CN102492135A - Method for synthesizing dimer acid type polyamide hot melt adhesive - Google Patents

Method for synthesizing dimer acid type polyamide hot melt adhesive Download PDF

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Publication number
CN102492135A
CN102492135A CN2011103905416A CN201110390541A CN102492135A CN 102492135 A CN102492135 A CN 102492135A CN 2011103905416 A CN2011103905416 A CN 2011103905416A CN 201110390541 A CN201110390541 A CN 201110390541A CN 102492135 A CN102492135 A CN 102492135A
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CN
China
Prior art keywords
acid
dimeracid
pressure
hot melt
melt adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011103905416A
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Chinese (zh)
Inventor
李哲龙
朱万育
施才财
曾作祥
韩涛
陶思玉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN TIANYANG HOT MELT ADHESIVE CO LTD
Shanghai Tianyang Hotmelt Adhesives Co ltd
East China University of Science and Technology
Original Assignee
KUNSHAN TIANYANG HOT MELT ADHESIVE CO LTD
Shanghai Tianyang Hotmelt Adhesives Co ltd
East China University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN TIANYANG HOT MELT ADHESIVE CO LTD, Shanghai Tianyang Hotmelt Adhesives Co ltd, East China University of Science and Technology filed Critical KUNSHAN TIANYANG HOT MELT ADHESIVE CO LTD
Priority to CN2011103905416A priority Critical patent/CN102492135A/en
Publication of CN102492135A publication Critical patent/CN102492135A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a method for synthesizing a dimer acid type polyamide hot melt adhesive. The polyamide hot melt adhesive is prepared by adding a catalyst, an aqueous solution of alcohol and an aid into monomers of dimer acid, aliphatic dicarboxylic acid and aliphatic diamine which are taken as reaction raw materials and performing condensation reaction. The method is easy to operate, the loss of amine in the reaction process is low, and the chemical equivalent can be controlled easily, so that the reaction is more complete, and finally a product with stable high molecular weight can be obtained; meanwhile, the deviation among different batches of products can also be improved, so that the product can be stably produced.

Description

A kind of compound method of dimeric acid type polyamide hot melt adhesive
Technical field
The present invention relates to a kind of compound method of dimeric acid type polyamide hot melt adhesive, be particularly suitable for preparing the dimeric acid type polyamide hot melt adhesive of high level of response.
Background technology
Dimeric acid type polyamide hot melt adhesive is a kind ofly to be produced through polycondensation by dimerization unsaturated aliphatic or the substituted dimerization unsaturated fatty acids of part and aliphatic diamine.
Chinese patent CN1357589A discloses a kind of with the substituted dimeracid of part and diamine synthetic component A under the condition of properties-correcting agent and catalyzer existence; With the advanced prepolymerization of properties-correcting agent such as hexanolactam, then with other diprotic acid and diamine synthetic B component under condition of high voltage, at last component A and B component are mixed by a certain percentage.
Chinese patent CN1415686A discloses and a kind of aliphatic diamine has been configured to the aqueous solution, with the binary aliphatic acid-respons, finally generate polyamide hot.
Chinese patent CN1763146A discloses a kind of method with aliphatic dibasic acid and diamine synthesizing polyamides.
The preparation method of the polyamide hot that above-mentioned and so on patent the is mentioned part that all comes with some shortcomings; Patent CN1357589A needs synthetic respectively component A and B; And then carry out blend, it is comparatively complicated to play synthesis technique, causes the difference between the product batches bigger; Patent CN1415686A uses the aqueous solution of amine as reaction raw materials, causes like this limiting to some extent reacting employed raw material, because dimeracid is relatively poor with the consistency of water, so this method is not suitable for and the synthesizing of dimeric acid type polyamide hot melt adhesive; Patent CN1763145A together drops into all reaction raw materials (diprotic acid and diamine) in the reaction kettle in advance and synthesizes; Like this when using more lower boiling diamine synthetic; To cause part amine owing to volatilization is lost; The final ratio that influences acid amide, inapplicable for the polyamide hot of the high level of response of preparation.
Summary of the invention
A kind of compound method of dimeric acid type polyamide hot melt adhesive; It is characterized in that with dimeracid, aliphaticdicarboxylic acid and aliphatic diamine be raw material; Through adding catalyzer, solvent, oxidation inhibitor and molecular weight regulator, generate dimeric acid type polyamide hot melt adhesive through polycondensation; Said dimeracid is C 18Unsaturated fatty acids deutero-dimeracid is selected from a kind of in linolic acid, oleic acid, oleum lini, behenic acid and the eleostearic acid deutero-dimeracid, dimeric content>=80wt% in the said dimeracid;
Said aliphaticdicarboxylic acid is to be selected from Succinic Acid, hexanodioic acid, sebacic acid, dodecanedioic acid and the tetradecane diacid more than one; Said aliphatic dicarboxylic amine is selected from more than one in quadrol, hexanediamine, decamethylene diamine, 12 diamines;
The mol ratio of said dimeracid and aliphaticdicarboxylic acid is 1: 0~0.2
The mol ratio of said dimeracid and aliphatic diamine is 0.95~1.05: 1.
Said solvent is that the mass concentration of alcohol is 20~50% the aqueous solution, and described alcohol is selected from a kind of in methyl alcohol, ethanol and the Virahol, and the quality of said solvent accounts for 30~70% of total reactant quality.
Said molecular weight regulator is that Triple Pressed Stearic Acid, said oxidation inhibitor are antioxidant 1010.
Said reaction conditions is that temperature of charge in the reactor drum is appreciated 160~260 ℃; Pressure is 1.0~2.0MPa, remains under this temperature, pressure condition to begin decompression behind the reaction 1h, in 1~3h the pressure in the reactor drum is reduced to normal pressure; Then in normal pressure logical nitrogen protection continuation reaction 1h, discharging.
Advantage of the present invention
The method of the invention is simple to operate, in the reaction process loss of amine little; Chemical equivalent is controlled easily, makes that reaction is more thorough, and that finally can cross arrives the HMW stable product; Simultaneously can also improve the deviation between the different batches product, make products production stable.
Embodiment
Following embodiment is used to further specify the present invention, but these embodiment can not be used to limit protection scope of the present invention.
Embodiment 1
In the high-pressure reactor of 2000ml, drop into dimeracid (Britain standing grain major company, Pripol1006) 678 grams, hexanediamine 139.6g, 20% aqueous ethanolic solution 250g; 1010 oxidation inhibitor 0.9g and Triple Pressed Stearic Acid 2.0g are warming up to 250 ℃, along with the rising of temperature in 2.0h; When the pressure in the reactor drum reaches 1.0MPa, keep reaction 1h, in 2h, the pressure of reactor drum reduced to normal pressure then, keep normal pressure 1h again after; To 0.2MPa, discharging gets product P 1 through nitrogen pressure
Embodiment 2
In the high-pressure reactor of 2000ml, drop into dimeracid (Britain standing grain major company, Pripol1006) 649.8 grams, sebacic acid 10.1g, hexanediamine 139.6g; 33% aqueous ethanolic solution 300g, 1010 oxidation inhibitor 0.3g and Triple Pressed Stearic Acid 1.5g are warming up to 250 ℃ in 2.5h; When the pressure in the reactor drum reaches 1.5MPa, keep reaction 1h, in 2h, the pressure of reactor drum reduced to normal pressure then, keep normal pressure 1h again after; To 0.2MPa, discharging gets product P 2 through nitrogen pressure
Embodiment 3
In the high-pressure reactor of 2000ml, drop into dimeracid (Britain standing grain major company, Pripol1006) 628.2 grams, hexanodioic acid 7.8g hexanediamine 139.6g, water 200g; Alcohol mixeding liquid 100g, 1010 oxidation inhibitor 0.3g and Triple Pressed Stearic Acid 2.0g are warming up to 250 ℃ in 3.0h; When the pressure in the reactor drum reaches 1.8MPa, keep reaction 1h, in 3h, the pressure of reactor drum reduced to normal pressure then, keep normal pressure 1h again after; To 0.2MPa, discharging gets product P 3 through nitrogen pressure
Embodiment 4
In the high-pressure reactor of 2000ml, drop into dimeracid (Britain standing grain major company, Pripol1006) 597.2 grams, hexanediamine 69.8g, decamethylene diamine 108.6g; Water 200g, alcohol mixeding liquid 100g, 1010 oxidation inhibitor 0.3g and Triple Pressed Stearic Acid 2.0g are warming up to 250 ℃ in 2.5h; When the pressure in the reactor drum reaches 2.0MPa, keep reaction 1h, in 2.5h, the pressure of reactor drum reduced to normal pressure then, keep normal pressure 1h again after; To 0.2MPa, discharging gets product P 4 through nitrogen pressure
Embodiment 5
In the high-pressure reactor of 2000ml, drop into dimeracid (Britain standing grain major company, Pripol1006) 565 grams, sebacic acid 40.4g, hexanediamine 139.6g; Water 200g, ethanol 100g, 1010 oxidation inhibitor 1.0g and Triple Pressed Stearic Acid 3.0g are warming up to 250 ℃ in 2.7h; When the pressure in the reactor drum reaches 2.0MPa, keep reaction 1h, in 3h, the pressure of reactor drum reduced to normal pressure then, keep normal pressure 1h again after; To 0.2MPa, discharging gets product P 5 through nitrogen pressure
Embodiment 6
In the high-pressure reactor of 2000ml, drop into dimeracid (Britain standing grain major company, Pripol1006) 649.8 grams, sebacic acid 10.1g, hexanediamine 132.47g; Water 200g, ethanol 100g, 1010 oxidation inhibitor 0.7g and Triple Pressed Stearic Acid 1.8g are warming up to 250 ℃ in 2.0h; When the pressure in the reactor drum reaches 1.5MPa, keep reaction 1h, in 2h, the pressure of reactor drum reduced to normal pressure then,, keep normal pressure 1h again after; To 0.2MPa, discharging gets product P 6 through nitrogen pressure
According to CNS GB/T2895-1982, GB/T15332-1994 and DIN DIN16945 acid number, softening temperature and the amine value of above-mentioned sample are tested respectively, the result is referring to table 1.
Table 1 embodiment 1~6 products obtained therefrom The performance test results

Claims (3)

1. the compound method of a dimeric acid type polyamide hot melt adhesive; It is characterized in that with dimeracid, aliphaticdicarboxylic acid and aliphatic diamine be raw material; Through adding catalyzer, solvent, oxidation inhibitor and molecular weight regulator, generate dimeric acid type polyamide hot melt adhesive through polycondensation; Said dimeracid is C 18Unsaturated fatty acids deutero-dimeracid is selected from a kind of in linolic acid, oleic acid, oleum lini, behenic acid and the eleostearic acid deutero-dimeracid; Said aliphaticdicarboxylic acid is selected from more than one in Succinic Acid, hexanodioic acid, sebacic acid, dodecanedioic acid and the tetradecane diacid; Said aliphatic dicarboxylic amine is selected from more than one in quadrol, hexanediamine, decamethylene diamine, 12 diamines;
The mol ratio of said dimeracid and aliphaticdicarboxylic acid is: 1: 0~0.2;
The mol ratio of said dimeracid and aliphatic diamine is: 0.95~1.05: 1;
Said molecular weight regulator is a Triple Pressed Stearic Acid, and said oxidation inhibitor is antioxidant 1010.
2. according to the said method of claim 1, it is characterized in that said solvent is that the mass concentration of alcohol is 20~50% the aqueous solution, described alcohol is selected from a kind of in methyl alcohol, ethanol and the Virahol, and the quality of said solvent accounts for 30~70% of total reactant quality.
3. according to the said method of claim 1; It is characterized in that said reaction conditions does, temperature of charge in the reactor drum appreciated 160~260 ℃ that pressure is 1.0~2.0MPa; Remain under this temperature, pressure condition and begin decompression behind the reaction 1h; In 1~3h the pressure in the reactor drum is reduced to normal pressure, then in normal pressure logical nitrogen protection continuation reaction 1h, discharging.
CN2011103905416A 2011-11-30 2011-11-30 Method for synthesizing dimer acid type polyamide hot melt adhesive Pending CN102492135A (en)

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102731776A (en) * 2012-07-20 2012-10-17 山东广垠新材料有限公司 Synthesis process for nylon 614
CN103113843A (en) * 2013-02-20 2013-05-22 江苏永林油脂化工有限公司 Preparation method of low-acid-value low-viscosity dimer acid type polyamide hot melt adhesive
CN103450470A (en) * 2013-08-28 2013-12-18 上海天洋热熔胶有限公司 Preparation method of dimer acid polyamide hot melt adhesive with high elongation
CN103484053A (en) * 2013-10-16 2014-01-01 上海天洋热熔胶有限公司 Preparation method of hot-melt adhesive for conductive fabrics
CN103555263A (en) * 2013-10-30 2014-02-05 安庆市虹泰新材料有限责任公司 Method for preparing dimer acid type copolymerized polyamide hot melt adhesive
CN106433549A (en) * 2016-09-21 2017-02-22 东莞市舜天实业有限公司 Polyamide colloidal particles
CN107418503A (en) * 2017-08-24 2017-12-01 安徽省鸿鑫生物科技有限公司 A kind of vehicle glass pad pasting light solidifying hot-melt adhesive and preparation method thereof
CN107556965A (en) * 2017-09-20 2018-01-09 华特粘接材料股份有限公司 High temperature resistant copolyamide PUR and processing method for footwear material
CN109880532A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of dimeric dibasic acid and its preparation method and application
CN109880529A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of tung oil based dimeric acid and its synthetic method
CN109879744A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of dimeric dibasic acid and preparation method thereof
CN109880530A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of dimer (fatty acid) yl and its synthetic method
CN109879745A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of dimeric dibasic acid and its synthetic method
CN109880531A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of dimer (fatty acid) yl and preparation method thereof

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CN101928544A (en) * 2010-09-21 2010-12-29 烟台德邦电子材料有限公司 Polyamide hot cement with high softening point and low-temperature resistance, and preparing method thereof
CN101962526A (en) * 2010-09-30 2011-02-02 烟台德邦电子材料有限公司 Low-viscosity dimer acid type polyamine hot melt adhesive and preparation method thereof
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US2840264A (en) * 1957-10-08 1958-06-24 American Can Co Polyamide resin composition and method of preparing same
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CN1302826A (en) * 2000-01-05 2001-07-11 中国石油化工集团公司 Process for synthesizing dimer acid type polyamide resin
CN1357589A (en) * 2000-12-12 2002-07-10 梁子材 Multi-purpose polyamide hot melt adhesive and its prepn
US20060111502A1 (en) * 2004-10-18 2006-05-25 Groeneveld Daan Y Teak deck caulking
WO2008067974A2 (en) * 2006-12-04 2008-06-12 Byk-Chemie Gmbh Antifoaming agent for aqueous media
CN101016378A (en) * 2007-02-12 2007-08-15 南京工业大学 Production process of novel dimer acid amide nylon
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CN101705073A (en) * 2009-11-13 2010-05-12 上海天洋热熔胶有限公司 Soybean oil-based dimeric acid type polyamide hot melt adhesive and preparation method thereof
CN101928544A (en) * 2010-09-21 2010-12-29 烟台德邦电子材料有限公司 Polyamide hot cement with high softening point and low-temperature resistance, and preparing method thereof
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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102731776A (en) * 2012-07-20 2012-10-17 山东广垠新材料有限公司 Synthesis process for nylon 614
CN103113843A (en) * 2013-02-20 2013-05-22 江苏永林油脂化工有限公司 Preparation method of low-acid-value low-viscosity dimer acid type polyamide hot melt adhesive
CN103450470A (en) * 2013-08-28 2013-12-18 上海天洋热熔胶有限公司 Preparation method of dimer acid polyamide hot melt adhesive with high elongation
CN103450470B (en) * 2013-08-28 2015-12-02 上海天洋热熔粘接材料股份有限公司 A kind of preparation method with the dimeric acid type polyamide hot melt adhesive of high-elongation
CN103484053A (en) * 2013-10-16 2014-01-01 上海天洋热熔胶有限公司 Preparation method of hot-melt adhesive for conductive fabrics
CN103555263A (en) * 2013-10-30 2014-02-05 安庆市虹泰新材料有限责任公司 Method for preparing dimer acid type copolymerized polyamide hot melt adhesive
CN106433549A (en) * 2016-09-21 2017-02-22 东莞市舜天实业有限公司 Polyamide colloidal particles
CN107418503A (en) * 2017-08-24 2017-12-01 安徽省鸿鑫生物科技有限公司 A kind of vehicle glass pad pasting light solidifying hot-melt adhesive and preparation method thereof
CN107556965A (en) * 2017-09-20 2018-01-09 华特粘接材料股份有限公司 High temperature resistant copolyamide PUR and processing method for footwear material
CN109880532A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of dimeric dibasic acid and its preparation method and application
CN109880529A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of tung oil based dimeric acid and its synthetic method
CN109879744A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of dimeric dibasic acid and preparation method thereof
CN109880530A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of dimer (fatty acid) yl and its synthetic method
CN109879745A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of dimeric dibasic acid and its synthetic method
CN109880531A (en) * 2017-12-06 2019-06-14 中国石油化工股份有限公司 A kind of dimer (fatty acid) yl and preparation method thereof
CN109880532B (en) * 2017-12-06 2021-11-09 中国石油化工股份有限公司 Dimer acid and preparation method and application thereof
CN109880529B (en) * 2017-12-06 2021-12-07 中国石油化工股份有限公司 Tung oil based dimer acid and synthesis method thereof

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Application publication date: 20120613