CN102514829B - Substrate assembly method and substrate assembly product - Google Patents

Substrate assembly method and substrate assembly product Download PDF

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CN102514829B
CN102514829B CN201110395786.8A CN201110395786A CN102514829B CN 102514829 B CN102514829 B CN 102514829B CN 201110395786 A CN201110395786 A CN 201110395786A CN 102514829 B CN102514829 B CN 102514829B
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substrate
draw
groove
shell
base
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CN102514829A (en
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夏俊生
侯育增
李波
李文才
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No 214 Institute of China North Industries Group Corp
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No 214 Institute of China North Industries Group Corp
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Abstract

The invention relates to a substrate assembly method and a substrate assembly product. The method comprises the steps that a pair of inner sides of the side wall of a shell is respectively processed with a blocking groove along the bottom side; a substrate which has the length being longer than the distance between the inner sides of the shell and less than the distance between the blocking grooves at the two sides is arranged in a base of the shell in an inclined way; one end of the substrate firstly is leaned against the interior of the blocking groove at one side of the base of the shell, and the other end of the substrate is then put into the blocking groove at the other side of the base of the shell, so that the two ends of the substrate 2 can be ensured to be embedded into the blocking grooves, the problem that the substrate easily falls off under the action of high overload impact (such as more than 10000g) can be solved, and the substrate can be closely, evenly and stably clamped with various bases; the invention also provides a substrate assembly product; the pair of inner sides of the side wall of the shell of the substrate assembly product is respectively processed with the blocking groove along the bottom side; the length of the substrate is longer than the distance between the inner sides of the side wall and less than the distance between the blocking grooves at the two sides; and the substrate is arranged in the blocking grooves and is fixedly connected with a base of a die cavity by bonding material, and the substrate is arranged between the two blocking grooves, so that the substrate is closely, evenly and stably connected with the base and is capable of withstanding the action of high overload impact (such as more than 10000g).

Description

A kind of substrate assemble method and substrate completed knocked down products
Technical field
The present invention relates to microelectronic product and manufacture field, especially a kind of substrate assemble method and substrate completed knocked down products.
Background technology
Microelectronic technique is to realize electronic system miniaturization, multi-functional, highly reliable important channel, in each field, is widely applied in recent years.Wherein, substrate assembling process be adopt specific adhesives by substrate together with the outer casing base strong bond, to reach the purpose of reliable assembly and connection, substrate assembling process is a basic packaging technology of microelectronic product.
In the different overload impact directions that are subject at microelectronic product, Y1 direction (being the direction that substrate breaks away from the shell bottom surface) is the harshest direction, because the suffered impulsive force of this direction makes whole substrate together with all components and parts, raw MAT'L on it, the trend broken away from the shell bottom surface is arranged; Simultaneously, in the overload impact effect of X, Z direction (parallel with the shell bottom surface), make whole underlay substrate there is the trend that along continuous straight runs breaks away from outer casing base.Thereby the anti-high overload level of substrate assembling becomes the weakest link that affects the anti-high overload ability of integrated circuit, is also the link of most critical.
This routine substrate assembling adhering method; only can reach by the bonding force of adhesives the adhesive effect between substrate and outer casing base; although can be for certain bind strength be provided between underlay substrate and shell; but in conventional bonded structure; rectangular relation between outer casing base and sidewall; no matter existence one determining deviation between underlay substrate and side wall of outer shell is in the direction (Y1) that breaks away from shell or all there is no other structural support safety method on (X, Z) in the horizontal direction.Therefore, the anti-overload impact level of conventional substrate package assembly is lower, generally in the Y1 direction, only reach 4000g, X, Z direction can only reach 6000g, be easy to produce the substrate problem that comes off and impact under (more than 10000g) effect at high overload, thereby cause whole circuit function to lose efficacy, can't meet the high overload application demand.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of substrate assemble method, solves at high overload and impacts under (more than 10000g) effect and be easy to produce the problem that substrate comes off, realize substrate and all kinds of bases closely, even, firmly be connected.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of substrate assemble method is characterized in that:
A. process draw-in groove at the pair of inside face of side wall of outer shell along base;
B. adhesives is placed horizontally between two draw-in grooves in outer casing base;
C. length is greater than to the substrate tilting that shell medial surface spacing and length is less than two side bayonet slot spacings and puts into outer casing base, one end of substrate first supports in a side bayonet slot of outer casing base, again the other end of substrate is put into to the opposite side draw-in groove of outer casing base, all embedded in draw-in groove to guarantee the substrate two ends;
D. substrate and shell are firmly clamped, and adhesives is cured.
On the basis of above-mentioned main technical schemes, can increase following further perfect technical scheme:
Further improvement of the present invention, also comprise the e step, reinforcement material evenly splashed into to the position, space in draw-in groove, then reinforcement material is cured.
Technique scheme of the present invention is further optimized, and in a step, described two side bayonet slots are symmetrical arranged or asymmetric setting.
Technique scheme of the present invention is further optimized, and described adhesives can be epoxy cement film, epoxy cement glue.
Technique scheme of the present invention is further optimized, and described reinforcing adhesives can be epoxy cement glue, reinforced glue.
The invention has the beneficial effects as follows between two draw-in grooves by substrate being assembled in to base, make substrate and base closely, evenly, firmly is connected, can stand high overload impact (more than 10000g) and act on.
The present invention also provides a kind of substrate completed knocked down products, solves at high overload and impacts under (more than 10000g) effect and be easy to produce the substrate problem that comes off, realize this substrate and all kinds of bases closely, even, firmly be connected.
The technical solution adopted for the present invention to solve the technical problems is:
The substrate completed knocked down products, comprise shell, be provided with substrate in shell, it is characterized in that: the pair of inside face of side wall of outer shell is respectively equipped with draw-in groove along its base, the length of described substrate is greater than the inside sidewalls interplanar distance and length is less than two side bayonet slot spacings, and described substrate is arranged in draw-in groove and is fixedly connected with the base of die cavity by adhesives.
The invention has the beneficial effects as follows that substrate is arranged between two draw-in grooves, make substrate and base closely, evenly, firmly is connected, can stand high overload impact (more than 10000g) and act on.
On the basis of above-mentioned main technical schemes, can increase following further perfect technical scheme:
Further improvement of the present invention, be provided with reinforcement material and be connected with substrate in described draw-in groove.
Technique scheme of the present invention is further optimized, and between described draw-in groove and corresponding die cavity medial surface, is provided with chamfering, forms a kind of horn-like groove.
Technique scheme of the present invention is further optimized, and the thickness of substrate is less than the height of draw-in groove, meets height and adhesives height sum that the draw-in groove height equals substrate.
Below in conjunction with drawings and Examples, the present invention is further described.
The accompanying drawing explanation:
Fig. 1 is artwork of the present invention;
The front view that Fig. 2 is product of the present invention;
The cutaway view that Fig. 3 is product front view of the present invention;
Fig. 4 is product size graph of a relation of the present invention.
The specific embodiment
A kind of substrate assemble method:
1, shell customization
At first according to the size of substrate, customization and the shell that uses size to be complementary: the pair of inside face at side wall of outer shell is processed draw-in groove along base, the symmetrical processing of described draw-in groove or asymmetric processing, the length of substrate is greater than two sides spacing in side wall of outer shell, is slightly less than two side bayonet slot maximum spacings, the width of substrate is slightly less than the length of draw-in groove, and the thickness of substrate 2 is less than the draw-in groove height;
2, the substrate binding material is placed
Adhesives is placed horizontally in the base of shell, the length of adhesives is equal to the draw-in groove maximum spacing, and the two ends of adhesives all touch the inboard of draw-in groove just;
3, substrate is placed
As shown in Figure 1, the substrate tilting processed is put into to shell, and an end of substrate first supports the side bayonet slot inboard into shell, then the other end of substrate is put down, also need after the substrate horizontal positioned slightly to move to the opposite side draw-in groove of shell, to guarantee the substrate two ends, all embed draw-in groove;
4, substrate binding material cured
Use the special substrate assembling fixture that the base of substrate and shell is firmly clamped, in clamping process, will guarantee the substrate non-displacement, the product of clamping is put into to substrate binding material cured equipment and be cured, after curing the end, take off the substrate assembling fixture;
5, the substrate termination reinforces
Substrate termination reinforcement material is evenly splashed into to the position, whole space of the draw-in groove at substrate two ends; workpiece being put into to the reinforcement material curing apparatus is cured again; substrate termination reinforcement material tightly wraps the substrate two ends in draw-in groove after solidifying; thereby realize substrate is assembled in an overfill protection of Y1 and X, Z direction, effectively improve the anti-high overload ability of substrate assembling.
As shown in Figures 2 and 3, the substrate completed knocked down products, comprise shell 1, shell 1 comprises base, the sidewall of base surrounding, be arranged on base the pin stretched out to the opposite sense of sidewall, the pair of inside face of side wall of outer shell is respectively equipped with draw-in groove 5 along its base, also comprise substrate 2, the length of described substrate 2 is greater than the inside sidewalls interplanar distance and length is less than two side bayonet slot 5 spacings, described substrate 2 is arranged in draw-in groove 5 and is fixedly connected with the base of die cavity by adhesives 3, substrate termination reinforcement material 4 is evenly splashed into to the position, whole space of the draw-in groove 5 at substrate 2 two ends, substrate is fixedly connected with draw-in groove.
In the both sides of outer casing base, two symmetries or non-symmetrical draw-in groove are arranged respectively, draw-in groove can be designed to rectangle as required, between described draw-in groove and corresponding die cavity medial surface, is provided with chamfering, forms a kind of horn-like groove.
Described substrate 2 refers on substrate the workpiece that is assembled with passive, active component or other element and forms.The length of substrate 2 is greater than the spacing L of shell madial wall 1, be slightly less than the bottom land spacing L of two side bayonet slots 5 2, the width of substrate 2 is slightly less than the length L of draw-in groove 3, the thickness of substrate 2 is less than the bottom land height H of draw-in groove.
The size of this substrate completed knocked down products: as shown in Figure 4:
Figure 2011103957868100002DEST_PATH_IMAGE001
measure substrate height H c, the substrate length L c, substrate binding material thickness H z;
Figure 693295DEST_PATH_IMAGE002
set draw-in groove bell mouth angle θ, for ease of substrate termination reinforcement material is evenly splashed in draw-in groove, generally can be set as 135 °.
set the overall width that substrate embeds draw-in groove, generally be not less than the substrate thickness of substrate, in the HIC substrate is used, this width can be set as 1 ㎜～2 ㎜.
According to above-mentioned known parameters, calculate all the other key parameters of draw-in groove:
Figure 507667DEST_PATH_IMAGE001
draw-in groove outside spacing L w=substrate length L c-substrate embeds the overall width of draw-in groove
Figure 517080DEST_PATH_IMAGE002
the draw-in groove height H b=min (substrate height H c+ substrate binding material thickness H z)
Figure 784113DEST_PATH_IMAGE003
when adopting asymmetric draw-in groove:
Left side draw-in groove depth S zthe overall width of=substrate embedding draw-in groove/2
Right side draw-in groove depth S y=L c* cos (arcsin (H l/ L c))+H c* sin (arcsin (H l/ L c))-L w
Figure 920697DEST_PATH_IMAGE004
when adopting symmetrical draw-in groove, the two side bayonet slot degree of depth are identical, i.e. S z=S y, and need be by computing machine according to following formula computer card groove depth value:
（H c＋S Z） 2＋（L w＋S y－H c*sin(arcsin((H c＋S Z)/L C)) 2＝L C 2

Claims (9)

1. a substrate assemble method is characterized in that:
A. process draw-in groove at the pair of inside face of side wall of outer shell along base;
B. adhesives is placed horizontally between two draw-in grooves in outer casing base;
C. length is greater than to the substrate tilting that shell medial surface spacing and length is less than two side bayonet slot spacings and puts into outer casing base, one end of substrate first supports in a side bayonet slot of outer casing base, again the other end of substrate is put into to the opposite side draw-in groove of outer casing base, all embedded in draw-in groove to guarantee the substrate two ends;
D. substrate and shell are firmly clamped, and adhesives is cured.
2. according to the described a kind of substrate assemble method of claim 1, it is characterized in that: also comprise the e step, reinforcement material is evenly splashed into to the position, space in draw-in groove, then reinforcement material is cured.
3. according to the described a kind of substrate assemble method of claim 1 or 2, it is characterized in that: in a step, described two side bayonet slots are symmetrical arranged or asymmetric setting.
4. according to the described a kind of substrate assemble method of claim 1 or 2, it is characterized in that: described adhesives can be epoxy cement film, epoxy cement glue.
5. according to the described a kind of substrate assemble method of claim 2, it is characterized in that: described reinforcement material can be epoxy cement glue, reinforced glue.
6. substrate completed knocked down products, comprise shell, be provided with substrate in shell, it is characterized in that: the pair of inside face of side wall of outer shell is respectively equipped with draw-in groove along its base, the length of described substrate is greater than the spacing of inside sidewalls face and the spacing that length is less than two side bayonet slots, and described substrate is arranged in draw-in groove and is fixedly connected with the base of die cavity by adhesives.
7. according to the described substrate completed knocked down products of claim 6, it is characterized in that: be provided with reinforcement material in described draw-in groove and be connected with substrate.
8. according to the described substrate completed knocked down products of claim 7, it is characterized in that: be provided with chamfering between described draw-in groove and corresponding die cavity medial surface, form a kind of horn-like groove.
9. described substrate completed knocked down products according to Claim 8, it is characterized in that: the thickness of substrate is less than the height of draw-in groove, meets height and adhesives height sum that the draw-in groove height is not less than substrate.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9304350U1 (en) * 1993-03-23 1993-05-27 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
FR2894569A1 (en) * 2005-12-12 2007-06-15 Velfor Plast Sa Sa Packing case, for transporting and displaying product in cavities of plastics wedging piece, includes covering cardboard box with openings for detachable locking with projections on flap of wedging piece
CN101486404A (en) * 2009-03-09 2009-07-22 友达光电股份有限公司 Substrate packaging structure
CN101670918A (en) * 2009-09-30 2010-03-17 友达光电股份有限公司 Packing structure
CN101717014A (en) * 2009-12-23 2010-06-02 友达光电股份有限公司 Packing box structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9304350U1 (en) * 1993-03-23 1993-05-27 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
FR2894569A1 (en) * 2005-12-12 2007-06-15 Velfor Plast Sa Sa Packing case, for transporting and displaying product in cavities of plastics wedging piece, includes covering cardboard box with openings for detachable locking with projections on flap of wedging piece
CN101486404A (en) * 2009-03-09 2009-07-22 友达光电股份有限公司 Substrate packaging structure
CN101670918A (en) * 2009-09-30 2010-03-17 友达光电股份有限公司 Packing structure
CN101717014A (en) * 2009-12-23 2010-06-02 友达光电股份有限公司 Packing box structure

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