CN209773032U - Chip disassembling device for waste printed circuit board - Google Patents
Chip disassembling device for waste printed circuit board Download PDFInfo
- Publication number
- CN209773032U CN209773032U CN201920073728.5U CN201920073728U CN209773032U CN 209773032 U CN209773032 U CN 209773032U CN 201920073728 U CN201920073728 U CN 201920073728U CN 209773032 U CN209773032 U CN 209773032U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- support
- tin
- support frame
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002699 waste material Substances 0.000 title abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 29
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 9
- 239000000155 melt Substances 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000013016 damping Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 11
- 230000002349 favourable effect Effects 0.000 abstract description 4
- 229910052718 tin Inorganic materials 0.000 description 21
- 238000005485 electric heating Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a waste printed circuit board disassembles chip device, including frame main part, control box and base, the frame main part comprises base, support frame and roof, the base with fixed welding has the support frame between the roof, and the support frame is equipped with two, the support frame comprises first backup pad and second backup pad, and the fixed welding has the support in side of second backup pad, the top welding of support one side has the connecting rod, and this kind of waste printed circuit board disassembles chip device melts the tin silk around the chip through adopting the method that the thermostat heats the tin melting lantern ring, has greatly reduced the damage to the chip in the PCB circuit board in the process of tearing open, and the tin silk is difficult to waste, can continue to collect, waits for reuse next time; through being equipped with mounting fixture, be favorable to fixing the circuit board in the circuit board fixed block for when the chip was absorb to the sucking disc, the PCB circuit board can not remove, has improved the stability of disassembling the in-process.
Description
Technical Field
The utility model relates to a waste electronic product disassembles technical field, specifically is a chip device is disassembled to useless printed circuit board.
Background
the printed circuit board is an important component of electronic and electrical products, with the continuous updating and upgrading of electronic products, at least tens of thousands tons of waste printed circuit boards are generated every year, and the waste printed circuit boards mainly comprise organic reinforced resin, glass fiber, copper foil and electronic components, contain a large amount of valuable metals (such as copper, iron, aluminum, tin and the like), and also contain precious metals (such as gold, silver, platinum, palladium and the like), and have high resource recovery value. However, the waste circuit board also contains various heavy metals such as lead, mercury, cadmium, chromium and the like, and toxic and harmful substances such as halide flame retardants and the like, and serious secondary pollution is caused to the environment due to improper treatment. Therefore, how to effectively realize the harmless recovery of the waste circuit board and realize the recycling of the waste circuit board has very important significance for reducing the environmental pressure, preventing the environmental pollution, improving the recycling rate of secondary resources and ensuring the sustainable development of economy, society and environment in China. However, in the traditional process of disassembling the waste printed circuit board chip, the tin wire on the PCB is usually erased by adopting an electric soldering iron, so that the tin wire is easily wasted, the chip is easily damaged, and great potential safety hazards are brought to the next use of the chip.
Therefore, how to design a device for disassembling a chip from a waste printed circuit board becomes a problem to be solved currently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip device is disassembled to useless printed circuit board to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a chip disassembling device for waste printed circuit boards comprises a frame main body, a control box, a base, a support frame, a top plate, a first support plate, a second support plate, a support, connecting rods, circuit board fixing blocks, a sucker, a moving rod, a handle, a temperature controller, a wire, a tin melting lantern ring, an electric heating wire, a switch, a rectangular groove, a fixing clamp, a limiting block, a damping block and a control knob, wherein the frame main body comprises the base, the support frame and the top plate, the two support frames are fixedly welded between the base and the top plate and comprise the first support plate and the second support plate, the support frame is fixedly welded on the side surface of the second support plate, the connecting rod is welded at the top end of one side of the support frame, the top end of the connecting rod is fixedly welded with the top plate, the connecting rod comprises two circuit boards, and the fixing, the top of circuit board fixed block is equipped with the sucking disc, the top of sucking disc is connected with the carriage release lever, just the carriage release lever run through set up in the roof, the handle is installed to the bottom of carriage release lever, the thermostat is installed at the top of base, install control knob on the thermostat, the thermostat is connected with through the wire and melts the tin lantern ring, just melt the tin lantern ring run through install in inside the circuit board fixed block, melt the internally mounted of tin lantern ring and have the heating wire, just the thermostat with control box electric connection, the control box fixed weld in the side of first backup pad, install the switch in the control box, just the switch with thermostat electric connection.
Furthermore, a rectangular groove is formed in the circuit board fixing block, and the PCB circuit board can be placed in the rectangular groove through the rectangular groove, so that the chip can be conveniently removed by a machine.
Further, install mounting fixture on the lateral wall of circuit board fixed block, just mounting fixture is equipped with two, through being equipped with mounting fixture, is favorable to fixing the circuit board in the circuit board fixed block for when the chip was absorb to the sucking disc, the PCB circuit board can not remove, has improved the stability of disassembling the in-process.
Further, be equipped with the stopper on the carriage release lever, through being equipped with the stopper, when carrying out the pulling of chip to the PCB circuit board, the stopper can play the effect that blocks the carriage release lever for the carriage release lever can not deviate the direction of pulling the chip, has improved the practicality.
furthermore, the handle is in a wave-shaped structural design, and the wave-shaped structure is matched with the structure of a hand, so that a worker can hold the handle conveniently, and the force in the chip pulling process is saved.
Furthermore, the bottom of heater is equipped with the snubber block, through being equipped with the snubber block, has avoided the heater during operation to the influence of device stability, has improved stability.
Furthermore, the left side and the right side of the tin melting lantern ring are internally provided with electric heating wires, and insulating layers are arranged on the left side and the right side of the electric heating wires.
Furthermore, the temperature controller is connected with an electric heating wire inside the tin melting lantern ring through a lead, and the current of the temperature controller is changed through the control knob, so that the temperature of the electric heating wire is changed, and the temperature controller belongs to the existing device.
Compared with the prior art, the beneficial effects of the utility model are that: according to the device for disassembling the chip of the waste printed circuit board, the tin wires around the chip are melted by adopting the method of heating the tin melting lantern ring by the temperature controller, so that the damage to the chip in the PCB in the disassembling process is greatly reduced, the tin wires are not easy to waste, and can be continuously collected to wait for the next reuse; through being equipped with mounting fixture, be favorable to fixing the circuit board in the circuit board fixed block for when the chip was absorb to the sucking disc, the PCB circuit board can not remove, has improved the stability of disassembling the in-process.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
Fig. 2 is a schematic structural view of the circuit board fixing block of the present invention;
Fig. 3 is a partial structural sectional view of the present invention;
Fig. 4 is a schematic view of a partial structure of the present invention.
In the figure: 1-a frame body; 2-a control box; 3-a base; 4-a support frame; 5-a top plate; 6-a first support plate; 7-a second support plate; 8-a scaffold; 9-a connecting rod; 10-a circuit board fixing block; 11-a suction cup; 12-a moving bar; 13-a handle; 14-a temperature controller; 15-a wire; 16-a molten tin collar; 17-electric heating wire; 18-a switch; 19-a rectangular groove; 20-fixing the clamp; 21-a limiting block; 22-a damper block; 23-control knob.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a chip device is disassembled to useless printed circuit board, includes frame main part 1, control box 2, base 3, support frame 4, roof 5, first backup pad 6, second backup pad 7, support 8, connecting rod 9, circuit board fixed block 10, sucking disc 11, carriage release lever 12, handle 13, thermostat 14, wire 15, melts tin lantern ring 16, heating wire 17, switch 18, rectangle recess 19, mounting fixture 20, stopper 21, snubber block 22 and control knob 23, frame main part 1 comprises base 3, support frame 4 and roof 5, fixed welding has support frame 4 between base 3 and the roof 5, and support frame 4 is equipped with two, support frame 4 comprises first backup pad 6 and second backup pad 7, and fixed welding has support 8 in the side of second backup pad 7, the welding of the top of one side of support 8 has connecting rod 9, the top of connecting rod 9 with roof 5 fixed welding, just connecting rod 9 has two, circuit board fixed block 10 is installed at the top of support 8, the top of circuit board fixed block 10 is equipped with sucking disc 11, the top of sucking disc 11 is connected with carriage release lever 12, just carriage release lever 12 runs through and sets up in roof 5, handle 13 is installed to the bottom of carriage release lever 12, thermostat 14 is installed at the top of base 3, install control knob 23 on thermostat 14, thermostat 14 is connected with the tin melting lantern ring 16 through wire 15, just the tin melting lantern ring 16 runs through install inside circuit board fixed block 10, the internally mounted of tin melting lantern ring 16 has heating wire 17, just thermostat 14 with control box 2 electric connection, control box 2 fixed welding in the side of first backup pad 6, install switch 18 in the control box 2, just switch 18 with 14 electric connection of thermostat, be equipped with rectangle recess 19 in the circuit board fixed block 10, install mounting fixture 20 on the lateral wall of circuit board fixed block 10, just mounting fixture 20 is equipped with two, be equipped with stopper 21 on the carriage release lever 12, the bottom of thermostat 14 is equipped with snubber block 22, the internally mounted of melting tin lantern ring 16 has the heating wire 17 left and right sides to install the insulating layer.
The working principle is as follows: firstly, turning on a switch 18, rotating a control knob 23, starting a temperature controller 14 to work, placing a PCB (printed Circuit Board) in a rectangular groove 19 of a circuit board fixing block 10, fixing the PCB by using a fixing clamp 20, placing a heating wire 17 on tin wires around a chip of the PCB, controlling the heating wire 17 to heat by using the temperature controller 14, driving a tin melting lantern ring 16 to heat, melting the tin wires around the chip, and finally, putting down a movable rod 12 by a worker, aligning a sucker 11 with the chip on the PCB, holding a handle 13, and slowly pulling the chip off the PCB so as to finish the whole process of disassembling the circuit board chip; through being equipped with mounting fixture 20, be favorable to fixing the circuit board in circuit board fixed block 10 for when sucking disc 11 absorbs the chip, the PCB circuit board can not remove, has improved the stability of disassembling the in-process.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a chip device is disassembled to useless printed circuit board, includes frame main part (1), control box (2), base (3), support frame (4), roof (5), first backup pad (6), second backup pad (7), support (8), connecting rod (9), circuit board fixed block (10), sucking disc (11), carriage release lever (12), handle (13), thermostat (14), wire (15), melt tin lantern ring (16), heating wire (17), switch (18), rectangle recess (19), mounting fixture (20), stopper (21), snubber block (22) and control knob (23), its characterized in that: the frame body (1) comprises a base (3), a support frame (4) and a top plate (5), the support frame (4) is fixedly welded between the base (3) and the top plate (5), the support frame (4) is provided with two support frames, the support frame (4) comprises a first support plate (6) and a second support plate (7), a support (8) is fixedly welded on the side surface of the second support plate (7), a connecting rod (9) is welded on the top end of one side of the support (8), the top end of the connecting rod (9) is fixedly welded with the top plate (5), the connecting rod (9) is provided with two connecting rods, a circuit board fixing block (10) is installed at the top of the support (8), a sucker (11) is arranged at the top of the circuit board fixing block (10), a moving rod (12) is connected on the top end of the sucker (11), and the moving rod (12) is penetratingly arranged in the top plate (5), handle (13) are installed to the bottom of carriage release lever (12), thermostat (14) are installed at the top of base (3), install control knob (23) on thermostat (14), thermostat (14) are connected with through wire (15) and melt the tin lantern ring (16), just melt the tin lantern ring (16) run through install in inside circuit board fixed block (10), the internally mounted who melts the tin lantern ring (16) has heating wire (17), just thermostat (14) with control box (2) electric connection, control box (2) fixed welding in the side of first backup pad (6), install switch (18) in control box (2), just switch (18) with thermostat (14) electric connection.
2. The apparatus for disassembling chips from used printed wiring boards according to claim 1, wherein: a rectangular groove (19) is formed in the circuit board fixing block (10).
3. The apparatus for disassembling chips from used printed wiring boards according to claim 1, wherein: and the side wall of the circuit board fixing block (10) is provided with two fixing clamps (20), and the number of the fixing clamps (20) is two.
4. The apparatus for disassembling chips from used printed wiring boards according to claim 1, wherein: the moving rod (12) is provided with a limiting block (21).
5. The apparatus for disassembling chips from used printed wiring boards according to claim 1, wherein: the handle (13) is designed in a wave-shaped structure.
6. The apparatus for disassembling chips from used printed wiring boards according to claim 1, wherein: and a damping block (22) is arranged at the bottom of the temperature controller (14).
7. The apparatus for disassembling chips from used printed wiring boards according to claim 1, wherein: insulating layers are arranged on the left side and the right side of the tin melting lantern ring (16) which is internally provided with heating wires (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920073728.5U CN209773032U (en) | 2019-01-17 | 2019-01-17 | Chip disassembling device for waste printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920073728.5U CN209773032U (en) | 2019-01-17 | 2019-01-17 | Chip disassembling device for waste printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209773032U true CN209773032U (en) | 2019-12-13 |
Family
ID=68792749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920073728.5U Expired - Fee Related CN209773032U (en) | 2019-01-17 | 2019-01-17 | Chip disassembling device for waste printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209773032U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112337944A (en) * | 2020-10-15 | 2021-02-09 | 马素琴 | Electrochromic glass recovery device separated by heating |
| CN112496487A (en) * | 2021-02-05 | 2021-03-16 | 江西科技学院 | Recovery device for electrical components on waste circuit board |
-
2019
- 2019-01-17 CN CN201920073728.5U patent/CN209773032U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112337944A (en) * | 2020-10-15 | 2021-02-09 | 马素琴 | Electrochromic glass recovery device separated by heating |
| CN112496487A (en) * | 2021-02-05 | 2021-03-16 | 江西科技学院 | Recovery device for electrical components on waste circuit board |
| CN112496487B (en) * | 2021-02-05 | 2021-05-18 | 江西科技学院 | Recovery device for electrical components on waste circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191213 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |