CN102500858A - System for separating electronic component in waste and old circuit board by utilizing high-frequency induction heating and method - Google Patents
System for separating electronic component in waste and old circuit board by utilizing high-frequency induction heating and method Download PDFInfo
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- CN102500858A CN102500858A CN2011103354184A CN201110335418A CN102500858A CN 102500858 A CN102500858 A CN 102500858A CN 2011103354184 A CN2011103354184 A CN 2011103354184A CN 201110335418 A CN201110335418 A CN 201110335418A CN 102500858 A CN102500858 A CN 102500858A
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Abstract
The invention discloses a system and a method for separating an electronic component in a waste and old circuit board by utilizing high-frequency induction heating. The system comprises a high-frequency induction heating coil, a circuit board fixing clamp, a vibratory component recovery net, a tin-soldered recovery box, an air pump, a harmful gas treatment box, a ventilation opening, an openable box cover, a vibrating motor, an induction coil control box, a shell and a rear machine cover, wherein the waste and old circuit board is clamped on the circuit board fixing clamp; and soldered tin at pins for connecting the electronic component and the substrate is heated and melted by the high-frequency induction heating device, and the electronic component and the substrate are separated by vibration of the circuit board fixing clamp. The separated electronic component and the soldered tin fall on the vibratory component recovery net which leads the soldered tin and the component to be separated and fall into the soldered tin recovery box for recovery continuously. The invention has the characteristic that the electronic components are separated quickly and efficiently.
Description
Technical field:
The present invention relates to a kind of system and method that utilizes electronic devices and components in the high-frequency induction heating separating waste, worn circuit board, belong to electronic device recovery gear field.
Background technology:
Modern social development's speed is accelerated day by day, and Informatization Development is particularly violent, and the thing followed is the generation of a large amount of electron wastes.These electron wastes have brought serious harm for society and environment, waste and old printed circuit board be exactly have much in these electron wastes representational a kind of.Waste and old printed circuit board mainly is made up of substrate and the various members that weld on it, wherein contains a large amount of base metals and part precious metal, can pass through the special process recycling.Simultaneously, some also can reuse the electronic devices and components on the circuit board after reliability detects, and can carry out Selective Separation and individual processing to the electronic devices and components that contain hazardous substance in addition, can prevent contaminate subsequent technology like this.Based on above some, waste and old printed circuit board reasonably reclaimed just seem particularly important.To reclaim it, the electronic component at first will the disconnect circuit plate, requirement in demolishing process, the fast Demolition electronic devices and components guarantee the excellent of electronic component on the other hand as far as possible on the one hand, can also reclaim scolder at last.But the dismounting of electronic devices and components at present can guarantee the excellent of its components and parts to a certain extent generally by manual completion, but along with waste and old circuit board is increasing, the manual dismounting obviously can not meet the demands.
Chinese invention patent CN200960577Y (day for announcing 2007.10.17) has proposed a kind of extracting tool, sends circuit board, device to be removed and extracting tool to the reflow ovens heating together, utilizes the spring restoring force that device to be removed is separated with circuit board then.Its shortcoming is: circuit board integral body is heated, and yielding deliquescing is damaged, and this moment is more complicated with being connected of components and parts; The simple restoring force of spring that leans on is difficult for making device to be removed to separate with circuit board; The dismounting rate is not high, removes not thoroughly, and the circuit board of distortion also has certain influence to post-processed.Chinese invention patent CN201235436Y (day for announcing 2009.5.13) has proposed a kind of circuit board demountor device, is in the lower end, middle part of transmission net the purpose that heating tube heater circuit plate reaches dismounting to be set.Its shortcoming is: heating tube is through transmission net indirect circuit board; Its efficiency of heating surface is not high, and the stitch of electronic devices and components can not thoroughly melt on the circuit board, and components and parts separate not thorough with circuit board; Circuit board during through the transmission net integral body be heated and very easily be damaged, influential to post-processed.
High-frequency induction heating is that metallic conductor is put into inductor (coil), when feeding the alternating current of certain frequency in the inductor, promptly produces alternating magnetic field on every side.Utilize high-frequency induction in metallic conductor (scolding tin), to produce induced electromotive force, produce induced-current then, electric current according to Joule's law, sends a large amount of heats and makes metallic conductor (scolding tin) be heated fusing then in metallic conductor (scolding tin).Its advantage is the highest, fastest to the metal material efficiency of heating surface, and low consumption environment protection.It has been widely used in the heat treated of all trades and professions to metal material.It not only can heat whole workpiece, can also be to the local specific aim heating of workpiece; The deep layer that can realize workpiece is diathermanous, also can only concentrate heating to its surface, top layer; Can realize metal and nonmetal difference heating.
Summary of the invention
For solve in the unloading process separate not thorough, the problem that the dismounting rate is not high, the present invention uses the high-frequency induction heating effect and has proposed a kind of method and system of utilizing electronic devices and components in the high-frequency induction heating separating waste, worn circuit board.
The system of electronic devices and components in the high-frequency induction heating separating waste, worn circuit board, it comprises: it comprise high-frequency induction heating coil 101, circuit board fixedly clip 102, can shake components and parts reclaim net 103, scolding tin reclaim box 104, aspiration pump 105, pernicious gas treatment box 106, ventilating opening 107, can unpack cover 108, vibrating motor 109, induction coil control cabinet 110, shell 111, back cover 112; System ontology is made up of shell 111, the back cover 112 that is connected the unpacked lid 108 of cover top portion and is positioned at the shell side, and it constitutes the cavity of a sealing; High-frequency induction heating coil 101 is arranged at top in the system ontology inside, and back cover 112 middle and upper parts are equipped with the aperture that high-frequency induction heating coil 101 is installed, and guarantee its sealing; The input of high-frequency induction heating coil 101 passes back cover 112 and is connected the high-frequency induction heating apparatus that constituted system with the induction coil control cabinet 110 at system ontology back; Vibrating motor 109 pass can unpack cover 108 with circuit board fixedly clip 102 be connected, constituted the circuit board vibrations fixture of system; Circuit board fixedly clip 102 is in sustained height with high-frequency induction heating coil 101; Ventilating opening 107 and aspiration pump 105 are set respectively in the both sides of shell 111; The side plate that aspiration pump 105 passes shell 111 is connected with pernicious gas treatment box 106 through pipeline, ventilating opening 107, aspiration pump 105 and the pernicious gas treatment box 106 common poisonous and harmful circulating treating systems of forming; Be provided with below in system ontology and can shake components and parts recovery net 103, its bottom is provided with scolding tin and reclaims box 104.
Said circuit board fixedly clip 102 integral body is processed by plastic material.
Circuit board fixedly clip 102 is connected in vibrating motor 109 through connecting rod.
Liquid is the low-temperature alkali organic solvent in the said pernicious gas treatment box 106, comprises ethanol and ether.
Said induction coil control cabinet 110, its electrical quantity: power frequency 50kHz, electric current 30-50A, correspondence 6s-10s heat time heating time.
Circuit board fixedly clip 102 adds and holds circuit board; Circuit board is eddy-current heating in high-frequency induction heating coil 101; The scolding tin at the stitch place that components and parts are connected with substrate is induction heated and melts, and under the physical action of circuit board vibrations fixture, comes off simultaneously, separates with substrate; The electronic devices and components that come off drop in the gravity effect and can shake components and parts and reclaim net 103, and the scolding tin that fusing comes off drops to scolding tin again and reclaims box 104 and obtain reclaiming through reclaiming the net vibrations.
Native system is in processing procedure, and circuit board is fixed in the middle of two plastic grips, and two plastic grip intermediate distance scalable are to adapt to the circuit board of different sizes.Form the poisonous and harmful circulating treating system by said ventilating opening 107, aspiration pump 105 and pernicious gas treatment box 106.In the heating process the toxic and harmful that produces get into pernicious gas treatment boxes 106 through aspiration pump 105 and carry out safe handling; Ventilating opening 107 blasts air in system makes the whole system inner air reach circulation; Liquid is the low-temperature alkali organic solvent in the pernicious gas treatment box 106; Comprise ethanol and ether, toxic gas is absorbed by organic solvent.
Characteristics of the present invention are only metal scolding tin to be heated through high-frequency induction heating; Make it fusing, high molecule plastic is not acted on, combining with physical shock simultaneously makes electronic devices and components come off with circuit substrate to separate; Melts soldering tin speed is high, and electronic devices and components are harmless intact.
Description of drawings
Fig. 1 is an agent structure sketch map of the present invention.
Fig. 2 is the front view of high-frequency induction heating apparatus of the present invention.
Fig. 3 is the vertical view of high-frequency induction heating apparatus of the present invention.
Label among the figure: 101, high-frequency induction heating coil, 102, the fixing clip of circuit board, 103, can shake components and parts and reclaim net; 104, scolding tin reclaims box, and 105, aspiration pump, 106, the pernicious gas treatment box; 107, ventilating opening, 108, the lid of can unpacking, 109, vibrating motor; 110, induction coil control cabinet, 111, shell, 112, the back cover.
The specific embodiment
The present invention will be described according to accompanying drawing below.
Fig. 1 is the main body view of whole system.The shell 111 of whole system is made by high molecule plastic, to guarantee that induction coil is to not influence of external frame.System ontology by shell 111, can unpack cover 108 and the back cover 112 form; High-frequency induction heating coil 101 is arranged at top in the internal system, and cover 112 middle and upper parts are equipped with the aperture that high-frequency induction heating coil 101 is installed after the system, and guarantee its sealing.High-frequency induction heating coil 101 passes back cover 112 and is connected with the induction coil control cabinet 110 at system back, the two has constituted system high-frequency induction heating apparatus; Vibrating motor 109 pass can unpack cover 108 with circuit board fixedly clip 102 be connected, the two has constituted circuit board vibrations fixture of system; Ventilating opening 107 and aspiration pump 105 are set respectively in the both sides of shell 111; The side plate that aspiration pump 105 passes shell 111 is connected with pernicious gas treatment box 106 through pipeline, ventilating opening 107, aspiration pump 105 and the pernicious gas treatment box 106 common poisonous and harmful circulating treating systems of forming; Be provided with below in internal system and can shake components and parts recovery net 103, its bottom is provided with scolding tin and reclaims box 104.
Fig. 2 is the front view of high-frequency induction heating apparatus of the present invention.The input line of figure medium-high frequency load coil 101 passes the back cover 112 that is equipped with the aperture and is connected with thereafter induction coil control cabinet 110, has constituted the high-frequency induction heating apparatus of system.
Fig. 3 is the vertical view of high-frequency induction heating apparatus of the present invention.
In the equipment course of work; Be heated circuit board and can emit some toxic gases; Like dibrom furan etc.; Toxic gas can be drawn into suction opeing fully and get into pernicious gas treatment box 106 through pipeline under blast orifice 107 and aspiration pump 105 act synergistically this moment, made toxic gas obtain smoothly handling.
Circuit board is eddy-current heating in high-frequency induction heating coil 101, and the scolding tin at the stitch place that components and parts are connected with substrate is induction heated and melts, and under the physical action of circuit board vibrations fixture, comes off simultaneously, separates with substrate.The electronic devices and components that come off drop in the gravity effect and can shake components and parts and reclaim net 103, and the scolding tin that fusing comes off drops to scolding tin again and reclaims box 104 and obtain reclaiming through reclaiming the net vibrations.
Course of work example.
Example 1.
Get a waste and old circuit board, at first the plug-in unit on the waste and old circuit board, buckle are removed, and some screw members are removed, remove some electric wires, at last circuit board is classified with size shape.
Opening to unpack covers 108, and at the circuit board circuit board of fixedly packing in the clip 102, covering to unpack covers 108; Open blast orifice 107 and air pump 105, open vibrating motor 109, make and to shake components and parts and reclaim net 103 and be in vibrating state; Open induction coil control cabinet 110 switches, set HF induction heating apparatus electric current 50kHz, 30A; Heat time heating time, 10s carried out eddy-current heating.
Close vibrating motor, opening to unpack covers 108, takes off circuit board, and at this moment, electronic devices and components come off totally basically on the circuit board.
Example 2.
Opening to unpack covers 108, and at the circuit board circuit board of fixedly packing in the clip 102, covering to unpack covers 108; Open blast orifice 107 and air pump 105, open vibrating motor 109, make and to shake components and parts and reclaim net 103 and be in vibrating state; Open induction coil control cabinet 110 switches, set HF induction heating apparatus electric current 50kHz, 40A; Heat time heating time, 8s carried out eddy-current heating.
Close vibrating motor, opening to unpack covers 108, takes off circuit board, and at this moment, electronic devices and components come off totally fully on the circuit board.
Example 3.
Opening to unpack covers 108, and at the circuit board circuit board of fixedly packing in the clip 102, covering to unpack covers 108; Open blast orifice 107 and air pump 105, open vibrating motor 109, make and to shake components and parts and reclaim net 103 and be in vibrating state; Open induction coil control cabinet 110 switches, set HF induction heating apparatus electric current 50kHz, 50A; Heating 6s carries out eddy-current heating.
Close vibrating motor, opening to unpack covers 108, takes off circuit board, and at this moment, electronic devices and components come off totally fully on the circuit board.Circuit board has softening slightly.
Claims (4)
1. the system of electronic devices and components in the high-frequency induction heating separating waste, worn circuit board, it comprises: it comprise high-frequency induction heating coil (101), circuit board fixedly clip (102), can shake components and parts and reclaim net (103), scolding tin and reclaim box (104), aspiration pump (105), pernicious gas treatment box (106), ventilating opening (107), the lid (108) of can unpacking, vibrating motor (109), induction coil control cabinet (110), shell (111), back cover (112); It is characterized in that: system ontology is made up of shell (111), the back cover (112) that is connected the unpacked lid (108) of cover top portion and is positioned at the shell side, and it constitutes the cavity of a sealing; High-frequency induction heating coil (10) 1 is arranged at top in the system ontology inside, and back cover (112) middle and upper part is equipped with the aperture that high-frequency induction heating coil (101) is installed, and guarantees its sealing; The input of high-frequency induction heating coil (101) passes back cover (112) and is connected the high-frequency induction heating apparatus that constituted system with the induction coil control cabinet (110) at system ontology back; Vibrating motor (109) pass can unpack lid (108) and circuit board fixedly clip (102) be connected, constituted the circuit board vibrations fixture of system; Circuit board fixedly clip (102) is in sustained height with high-frequency induction heating coil (101); Ventilating opening (107) and aspiration pump (105) are set respectively in the both sides of shell (111); The side plate that aspiration pump (105) passes shell (111) is connected with pernicious gas treatment box (106) through pipeline, and ventilating opening (107), aspiration pump (105) and pernicious gas treatment box (106) are formed the poisonous and harmful circulating treating system jointly; Be provided with below in system ontology and can shake components and parts recovery net (103), its bottom is provided with scolding tin and reclaims box (104).
2. the system of electronic devices and components in the high-frequency induction heating separating waste, worn circuit board according to claim 1 is characterized in that: said circuit board fixedly clip (102) integral body is processed by plastic material.
Circuit board fixedly clip 102 is connected in vibrating motor 109 through connecting rod.
3. the system of electronic devices and components in the high-frequency induction heating separating waste, worn circuit board according to claim 1 is characterized in that: said induction coil control cabinet (110), its electrical quantity: power frequency 50kHz, electric current 30-50A, correspondence 6s-10s heat time heating time.
4. application rights requires the processing method of the system of electronic devices and components in the 1 described high-frequency induction heating separating waste, worn circuit board; It is characterized in that: circuit board fixedly clip (102) adds and holds circuit board; Circuit board is eddy-current heating in high-frequency induction heating coil (101); The scolding tin at the stitch place that components and parts are connected with substrate is induction heated and melts, and under the physical action of circuit board vibrations fixture, comes off simultaneously, separates with substrate; The electronic devices and components that come off the gravity effect drop to can shake components and parts reclaim net (103 (, the scolding tin that fusing comes off drops to scolding tin again and reclaims box (104) and obtain reclaiming through reclaiming the net vibrations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110335418.4A CN102500858B (en) | 2011-10-28 | 2011-10-28 | System for separating electronic component in waste and old circuit board by utilizing high-frequency induction heating and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110335418.4A CN102500858B (en) | 2011-10-28 | 2011-10-28 | System for separating electronic component in waste and old circuit board by utilizing high-frequency induction heating and method |
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| CN102500858A true CN102500858A (en) | 2012-06-20 |
| CN102500858B CN102500858B (en) | 2014-11-26 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103484681A (en) * | 2013-10-23 | 2014-01-01 | 吉林大学 | Waste circuit board metal recovering device based on high-frequency induction heating principle |
| CN103551693A (en) * | 2013-10-31 | 2014-02-05 | 深圳市卓茂科技有限公司 | Intelligent hot air desoldering system |
| CN107775135A (en) * | 2017-11-16 | 2018-03-09 | 广州市谊华电子设备有限公司 | A kind of Multi-functional hot air tin attracting welding gun |
| CN109648169A (en) * | 2018-12-29 | 2019-04-19 | 大连长丰实业总公司 | A kind of aircraft arranges the shell and watch core decomposer of warm table |
| CN111740725A (en) * | 2020-07-10 | 2020-10-02 | 重庆大学 | Electromagnetic pulse separation method |
| CN111872038A (en) * | 2020-07-24 | 2020-11-03 | 重庆大学 | Equipment and method applied to electromagnetic pulse separation of waste PCB (printed Circuit Board) |
| CN112496487A (en) * | 2021-02-05 | 2021-03-16 | 江西科技学院 | Recovery device for electrical components on waste circuit board |
| CN112846434A (en) * | 2020-12-01 | 2021-05-28 | 国营芜湖机械厂 | Special decomposition device for landing gear terminal electric door mechanism and use method thereof |
| TWI747767B (en) * | 2021-03-15 | 2021-11-21 | 駿曦股份有限公司 | Automatic welding system and heating device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000273462A (en) * | 1999-03-29 | 2000-10-03 | Matsushita Electric Ind Co Ltd | Dry distillation device and dry distillation method |
| JP2000288509A (en) * | 1999-04-09 | 2000-10-17 | Matsushita Electric Ind Co Ltd | Method for treating circuit board |
| EP1106672A1 (en) * | 1999-12-07 | 2001-06-13 | Donizetti Srl | Process and equipment for the transformation of refuse using induced currents |
| CN201304409Y (en) * | 2008-11-07 | 2009-09-09 | 湖南文理学院 | Device for separating and disassembling electronic components from a waste printed circuit board |
| CN101537522A (en) * | 2009-03-20 | 2009-09-23 | 湖南万容科技有限公司 | Method and device for disassembling electronic components from waste printed circuit boards and recovering soldering tin |
| CN201380345Y (en) * | 2009-03-20 | 2010-01-13 | 伟翔环保科技发展(上海)有限公司 | Hot-disassembling automatic production line system of circuit board component |
| JP2011082282A (en) * | 2009-10-06 | 2011-04-21 | Shigeki Kobayashi | Reflow apparatus |
| CN102069256A (en) * | 2010-12-20 | 2011-05-25 | 北京工业大学 | Electronic component removing device based on final treatment of waste circuit board |
| CN202278278U (en) * | 2011-10-28 | 2012-06-20 | 北京工业大学 | System for separating electronic elements in waste printed circuit boards by high-frequency induction heating |
-
2011
- 2011-10-28 CN CN201110335418.4A patent/CN102500858B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000273462A (en) * | 1999-03-29 | 2000-10-03 | Matsushita Electric Ind Co Ltd | Dry distillation device and dry distillation method |
| JP2000288509A (en) * | 1999-04-09 | 2000-10-17 | Matsushita Electric Ind Co Ltd | Method for treating circuit board |
| EP1106672A1 (en) * | 1999-12-07 | 2001-06-13 | Donizetti Srl | Process and equipment for the transformation of refuse using induced currents |
| CN201304409Y (en) * | 2008-11-07 | 2009-09-09 | 湖南文理学院 | Device for separating and disassembling electronic components from a waste printed circuit board |
| CN101537522A (en) * | 2009-03-20 | 2009-09-23 | 湖南万容科技有限公司 | Method and device for disassembling electronic components from waste printed circuit boards and recovering soldering tin |
| CN201380345Y (en) * | 2009-03-20 | 2010-01-13 | 伟翔环保科技发展(上海)有限公司 | Hot-disassembling automatic production line system of circuit board component |
| JP2011082282A (en) * | 2009-10-06 | 2011-04-21 | Shigeki Kobayashi | Reflow apparatus |
| CN102069256A (en) * | 2010-12-20 | 2011-05-25 | 北京工业大学 | Electronic component removing device based on final treatment of waste circuit board |
| CN202278278U (en) * | 2011-10-28 | 2012-06-20 | 北京工业大学 | System for separating electronic elements in waste printed circuit boards by high-frequency induction heating |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103484681A (en) * | 2013-10-23 | 2014-01-01 | 吉林大学 | Waste circuit board metal recovering device based on high-frequency induction heating principle |
| CN103551693A (en) * | 2013-10-31 | 2014-02-05 | 深圳市卓茂科技有限公司 | Intelligent hot air desoldering system |
| CN103551693B (en) * | 2013-10-31 | 2015-08-12 | 深圳市卓茂科技有限公司 | A kind of intelligent hot blast sealing-off system |
| CN107775135A (en) * | 2017-11-16 | 2018-03-09 | 广州市谊华电子设备有限公司 | A kind of Multi-functional hot air tin attracting welding gun |
| CN109648169B (en) * | 2018-12-29 | 2021-04-23 | 大连长丰实业总公司 | Shell and watch core decomposition device of aircraft exhaust thermometer |
| CN109648169A (en) * | 2018-12-29 | 2019-04-19 | 大连长丰实业总公司 | A kind of aircraft arranges the shell and watch core decomposer of warm table |
| CN111740725A (en) * | 2020-07-10 | 2020-10-02 | 重庆大学 | Electromagnetic pulse separation method |
| CN111740725B (en) * | 2020-07-10 | 2022-03-18 | 重庆大学 | Electromagnetic pulse separation method |
| CN111872038A (en) * | 2020-07-24 | 2020-11-03 | 重庆大学 | Equipment and method applied to electromagnetic pulse separation of waste PCB (printed Circuit Board) |
| CN111872038B (en) * | 2020-07-24 | 2021-09-10 | 重庆大学 | Equipment and method applied to electromagnetic pulse separation of waste PCB (printed Circuit Board) |
| CN112846434A (en) * | 2020-12-01 | 2021-05-28 | 国营芜湖机械厂 | Special decomposition device for landing gear terminal electric door mechanism and use method thereof |
| CN112496487B (en) * | 2021-02-05 | 2021-05-18 | 江西科技学院 | Recovery device for electrical components on waste circuit board |
| CN112496487A (en) * | 2021-02-05 | 2021-03-16 | 江西科技学院 | Recovery device for electrical components on waste circuit board |
| TWI747767B (en) * | 2021-03-15 | 2021-11-21 | 駿曦股份有限公司 | Automatic welding system and heating device |
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