CN102516592A - Preparation method of waste plastic composite material modified by waste circuit board non-metal powder - Google Patents
Preparation method of waste plastic composite material modified by waste circuit board non-metal powder Download PDFInfo
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- CN102516592A CN102516592A CN201110358001XA CN201110358001A CN102516592A CN 102516592 A CN102516592 A CN 102516592A CN 201110358001X A CN201110358001X A CN 201110358001XA CN 201110358001 A CN201110358001 A CN 201110358001A CN 102516592 A CN102516592 A CN 102516592A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
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Abstract
The invention relates to a preparation method of a waste plastic composite material modified by waste circuit board non-metal powder. The preparation method disclosed by the invention comprises the following steps of: performing hydrothermal process activation treatment on the waste circuit board non-metal powder after drying to get the activated waste circuit board non-metal powder, further mixing the activated waste circuit board non-metal powder with a waste plastic recycled material, and then performing extrusion molding in a parallel co-rotating twin-screw extruder to get the waste plastic composite material modified by the waste circuit board non-metal powder. The preparation method disclosed by the invention is simple in process, and the hydrothermal process activation treatment is performed on the waste circuit board non-metal powder, so that chemical bonds of the non-metal powder can be broken, new activation points are produced for producing new activation groups from the waste circuit board non-metal powder, the purpose of improving the bonding performance of the waste circuit board non-metal powder with an interface of a resin matrix can be achieved and the overall performance of the composite material can be improved. According to the preparation method disclosed by the invention, the waste circuit board non-metal powder and the waste plastic recycled material are taken as raw materials, so that resource utilization of the waste materials is realized, the cost of the materials is simultaneously reduced, and great economic and social significance is further realized.
Description
Technical field
The invention belongs to solid waste comprehensive utilization technique field, be specifically related to a kind of preparation method of old circuit board non-metal powder modified waste plastics composite.
Background technology
At present; Recycling for non-metallic material in the old circuit board disposal process; Still lack the effective economic means both at home and abroad at present; A big chunk non-metallic material are taken as rubbish and abandon, burn or bury, and have not only caused the serious environmental pollution, and have caused a large amount of wastes of useful resources.Non-metallic material generally account for more than 60% in the old circuit board; Staple is spun glass and thermosetting epoxy resin, if can make full use of these materials, not only can alleviate offal treatment pressure; Can also reduce material cost, have great economic implications and social effect.
Matrix material is that present field of materials has one of field of using with development prospect most, also is the main path of technics of reclaim of plastic waste utilization.Spun glass in the old circuit board non-metal powder is a kind of ideal strongthener; Good insulating, thermotolerance is strong, erosion resistance good; Physical strength is high; Simultaneously the spun glass of old circuit board non-metal powder is the composite particles that is closely linked with the epoxy resin that has solidified, so it has good consistency with plastics.The chemical bond that utilizes hydrothermal method activation treatment old circuit board non-metal powder can interrupt cured epoxy resin in the non-metal powder produces new activated point; Thereby make the old circuit board non-metal powder produce new activating group; Reach the purpose of the interfacial combined function that improves old circuit board non-metal powder and resin matrix, thereby further improve the overall performance of matrix material.With old circuit board non-metal powder and waste or used plastics is that the matrix material of feedstock production has comparatively ideal over-all properties; Applying of its technology opened up the frontier that old circuit board non-metal powder and technics of reclaim of plastic waste are utilized, and forms the closed circulation of raw material-product-raw material; Realized the waste and scrap recycling of highest level; Not only can alleviate offal treatment pressure, can also reduce material cost, have great economic implications and social effect.
Summary of the invention
The object of the present invention is to provide a kind of preparation method of old circuit board non-metal powder modified waste plastics composite.
The preparation method of the old circuit board non-metal powder modified waste plastics composite that the present invention proposes; Dried old circuit board non-metal powder is carried out the hydrothermal method activation treatment; Obtain activatory old circuit board non-metal powder; Again activatory old circuit board non-metal powder is mixed back extrusion moulding in parallel parallel dual-screw extruding machine with the waste thermoplastic resin reclaimed materials, obtain the nonmetal powder filled modified waste plastics composite of old circuit board.Its concrete steps are following:
(1) in autoclave, adds 1～4 * 10
3G liquefaction solvent and 1～1 * 10
3The g catalyzer after 1～30 minute, adds 1～1 * 10 with the glass stick stirring again
3G exsiccant old circuit board non-metal powder; With the glass stick dispersed with stirring after 1～60 minute; Handled 1 minute ~ 12 hours down after the deionized water dilution is washed at 1 ~ 200 ℃, the filter membrane suction filtration, repetitive scrubbing to filtrating is neutral; Drying is 1～48 hour under 25 ~ 120 ℃, obtains the old circuit board non-metal powder through the hydrothermal method activation treatment;
(2) with the old circuit board non-metal powder of handling through hydrothermal method 1～1 * 10 of step (1) gained
3G and technics of reclaim of plastic waste material 1～1 * 10
3G adds in the high-speed mixer together, in rotor speed is to mix under the condition of 1～300r/min after 1～60 minute to take out, and obtains Preblend;
(3) with the Preblend 1～1 * 10 of step (2) gained
3G and lubricant 1～1 * 10
2G adds in the parallel parallel dual-screw extruding machine, is that 1 ~ 200 ℃, screw speed are extrusion moulding under the condition of 1～200r/min in temperature, obtains old circuit board non-metal powder modified waste plastics composite.
Among the present invention, liquefaction solvent described in the step (1) is any or its multiple combination in water, phenol, methyl alcohol, ethanol, terepthaloyl moietie, polyoxyethylene glycol, propyl alcohol, butanols, naphthane or the perhydronaphthalene.
Among the present invention, catalyzer described in the step (1) is any or its multiple combination in sulfuric acid, nitric acid, hydrochloric acid, phosphoric acid, perchloric acid, Phenylsulfonic acid, oxalic acid, acetic acid, Pottasium Hydroxide, sodium hydroxide, salt of wormwood or the yellow soda ash.
Among the present invention, old circuit board non-metal powder described in the step (1) is for separate the non-metal powder that obtains through old circuit board is broken, pulverising mill powdered again.
Among the present invention, the technics of reclaim of plastic waste material described in the step (2) is any or its multiple combination in waste polyethylene reclaimed materials, waste and old polypropylene reclaimed materials, waste polyvinyl chloride reclaimed materials, waste and old polystyrol reclaimed materials, waste and old polymethylmethacrylate reclaimed materials, waste and old polyoxymethylene reclaimed materials, waste and old polymeric amide reclaimed materials, waste and old polycarbonate reclaimed materials, waste and old polyethylene terephthalate reclaimed materials, waste and old polybutylene terephthalate reclaimed materials, waste and old polyphenylene thioether, waste and old ppe reclaimed materials or the waste and old polyethylene terephthalate reclaimed materials.
Among the present invention, the lubricant described in the step (3) is any or its multiple combination in paraffin, polyethylene wax, Zinic stearas or the Triple Pressed Stearic Acid.
Technology of the present invention is simple; Utilize hydrothermal method activation treatment old circuit board non-metal powder can interrupt the chemical bond of non-metal powder; Producing new activated point makes the old circuit board non-metal powder produce new activating group; Reach the purpose of the interfacial combined function that improves old circuit board non-metal powder and resin matrix, thereby improve the overall performance of matrix material.The matrix material of the present invention's preparation is a raw material with old circuit board non-metal powder and waste or used plastics; Form the closed circulation of raw material-product-raw material; Realized the waste and scrap recycling of highest level; Not only can alleviate offal treatment pressure, can also reduce material cost, have great economic implications and social effect.
Description of drawings
Fig. 1 impacts profile scanning Electronic Speculum figure for the nonmetal powder filled modified waste plastics composite of old circuit board that EXAMPLE l provides.
Embodiment
Following embodiment further specifies of the present invention, rather than limits scope of the present invention.
Embodiment 1: be that liquefaction solution, sulfuric acid are that catalyzer carries out the hydrothermal method activation treatment to the old circuit board non-metal powder with water, obtain through hydrothermal method activatory old circuit board non-metal powder; With above extrusion moulding in parallel parallel dual-screw extruding machine after hydrothermal method activatory old circuit board non-metal powder and waste polyethylene reclaimed materials mix, obtain the nonmetal powder filled modified waste plastics composite of old circuit board again.
Step (1): the water of adding 800mL and 80mL, 90% weight concentration sulphuric acid soln in autoclave after 10 minutes, add exsiccant old circuit board non-metal powder 250g with the glass stick stirring again; With the glass stick dispersed with stirring after 30 minutes; Handled 4 hours down after the deionized water dilution is washed at 180 ℃, the filter membrane suction filtration, repetitive scrubbing to filtrating is neutral; Drying is 6 hours under 120 ℃, obtains the old circuit board non-metal powder through the hydrothermal method activation treatment;
Step (2): add the old circuit board non-metal powder 200g and the waste polyethylene reclaimed materials 800g through the hydrothermal method activation treatment of step (1) gained in the high-speed mixer together; Be to mix after 30 minutes under the condition of 150r/min to take out in high-speed mixer rotor speed, obtain Preblend;
Step (3): the Preblend 1000g of step (2) gained is added in the parallel parallel dual-screw extruding machine with lubricant paraffin 10g; In temperature is that 180 ℃, screw speed are extrusion moulding under the condition of 70r/min, obtains the nonmetal powder filled modified waste plastics composite of old circuit board.
The Mechanics Performance Testing result shows that the shock strength of the nonmetal powder filled modified waste plastics composite of old circuit board is 8KJ.m
-2, flexural strength is 70MPa, modulus in flexure is 6GPa.
Fig. 1 provides the nonmetal powder filled modified waste plastics composite of old circuit board and impacts profile scanning Electronic Speculum figure.
Embodiment 2: be that liquefaction solution, Pottasium Hydroxide are that catalyzer carries out the hydrothermal method activation treatment to the old circuit board non-metal powder with water, obtain through hydrothermal method activatory old circuit board non-metal powder; With above extrusion moulding in parallel parallel dual-screw extruding machine after hydrothermal method activatory old circuit board non-metal powder and waste and old polypropylene reclaimed materials mix, obtain the nonmetal powder filled modified waste plastics composite of old circuit board again.
Step (1): in autoclave, add the water of 900mL and the Pottasium Hydroxide of 90g, after 20 minutes, add exsiccant old circuit board non-metal powder 300g again with the glass stick stirring; With the glass stick dispersed with stirring after 20 minutes; Handled 6 hours down after the deionized water dilution is washed at 160 ℃, the filter membrane suction filtration, repetitive scrubbing to filtrating is neutral; Drying is 6 hours under 100 ℃, obtains the old circuit board non-metal powder through the hydrothermal method activation treatment;
Step (2): add the old circuit board non-metal powder 250g and the waste and old polypropylene reclaimed materials 750g through the hydrothermal method activation treatment of step (1) gained in the high-speed mixer together; Be to mix after 40 minutes under the condition of 120r/min to take out in high-speed mixer rotor speed, obtain Preblend;
Step (3): the Preblend 1000g of step (2) gained is added in the parallel parallel dual-screw extruding machine with lubricant paraffin 10g; In temperature is that 160 ℃, screw speed are extrusion moulding under the condition of 80r/min, obtains the nonmetal powder filled modified waste plastics composite of old circuit board.
The Mechanics Performance Testing result shows that the shock strength of the nonmetal powder filled modified waste plastics composite of old circuit board is 9KJ.m-2, and flexural strength is 75MPa, and modulus in flexure is 8GPa.
Embodiment 3: be that liquefaction solution, salt of wormwood are that catalyzer carries out the hydrothermal method activation treatment to the old circuit board non-metal powder with water, obtain through hydrothermal method activatory old circuit board non-metal powder; With above extrusion moulding in parallel parallel dual-screw extruding machine after hydrothermal method activatory old circuit board non-metal powder and waste polyvinyl chloride reclaimed materials mix, obtain the nonmetal powder filled modified waste plastics composite of old circuit board again.
Step (1): in autoclave, add the water of 600mL and the salt of wormwood of 60g, after 20 minutes, add exsiccant old circuit board non-metal powder 200g again with the glass stick stirring; With the glass stick dispersed with stirring after 30 minutes; Handled 5 hours down after the deionized water dilution is washed at 170 ℃, the filter membrane suction filtration, repetitive scrubbing to filtrating is neutral; Drying is 5 hours under 110 ℃, obtains the old circuit board non-metal powder through the hydrothermal method activation treatment;
Step (2): add the old circuit board non-metal powder 150g and the waste polyvinyl chloride reclaimed materials 850g through the hydrothermal method activation treatment of step (1) gained in the high-speed mixer together; Be to mix after 40 minutes under the condition of 120r/min to take out in high-speed mixer rotor speed, obtain Preblend;
Step (3): the Preblend 1000g of step (2) gained is added in the parallel parallel dual-screw extruding machine with lubricant paraffin 15g; In temperature is that 160 ℃, screw speed are extrusion moulding under the condition of 80r/min, obtains the nonmetal powder filled modified waste plastics composite of old circuit board.
The Mechanics Performance Testing result shows that the shock strength of the nonmetal powder filled modified waste plastics composite of old circuit board is 7KJ.m-2, and flexural strength is 72MPa, and modulus in flexure is 7GPa.
Embodiment 4: be that liquefaction solution, nitric acid are that catalyzer carries out the hydrothermal method activation treatment to the old circuit board non-metal powder with water, obtain through hydrothermal method activatory old circuit board non-metal powder; With above extrusion moulding in parallel parallel dual-screw extruding machine after hydrothermal method activatory old circuit board non-metal powder and waste and old polystyrol reclaimed materials mix, obtain the nonmetal powder filled modified waste plastics composite of old circuit board again.
Step (1): the water of adding 800mL and 80mL, 90% weight concentration salpeter solution in autoclave after 20 minutes, add exsiccant old circuit board non-metal powder 200g with the glass stick stirring again; With the glass stick dispersed with stirring after 45 minutes; Handled 6 hours down after the deionized water dilution is washed at 160 ℃, the filter membrane suction filtration, repetitive scrubbing to filtrating is neutral; Drying is 6 hours under 115 ℃, obtains the old circuit board non-metal powder through the hydrothermal method activation treatment;
Step (2): add the old circuit board non-metal powder 150g and the waste and old polystyrol reclaimed materials 850g through the hydrothermal method activation treatment of step (1) gained in the high-speed mixer together; Be to mix after 60 minutes under the condition of 150r/min to take out in high-speed mixer rotor speed, obtain Preblend;
Step (3): the Preblend 1000g of step (2) gained is added in the parallel parallel dual-screw extruding machine with lubricant paraffin 12g; In temperature is that 170 ℃, screw speed are extrusion moulding under the condition of 130r/min, obtains the nonmetal powder filled modified waste plastics composite of old circuit board.
The Mechanics Performance Testing result shows that the shock strength of the nonmetal powder filled modified waste plastics composite of old circuit board is 12KJ.m-2, and flexural strength is 100MPa, and modulus in flexure is 8GPa.
Embodiment 5: be that liquefaction solution, sulfuric acid are that catalyzer carries out the hydrothermal method activation treatment to the old circuit board non-metal powder with phenol, obtain through hydrothermal method activatory old circuit board non-metal powder; With above extrusion moulding in parallel parallel dual-screw extruding machine after hydrothermal method activatory old circuit board non-metal powder and waste polyethylene reclaimed materials mix, obtain the nonmetal powder filled modified waste plastics composite of old circuit board again.
Step (1): the phenol of adding 1200g and 100mL, 90% weight concentration sulphuric acid soln in autoclave after 20 minutes, add exsiccant old circuit board non-metal powder 300g with the glass stick stirring again; With the glass stick dispersed with stirring after 25 minutes; Handled 6 hours down after the deionized water dilution is washed at 160 ℃, the filter membrane suction filtration, repetitive scrubbing to filtrating is neutral; Drying is 5 hours under 120 ℃, obtains the old circuit board non-metal powder through the hydrothermal method activation treatment;
Step (2): add the old circuit board non-metal powder 250g and the waste polyethylene reclaimed materials 750g through the hydrothermal method activation treatment of step (1) gained in the high-speed mixer together; Be to mix after 40 minutes under the condition of 130r/min to take out in high-speed mixer rotor speed, obtain Preblend;
Step (3): the Preblend 1000g of step (2) gained is added in the parallel parallel dual-screw extruding machine with lubricant polyethylene wax 12g; In temperature is that 180 ℃, screw speed are extrusion moulding under the condition of 120r/min, obtains the nonmetal powder filled modified waste plastics composite of old circuit board.
The Mechanics Performance Testing result shows that the shock strength of the nonmetal powder filled modified waste plastics composite of old circuit board is 9KJ.m-2, and flexural strength is 80MPa, and modulus in flexure is 7GPa.
Embodiment 6: be that liquefaction solution, sodium hydroxide are that catalyzer carries out the hydrothermal method activation treatment to the old circuit board non-metal powder with the absolute ethyl alcohol, obtain through hydrothermal method activatory old circuit board non-metal powder; With above extrusion moulding in parallel parallel dual-screw extruding machine after hydrothermal method activatory old circuit board non-metal powder and waste and old polypropylene reclaimed materials mix, obtain the nonmetal powder filled modified waste plastics composite of old circuit board again.
Step (1): in autoclave, add the sodium hydroxide of 900mL absolute ethyl alcohol and 100g, after 20 minutes, add exsiccant old circuit board non-metal powder 300g again with the glass stick stirring; With the glass stick dispersed with stirring after 35 minutes; Handled 5 hours down after the deionized water dilution is washed at 170 ℃, the filter membrane suction filtration, repetitive scrubbing to filtrating is neutral; Drying is 6 hours under 100 ℃, obtains the old circuit board non-metal powder through the hydrothermal method activation treatment;
Step (2): add the old circuit board non-metal powder 250g and the waste and old polypropylene reclaimed materials 750g through the hydrothermal method activation treatment of step (1) gained in the high-speed mixer together; Be to mix after 30 minutes under the condition of 120r/min to take out in high-speed mixer rotor speed, obtain Preblend;
Step (3): the Preblend 800g of step (2) gained is added in the parallel parallel dual-screw extruding machine with lubricant stearic acid 8g; In temperature is that 180 ℃, screw speed are extrusion moulding under the condition of 140r/min, obtains the nonmetal powder filled modified waste plastics composite of old circuit board.
The Mechanics Performance Testing result shows that the shock strength of the nonmetal powder filled modified waste plastics composite of old circuit board is 10KJ.m-2, and flexural strength is 83MPa, and modulus in flexure is 10GPa.
Above-mentioned description to embodiment is to understand and application the present invention for the ease of the those of ordinary skill of this technical field.The personnel of skilled obviously can easily make various modifications to these embodiments, and needn't pass through performing creative labour being applied in the General Principle of this explanation among other embodiment.Therefore, the invention is not restricted to the embodiment here, those skilled in the art should be within protection scope of the present invention to improvement and modification that the present invention makes according to announcement of the present invention.
Claims (6)
1. the preparation method of old circuit board non-metal powder modified waste plastics composite is characterized in that concrete steps are following:
(1) in autoclave, adds 1～4 * 10
3G liquefaction solvent and 1～1 * 10
3The g catalyzer after 1～30 minute, adds 1～1 * 10 with the glass stick stirring again
3G exsiccant old circuit board non-metal powder; With the glass stick dispersed with stirring after 1～60 minute; Handled 1 minute ~ 12 hours down after the deionized water dilution is washed at 1 ~ 200 ℃, the filter membrane suction filtration, repetitive scrubbing to filtrating is neutral; Drying is 1～48 hour under 25 ~ 120 ℃, obtains the old circuit board non-metal powder through the hydrothermal method activation treatment;
(2) with the old circuit board non-metal powder 1～1 * 10 through the hydrothermal method activation treatment of step (1) gained
3G and technics of reclaim of plastic waste material 1～1 * 10
3G adds in the high-speed mixer together, in rotor speed is to mix under the condition of 1～300r/min after 1～60 minute to take out, and obtains Preblend;
(3) with the Preblend 1～1 * 10 of step (2) gained
3G and lubricant 1～1 * 10
2G adds in the parallel parallel dual-screw extruding machine, is that 1 ~ 200 ℃, screw speed are extrusion moulding under the condition of 1～200r/min in temperature, obtains old circuit board non-metal powder modified waste plastics composite.
2. the preparation method of old circuit board non-metal powder modified waste plastics composite according to claim 1 is characterized in that liquefaction solvent described in the step (1) is any or its multiple combination in water, phenol, methyl alcohol, ethanol, terepthaloyl moietie, polyoxyethylene glycol, propyl alcohol, butanols, naphthane or the perhydronaphthalene.
3. the preparation method of old circuit board non-metal powder modified waste plastics composite according to claim 1 is characterized in that catalyzer described in the step (1) is any or its multiple combination in sulfuric acid, nitric acid, hydrochloric acid, phosphoric acid, perchloric acid, Phenylsulfonic acid, oxalic acid, acetic acid, Pottasium Hydroxide, sodium hydroxide, salt of wormwood or the yellow soda ash.
4. the preparation method of old circuit board non-metal powder modified waste plastics composite according to claim 1 is characterized in that old circuit board non-metal powder described in the step (1) is for separate the non-metal powder that obtains through old circuit board is broken, pulverising mill powdered again.
5. the preparation method of old circuit board non-metal powder modified waste plastics composite according to claim 1 is characterized in that the technics of reclaim of plastic waste material described in the step (2) is any or its multiple combination in waste polyethylene reclaimed materials, waste and old polypropylene reclaimed materials, waste polyvinyl chloride reclaimed materials, waste and old polystyrol reclaimed materials, waste and old polymethylmethacrylate reclaimed materials, waste and old polyoxymethylene reclaimed materials, waste and old polymeric amide reclaimed materials, waste and old polycarbonate reclaimed materials, waste and old polyethylene terephthalate reclaimed materials, waste and old polybutylene terephthalate reclaimed materials, waste and old polyphenylene thioether, waste and old ppe reclaimed materials or the waste and old polyethylene terephthalate reclaimed materials.
6. the preparation method of old circuit board non-metal powder modified waste plastics composite according to claim 1 is characterized in that the lubricant described in the step (3) is any or its multiple combination in paraffin, polyethylene wax, Zinic stearas or the Triple Pressed Stearic Acid.
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Cited By (9)
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| CN103044772A (en) * | 2012-12-19 | 2013-04-17 | 清远市宏保环保科技有限公司 | Resin glass fiber formula and resin glass fiber type tile prepared by same |
| CN104610651A (en) * | 2014-12-31 | 2015-05-13 | 上海第二工业大学 | Chemically-treated waste printed circuit board nonmetal powder/polypropylene composite material and preparation method thereof |
| CN105524434A (en) * | 2016-01-19 | 2016-04-27 | 上海第二工业大学 | Organic acid-treated waste printed circuit board non-metallic powder/polyethylene glycol terephthalate composite material and preparation method thereof |
| CN105694239A (en) * | 2016-04-19 | 2016-06-22 | 常熟理工学院 | Waste PCB (printed circuit board) nonmetal powder/EPDM rubber composite material and preparation method thereof |
| CN106750915A (en) * | 2016-12-07 | 2017-05-31 | 盐城工学院 | Nonmetallic residue building element of waste and old printed circuit board and its preparation method and application |
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| CN109467867A (en) * | 2018-10-23 | 2019-03-15 | 上海第二工业大学 | A kind of fiber glass waste reinforced ABS/HIPS plastic alloy material and preparation method thereof |
| CN110757682A (en) * | 2019-10-29 | 2020-02-07 | 中国科学院山西煤炭化学研究所 | Method for recycling waste circuit boards in full-component mode through two-step method |
| CN113563686A (en) * | 2021-08-02 | 2021-10-29 | 清远市东江环保技术有限公司 | Method for preparing composite material from waste circuit board nonmetal powder |
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| CN103044772A (en) * | 2012-12-19 | 2013-04-17 | 清远市宏保环保科技有限公司 | Resin glass fiber formula and resin glass fiber type tile prepared by same |
| CN103044772B (en) * | 2012-12-19 | 2015-07-15 | 清远市宏保环保科技有限公司 | Resin glass fiber formula and resin glass fiber type tile prepared by same |
| CN104610651A (en) * | 2014-12-31 | 2015-05-13 | 上海第二工业大学 | Chemically-treated waste printed circuit board nonmetal powder/polypropylene composite material and preparation method thereof |
| CN104610651B (en) * | 2014-12-31 | 2019-07-12 | 上海第二工业大学 | A kind of chemical treatment abandoned printed circuit board non-metal powder/PP composite material and preparation method thereof |
| CN105524434A (en) * | 2016-01-19 | 2016-04-27 | 上海第二工业大学 | Organic acid-treated waste printed circuit board non-metallic powder/polyethylene glycol terephthalate composite material and preparation method thereof |
| CN105694239A (en) * | 2016-04-19 | 2016-06-22 | 常熟理工学院 | Waste PCB (printed circuit board) nonmetal powder/EPDM rubber composite material and preparation method thereof |
| CN106750915A (en) * | 2016-12-07 | 2017-05-31 | 盐城工学院 | Nonmetallic residue building element of waste and old printed circuit board and its preparation method and application |
| CN109306065A (en) * | 2018-08-28 | 2019-02-05 | 陕西理工大学 | A kind of PVC foundation stone plastic composite board surface modes cover membrane preparation method |
| CN109306065B (en) * | 2018-08-28 | 2021-01-26 | 陕西理工大学 | Preparation method of PVC-based stone-plastic composite board surface mold pressing film |
| CN109467867A (en) * | 2018-10-23 | 2019-03-15 | 上海第二工业大学 | A kind of fiber glass waste reinforced ABS/HIPS plastic alloy material and preparation method thereof |
| CN110757682A (en) * | 2019-10-29 | 2020-02-07 | 中国科学院山西煤炭化学研究所 | Method for recycling waste circuit boards in full-component mode through two-step method |
| CN113563686A (en) * | 2021-08-02 | 2021-10-29 | 清远市东江环保技术有限公司 | Method for preparing composite material from waste circuit board nonmetal powder |
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