CN102513635A - Copper/aluminum ultrasonic liquid-phase diffusion brazing process and brazing device - Google Patents

Copper/aluminum ultrasonic liquid-phase diffusion brazing process and brazing device Download PDF

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Publication number
CN102513635A
CN102513635A CN201110402972XA CN201110402972A CN102513635A CN 102513635 A CN102513635 A CN 102513635A CN 201110402972X A CN201110402972X A CN 201110402972XA CN 201110402972 A CN201110402972 A CN 201110402972A CN 102513635 A CN102513635 A CN 102513635A
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brazing
crucible
copper
solder
phase diffusion
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CN102513635B (en
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孙德明
杨刘波
刘鹏
李阳
王献忠
张保议
王志刚
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Shandong Jianzhu University
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Shandong Jianzhu University
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Abstract

The invention discloses a copper/aluminum ultrasonic liquid-phase diffusion brazing process and a brazing device. The brazing process adopts the technical scheme that the copper/aluminum ultrasonic liquid-phase diffusion brazing process adopts Sn-9Zn eutectic alloy brazing filler metal, and does not adopt brazing flux; the brazing temperature is low; and the requirements on the surface and the structure of a copper/aluminum brazing connector are not high. The brazing process has the beneficial effects that the brazing process is accomplished in brazing filler metal at a molten state, and the problem of heat preservation of the brazing filler metal during the brazing is eliminated; the controllability of brazing technological parameters is high, the operation process is simple, and the efficiency is high; the copper/aluminum connector adopting the brazing process is smooth, and the performances of the copper/aluminum connector are remarkably improved; and the anti-corrosion capability and both the high and low temperature impact resistance of the copper/aluminum brazing connector meet the requirements of national relevant standards.

Description

Ultrasonic Liquid Phase Diffusion soldering processes of a kind of copper/aluminium and brazing device
Technical field
The present invention relates to a kind of soldering processes and brazing device, relate in particular to ultrasonic Liquid Phase Diffusion soldering processes of a kind of copper/aluminium and brazing device.
Background technology
Patent (US 7 624 906 B2. Dec.1; 2009) disclose a kind of copper/aluminium soldering method, its method is that ultrasonic wave is applied on the mother metal, ultrasonic energy is passed to the molten state solder of an end that is positioned over joint to be welded through mother metal; Make solder fill brazed seam rapidly, realize brazing process.Its weak point is that this method needs to use brazing flux in brazing process; Surface state and structure to copper/aluminium joint have higher requirements; For baroque joint; Like the electric industry aluminum steel that arrives commonly used and the joint design (copper tip semi-surrounding aluminum steel) of copper exit, its ultrasonic brazing is difficulty comparatively.
Summary of the invention
Technical problem to be solved by this invention is directed against the deficiency of prior art and ultrasonic Liquid Phase Diffusion soldering processes of a kind of copper/aluminium and brazing device is provided; It adopts the Sn-9Zn eutectic solder; In ultrasonic vibration, and the method for implementing soldering under the argon shield condition, the present invention does not use brazing flux in brazing process; Need not to add alloy element in the solder alloy, not high to the structural requirement of copper/aluminium soldering joint.
The present invention realizes through following technical measures: a kind of ultrasonic Liquid Phase Diffusion soldering processes that are used for copper/aluminium joint, it is characterized in that, and at first carry out the aluminum steel cleaning, dispose the outer enamelled coating of aluminum steel with the polishing of terylene wheel, and use the acetone wiped clean;
Aluminum steel after the cleaning is immersed in the molten state Sn-9Zn eutectic solder, under the ultrasonic wave effect, make aluminum steel surface plating one deck solder;
The solder cladding portion that has of aluminum steel is crimped on the copper exit;
At last, will need welding portion to immerse and implement ultrasonic wave liquid phase diffusion brazing in the molten state Sn-9Zn eutectic solder, keep 2-5 second weld interval, and make solder and workpiece all in argon gas stream in the welding process, the postwelding air cooling.
Concrete characteristics of the present invention also have, and the temperature of above-mentioned molten state Sn-9Zn eutectic solder is 320-380, and said ultrasonic frequency is 20KHz, and power density is 0.3-0.5W/mm 2, argon flow amount 5L/min.
Of the present inventionly specifically comprise the steps,
A: prepare crucible, in the bottom of crucible supersonic generator is installed, supersonic generator is positioned at outside the crucible, and the argon gas air curtain is installed directly over crucible, in the periphery of crucible heater is set;
B: regulate the supersonic generator control panel, making it produce frequency is 20KHz, and power density is 0.3-0.5W/mm 2Ultrasonic wave; The control panel of regulating heater makes the temperature of solder reach 320-420 ℃ and maintenance;
C: open the argon gas air curtain, the flow that makes argon gas is 5L/min and leads in the crucible, and carries out soldering simultaneously.
Brazing device used in the present invention comprises that it comprises crucible, and the crucible outer periphery is equipped with heater, and said heater has control panel; Said crucible bottom is equipped with supersonic generator, and said supersonic generator is positioned at outside the crucible, and said supersonic generator has control panel, is provided with the argon gas air curtain directly over the said crucible.
That brazing device of the present invention has is simple in structure, design advantage cleverly; Process using Sn-9Zn eutectic alloy solder of the present invention does not use brazing flux, and brazing temperature is low, and is not high to the surface and the structural requirement of copper/aluminium soldering joint.Beneficial effect of the present invention is: brazing process is in the solder under the molten condition, to accomplish, and has eliminated the problem of solder insulation in the brazing process; The technological parameter controllability of soldering is strong, and operating process is simple, and efficient is higher; Adopt the copper/aluminium joint of this technology soldering, not only soldered fitting is bright and clean, and its performance also is significantly improved; Corrosion-resistant and the high-low temperature resistant impact capacity of copper/aluminium soldering joint all can reach the requirement of relevant national standard.
Description of drawings
Fig. 1 is the structural representation of brazing device in the specific embodiment of the invention;
Among the figure, 1, crucible, 2, supersonic generator, 3, control panel, 4, heater, 5, control panel, 6, the argon gas air curtain.
The specific embodiment
For clearly demonstrating the technical characterstic of this programme, through a specific embodiment, this programme is set forth below.
Shown in accompanying drawing, a kind of ultrasonic Liquid Phase Diffusion soldering processes that are used for copper/aluminium joint is characterized in that, at first carry out the aluminum steel cleaning, dispose the outer enamelled coating of aluminum steel with the polishing of terylene wheel, and use the acetone wiped clean; Aluminum steel after the cleaning is immersed in the molten state Sn-9Zn eutectic solder, under the ultrasonic wave effect, make aluminum steel surface plating one deck solder; The solder cladding portion that has of aluminum steel is crimped on the copper exit; At last, will need welding portion to immerse and implement ultrasonic wave liquid phase diffusion brazing in the molten state Sn-9Zn eutectic solder, keep 2-5 second weld interval, and make solder and workpiece all in argon gas stream in the welding process, the postwelding air cooling.Wherein, the temperature of molten state Sn-9Zn eutectic solder is 320-380, and said ultrasonic frequency is 20KHz, and power density is 0.3-0.5W/mm 2, argon flow amount 5L/min.
Of the present inventionly specifically comprise the steps,
A: prepare crucible, in the bottom of crucible supersonic generator is installed, supersonic generator is positioned at outside the crucible, and the argon gas air curtain is installed directly over crucible, in the periphery of crucible heater is set;
B: regulate the supersonic generator control panel, making it produce frequency is 20KHz, and power density is 0.3-0.5W/mm 2Ultrasonic wave; The control panel of regulating heater makes the temperature of solder reach 320-420 ℃ and maintenance;
C: open the argon gas air curtain, the flow that makes argon gas is 5L/min and leads in the crucible, and carries out soldering simultaneously.
Brazing device used in the present invention comprises that it comprises crucible 1, and crucible 1 outer periphery is equipped with heater 4, and said heater 4 has control panel 5; Said crucible 1 bottom is equipped with supersonic generator 2, and said supersonic generator 2 is positioned at outside the crucible 1, and said supersonic generator 2 has control panel 3, is provided with argon gas air curtain 6 directly over the said crucible 1.
To pass through its smooth in appearance of range estimation through the brazing product that this technology makes, and carry out its high-low temperature resistant impact capacity and corrosion resistance are made an experiment:
High-low temperature resistant impact test condition:
The non-heat radiation of GB/T2423.1 Aa temperature jump low temperature-25 ℃ continues 2h;
The non-heat radiation of GB/T2423.2 Ba temperature jump 125 DEG C high temperature continues 2h;
Acceptance condition: sample coating does not have the cracking obscission.
Get 10 of the products that make through this technology at random, through above-mentioned experimental condition, 10 product soldering place coating do not have the cracking obscission, and therefore, product is all qualified.
Corrosion resistance test:
GB/T2423.17 concentration 5% Ph=6.5 continues 48h
Acceptance condition: sample coating does not have the cracking obscission.
Get 10 of the products that make through this technology at random, through above-mentioned experimental condition, 10 product soldering place coating do not have the cracking obscission, and therefore, product is all qualified.
The present invention can pass through or adopt existing techniques in realizing without the technical characterictic of describing; Repeat no more at this; Certainly, above-mentioned explanation is not to be limitation of the present invention, and the present invention also is not limited in above-mentioned giving an example; Variation, remodeling, interpolation or replacement that those skilled in the art are made in essential scope of the present invention also should belong to protection scope of the present invention.

Claims (4)

1. ultrasonic Liquid Phase Diffusion soldering processes that are used for copper/aluminium joint is characterized in that, at first carry out the aluminum steel cleaning, dispose the outer enamelled coating of aluminum steel with the polishing of terylene wheel, and use the acetone wiped clean;
Aluminum steel after the cleaning is immersed in the molten state Sn-9Zn eutectic solder, under the ultrasonic wave effect, make aluminum steel surface plating one deck solder;
The solder cladding portion that has of aluminum steel is crimped on the copper exit;
At last, will need welding portion to immerse and implement ultrasonic wave liquid phase diffusion brazing in the molten state Sn-9Zn eutectic solder, keep 2-5 second weld interval, and make solder and workpiece all in argon gas stream in the welding process, the postwelding air cooling.
2. the ultrasonic Liquid Phase Diffusion soldering processes that are used for copper/aluminium joint according to claim 1 is characterized in that the temperature of said molten state Sn-9Zn eutectic solder is 320-380 ℃, and said ultrasonic frequency is 20KHz, and power density is 0.3-0.5W/mm 2, argon flow amount 5L/min.
3. the ultrasonic Liquid Phase Diffusion soldering processes that are used for copper/aluminium joint according to claim 1 is characterized in that, specifically comprise the steps,
A: prepare crucible, in the bottom of crucible supersonic generator is installed, supersonic generator is positioned at outside the crucible, and the argon gas air curtain is installed directly over crucible, in the periphery of crucible heater is set;
B: regulate the supersonic generator control panel, making it produce frequency is 20KHz, and power density is 0.3-0.5W/mm 2Ultrasonic wave; The control panel of regulating heater makes the temperature of solder reach 320-420 ℃ and maintenance;
C: open the argon gas air curtain, the flow that makes argon gas is 5L/min and leads in the crucible, and carries out soldering simultaneously.
4. a brazing device of implementing claim 1 or 2 or 3 said technologies is characterized in that it comprises crucible, and said crucible outer periphery is equipped with heater, and said heater has control panel; Said crucible bottom is equipped with supersonic generator, and said supersonic generator is positioned at outside the crucible, and said supersonic generator has control panel, is provided with the argon gas air curtain directly over the said crucible.
CN201110402972.XA 2011-12-07 2011-12-07 Copper/aluminum ultrasonic liquid-phase diffusion brazing process and brazing device Expired - Fee Related CN102513635B (en)

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Publication number Priority date Publication date Assignee Title
CN103612008A (en) * 2013-11-30 2014-03-05 西安科技大学 Magnesium alloy and copper composite panel manufacturing method based on transient liquid phase diffusion connection
CN103785911A (en) * 2012-10-30 2014-05-14 宁波江丰电子材料有限公司 Welding process of target assembly
CN108465892A (en) * 2018-02-05 2018-08-31 东莞市新玛博创超声波科技有限公司 Flux-free ultrasonic cryogenic method for welding and application under copper-based material atmospheric conditions
CN114434039A (en) * 2021-01-15 2022-05-06 重庆理工大学 Welding flux for low-temperature interconnection of copper and aluminum dissimilar materials and welding method

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103785911A (en) * 2012-10-30 2014-05-14 宁波江丰电子材料有限公司 Welding process of target assembly
CN103785911B (en) * 2012-10-30 2016-03-09 宁波江丰电子材料股份有限公司 The welding method of target material assembly
CN103612008A (en) * 2013-11-30 2014-03-05 西安科技大学 Magnesium alloy and copper composite panel manufacturing method based on transient liquid phase diffusion connection
CN108465892A (en) * 2018-02-05 2018-08-31 东莞市新玛博创超声波科技有限公司 Flux-free ultrasonic cryogenic method for welding and application under copper-based material atmospheric conditions
CN108465892B (en) * 2018-02-05 2020-08-07 东莞市新玛博创超声波科技有限公司 Fluxing agent-free ultrasonic low-temperature brazing method for copper-based material under atmospheric condition and application
CN114434039A (en) * 2021-01-15 2022-05-06 重庆理工大学 Welding flux for low-temperature interconnection of copper and aluminum dissimilar materials and welding method

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