CN101126007A - Polyamide thermosol for clothing and preparation method thereof - Google Patents
Polyamide thermosol for clothing and preparation method thereof Download PDFInfo
- Publication number
- CN101126007A CN101126007A CNA2007100432378A CN200710043237A CN101126007A CN 101126007 A CN101126007 A CN 101126007A CN A2007100432378 A CNA2007100432378 A CN A2007100432378A CN 200710043237 A CN200710043237 A CN 200710043237A CN 101126007 A CN101126007 A CN 101126007A
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- acid
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- clothing
- polyamide
- diamine
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- Adhesives Or Adhesive Processes (AREA)
- Polyamides (AREA)
Abstract
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Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2007100432378A CN100439467C (en) | 2007-06-29 | 2007-06-29 | Polyamide thermosol for clothing and preparation method thereof |
Applications Claiming Priority (1)
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CNB2007100432378A CN100439467C (en) | 2007-06-29 | 2007-06-29 | Polyamide thermosol for clothing and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
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CN101126007A true CN101126007A (en) | 2008-02-20 |
CN100439467C CN100439467C (en) | 2008-12-03 |
Family
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Family Applications (1)
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CNB2007100432378A Active CN100439467C (en) | 2007-06-29 | 2007-06-29 | Polyamide thermosol for clothing and preparation method thereof |
Country Status (1)
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CN (1) | CN100439467C (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101863792A (en) * | 2010-05-24 | 2010-10-20 | 中科院广州化学有限公司 | Amide oligomer and polyamide paste rheological aid prepared by swelling same |
CN101307218B (en) * | 2008-06-20 | 2011-06-22 | 上海天洋热熔胶有限公司 | High temperature resistant water washing polyamide hot-melt adhesive for clothes and preparation method thereof |
CN102492135A (en) * | 2011-11-30 | 2012-06-13 | 上海天洋热熔胶有限公司 | Method for synthesizing dimer acid type polyamide hot melt adhesive |
CN102559129A (en) * | 2010-12-07 | 2012-07-11 | 上海轻工业研究所有限公司 | Polyamide hot melt adhesive and application thereof |
CN106893096A (en) * | 2017-02-21 | 2017-06-27 | 东华大学 | A kind of biological poly acid amides and preparation method thereof |
CN108690550A (en) * | 2018-05-14 | 2018-10-23 | 启东鑫天鼎热熔胶有限公司 | A kind of formula and preparation method thereof of weaving high temperature resistant water washing polyamide hot-melt adhesive |
CN109476823A (en) * | 2016-06-22 | 2019-03-15 | 瀚森公司 | Chemical products for adhesive application |
CN110527083A (en) * | 2019-09-18 | 2019-12-03 | 温州华特热熔胶股份有限公司 | Copolyamide hot melt adhesive and preparation method thereof for spinning |
CN114231242A (en) * | 2022-01-17 | 2022-03-25 | 万华化学集团股份有限公司 | Nylon 12 hot melt adhesive and preparation method thereof |
CN116640547A (en) * | 2023-05-15 | 2023-08-25 | 浙江澳宇新材料科技有限公司 | Copolyamide hot melt adhesive for low-pressure injection molding and preparation method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2324160A1 (en) * | 1973-05-12 | 1974-11-28 | Plate Bonn Gmbh | COPOLYAMIDS CONTAIN CAPROLACTAM, LAURINLACTAM AND 11-AMINOUNDECANIC ACID |
CN1033862C (en) * | 1992-08-20 | 1997-01-22 | 张国福 | Metal adhesive |
CN1061672C (en) * | 1997-03-11 | 2001-02-07 | 连云港港务局 | Two-component surface layer anticorrosive paint based on epoxy resin and its preparing method |
-
2007
- 2007-06-29 CN CNB2007100432378A patent/CN100439467C/en active Active
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101307218B (en) * | 2008-06-20 | 2011-06-22 | 上海天洋热熔胶有限公司 | High temperature resistant water washing polyamide hot-melt adhesive for clothes and preparation method thereof |
CN101863792A (en) * | 2010-05-24 | 2010-10-20 | 中科院广州化学有限公司 | Amide oligomer and polyamide paste rheological aid prepared by swelling same |
CN101863792B (en) * | 2010-05-24 | 2013-07-03 | 中科院广州化学有限公司 | Amide oligomer and polyamide paste rheological aid prepared by swelling same |
CN102559129A (en) * | 2010-12-07 | 2012-07-11 | 上海轻工业研究所有限公司 | Polyamide hot melt adhesive and application thereof |
CN102559129B (en) * | 2010-12-07 | 2014-03-19 | 上海轻工业研究所有限公司 | Polyamide hot melt adhesive and application thereof |
CN102492135A (en) * | 2011-11-30 | 2012-06-13 | 上海天洋热熔胶有限公司 | Method for synthesizing dimer acid type polyamide hot melt adhesive |
CN109476823B (en) * | 2016-06-22 | 2021-12-14 | 瀚森公司 | Chemical products for adhesive applications |
CN109476823A (en) * | 2016-06-22 | 2019-03-15 | 瀚森公司 | Chemical products for adhesive application |
CN106893096B (en) * | 2017-02-21 | 2019-01-15 | 东华大学 | A kind of biological poly amide and preparation method thereof |
CN106893096A (en) * | 2017-02-21 | 2017-06-27 | 东华大学 | A kind of biological poly acid amides and preparation method thereof |
CN108690550A (en) * | 2018-05-14 | 2018-10-23 | 启东鑫天鼎热熔胶有限公司 | A kind of formula and preparation method thereof of weaving high temperature resistant water washing polyamide hot-melt adhesive |
CN110527083A (en) * | 2019-09-18 | 2019-12-03 | 温州华特热熔胶股份有限公司 | Copolyamide hot melt adhesive and preparation method thereof for spinning |
CN114231242A (en) * | 2022-01-17 | 2022-03-25 | 万华化学集团股份有限公司 | Nylon 12 hot melt adhesive and preparation method thereof |
CN114231242B (en) * | 2022-01-17 | 2023-05-30 | 万华化学集团股份有限公司 | Nylon 12 hot melt adhesive and preparation method thereof |
CN116640547A (en) * | 2023-05-15 | 2023-08-25 | 浙江澳宇新材料科技有限公司 | Copolyamide hot melt adhesive for low-pressure injection molding and preparation method thereof |
CN116640547B (en) * | 2023-05-15 | 2023-12-01 | 浙江澳宇新材料科技有限公司 | Copolyamide hot melt adhesive for low-pressure injection molding and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN100439467C (en) | 2008-12-03 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI TIANYANG HEAT FUSION BONDING MATERIAL CO. Free format text: FORMER NAME: SHANGHAI TIANYANG HOTMELT ADHESIVES CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 201802 Shanghai city Jiading District Nanxiang Hui Ping Road No. 505 Patentee after: Shanghai Tianyang hot melt adhesive materials Limited by Share Ltd Address before: 201802 Shanghai city Jiading District Nanxiang Hui Ping Road No. 505 Patentee before: Shanghai Tianyang Hotmelt Adhesives Co., Ltd. |
|
C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI TIANYANG HOLT MELT ADHESIVE MATERIALS CO. Free format text: FORMER NAME: SHANGHAI TIANYANG HEAT FUSION BONDING MATERIAL CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 201802 Shanghai city Jiading District Nanxiang Hui Ping Road No. 505 Patentee after: Shanghai Tianyang Holt Melt Adhesive Materials Co., Ltd. Address before: 201802 Shanghai city Jiading District Nanxiang Hui Ping Road No. 505 Patentee before: Shanghai Tianyang hot melt adhesive materials Limited by Share Ltd |
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TR01 | Transfer of patent right |
Effective date of registration: 20220324 Address after: 226000 phase I of Lingang Industrial Zone, Weisan Road, Yangkou Port Economic Development Zone, Rudong County, Nantong City, Jiangsu Province Patentee after: Nantong Tianyang photovoltaic material technology Co.,Ltd. Address before: 201802 Shanghai city Jiading District Nanxiang Hui Ping Road No. 505 Patentee before: SHANGHAI TIANYANG HOT MELT ADHESIVE Co.,Ltd. |
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TR01 | Transfer of patent right |