CN110527083A - Copolyamide hot melt adhesive and preparation method thereof for spinning - Google Patents
Copolyamide hot melt adhesive and preparation method thereof for spinning Download PDFInfo
- Publication number
- CN110527083A CN110527083A CN201910881486.7A CN201910881486A CN110527083A CN 110527083 A CN110527083 A CN 110527083A CN 201910881486 A CN201910881486 A CN 201910881486A CN 110527083 A CN110527083 A CN 110527083A
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- CN
- China
- Prior art keywords
- melt adhesive
- hot melt
- spinning
- copolyamide hot
- molecular weight
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/36—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines and polycarboxylic acids
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
- D01F1/00—General methods for the manufacture of artificial filaments or the like
- D01F1/02—Addition of substances to the spinning solution or to the melt
- D01F1/10—Other agents for modifying properties
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
- D01F6/00—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof
- D01F6/88—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from mixtures of polycondensation products as major constituent with other polymers or low-molecular-weight compounds
- D01F6/90—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from mixtures of polycondensation products as major constituent with other polymers or low-molecular-weight compounds of polyamides
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Textile Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Proteomics, Peptides & Aminoacids (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyamides (AREA)
Abstract
The present invention relates to a kind of hot melt adhesive, in particular to a kind of copolyamide hot melt adhesive and preparation method thereof for spinning.The present invention provides the following technical scheme that a kind of copolyamide hot melt adhesive for spinning, includes following component according to weight: diamine 15%-30%, binary acid 32%-40%, lactams 10%-25%, water 2.4%-5%, molecular weight regulator 0.4%-5%, nucleating agent 4.5%-8%, auxiliary agent 0.7%-3%.By adopting the above technical scheme, the copolyamide hot melt adhesive for spinning and preparation method thereof that a kind of molecular weight ranges are narrow, fusing point is low, curing time is short, thermal stability and caking property are excellent is provided.
Description
Technical field
It is the present invention relates to a kind of hot melt adhesive, in particular to a kind of for the copolyamide hot melt adhesive of spinning and its preparation side
Method.
Background technique
Copolyamide hot melt adhesive is a kind of common hot-melt adhesive, there is excellent adhesive strength, water-fastness, heat-resisting
Property and solvent resistance, are very important a kind of hot melt adhesion material.But common copolyamide hot melt adhesive on the market at present,
Its as membranaceous, strip or filamentous form in use, its internal molecular weight ranges is wider, as spinning in use, its
The viscosity of spin fluid is more difficult to control.And fusing point is high, and curing time is long, causes its adhesive property uncontrollable, and increase
The production time of spinning, reduce production efficiency.
Summary of the invention
That in view of the deficiencies of the prior art, the present invention provides a kind of molecular weight ranges is narrow, fusing point is low, curing time
Short, thermal stability and the excellent copolyamide hot melt adhesive and preparation method thereof for spinning of caking property.
To achieve the above object, the present invention provides the following technical scheme that a kind of copolyamide hot melt adhesive for spinning,
It is characterized in that, including following component according to weight: diamine 15%-30%, binary acid 32%-40%, lactams 10%-
25%, water 2.4%-5%, molecular weight regulator 0.4%-5%, nucleating agent 4.5%-8%, auxiliary agent 0.7%-3%.
Wherein, binary acid is from any one in mixed conjunction 11 acid ﹑ of acid ﹑, the 12 acid ﹑ tetradecylic acid of two acid ﹑ of the adipic acid ﹑ last of the ten Heavenly stems
Kind.Molecular weight regulator is monocarboxylic acid.
Nucleating agent is inorganic nucleator, is talcum powder, calcium carbonate, silica, alum, titanium dioxide, calcium oxide, oxygen
Change magnesium, carbon black, any one in mica.
Lactams is the cyclic amino acid that carbon atom number is 6-12.
Diamine is selected from the aliphatic diamine of carbon atom number 6-10.
Auxiliary agent is tackifier.
By adopting the above technical scheme, copolyamide hot melt adhesive fusing point obtained is in 110-140 DEG C of model
It encloses, molecular weight regulator controls the molecular weight of copolyamide hot melt adhesive, controls the viscosity of spin fluid；Nucleating agent can promote
Into copolyamide hot melt adhesive crystallization of fluids, improve the curing time of copolyamide hot melt adhesive fluid；PE wax and erucyl amide shorten
The open hour of copolyamide hot melt adhesive；Copolyamide hot-melt adhesive granules moisture content produced by the present invention is low, and thermal stability is excellent
Different, spinnability is high, can be with high speed spinning, and adhesive property is excellent.
Specific embodiment
The present invention is a kind of copolyamide hot melt adhesive for spinning, includes following component: diamine according to weight
15%-30%, binary acid 32%-40%, lactams 10%-25%, water 2.4%-5%, molecular weight regulator 0.4%-5%,
Nucleating agent 4.5%-8%, auxiliary agent 0.7%-3%.Wherein, binary acid is to close 11 acid ﹑ ten of acid ﹑ from two acid ﹑ of the adipic acid ﹑ last of the ten Heavenly stems is mixed
Any one in Er Suan ﹑ tetradecylic acid.Molecular weight regulator is monocarboxylic acid.Nucleating agent is inorganic nucleator, be talcum powder,
Calcium carbonate, silica, alum, titanium dioxide, calcium oxide, magnesia, carbon black, any one in mica.Lactams is carbon
Atomicity is the cyclic amino acid of 6-12.Diamine is selected from the aliphatic diamine of carbon atom number 6-10.Auxiliary agent is tackifier.
In the embodiment of the present invention 1, the preparation method is as follows: having blender, air inlet pipe, exhaust pipe, temperature and pressure
In the autoclave pressure of test device, it is added hexamethylene diamine (298.5g), 2-making methylpentamethylenediamine diamines (140g), adipic acid (81.8g), 11
Sour (392.4g), tetradecylic acid (360.8g), caprolactam (740.7g), deionized water (60g), titanium dioxide (60g), PE wax
(10g), stearic acid (15g), after raw material is put into, then inflated with nitrogen 0.1Mpa slowly empties to normal pressure, replace kettle repeatedly three times
Interior air eliminates, and in temperature-rise period, for material just after polymerization reaction exiting water process, polymerization reaction kettle rushes nitrogen protection, polymerization
Reactor pressure control is 220-240 DEG C in 0.05MPa-0.1MPa, reaction temperature control, reaction time 2-4h；Polymerization is anti-
Answer kettle to vacuumize, the control of polymeric kettle material reaction temperature is 220-240 DEG C, vacuum degree control in -0.095MPa--0.1MPa,
Pumpdown time is 2-4h, and dehydration discharges after removing molecular weight polymers, obtains the polyamide hot that fusing point is 110 ~ 115 DEG C.
In the embodiment of the present invention 2, the preparation method is as follows: having blender, air inlet pipe, exhaust pipe, temperature and pressure
In the autoclave pressure of test device, it is added hexamethylene diamine (358.5g), 2-making methylpentamethylenediamine diamines (80.0g), adipic acid (425.8g), the last of the ten Heavenly stems
Diacid (400g), decamethylene diamine (192.6g), caprolactam (450.6g), titanium dioxide (80g), PE wax (8g), stearic acid (12g),
After raw material investment, then inflated with nitrogen 0.1Mpa slowly empties to normal pressure, replace and three times eliminate air in kettle repeatedly, heated up
Cheng Zhong, for material just after polymerization reaction exiting water process, polymerization reaction kettle rushes nitrogen protection, and the control of polymerization reaction kettle pressure exists
0.05MPa-0.1MPa, reaction temperature control are 220-240 DEG C, reaction time 2-4h；Polymerization reaction kettle vacuumizes, polymeric kettle
The control of material reaction temperature is 220-240 DEG C, vacuum degree control in -0.095MPa--0.1MPa, pumpdown time 2-4h,
Dehydration, discharges after removing molecular weight polymers, obtains the polyamide hot that fusing point is 125-130 DEG C.
In the embodiment of the present invention 3, the preparation method is as follows: having blender, air inlet pipe, exhaust pipe, temperature and pressure
In the autoclave pressure of test device, it is added hexamethylene diamine (263.6g), 2-making methylpentamethylenediamine diamines (174.9g), adipic acid (154.4g), the last of the ten Heavenly stems
Diacid (316.8g), undecanoic acid (248.7g), caprolactam (757.7g), 10000 mesh of talcum powder (150g), erucyl amide
(2g), stearic acid (13g), after raw material is put into, then inflated with nitrogen 0.1Mpa slowly empties to normal pressure, replace kettle repeatedly three times
Interior air eliminates, and in temperature-rise period, for material just after polymerization reaction exiting water process, polymerization reaction kettle rushes nitrogen protection, polymerization
Reactor pressure control is 220-240 DEG C in 0.05MPa-0.1MPa, reaction temperature control, reaction time 2-4h；Polymerization is anti-
Answer kettle to vacuumize, the control of polymeric kettle material reaction temperature is 220-240 DEG C, vacuum degree control in -0.095MPa--0.1MPa,
Pumpdown time is 2-4h, and dehydration discharges after removing molecular weight polymers, obtains the polyamide hot that fusing point is 100-105 DEG C.
The correlated performance test table of the embodiment of the present invention 1-3 is as follows.
| Index | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Fusing point DEG C | 110℃ | 125℃ | 130℃ |
| Melt and refers to min | 10.0g/10min | 4.0g/10min | 6.0g/10min |
| Open hour min | 1.0min | 1.0min | 0.8min |
Claims (10)
1. a kind of copolyamide hot melt adhesive for spinning, which is characterized in that according to weight include following component: diamine
15%-30%, binary acid 32%-40%, lactams 10%-25%, water 2.4%-5%, molecular weight regulator 0.4%-5%,
Nucleating agent 4.5%-8%, auxiliary agent 0.7%-3%.
2. the copolyamide hot melt adhesive according to claim 1 for spinning, it is characterised in that: the binary acid is certainly
Any one in Ji bis- Suan ﹑ Gui bis- Suan ﹑ Hun He Suan ﹑ Shi mono- Suan ﹑ Shi bis- Suan ﹑ tetradecylic acid.
3. the copolyamide hot melt adhesive according to claim 1 or 2 for spinning, it is characterised in that: the molecular weight
Regulator is monocarboxylic acid.
4. the copolyamide hot melt adhesive according to claim 1 or 2 for spinning, it is characterised in that: the nucleating agent
It is talcum powder, calcium carbonate, silica, alum, titanium dioxide, calcium oxide, magnesia, carbon black, mica for inorganic nucleator
In any one.
5. the copolyamide hot melt adhesive according to claim 1 or 2 for spinning, it is characterised in that: the lactams
The cyclic amino acid for being 6-12 for carbon atom number.
6. the copolyamide hot melt adhesive according to claim 1 or 2 for spinning, it is characterised in that: the diamine
Aliphatic diamine selected from carbon atom number 6-10.
7. the copolyamide hot melt adhesive according to claim 1 or 2 for spinning, it is characterised in that: the auxiliary agent is to increase
Stick.
8. a kind of preparation method for the copolyamide hot melt adhesive for spinning that the component using in claim 1 is implemented, special
Sign is that steps are as follows: a, preparing raw material diamine, binary acid, lactams, water, molecular weight regulator, nucleating agent, auxiliary agent；b,
The raw material prepared in step a is proportionally put into polymerization reaction kettle and is stirred and reacts；C, step b is completed into reaction original
It is filled with nitrogen in the reaction kettle of material, and the air in replacement reaction kettle, the raw material in reaction kettle is promoted to implement polymerization reaction；D, will
Vacuum is extracted in the reaction kettle inner cavity that polymerization reaction raw material is completed in step c, promotes raw material dehydration and forms low-molecular weight polymer；
E, the copolymer for completing to be dehydrated and formed low-molecular weight polymer in step d is cut into particle by granulate equipment；F, by step e
The particle of middle formation is dried in vacuo, and copolyamide hot-melt adhesive granules are obtained.
9. the preparation method of the copolyamide hot melt adhesive according to claim 8 for spinning, it is characterised in that: described
Reaction temperature in step b is 80 DEG C -100 DEG C, and mixing time is 2h -3h；Reaction temperature is 220 in the step c
DEG C -240 DEG C, the reaction time is 2h -3h；The reaction temperature vacuumized in the step d is 220 DEG C -240 DEG C, vacuum degree
For -0.095MPa--0.1MPa, the pumpdown time is 2h -4h；In the step f be dried in vacuo after moisture content be
100ppm or less.
10. the preparation method of the copolyamide hot melt adhesive according to claim 8 for spinning, it is characterised in that: described
Step c in the pressure of nitrogen is filled in reaction kettle is 0.05MPa -0.1MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910881486.7A CN110527083A (en) | 2019-09-18 | 2019-09-18 | Copolyamide hot melt adhesive and preparation method thereof for spinning |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910881486.7A CN110527083A (en) | 2019-09-18 | 2019-09-18 | Copolyamide hot melt adhesive and preparation method thereof for spinning |
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| Publication Number | Publication Date |
|---|---|
| CN110527083A true CN110527083A (en) | 2019-12-03 |
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ID=68669210
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910881486.7A Pending CN110527083A (en) | 2019-09-18 | 2019-09-18 | Copolyamide hot melt adhesive and preparation method thereof for spinning |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112251909A (en) * | 2020-09-21 | 2021-01-22 | 江苏惠沣环保科技有限公司 | Manufacturing process of high-low temperature integrally-formed hot-melt net film |
Citations (7)
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|---|---|---|---|---|
| CN1976976A (en) * | 2005-03-30 | 2007-06-06 | 阿克马法国公司 | Low-melting-point copolyamides and their use as hot-melt adhesives |
| CN101126007A (en) * | 2007-06-29 | 2008-02-20 | 上海天洋热熔胶有限公司 | Polyamide thermosol for clothing and preparation method thereof |
| CN102863616A (en) * | 2012-06-16 | 2013-01-09 | 上海天洋热熔胶有限公司 | Preparation method of low-melting-point copolyamide hot melt adhesive |
| CN102924712A (en) * | 2012-10-18 | 2013-02-13 | 上海天洋热熔胶有限公司 | Low-melting-point polyamide hot melt adhesive with high weather resistance and preparation method thereof |
| CN105504271A (en) * | 2016-02-03 | 2016-04-20 | 温州华特热熔胶有限公司 | Low-melting-point copolyamide hot melt adhesive for clothes and processing method thereof |
| CN108219737A (en) * | 2017-12-05 | 2018-06-29 | 昆山天洋热熔胶有限公司 | A kind of preparation method of copolyamide hot melt adhesive |
| CN110184025A (en) * | 2019-06-26 | 2019-08-30 | 上海天洋热熔粘接材料股份有限公司 | A kind of preparation method of low-melting-point copolyamide hot melt adhesive |
-
2019
- 2019-09-18 CN CN201910881486.7A patent/CN110527083A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1976976A (en) * | 2005-03-30 | 2007-06-06 | 阿克马法国公司 | Low-melting-point copolyamides and their use as hot-melt adhesives |
| CN101126007A (en) * | 2007-06-29 | 2008-02-20 | 上海天洋热熔胶有限公司 | Polyamide thermosol for clothing and preparation method thereof |
| CN102863616A (en) * | 2012-06-16 | 2013-01-09 | 上海天洋热熔胶有限公司 | Preparation method of low-melting-point copolyamide hot melt adhesive |
| CN102924712A (en) * | 2012-10-18 | 2013-02-13 | 上海天洋热熔胶有限公司 | Low-melting-point polyamide hot melt adhesive with high weather resistance and preparation method thereof |
| CN105504271A (en) * | 2016-02-03 | 2016-04-20 | 温州华特热熔胶有限公司 | Low-melting-point copolyamide hot melt adhesive for clothes and processing method thereof |
| CN108219737A (en) * | 2017-12-05 | 2018-06-29 | 昆山天洋热熔胶有限公司 | A kind of preparation method of copolyamide hot melt adhesive |
| CN110184025A (en) * | 2019-06-26 | 2019-08-30 | 上海天洋热熔粘接材料股份有限公司 | A kind of preparation method of low-melting-point copolyamide hot melt adhesive |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112251909A (en) * | 2020-09-21 | 2021-01-22 | 江苏惠沣环保科技有限公司 | Manufacturing process of high-low temperature integrally-formed hot-melt net film |
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Application publication date: 20191203 |
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| RJ01 | Rejection of invention patent application after publication |