CN204749005U - Nonmetal powder reinforced plastics combined material apparatus for producing of waste circuit board - Google Patents
Nonmetal powder reinforced plastics combined material apparatus for producing of waste circuit board Download PDFInfo
- Publication number
- CN204749005U CN204749005U CN201520572996.3U CN201520572996U CN204749005U CN 204749005 U CN204749005 U CN 204749005U CN 201520572996 U CN201520572996 U CN 201520572996U CN 204749005 U CN204749005 U CN 204749005U
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- China
- Prior art keywords
- circuit board
- treating apparatus
- reinforced plastics
- metal powder
- producing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/52—Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
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- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model provides a nonmetal powder reinforced plastics combined material apparatus for producing of waste circuit board, the apparatus for producing includes sorting unit, reducing mechanism, hybrid processing device, air exhaust device, heating drying control device, crowded source reason device, supercharging device and common extrusion device. Compare with present device, utilize the production of this device, simple process, the nonmetal powder packing proportion of waste circuit board is high, low cost, the outward appearance of product is smooth simultaneously, and color -tunable can obtain multiple products such as tubular product, sheet, section bar and profile shapes, and product grades is high, and economic value is high.
Description
Technical field
The present invention relates to field of Environment Protection, refer more particularly to a kind of process units utilizing abandoned printed circuit board non-metal powder reinforced plastics composite.
Background technology
Wiring board, as the basis of electronics industry, is indispensable vitals in each electronic product.The development gradually of electronics and information industry, result in the generation of a large amount of old circuit boards.Be because the waste printed circuit boards such as the leftover pieces in production process roll up on the one hand, also result from scrapping of a large amount of waste and old electric electric equipment products simultaneously.Due to the mixture that wiring board is nonmetal and various metals material in a large number, the recovery technology of current old circuit board more pays close attention to the recovery of valuable metal, and the nonmetallic materials wherein content being reached to 76% ~ 94% then almost do not utilize.In wiring board nonmetallic materials except resin and glass fibre, also containing bromine flame retardant and a small amount of heavy metal, if stacking, landfill or burning arbitrarily, not only cause a large amount of useful resources to run off, also can cause serious harm to environment.Therefore, the reasonable recycling of nonmetallic materials is new problems urgently to be resolved hurrily in current discarded circuit board Resource analysis.Recent people have carried out discarded object have been made the new resource such as sheet material by mould pressing process, and both recycled discarded object, reducing original material consumption again, is the effective way of comprehensive utilization of resources.
Waste printed circuit board non-metal powder with epoxy resin and glass fibre for Main Ingredients and Appearance.In recent years, researcher attempts filling it in high-molecular organic material making composite, obtains and is necessarily in progress.The method of preparation has die pressing and extrusion molding etc.Die pressing technique is simple, but production efficiency is lower.Extrusion molding production efficiency is higher, but waste printed circuit board non-metal powder is a kind of line structure with certain draw ratio, and plastic melt mobility is deteriorated poor, cause its loading not high enough (generally less than 50%), cost is higher; The product appearance simultaneously directly extruded and the defect of mechanical property aspect, produce product specification not high, be in a disadvantageous position in economic investment and the utilization of resources.
Summary of the invention
The technical problems to be solved in the utility model is, provides the process units of the useless circuit board non-metal powder reinforced plastics composite that a kind of environmentally safe, production and processing cost are cheap, product specification is high.
The technical solution of the utility model is as follows: a kind of discarded circuit board non-metal powder reinforced plastics composite process units, and this device comprises: sorting unit, reducing mechanism, mixed processing device, air extractor, heat drying control device, extrude treating apparatus, supercharging device and co-extrusion device.It is characterized in that: sorting unit connects reducing mechanism, reducing mechanism connects mixed processing device, and air extractor is connected mixed processing device with heat drying control device, and mixed processing device connects extrudes treating apparatus, extrude treating apparatus and connect supercharging device, supercharging device connects co-extrusion device.
Further, extrude treating apparatus described in and can connect vacuum extractor.
Further, this process units can arrange two and extrude treating apparatus, namely be respectively first to extrude treating apparatus and second and extrude treating apparatus, vacuum extractor can only connect wherein one extrude treating apparatus, also can connect two simultaneously and extrude treating apparatus.
Compared with prior art, the utility model melt supercharging technology, obtain waste printed circuit board non-metal powder loading up to 70% enhancing compound composite, adopt the mode of coextrusion on composite material surface, cover colourless or coloured virgin material simultaneously, substantially improve material appearance, improve its product specification, higher economic benefit can be obtained.
Accompanying drawing explanation
Fig. 1 is the process units system architecture schematic diagram of the utility model abandoned printed circuit board non-metal powder reinforced plastics composite.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1, a kind of discarded circuit board non-metal powder reinforced plastics composite process units, it comprises sorting unit, reducing mechanism, mixed processing device, air extractor, and heat drying control device, extrudes treating apparatus, supercharging device and co-extrusion device; Wherein, sorting unit connects reducing mechanism, reducing mechanism connects mixed processing device, mixed processing device connects extrusion device, extrude treating apparatus and connect supercharging device, supercharging device connects co-extrusion device, in addition, air extractor and heat drying control device are also connected to mixed processing device, and vacuum extractor connects extrudes treating apparatus.
Embodiment 1:
The first step: a certain amount of wiring board non-metallic particle is added reducing mechanism, pulverizes 30 minutes, obtains by sorting unit the wiring board non-metal powder that particle diameter is less than 200 microns;
Second step: after mixing 5 minutes under wiring board non-metal powder, polyvinyl resin, compatilizer and lubricant in mass ratio 50: 50: 5: 1 normal temperature in high-speed mixer, is progressively heated to 105 DEG C and continues mixing 10 minutes, bleed, removing moisture;
3rd step: the raw material mixed is processed by extruding treating apparatus, treatment temperature is 170 DEG C, by Melt Pump supercharging after process; Pure polyvinyl resin is added corresponding Masterbatch simultaneously or do not add Masterbatch and extrude treating apparatus process by other, treatment temperature is 150 DEG C; Both are extruded by coextrusion treating apparatus, obtain discarded circuit board non-metal powder reinforced plastics composite.
Embodiment 2:
The first step: a certain amount of wiring board non-metallic particle is added reducing mechanism, pulverizes 30 minutes, obtains by sorting unit the wiring board non-metal powder that particle diameter is less than 200 microns;
Second step: after mixing 5 minutes under wiring board non-metal powder, polyvinyl resin, compatilizer and lubricant in mass ratio 60: 40: 6: 1.5 normal temperature in high-speed mixer, is progressively heated to 105 DEG C and continues mixing 10 minutes, bleed, removing moisture;
3rd step: the raw material mixed is processed by extruding treating apparatus, treatment temperature is 175 DEG C, by Melt Pump supercharging after process; Pure polyvinyl resin is added corresponding Masterbatch simultaneously or do not add Masterbatch and extrude treating apparatus process by other, treatment temperature is 150 DEG C; Both are extruded by coextrusion treating apparatus, obtain discarded circuit board non-metal powder reinforced plastics composite.
Embodiment 3:
The first step: a certain amount of wiring board non-metallic particle is added reducing mechanism, pulverizes 30 minutes, obtains by sorting unit the wiring board non-metal powder that particle diameter is less than 200 microns;
Second step: after mixing 5 minutes under wiring board non-metal powder, polyvinyl resin, compatilizer and lubricant in mass ratio 70: 30: 7: 2 normal temperature in high-speed mixer, is progressively heated to 105 DEG C and continues mixing 10 minutes, bleed, removing moisture;
3rd step: the raw material mixed is processed by extruding treating apparatus, treatment temperature is 180 DEG C, by Melt Pump supercharging after process; Pure polyvinyl resin is added corresponding Masterbatch simultaneously or do not add Masterbatch and extrude treating apparatus process by other, treatment temperature is 150 DEG C; Both are extruded by coextrusion treating apparatus, obtain discarded circuit board non-metal powder reinforced plastics composite.
Embodiment 4:
The first step: a certain amount of wiring board non-metallic particle is added reducing mechanism, pulverizes 30 minutes, obtains by sorting unit the wiring board non-metal powder that particle diameter is less than 200 microns;
Second step: after mixing 5 minutes under wiring board non-metal powder, polyvinyl resin, compatilizer and lubricant in mass ratio 80: 20: 8: 2.5 normal temperature in high-speed mixer, is progressively heated to 105 DEG C and continues mixing 10 minutes, bleed, removing moisture;
3rd step: the raw material mixed is processed by extruding treating apparatus, treatment temperature is 175 DEG C, by Melt Pump supercharging after process; Pure polyvinyl resin is added corresponding Masterbatch simultaneously or do not add Masterbatch and extrude treating apparatus process by other, treatment temperature is 150 DEG C; Both are extruded by coextrusion treating apparatus, obtain discarded circuit board non-metal powder reinforced plastics composite.
Compared with existing device, utilize apparatus of the present invention to produce, technique is simple, and the nonmetal powder filled ratio of discarded circuit board is high, with low cost; The smooth in appearance of product simultaneously, Color tunable, can obtain tubing, sheet material, section bar and profile shapes etc., product specification is high, and economic worth is high.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (2)
1. a discarded circuit board non-metal powder reinforced plastics composite process units, it comprises: sorting unit, reducing mechanism, mixed processing device, air extractor, and heat drying control device, extrudes treating apparatus, supercharging device and co-extrusion device;
It is characterized in that: sorting unit connects reducing mechanism, reducing mechanism connects mixed processing device, and air extractor is connected mixed processing device with heat drying control device, and mixed processing device connects extrudes treating apparatus, extrude treating apparatus and connect supercharging device, supercharging device connects co-extrusion device.
2. discarded circuit board non-metal powder reinforced plastics composite process units according to claim 1, is characterized in that: extrude treating apparatus and be also connected with vacuum extractor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520572996.3U CN204749005U (en) | 2015-07-31 | 2015-07-31 | Nonmetal powder reinforced plastics combined material apparatus for producing of waste circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520572996.3U CN204749005U (en) | 2015-07-31 | 2015-07-31 | Nonmetal powder reinforced plastics combined material apparatus for producing of waste circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN204749005U true CN204749005U (en) | 2015-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520572996.3U Expired - Fee Related CN204749005U (en) | 2015-07-31 | 2015-07-31 | Nonmetal powder reinforced plastics combined material apparatus for producing of waste circuit board |
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| Country | Link |
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| CN (1) | CN204749005U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112795074A (en) * | 2021-02-18 | 2021-05-14 | 赵安琴 | Filler formed by recycling nonmetal powder of waste circuit board and preparation method thereof |
-
2015
- 2015-07-31 CN CN201520572996.3U patent/CN204749005U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112795074A (en) * | 2021-02-18 | 2021-05-14 | 赵安琴 | Filler formed by recycling nonmetal powder of waste circuit board and preparation method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151111 Termination date: 20200731 |
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| CF01 | Termination of patent right due to non-payment of annual fee |