CN112795074A - Filler formed by recycling nonmetal powder of waste circuit board and preparation method thereof - Google Patents
Filler formed by recycling nonmetal powder of waste circuit board and preparation method thereof Download PDFInfo
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- CN112795074A CN112795074A CN202110187149.5A CN202110187149A CN112795074A CN 112795074 A CN112795074 A CN 112795074A CN 202110187149 A CN202110187149 A CN 202110187149A CN 112795074 A CN112795074 A CN 112795074A
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- Prior art keywords
- circuit board
- recycling
- waste circuit
- filler
- waste
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- 239000002699 waste material Substances 0.000 title claims abstract description 104
- 239000000843 powder Substances 0.000 title claims abstract description 82
- 229910052755 nonmetal Inorganic materials 0.000 title claims abstract description 63
- 239000000945 filler Substances 0.000 title claims abstract description 50
- 238000004064 recycling Methods 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title abstract description 12
- 239000004033 plastic Substances 0.000 claims abstract description 96
- 229920003023 plastic Polymers 0.000 claims abstract description 96
- 239000007787 solid Substances 0.000 claims abstract description 53
- 239000000463 material Substances 0.000 claims abstract description 37
- 239000006057 Non-nutritive feed additive Substances 0.000 claims abstract description 32
- 238000011049 filling Methods 0.000 claims abstract description 30
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 238000010008 shearing Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 22
- 239000007822 coupling agent Substances 0.000 claims description 21
- 239000004014 plasticizer Substances 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- -1 titanium aluminate Chemical class 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 229910019142 PO4 Inorganic materials 0.000 claims description 4
- 239000008029 phthalate plasticizer Substances 0.000 claims description 4
- 239000012188 paraffin wax Substances 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 125000005591 trimellitate group Chemical group 0.000 claims description 2
- 238000005469 granulation Methods 0.000 abstract description 29
- 230000003179 granulation Effects 0.000 abstract description 29
- 230000007613 environmental effect Effects 0.000 abstract description 9
- 239000000047 product Substances 0.000 description 33
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 12
- 230000001965 increasing effect Effects 0.000 description 10
- 239000003381 stabilizer Substances 0.000 description 10
- 229920001187 thermosetting polymer Polymers 0.000 description 10
- 239000000314 lubricant Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- 239000002023 wood Substances 0.000 description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 7
- 230000009471 action Effects 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- 239000003063 flame retardant Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229920001587 Wood-plastic composite Polymers 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 5
- 230000009931 harmful effect Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000011155 wood-plastic composite Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 235000021190 leftovers Nutrition 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000010813 municipal solid waste Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 239000002920 hazardous waste Substances 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 239000002910 solid waste Substances 0.000 description 3
- 239000005995 Aluminium silicate Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 239000005539 carbonized material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000426 Microplastic Polymers 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000010793 electronic waste Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004597 plastic additive Substances 0.000 description 1
- 239000008031 plastic plasticizer Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000009877 shengmai Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011830 transgenic mouse model Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K11/00—Use of ingredients of unknown constitution, e.g. undefined reaction products
- C08K11/005—Waste materials, e.g. treated or untreated sewage sludge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/02—Making granules by dividing preformed material
- B29B9/06—Making granules by dividing preformed material in the form of filamentary material, e.g. combined with extrusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/12—Making granules characterised by structure or composition
- B29B9/14—Making granules characterised by structure or composition fibre-reinforced
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/08—Ingredients of unknown constitution and ingredients covered by the main groups C08K3/00 - C08K9/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
Abstract
The invention belongs to the technical field of waste recycling, and particularly discloses a filler formed by recycling waste circuit board nonmetal powder and a preparation method thereof, wherein the filler comprises the following components in parts by weight: the filler is prepared from 25-65% of solid plastic, 25-65% of waste circuit board nonmetal powder and 8-12% of processing aid by preparing materials, mixing, feeding and granulating, wherein the granulation is carried out by shearing and plasticizing by using a parallel double-screw granulator, the preheating temperature is set to be 120-250 ℃, and the granulating temperature is set to be 130-300 ℃. The technical scheme realizes harmless recycling of the waste circuit board nonmetal powder and can also utilize waste plastics, so that the formed filler has wide application, large filling amount in use, simple preparation process, convenient operation, low cost and good environmental protection performance.
Description
Technical Field
The invention belongs to the technical field of waste recycling, and particularly relates to a filler formed by recycling waste circuit board nonmetal powder and a preparation method thereof.
Background
Environmental pollution refers to natural or artificial damage, and the action of adding a certain substance into the environment exceeds the self-cleaning capability of the environment to cause harm, thereby having harmful effects on the growth and reproduction of organisms and the normal life of human beings, and damaging the ecosystem and the normal production and living conditions of human beings.
The waste circuit boards are produced by 600-800 million tons every year in China, the waste electronic circuit boards are mixtures of glass fiber reinforced resin and various metals, the most typical electronic wastes belong to the category of hazardous wastes, and if the waste electronic circuit boards are not treated and disposed, a large amount of useful resources can be lost, and the environment can be seriously damaged, so that the waste electronic circuit boards have great economic recovery value and environmental protection significance for the full resource utilization of the waste circuit boards. After the metal substances in the waste electronic circuit boards are extracted and recovered, the residual waste electronic circuit board powder, namely thermosetting resin powder and glass fiber powder, belongs to dangerous waste, is not a reasonable method for discarding or burying or burning as useless garbage, and can cause pollution to the environment such as soil atmosphere and the like. And the material components of the waste electronic circuit board powder comprise epoxy resin, framework material glass fiber and the like, the chemical stability of the waste electronic circuit board powder is high, and the waste electronic circuit board powder is not easy to degrade in natural environment, so that the treatment difficulty of the waste electronic circuit board powder is brought. The main component contained in the waste circuit board is thermosetting resin, and the thermosetting resin has the advantages of high rigidity, high hardness, high temperature resistance, good product size stability and the like, so that the waste circuit board is widely applied to the household appliance industry, automobile manufacturing, building materials and the like.
Nowadays, under the vigorous push of garbage classification, the waste is subjected to shunting treatment, the existing production and manufacturing capacity is utilized, the recycled products are recycled, and the harmless treatment of the garbage is more and more emphasized. Among them, particularly, the harmless processing of recycling of waste solid plastics and waste electronic circuit boards is receiving attention.
For example, CN201110350720.7 discloses a method for harmless treatment and comprehensive resource recovery of a circuit board, wherein an electrolytic method is used to remove soldering tin to effectively separate and recover other metal and non-metal components, and an organic solvent is used to extract non-metal parts to effectively recover non-metal resources, thereby preventing the non-metal components from damaging the environment, so as to obtain epoxy resin, which is a hazardous waste, and generates harmful gas during incineration and pollutes the atmosphere. For another example, CN201810335615.8 discloses a method for preparing a flexible strain sensor from waste thermosetting resin, wherein the method for preparing a flexible strain sensor from waste thermosetting resin comprises the steps of performing high-temperature carbonization treatment on waste thermosetting resin in an inert atmosphere to obtain a carbonized material; the electrodes are arranged on the carbonized material and connected with external leads, and then the flexible strain sensor is obtained by using the polymer elastomer for encapsulation and solidification, so that the thermosetting resin is recycled, but the method has severe conditions, high-temperature carbonization treatment needs to be carried out in inert gas, the process cost is high, most of the waste thermosetting resin comes from non-metal parts of electronic components such as waste electronic circuit boards, and more various method modes are required for recycling the waste circuit boards. CN2020103335146.7 discloses a modified regenerated plastic particle with flame retardance, which comprises 15-40 parts of polyethylene, 8-25 parts of polycarbonate, 12-30 parts of transgenic mouse model polyethylene lactone, 1-8 parts of hexabromocyclododecane, 2-6 parts of antimony trioxide, 3-5 parts of antimony pentoxide, 4-8 parts of nano silica, 2-12 parts of glass fiber, 8-20 parts of pigment and filler, 3-8 parts of coupling agent, 3-8 parts of dispersing agent, 2-6 parts of stabilizing agent, 4-10 parts of plasticizer, 1-5 parts of antioxidant and 5-15 parts of intumescent flame retardant, wherein the flame retardance of the modified regenerated plastic can be increased by adding the intumescent flame retardant into the raw materials to be matched with the antioxidant for use, and the modified regenerated plastic particle can also be used as a filler, however, it merely proposes a solution for recycling plastics, and optimization of flame retardancy can be further improved.
Disclosure of Invention
The first purpose of the present invention is to provide a filler formed by recycling waste circuit board nonmetal powder and a preparation method thereof, aiming at overcoming the defects of the prior art, and solving the problem that no harmless processing method with diversity, low cost and simple operation is provided for recycling waste electronic circuit board nonmetal powder in the prior art.
In order to solve the technical problems, the invention adopts a technical scheme that: the filler formed by recycling the nonmetal powder of the waste circuit board is provided, and consists of the following components in parts by weight: 25-65% of solid plastic, 25-65% of waste circuit board nonmetal powder and 8-12% of processing aid.
In the technical scheme, the waste circuit board nonmetal powder is mainly derived from leftover materials of a copper-clad plate factory, leftover materials and drilling powder of a circuit board processing factory, and a powder grinding factory for recycling the waste circuit board. Part is retrieved waste circuit board's powder mill and is handled after extracting other rare metals such as copper, gold, silver, nickel, palladium for other uses, and the non-metallic component of remaining waste circuit board generally accounts for more than 60%, and the useless epoxy resin powder that contains in the non-metallic part after the powder mill handles, because has metal powder and the halogen substance that can't thoroughly separate clean, can cause heavy metal pollution or the environmental pollution possibility that the toxic material precipitates under the condition of handling inadequately, consequently belongs to dangerous waste. If the waste circuit board is not properly treated and disposed, not only a large amount of useful resources are lost, but also the environment is seriously damaged, so that the method has great economic recovery value and environmental protection significance for the full resource utilization of the waste circuit board.
According to the technical scheme, the components are fully mixed by adopting the mass percentage ratio, after the mixture enters a parallel double-screw granulator, the plastic can be fully melted, the waste circuit board nonmetal powder contains thermosetting resin which has good heat resistance and can not deform under stress, the melted plastic and the waste circuit board nonmetal powder are further mixed again under the action of a rotating screw of the parallel double-screw granulator and a processing aid, and the surface of the waste circuit board nonmetal powder can be fully cast by the melted plastic under the action of the force, such as Van der Waals force and the like, so that the coating of the solid plastic on the waste circuit board nonmetal powder is ensured, and the aim of harmlessness is fulfilled. The product obtained by the technical scheme fully utilizes solid plastics and waste circuit board nonmetal powder, is environment-friendly and low in cost, can be used for filling plastic plates and plastic products, and can also be used for spraying plastics and coatings. The processing aid is selected from common lubricant, stabilizer, compatilizer, toner and the like.
Preferably, the filling material consists of the following components in percentage by weight: 30% of solid plastic, 60% of waste circuit board nonmetal powder and 10% of processing aid.
Wherein the solid plastic is waste solid plastic. In the technical scheme, the waste solid plastics are derived from domestic solid waste and industrial solid waste, and different types of plastics can be sorted out after garbage classification; and plastic products and various plastic wastes such as leftover materials and leftovers generated in the industrial production process of related industries are sorted, crushed and cleaned, and then are subjected to mixing, shearing, plasticizing and granulating at the temperature of 120-300 ℃ by a parallel double-screw granulator to form different types of plastic granules. At present, a plurality of manufacturers specially sorting, granulating and recovering plastics on the market only need to purchase different types of recovered plastic particles. The technical scheme simultaneously utilizes the waste solid plastic and the waste circuit board nonmetal powder, and the environmental protection performance is greatly improved.
Preferably, the solid plastic is any one of PE, PP, PVC, PS, PET and PA.
Preferably, the processing aid contains a coupling agent, and the coupling agent is any one or a mixture of more of a silane coupling agent, a titanate coupling agent and a titanium aluminate coupling agent.
Further preferably, the added weight of the coupling agent is 0.3% -1% of the weight of the loading.
In the technical scheme, the coupling agent is used as a plastic additive for improving the interface performance of synthetic resin and inorganic filler or reinforcing material in plastic compounding, the viscosity of synthetic resin melt can be reduced in the plastic processing process, the dispersity of the filler is improved to improve the processing performance, and then the product obtains good surface quality and mechanical, thermal and electrical properties; the coupling is particularly suitable for thermoplastic plastics such as polyolefines including PP, PE, PET and the like, and the long-chain winding can transfer stress strain, so that the impact strength, the elongation and the shear strength are improved, and the filling amount can be increased under the condition of keeping the tensile strength; the titanium aluminate coupling agent replaces part of aluminum as a central atom of the coupling agent, reduces the content of titanium with higher price, reduces the cost, has the characteristics of both titanium and aluminum coupling agents, has better thermal stability, simultaneously enables coupling between inorganic filler and matrix resin to be generated, is beneficial to mutual coupling between all components in the waste circuit board nonmetal powder, and simultaneously can generate a synergistic effect when the titanate coupling agent and the silane coupling agent are mixed for use, so that the solid plastic, the waste circuit board nonmetal powder and the processing aid are fully coupled to improve the dispersity of the filler so as to improve the processing performance, and further enable the product to obtain good surface quality and mechanical, thermal and electrical properties.
Preferably, the processing aid contains a plasticizer.
Further preferably, the plasticizer is any one of phthalate plasticizers, phosphates, trimellitates and chlorinated paraffins.
More preferably, the weight of the plasticizer is 0.1-2% of the weight of the filler.
The plasticizer is a polymer material auxiliary agent widely used in industrial production, so that the plasticity of a polymer material, namely plastic, is improved, the performance of the polymer material can be improved by using the plasticizer, the production cost is reduced, and the production benefit is improved. The plasticizer mainly has the functions of weakening the secondary valence bonds among resin molecules, increasing the mobility of the molecular bonds of the resin, reducing the crystallinity of the resin molecules, increasing the plasticity of the resin molecules, enhancing the flexibility of the resin molecules, being easy to process, and being miscible with polymers to a certain extent, and can reduce the viscosity of polymer melt and the glass transition temperature and the elastic modulus of products based on weakening the attractive force of the plasticizer molecules to polymer molecular chains.
The plasticizer in the technical scheme uses an external plasticizer, does not react with a polymer and does not become a part of a polymer chain segment, for example, the phthalate plasticizer is the most common plastic plasticizer, and the phosphate plasticizer and the chlorinated paraffin have flame retardant effect, are more suitable for the working condition of the invention, and work with halogen elements and glass fibers in the waste circuit board nonmetal powder to improve the flame retardant property of the filler of the invention; the trimellitate ester has good heat resistance and can be suitable for continuously playing a plasticizing role under granulation conditions. The plasticizer is used, so that the heating cost can be reduced in the granulation process, and the filler can have better flame retardant property.
The second purpose of the invention is to provide a preparation method of the filling material, which comprises the steps of material preparation, mixing, feeding and granulation, wherein a parallel double-screw granulator is used for shearing and plasticizing in the granulation process, the parallel double-screw granulator needs to be preheated before the granulation, the preheating temperature is set to be 120-250 ℃, and the granulation temperature is set to be 130-300 ℃.
In the above technical scheme, use parallel twin-screw granulator to carry out the granulation of this novel filler: the novel filling material contains hazardous waste epoxy resin, the epoxy resin is thermosetting resin, so other components are required to be used for coating the filling material, the contact between the epoxy resin and air and the outside is cut off, and the harmless treatment is realized, so that a parallel double-screw granulator is selected to be used, a charging barrel and a screw of the parallel double-screw granulator are designed according to a building block principle, and different combinations can be carried out according to requirements. When the material passes through the feeding port, under the action of the rotating screw rod, the material is kneaded into a dough shape and rolls along the screw groove to advance, the material is further mixed and plasticized under the shearing, compression and stirring actions of the screw rod, the temperature and the pressure are gradually increased to present a viscous flow state, and the viscous flow state passes through the machine head at a certain pressure and temperature, and finally a product with a required shape is obtained. Under the action of the parallel double-screw granulator, the obtained novel filler is in a shape that the outer layer of the solid plastic completely covers the non-metal powder of the waste circuit board at the inner layer, so that the harmless recycling of the waste solid plastic and the non-metal powder of the waste circuit board is realized. The novel filling material obtained by the technical scheme can be used for plastic plates and other products, and spraying plastics and coatings, and forms renewable resources, and cyclic economy is realized.
And meanwhile, the parallel double-screw granulator is preheated before granulation, the set preheating temperature is correspondingly adjusted according to different used solid plastics, so that the cost is further reduced, and the filler with better performance is obtained. The preheating temperature is lower than the melting point of the used solid plastic, so that the phenomenon that the mixture at normal temperature or approximate normal temperature before entering the granulation process generates coke in a high-temperature environment with the melting temperature suddenly to cause material loss and increase cost is avoided, meanwhile, the volatilization of processing aids can be caused due to overhigh temperature to influence the quality of the finished product of the filler, the granulation temperature is set to be slightly higher than the melting temperature of various plastics, the granulation temperature is controlled to be higher than the melting temperature of various plastics by about 5 ℃, the granulation process can be accelerated firstly, the time cost and the equipment operation cost are saved, secondly, the plastic material in the filler can be ensured to be fully melted without generating raw materials, the product quality is ensured, and if the granulation temperature is not controlled properly, the surface gloss and the density of particles of the finished filler can be influenced, the surface gloss and the particle looseness and other performances can be generated, thereby failing to meet the standard of product acceptance.
In addition, the order of the solid plastic, the processing aid and the waste circuit board nonmetal powder is optimal in the mixing process, so that the processing aid and the solid plastic are fully mixed, components such as a coupling agent, a plasticizer and the like in the processing aid are in full contact with the solid plastic, granulation is facilitated, and the final product quality of the filling material is ensured.
Preferably, when the type of the solid plastic is PE, the preheating temperature is set to be 120-125 ℃; when the type of the solid plastic is PVC, the preheating temperature is set to be 130-175 ℃; when the type of the solid plastic is PA, setting the preheating temperature to be 200-240 ℃; when the type of the solid plastic is PET, setting the preheating temperature to be 230-240 ℃; when the type of the solid plastic is PP, the preheating temperature is set to be 130-155 ℃; when the type of the solid plastic is PS, the preheating temperature is set to 130-160 ℃.
The non-metal powder of old and useless circuit board is extracted the powder mill collection of metal from the upper reaches, transports to the useless warehouse of danger, and the useless warehouse of danger is strict to be constructed according to the useless warehouse requirement of danger of environmental protection department, need ensure innoxious storage. The disposal workshop is constructed and processed in a closed way according to the requirements of environmental protection departments, and is conveyed to a mixer through a pipeline to ensure harmlessness in the conveying process; other raw materials (PE, PVC and other different plastics, a stabilizer, a lubricant, toner and other processing aids) belong to non-dangerous materials, so that the raw materials do not cause harmful pollution, even if the waste plastics are recycled, the waste plastics are solid wastes and harmless, and the granulation is finished in an upstream processing plant, so that the raw materials are controlled to be harmless. The mixer is a totally-enclosed mixing processing machine, so that no dust is generated during mixing. Then the premix is conveyed to a granulator through a spiral conveying pipeline, so that harmless conveying is ensured. In the link of producing finished filler products by processing a granulator, through high temperature, under the shearing pressure of a double screw, plastic is completely melted and plasticized, epoxy resin powder is completely coated, and the length-diameter ratio is not less than 40: 1, the plastic thus plasticized ensures sufficient time and space to coat the epoxy resin powder when passing through the screw barrel, and the finished filler produced meets the EU RoHS mandatory standard: upper limit concentrations specified for six harmful species in RoHS directive: cadmium: less than 100 ppm; lead: less than 1000 ppm; mercury: less than 1000 ppm; hexavalent chromium: less than 1000ppm, so the obtained product is a novel low-carbon and environment-friendly filler finished product. Because epoxy powder has few moisture because of reasons such as the moisture, under high temperature and shearing force effect, can form the vapor evaporation at the exhaust hole of granulator, avoid non-methane total hydrocarbon to discharge into the atmosphere, adopt UV light oxygen and active carbon to discharge into the atmosphere after handling non-methane total hydrocarbon such as vapor, consequently can not produce harmful substance such as waste water waste gas waste residue in the whole production course of working, the product of production also is harmless low carbon environmental protection's green product. Truly completely achieve harmless disposal.
The filler provided by the invention is large in size when in use, does not influence the product performance, and reduces the product cost. For example, the loading in the wood-plastic composite panel may be greater than 90%. In the production of plastic products, spray plastics and coatings, and plastic and polymer composite section composite boards, calcium carbonate, talcum powder, wood powder fiber, barium sulfate, kaolin, bentonite, even glass bead fiber and the like are generally adopted, and the general filling amount is not high, because the high filling amount can seriously affect the performance and the service life of the product, particularly increase the brittleness. Compared with the conventional filling material, the product can be filled with high filling times, and because the plastic is arranged in the product, the shaping material is not easy to damage under the action of external force, so that the performance is improved, and the cost is reduced. In the filling of the wood-plastic composite board, the product is used as a filling material, the addition amount can reach more than 90 percent, the performance strength and the fireproof and flame retardant properties of the wood-plastic composite board are improved, meanwhile, the waste is recycled as a raw material, the comprehensive cost is reduced, and the recycling economy of the renewable resources is realized.
The invention also provides a method for harmlessly treating the waste circuit board nonmetal powder, which is used as the filler for products such as wood-plastic composite boards.
The invention has the advantages that:
1. according to the technical scheme, the solid plastic and the waste circuit board non-metal powder are regenerated into the novel filler in the shape that the solid plastic covers the waste circuit board non-metal powder, so that the waste circuit board non-metal powder is harmlessly recycled, and meanwhile, the waste solid plastic can be recycled as a raw material, so that the environmental protection performance is improved;
2. the filling material provided by the invention has wide application, and has large filling amount when in use, so that the product performance is not influenced, and the product cost is reduced, for example, the filling amount in the wood-plastic composite board can be more than 90%;
3. the preparation method has the advantages of simple preparation process, convenient operation and low cost.
Detailed Description
The invention discloses a method for recycling waste circuit board nonmetal powder and a product thereof, and the invention is described in more detail by combining with an embodiment.
Example 1:
the filler for recycling the nonmetal powder of the waste circuit board comprises the following components in parts by weight: 30% of solid plastic, 60% of 20-mesh waste circuit board nonmetal powder and 10% of processing aid, wherein the solid plastic is PE, the diameter of the solid plastic is less than 5mm, and the processing aid is 2% of lubricant, 3% of stabilizer, 3% of compatilizer and 2% of toner.
Example 2:
the filler for recycling the nonmetal powder of the waste circuit board comprises the following components in parts by weight: 64 percent of solid plastic, 27.7 percent of 20-mesh waste circuit board nonmetal powder and 8.3 percent of processing aid, wherein the solid plastic is waste PVC, and the processing aid is 2 percent of lubricant, 2 percent of stabilizer, 2 percent of compatilizer, 2 percent of toner and 0.3 percent of titanate coupling agent.
Example 3:
the filler for recycling the nonmetal powder of the waste circuit board comprises the following components in parts by weight: 45% of solid plastic, 46% of 20-mesh waste circuit board nonmetal powder and 9% of processing aid, wherein the solid plastic is waste PA, and the processing aid is 2% of lubricant, 2% of stabilizer, 2% of compatilizer, 2% of toner and 1% of titanium aluminate coupling agent.
Example 4:
the filler for recycling the nonmetal powder of the waste circuit board comprises the following components in parts by weight: 27% of solid plastic, 64% of 20-mesh waste circuit board nonmetal powder and 9% of processing aid, wherein the solid plastic is waste PET, and the processing aid is 2% of lubricant, 2% of stabilizer, 2% of compatilizer, 2% of toner and 1% of chlorinated paraffin plasticizer.
Example 5:
the filler for recycling the nonmetal powder of the waste circuit board comprises the following components in parts by weight: 30% of solid plastic, 60% of 20-mesh waste circuit board nonmetal powder and 10% of processing aid, wherein the solid plastic is waste PP, and the processing aid is 2% of lubricant, 2% of stabilizer, 2% of compatilizer, 2% of toner and 2% of phosphate plasticizer.
Example 6:
the filler for recycling the nonmetal powder of the waste circuit board comprises the following components in parts by weight: 30% of solid plastic, 60% of 20-mesh waste circuit board nonmetal powder and 10% of processing aid, wherein the solid plastic is waste PS, and the processing aid is 2% of lubricant, 2% of stabilizer, 2% of compatilizer, 2% of toner, 1% of phthalate plasticizer, 0.5% of silane coupling agent and 0.5% of titanate coupling agent.
Example 7:
a preparation method of a filling material for recycling waste circuit board nonmetal powder comprises the following steps of material preparation, mixing, feeding and granulation:
preparing materials: preparing the components according to the weight of the embodiment 1;
mixing: starting a mixer, pouring the solid plastic, the processing aid and the waste circuit board nonmetal powder into the mixer in sequence, and stirring and mixing the solid plastic, the processing aid and the waste circuit board nonmetal powder for about 10 minutes to be fully and uniformly mixed;
feeding: conveying the mixture into a material barrel of a granulator by using a spiral feeding machine;
and (3) granulation: preheating a parallel double-screw granulator before granulation, setting the preheating temperature to be 120-125 ℃, starting the granulator according to an operation specification after preheating is finished, enabling the mixture to pass through the parallel double-screw granulator, setting the granulation temperature to be 135-140 ℃, forming novel multipurpose filler during discharging, and obtaining a granular finished product with powder through air cooling.
The mixer is a product which is produced by Changzhou Jinwei extrusion machinery manufacturing company Limited and has the specification of a mixer with 1000L and a motor with 220 KW; the spiral feeding machine is produced by Changzhou city sourced mechanical manufacturing Limited company and is a product with the specification of a screw diameter of 159mm, a stock bin of 650L and a motor of 3 KW; the parallel twin-screw pelletizer used was a pelletizing line of a 75/40 co-rotating parallel twin-screw extruder, manufactured by Changzhou city Shengmai mechanical manufacturing Co.
Example 8:
the difference from the embodiment 7 is that the components are prepared according to the weight of the embodiment 2, the preheating temperature is set to be 130-175 ℃ and the granulating temperature is set to be 185-190 ℃ before granulation.
Example 9:
the difference from the embodiment 7 is that the components are prepared according to the weight of the embodiment 3, the preheating temperature is set to be 200-240 ℃ and the granulation temperature is set to be 255-285 ℃ before granulation.
Example 10:
the difference from the embodiment 7 is that the components are prepared according to the weight of the embodiment 4, the preheating temperature is set to be 230-240 ℃ and the granulation temperature is set to be 255-265 ℃ before granulation.
Example 11:
the difference from the embodiment 7 is that the components are prepared according to the weight of the embodiment 5, the preheating temperature is set to be 130-155 ℃ and the granulation temperature is set to be 170-175 ℃ before granulation.
Example 12:
the difference from the embodiment 7 is that the raw materials are prepared according to the weight of the components in the embodiment 6, the preheating temperature is set to 130-160 ℃ and the granulation temperature is set to 190-230 ℃ before granulation.
Comparative example 1:
a filler is prepared from wood powder fiber in the prior art, and 60-mesh miscellaneous wood powder of Linan City pearl wood bamboo powder Co.
Test examples 1-6 and comparative example 1:
the fillers in the examples 1 to 6 and the comparative example 1 are respectively prepared into wood-plastic boards, and the wood-plastic boards are tested by referring to a building material incombustibility test method GB/T5464-2010, a wood-plastic floor GB/T24598-2009 and a wood-plastic decorative board GB/T20137-2009.
[ incombustibility ]: and testing the tested object by using the incombustibility testing furnace, and calculating the mass loss, the flame duration and the temperature rise of the tested object.
[ Shore Strength ]: the measured material is inserted into a Shore D hardness tester, a pointer on a dial is connected with a puncture needle through a spring, the surface of the measured object is punctured by the puncture needle, and the numerical value displayed on the dial is the hardness value.
The test results are shown in table 1:
analytical table 1: in the production of plastic and polymer composite section composite boards, calcium carbonate, talcum powder, wood powder fiber, barium sulfate, kaolin, bentonite, even glass bead fiber and the like are usually adopted, the general filling amount is not high, the high filling amount can seriously affect the performance and the service life of products, particularly the brittleness is increased, for example, in the wood powder fiber used in comparative example 1, the filling material in the manufactured wood-plastic board is only 30 percent, and due to the characteristics of the material of the wood powder fiber, if the filling amount is increased continuously, the brittleness of the manufactured board can be obviously increased, and the performance and the service life of the manufactured board are seriously affected. Compared with the conventional filling materials such as the comparative example 1 and the like, the filling materials of the invention can be filled in multiple times, and because the filling materials of the embodiment use plastics as main components, the problem of brittleness is hardly considered when the filling amount of the embodiment is increased, compared with wood flour used in the comparative example 1, the cost is obviously reduced in the embodiments 1 to 6, the environmental protection performance is also increased, and the Shore hardness and the fireproof flame retardant performance of the prepared wood-plastic board are improved. It can be seen that: the fillers of examples 1-6 have significantly better properties than the fillers of comparative example 1. And comparing examples 1-6 it can be seen that: the wood-plastic board obtained in the example 6 by adopting 30% of solid plastic, 60% of waste circuit board nonmetal powder and 10% of processing aid (2% of lubricant, 2% of stabilizer, 2% of compatilizer, 2% of toner, 1% of phthalate plasticizer, 0.5% of silane coupling agent and 0.5% of titanate coupling agent) is optimal in performance, the filling amount in the wood-plastic board can reach 92%, and the Shore hardness is improved by 26% compared with that in the comparative example 1.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but will be protected by patent law within the scope of the claims of the present invention.
Claims (10)
1. The filler formed by recycling the nonmetal powder of the waste circuit board is characterized by comprising the following components in parts by weight: 25-65% of solid plastic, 25-65% of waste circuit board nonmetal powder and 8-12% of processing aid.
2. The filler formed by recycling the nonmetal powder of the waste circuit board according to claim 1, wherein the filler is composed of the following components by weight: 30% of solid plastic, 60% of waste circuit board nonmetal powder and 10% of processing aid.
3. The filler formed by recycling nonmetal powder of waste circuit boards as recited in claim 1, wherein the solid plastic is any one of PE, PP, PVC, PS, PET and PA.
4. The filler formed by recycling the nonmetal powder of the waste circuit board according to claim 1, wherein the processing aid contains a coupling agent, and the coupling agent is any one or a mixture of silane coupling agent, titanate coupling agent and titanium aluminate coupling agent.
5. The filler formed by recycling the nonmetal powder of the waste circuit board according to claim 4, wherein the adding weight of the coupling agent is 0.3 to 1 percent of the weight of the filler.
6. The filler formed by recycling waste circuit board nonmetal powder according to claim 1, wherein the processing aid contains a plasticizer.
7. The filler formed by recycling waste circuit board nonmetal powder according to claim 6, wherein the plasticizer is any one of phthalate plasticizer, phosphate plasticizer, trimellitate plasticizer and chlorinated paraffin.
8. The filler formed by recycling the nonmetal powder of the waste circuit board according to claim 6, wherein the addition weight of the plasticizer is 0.1-2% of the weight of the filler.
9. The method for preparing the filling material formed by recycling the nonmetal powder of the waste circuit board according to claim 1, which comprises the following steps in sequence: preparing materials, mixing, feeding and granulating, wherein a parallel double-screw granulator is used for shearing and plasticizing in the granulating process, and needs to be preheated before the granulating, the preheating temperature is set to be 120-250 ℃, and the granulating temperature is set to be 130-300 ℃.
10. The method for preparing the filling material formed by recycling the nonmetal powder of the waste circuit board according to the claim 9, wherein when the solid plastic is PE, the preheating temperature is set to 120-125 ℃; when the type of the solid plastic is PVC, the preheating temperature is set to be 130-175 ℃; when the type of the solid plastic is PA, setting the preheating temperature to be 200-240 ℃; when the type of the solid plastic is PET, setting the preheating temperature to be 230-240 ℃; when the type of the solid plastic is PP, the preheating temperature is set to be 130-155 ℃; when the type of the solid plastic is PS, the preheating temperature is set to 130-160 ℃.
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