kind of Sn-Ag alloy plating liquid according to claim 1 is characterized in that said Bi
3+Or/and Cu
2+Salt is selected from following at least a: bismuth chloride, bismuth iodide, bismuth sulfate, methylsulfonic acid bismuth, glucono-bismuth, bismuth citrate, cupric chloride, copper sulfate, copper methane sulfonate, copper gluconate, Cuprocitrol.
5. a kind of Sn-Ag alloy plating liquid according to claim 1 is characterized in that, said sulfonic acid is selected from following at least a: methylsulfonic acid, ethyl sulfonic acid, propanesulfonic acid, fourth sulfonic acid, penta sulphonic acid chloride propane sulfonic acid, toluenesulphonic acids, cresol sulfonic acid.
6. a kind of Sn-Ag alloy plating liquid according to claim 1; It is characterized in that said brightening agent is selected from following at least a: polyoxyethylene glycol, Z 150PH, Vilaterm, adjoin pyrrolidone, phenylformic acid acetone, methyl phenyl ketone, formaldehyde, valeral, salicylic aldehyde, Vanillin.
7. a kind of Sn-Ag alloy plating liquid according to claim 1; It is characterized in that said tensio-active agent is selected from following at least a: methyl alcohol, ethanol, Virahol, vinyl carbinol, octyl phenol, nonylbenzene phenol, naphthyl alcohol, β-Nai Fen, oleic acid, laurostearic acid, Triple Pressed Stearic Acid, n-Laurylamine, stearic phthalein amine, coco amine.
8. a kind of Sn-Ag alloy plating liquid according to claim 1 is characterized in that said anti-Sn
2+Oxygenant is selected from following at least a: agent has Resorcinol, Resorcinol, pyrocatechol, phenol, pyrogallol, Phloroglucinol monomethyl ether, Sorbitol Powder, L-xitix.
9. a kind of Sn-Ag alloy plating liquid according to claim 1 is characterized in that said nickel-iron alloy plating liquid current density is 2～40A/dm
2
10. a kind of Sn-Ag alloy plating liquid according to claim 1 is characterized in that said nickel-iron alloy plating liquid temp is 20～25 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104246990A CN102517615A (en) | 2011-12-19 | 2011-12-19 | Sn-Ag alloy electroplate liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104246990A CN102517615A (en) | 2011-12-19 | 2011-12-19 | Sn-Ag alloy electroplate liquid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102517615A true CN102517615A (en) | 2012-06-27 |
Family
ID=46288671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104246990A Pending CN102517615A (en) | 2011-12-19 | 2011-12-19 | Sn-Ag alloy electroplate liquid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102517615A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103361685A (en) * | 2012-02-09 | 2013-10-23 | 罗门哈斯电子材料有限公司 | Plating bath and electroplating method |
| CN107723760A (en) * | 2017-11-28 | 2018-02-23 | 江苏澳光电子有限公司 | A kind of Au Ag alloy surfaces electroplate liquid and its application |
| CN109837572A (en) * | 2019-04-03 | 2019-06-04 | 浙江亚通焊材有限公司 | A kind of electro-deposition method of Sn-Bi system lead-free low-temperature solder |
| CN110392751A (en) * | 2017-03-31 | 2019-10-29 | 美泰乐科技(日本)股份有限公司 | It is electrolysed plating solution for silver-plating |
Citations (5)
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|---|---|---|---|---|
| EP0829557A1 (en) * | 1996-03-04 | 1998-03-18 | Naganoken | Tin-silver alloy plating bath and process for producing plated object using the plating bath |
| CN1570219A (en) * | 2003-04-07 | 2005-01-26 | 罗姆和哈斯电子材料有限责任公司 | Electroplating compositions and methods |
| CN1844476A (en) * | 2006-03-24 | 2006-10-11 | 哈尔滨工业大学 | Subacidity bath for electroplating Sn-Ag-Cu alloy coating and electroplating method therefor |
| JP2009149979A (en) * | 2007-11-30 | 2009-07-09 | Mitsubishi Materials Corp | METHOD FOR REPLENISHING Sn-ALLOY PLATING SOLUTION WITH Sn-COMPONENT AND Sn-ALLOY PLATING TREATMENT APPARATUS |
| CN102051645A (en) * | 2008-12-31 | 2011-05-11 | 罗门哈斯电子材料有限公司 | Lead-free tin alloy electroplating compositions and methods |
-
2011
- 2011-12-19 CN CN2011104246990A patent/CN102517615A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0829557A1 (en) * | 1996-03-04 | 1998-03-18 | Naganoken | Tin-silver alloy plating bath and process for producing plated object using the plating bath |
| CN1570219A (en) * | 2003-04-07 | 2005-01-26 | 罗姆和哈斯电子材料有限责任公司 | Electroplating compositions and methods |
| CN1844476A (en) * | 2006-03-24 | 2006-10-11 | 哈尔滨工业大学 | Subacidity bath for electroplating Sn-Ag-Cu alloy coating and electroplating method therefor |
| JP2009149979A (en) * | 2007-11-30 | 2009-07-09 | Mitsubishi Materials Corp | METHOD FOR REPLENISHING Sn-ALLOY PLATING SOLUTION WITH Sn-COMPONENT AND Sn-ALLOY PLATING TREATMENT APPARATUS |
| CN102051645A (en) * | 2008-12-31 | 2011-05-11 | 罗门哈斯电子材料有限公司 | Lead-free tin alloy electroplating compositions and methods |
Non-Patent Citations (2)
| Title |
|---|
| 安茂忠等: "Sn-Ag-Cu合金电沉积行为的研究", 《黑龙江大学自然科学学报》, vol. 25, no. 6, 31 December 2008 (2008-12-31), pages 701 - 705 * |
| 张锦秋等: "主盐浓度和工艺条件对Sn-Ag-Cu合金镀层组成和形貌的影响", 《无机化学学报》, vol. 24, no. 7, 31 December 2008 (2008-12-31), pages 1056 - 1061 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103361685A (en) * | 2012-02-09 | 2013-10-23 | 罗门哈斯电子材料有限公司 | Plating bath and electroplating method |
| CN103361685B (en) * | 2012-02-09 | 2016-09-07 | 罗门哈斯电子材料有限公司 | Plating solution and electro-plating method |
| CN110392751A (en) * | 2017-03-31 | 2019-10-29 | 美泰乐科技(日本)股份有限公司 | It is electrolysed plating solution for silver-plating |
| CN107723760A (en) * | 2017-11-28 | 2018-02-23 | 江苏澳光电子有限公司 | A kind of Au Ag alloy surfaces electroplate liquid and its application |
| CN109837572A (en) * | 2019-04-03 | 2019-06-04 | 浙江亚通焊材有限公司 | A kind of electro-deposition method of Sn-Bi system lead-free low-temperature solder |
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Application publication date: 20120627 |