CN102492263B - Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof - Google Patents
Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof Download PDFInfo
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- CN102492263B CN102492263B CN201110358054.1A CN201110358054A CN102492263B CN 102492263 B CN102492263 B CN 102492263B CN 201110358054 A CN201110358054 A CN 201110358054A CN 102492263 B CN102492263 B CN 102492263B
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- epoxy
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- low temperature
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 58
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000000853 adhesive Substances 0.000 title abstract description 6
- 230000001070 adhesive effect Effects 0.000 title abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 239000003463 adsorbent Substances 0.000 claims abstract description 17
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims abstract description 15
- 239000006229 carbon black Substances 0.000 claims abstract description 15
- 239000004814 polyurethane Substances 0.000 claims abstract description 15
- 229920002635 polyurethane Polymers 0.000 claims abstract description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 239000013543 active substance Substances 0.000 claims description 17
- 239000011863 silicon-based powder Substances 0.000 claims description 17
- 229930185605 Bisphenol Natural products 0.000 claims description 14
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 10
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 7
- 150000005215 alkyl ethers Chemical class 0.000 claims description 7
- 239000000194 fatty acid Substances 0.000 claims description 7
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 claims description 6
- 229920001451 polypropylene glycol Polymers 0.000 claims description 6
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 8
- 238000011161 development Methods 0.000 abstract description 6
- 238000003860 storage Methods 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 238000001723 curing Methods 0.000 abstract 2
- 238000009776 industrial production Methods 0.000 abstract 1
- 238000013035 low temperature curing Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- 239000012745 toughening agent Substances 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 10
- 239000002253 acid Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002594 sorbent Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses an epoxy under-fill adhesive capable of quickly curing at a low temperature. The components are as follows in part by weight: 16 to 53 parts of bisphenol A epoxy modified polyurethane, 17 to 50 parts of bisphenol F epoxy resin, 5 to 30 parts of toughener, 2 to 9 parts of curing agent, 2 to 8 parts of silane coupling agent, 1 to 7 parts of carbon black, 1 to 3 parts of ion adsorbent, 1 to 3 parts of surfactant, and 0 to 14 parts of silica micro powder. The invention further discloses a preparation method for the epoxy under-fill adhesive. The product is liquid single-component epoxy under-fill adhesive with the excellent performances such as small viscosity, easy flowing filling, quick low-temperature curing, good stability, a long storage period and the like; moreover, the preparation operation is simple, so that the epoxy under-fill adhesive is suitable for a large-scale industrial production, thus the imperious demands for a flip-chip technology are well satisfied with the benefit of prompting and pushing the development of the electronic information industry.
Description
Technical field
The present invention relates to electronic device chip encapsulation technology field, relate in particular to a kind of liquid single-component epoxy underfill and preparation method thereof.
Background technology
Along with improving constantly of electron device integrated level, chip area constantly enlarges, and integrated circuit pinnumber also is on the increase, so the Chip Packaging size needs further microminiaturized.For adapting to this development trend, many new encapsulation technologies have appearred at present, flip-chip is one of topmost encapsulation technology wherein.So-called flip chip technology (fct), refer to chip is faced down, the salient point of its conduction directly is connected and by being welded to connect firmly with substrate wiring layer circuit as chip electrode, thereby avoided unnecessary packaging process, but there is the little high frequency operation of size, low ghost effect and high I/O density, also there is higher packaging density, shorter interconnected distance, better electrical property and higher reliability simultaneously, thereby be widely used in the popular electric consumers such as mobile phone, pager, MP3 player and digital camera.
Liquid single-component epoxy underfill is a kind of material that is applicable to the flip-chip circuit, is single-component liquid encapsulation material before uncured at normal temperatures, and main component is epoxy resin.Bottom is filled and is referred to by liquid epoxies being filled in the slit between IC chip and organic substrate; and the connection welding seal protection is got up; whole crystal grain and substrate are adhered to each other or at least along whole crystal grain edge filling, form a whole composite system; not only can effectively improve the physical strength of solder joint; extend the work-ing life of chip; can reduce the thermal stresses that applies contact simultaneously; the thermal expansivity of whole composite system between the thermal expansivity of crystal grain and substrate, thereby can improve the reliability of product.
Fill bottom is mainly to flow to realize by capillarity,, after the connection of element completes, liquid macromolecule glue material point is annotated to two edges that the Jingjing grain is monolateral or be connected together that cover in assembling.Because the gap between chip and substrate is very little, thereby require the viscosity of Embedding Material very low.After last one glue completes, the Embedding Material of in baking box, bottom being filled is cured, and solidification value need be lower than the fusing point of scolder.
At present, highly integrated along with semiconductor assembling, that the size of flip-chip constantly becomes is large, the tin nodule number amount on the ball grid array structure printed circuit board (PCB) also is being on the increase, gap between the tin ball and thickness become more and more less, the epoxy glue material of filling as bottom requires to have large-area mobility in little gap, also requires epoxy underfill material must have lower viscosity.Simultaneously, because the gap between the tin ball becomes more and more less, it is more complicated that the flowing-path of underfill material also becomes, so colloidal materials easily produces cavity in solidification process, and the reliability of the generation in cavity semiconductor device can greatly affect flip-chip and install the time.For this reason, need to be after completing filling, by the low temperature fast setting effectively to reduce empty generation.
In addition, thicker printed circuit board has bend resistance and heat-resisting cycle performance preferably; Otherwise the counter-bending and resistance toheat of thinner printed circuit board is poor, therefore, adopting the bottom filling technique is also to improve the necessary means of above performance.
In recent years, China's Electronic Development of Information Industry is swift and violent, but the epoxy packages material is started late, research and comparison is few, liquid epoxy underfill material for flip-chip is all the more so, its quality of prior art products and performance are difficult to adapt to and meet the needs of application, inevitably the development of industry have been produced to great impact and restriction.Therefore, research and development have high performance epoxy underfill material, have extremely important using value, are also that pendulum is badly in need of the problem solved in face of us.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, but provide the liquid single-component epoxy underfill of a kind of low temperature fast setting, excellent performance, to meet the active demand of flip chip technology (fct), thereby be conducive to promote and promote the development of electronic information industry.Another object of the present invention is to provide the preparation method of above-mentioned epoxy underfill.
Purpose of the present invention is achieved by the following technical programs:
But the quick-setting epoxy underfill of a kind of low temperature provided by the invention, its raw material consists of by weight: bisphenol type epoxy modified polyurethane 16-53 part, bisphenol F epoxy resin 17-50 part, toughner 5-30 part, solidifying agent 2-9 part, silane coupling agent 2-8 part, carbon black 1-7 part, ion adsorbent 1-3 part, tensio-active agent 1-3 part, silicon powder 0-14 part.Preferably, raw material consists of: bisphenol type epoxy modified polyurethane 16-53 part, bisphenol F epoxy resin 17-46 part, toughner 5-30 part, solidifying agent 3-9 part, silane coupling agent 3-8 part, carbon black 1-7 part, ion adsorbent 1-3 part, tensio-active agent 1-3 part, silicon powder 2-14 part.
Further, the epoxy equivalent (weight) of epoxy resin of the present invention is advisable with 50-250g/mol.Described toughner is the one or more combination in polypropylene glycol diglycidyl ether, diglycidylether, hexanodioic acid glycidyl ether, glycerin triglycidyl ether, to increase resistance to sudden heating and to reduce semi-conductive internal stress.For solving problem conflicting between low temperature fast setting and stability in storage, described solidifying agent is latent curing agent, to extend the shelf lives of product.
The present invention uses ion adsorbent free halide-ions can be adsorbed to fall, thereby improves the reliability of product, and its particle diameter of described ion adsorbent is advisable with the 0.2-3.0 micron.Use tensio-active agent can reduce when underfill is shaped and produce the probability in space, and strengthen adhesive power by the wettability of improving bur, described tensio-active agent can be a kind of or its combination in polyethylene oxide alkyl ethers, sorbitan-fatty acid ester.
In such scheme, silicon powder of the present invention is the ball-type silicon powder, and its particle diameter is the 0.5-1.5 micron.
Another object of the present invention is achieved by the following technical programs:
The preparation method of above-mentioned epoxy underfill provided by the invention comprises the following steps:
(a) bisphenol type epoxy modified polyurethane, bisphenol F epoxy resin are mixed with carbon black;
(b) after adding solidifying agent to mix, vacuumize 30-60min in reactor;
(c) add silane coupling agent, toughner, ion adsorbent, tensio-active agent to mix, vacuumize 30-60min and obtain product.
Further, bisphenol type epoxy modified polyurethane, bisphenol F epoxy resin and after carbon black mixes in the described step of the inventive method (a), add silicon powder to be mixed; The consumption of silicon powder is 2-14 part by weight.
The present invention has following beneficial effect:
Liquid single-component epoxy underfill product viscosity of the present invention is little, is easy to flow fill; But the low temperature fast setting, good stability, the shelf lives is long; Linear expansivity is low, good heat resistance; And there is good vibration resistance, there is reliable provide protection for falling of chip and thermal shocking.Excellent product performance of the present invention, and preparation manipulation is easy, is suitable for industrialization production in enormous quantities, has met well the active demand of flip chip technology (fct), is conducive to promote and promote the development of electronic information industry.
Below in conjunction with embodiment, the present invention is described in further detail.
Embodiment
In the specific embodiment of the invention, the epoxy equivalent (weight) of epoxy resin is 50-250g/mol.Solidifying agent is latent curing agent PN-23.One or more combination in the KH-560 of the A-187 that silane coupling agent is U.S.'s union carbide corporation, the KBM-403 of Japanese Shin-Etsu Chemial Co., Ltd, the Chinese Academy of Sciences.Ion adsorbent adopts the sorbent material of the commodity IXE-500 by name produced by Toagosei Co., Ltd.Specific embodiment is as follows:
Embodiment mono-:
But 1, the quick-setting epoxy underfill of the present embodiment low temperature, its raw material consists of by weight:
2, the preparation method of the present embodiment epoxy underfill is as follows:
(a) bisphenol type epoxy modified polyurethane, bisphenol F epoxy resin are mixed with carbon black; Then add silicon powder to mix;
(b) after adding solidifying agent to mix in reactor, vacuum tightness is-0.1Mpa, vacuumizes 30min;
(c) add A-187, polypropylene glycol diglycidyl ether, ion adsorbent, polyethylene oxide alkyl ethers to mix, vacuum tightness is-0.1Mpa, vacuumizes 30min, obtains product.
Embodiment bis-:
But 1, the quick-setting epoxy underfill of the present embodiment low temperature, its raw material consists of by weight:
2, the preparation method of the present embodiment epoxy underfill is as follows:
(a) bisphenol type epoxy modified polyurethane, bisphenol F epoxy resin are mixed with carbon black; Then add silicon powder to mix;
(b) after adding solidifying agent to mix in reactor, vacuum tightness is-0.1Mpa, vacuumizes 60min;
(c) add KBM-403, diglycidylether, ion adsorbent, sorbitan-fatty acid ester to mix, vacuum tightness is-0.1Mpa, vacuumizes 60min, obtains product.
Embodiment tri-:
But 1, the quick-setting epoxy underfill of the present embodiment low temperature, its raw material consists of by weight:
Wherein, tensio-active agent is by weight polyethylene oxide alkyl ethers: the combination of sorbitan-fatty acid ester=1: 1.
2, the preparation method of the present embodiment epoxy underfill is as follows:
(a) bisphenol type epoxy modified polyurethane, bisphenol F epoxy resin are mixed with carbon black; Then add silicon powder to mix;
(b) after adding solidifying agent to mix in reactor, vacuum tightness is-0.1Mpa, vacuumizes 50min;
(c) add KH-560, hexanodioic acid glycidyl ether, ion adsorbent, tensio-active agent to mix, vacuum tightness is-0.1Mpa, vacuumizes 50min, obtains product.
Embodiment tetra-:
But 1, the quick-setting epoxy underfill of the present embodiment low temperature, its raw material consists of by weight:
Wherein, toughner is by weight polypropylene glycol diglycidyl ether: diglycidylether: hexanodioic acid glycidyl ether: glycerin triglycidyl ether=1: 1: 1: 1 combination.Silane coupling agent is by weight A-187: KBM-403: KH-560=1: the combination of 1: 1.Tensio-active agent is by weight polyethylene oxide alkyl ethers: the combination of sorbitan-fatty acid ester=1: 1.
2, the preparation method of the present embodiment epoxy underfill is as follows:
(a) bisphenol type epoxy modified polyurethane, bisphenol F epoxy resin are mixed with carbon black; Then add silicon powder to mix;
(b) after adding solidifying agent to mix in reactor, vacuum tightness is-0.1Mpa, vacuumizes 40min;
(c) add silane coupling agent, toughner, ion adsorbent, tensio-active agent to mix, vacuum tightness is-0.1Mpa, vacuumizes 40min, obtains product.
Embodiment five:
But 1, the quick-setting epoxy underfill of the present embodiment low temperature, its raw material consists of by weight:
Wherein, toughner is by weight polypropylene glycol diglycidyl ether: diglycidylether: hexanodioic acid glycidyl ether: glycerin triglycidyl ether=1: 1: 1: 1 combination.Silane coupling agent is by weight A-187: KBM-403: KH-560=1: the combination of 2: 2.Tensio-active agent is by weight polyethylene oxide alkyl ethers: the combination of sorbitan-fatty acid ester=2: 1.
2, the preparation method of the present embodiment epoxy underfill is as follows:
(a) bisphenol type epoxy modified polyurethane, bisphenol F epoxy resin are mixed with carbon black; Then add silicon powder to mix;
(b) after adding solidifying agent to mix in reactor, vacuum tightness is-0.1Mpa, vacuumizes 30min;
(c) add silane coupling agent, toughner, ion adsorbent, tensio-active agent to mix, vacuum tightness is-0.1Mpa, vacuumizes 30min, obtains product.
Embodiment six:
But 1, the quick-setting epoxy underfill of the present embodiment low temperature, its raw material consists of by weight:
Wherein, toughner is by weight polypropylene glycol diglycidyl ether: diglycidylether: hexanodioic acid glycidyl ether: glycerin triglycidyl ether=2: 1: 1: 1 combination.Silane coupling agent is by weight A-187: KBM-403: KH-560=3: the combination of 2: 1.Tensio-active agent is by weight polyethylene oxide alkyl ethers: the combination of sorbitan-fatty acid ester=2: 1.
2, the preparation method of the present embodiment epoxy underfill is as follows:
(a) bisphenol type epoxy modified polyurethane, bisphenol F epoxy resin are mixed with carbon black;
(b) after adding solidifying agent to mix in reactor, vacuum tightness is-0.1Mpa, vacuumizes 45min;
(c) add silane coupling agent, toughner, ion adsorbent, tensio-active agent to mix, vacuum tightness is-0.1Mpa, vacuumizes 45min, obtains product.
Embodiment of the present invention product is liquid single-component epoxy underfill, and its performance index are as shown in table 1.
The performance index of table 1 embodiment mono-～six liquid single-component epoxy underfill
Claims (8)
1. but the quick-setting epoxy underfill of low temperature, is characterized in that its raw material consists of by weight: bisphenol type epoxy modified polyurethane 16-53 part, bisphenol F epoxy resin 17-50 part, toughner 5-30 part, solidifying agent 2-9 part, silane coupling agent 2-8 part, carbon black 1-7 part, ion adsorbent 1-3 part, tensio-active agent 1-3 part, silicon powder 0-14 part; Wherein, described toughner is the one or more combination in polypropylene glycol diglycidyl ether, diglycidylether, glycerin triglycidyl ether; Described tensio-active agent is a kind of of polyethylene oxide alkyl ethers, sorbitan-fatty acid ester or its combination.
2. but the quick-setting epoxy underfill of low temperature according to claim 1, is characterized in that its raw material consists of by weight: bisphenol type epoxy modified polyurethane 16-53 part, bisphenol F epoxy resin 17-46 part, toughner 5-30 part, solidifying agent 3-9 part, silane coupling agent 3-8 part, carbon black 1-7 part, ion adsorbent 1-3 part, tensio-active agent 1-3 part, silicon powder 2-14 part.
3. but the quick-setting epoxy underfill of low temperature according to claim 1 and 2, it is characterized in that: the epoxy equivalent (weight) of described epoxy resin is 50-250g/mol.
4. but the quick-setting epoxy underfill of low temperature according to claim 1 and 2, it is characterized in that: described solidifying agent is latent curing agent.
5. but the quick-setting epoxy underfill of low temperature according to claim 1 and 2, it is characterized in that: its particle diameter of described ion adsorbent is the 0.2-3.0 micron.
But 6. the quick-setting epoxy underfill of low temperature according to claim 1 and 2, it is characterized in that: described silicon powder is the ball-type silicon powder, its particle diameter is the 0.5-1.5 micron.
7. the preparation method of the described epoxy underfill of claim 1 is characterized in that comprising the following steps:
(a) bisphenol type epoxy modified polyurethane, bisphenol F epoxy resin are mixed with carbon black;
(b) after adding solidifying agent to mix, vacuumize 30-60min in reactor;
(c) add silane coupling agent, toughner, ion adsorbent, tensio-active agent to mix, vacuumize 30-60min and obtain product.
8. the preparation method of epoxy underfill according to claim 7 is characterized in that: bisphenol type epoxy modified polyurethane, bisphenol F epoxy resin and after carbon black mixes in described step (a) add silicon powder to be mixed; The consumption of described silicon powder is 2-14 part by weight.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110358054.1A CN102492263B (en) | 2011-11-12 | 2011-11-12 | Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110358054.1A CN102492263B (en) | 2011-11-12 | 2011-11-12 | Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof |
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| CN104130378B (en) * | 2014-08-13 | 2016-04-27 | 山东一诺威聚氨酯股份有限公司 | Silane-modified dual-component polyurethane court plastic sizing agent and preparation method thereof |
| CN112679688B (en) * | 2020-12-28 | 2022-03-22 | 上海东大聚氨酯有限公司 | Low-heat-release quick-release combined polyether, B1-grade flame-retardant polyurethane block foam derived from combined polyether and preparation method of block foam |
| CN112812726A (en) * | 2021-01-07 | 2021-05-18 | 东莞市新懿电子材料技术有限公司 | Solid filling adhesive for large-size chip bottom filling and preparation method thereof |
| CN113088230A (en) * | 2021-05-12 | 2021-07-09 | 东莞精旺电子有限公司 | Underfill adhesive and preparation process and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101864147A (en) * | 2010-06-28 | 2010-10-20 | 深圳市库泰克电子材料技术有限公司 | Underfill with low viscosity and low linear expansion coefficient |
| CN101880514A (en) * | 2010-06-28 | 2010-11-10 | 深圳市库泰克电子材料技术有限公司 | Single-component under-filler with favorable repairing property and preparation method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101864147A (en) * | 2010-06-28 | 2010-10-20 | 深圳市库泰克电子材料技术有限公司 | Underfill with low viscosity and low linear expansion coefficient |
| CN101880514A (en) * | 2010-06-28 | 2010-11-10 | 深圳市库泰克电子材料技术有限公司 | Single-component under-filler with favorable repairing property and preparation method thereof |
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