CN107556965A - High temperature resistant copolyamide PUR and processing method for footwear material - Google Patents
High temperature resistant copolyamide PUR and processing method for footwear material Download PDFInfo
- Publication number
- CN107556965A CN107556965A CN201710849090.5A CN201710849090A CN107556965A CN 107556965 A CN107556965 A CN 107556965A CN 201710849090 A CN201710849090 A CN 201710849090A CN 107556965 A CN107556965 A CN 107556965A
- Authority
- CN
- China
- Prior art keywords
- acid
- high temperature
- temperature resistant
- pur
- footwear material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Polyamides (AREA)
Abstract
The invention discloses a kind of high temperature resistant copolyamide PUR and processing method for footwear material, the PUR is produced preparation by the component A of molar percentage 50% and 50% component B in the presence of catalyst, auxiliary agent small powder and surface drying conditioning agent, wherein, in component A, dimeric dibasic acid mol ratio accounts for 70 90%, binary acid mol ratio accounts for 10 30%, and component B is diamine.The dimeric dibasic acid mol ratio accounts for 80%, and the binary acid mol ratio accounts for 20%.The dimeric dibasic acid is mutually polymerized by octadecadienoic acid by intermolecular.The dimeric dibasic acid includes monomer acids, trimerization or polymer, wherein, dimerization acid content >=98%, monomeric acid content≤0.5%, trimerization and polymer≤2% in the dimeric dibasic acid.The present invention has high temperature resistant, wide adaptation range, flexible beneficial effect good, adhesive strength is high.
Description
Technical field
The present invention relates to a kind of PUR and processing method for footwear material, is especially suitable for resistant to elevated temperatures footwear material hot melt
Glue.
Background technology
Mainly have during shoemaking Shoe-upper base, outer bottom, it is main with, packet header, heel, hook the heart and shoe-pad etc. and need to be bonded.Upper of a shoe is more
For natural leather, the material such as dermatine and fabric, sole is mostly rubber, plastic or other material.Chinese patent CN 103289065
A discloses a kind of high temperature resistance polyester PUR of shoemaking, but its adhesive strength is not high.
The content of the invention
According to the above deficiency, providing a kind of high temperature resistant copolyamide PUR for footwear material, the present invention adopts the present invention
With a kind of dimer acid type PUR, it is compound to be particularly suitable for resistant to elevated temperatures footwear material.
The technical scheme is that：
A kind of high temperature resistant copolyamide PUR for footwear material, it is characterized in that, the PUR is by molar percentage 50%
Component A and 50% component B produces preparation in the presence of catalyst, auxiliary agent small powder and surface drying conditioning agent, wherein, in component A, two
Polyacids mol ratio accounts for 70-90%, and binary acid mol ratio accounts for 10-30%, and component B is diamine.
The dimeric dibasic acid mol ratio accounts for 80%, and the binary acid mol ratio accounts for 20%.
The dimeric dibasic acid is mutually polymerized by octadecadienoic acid by intermolecular.
The dimeric dibasic acid includes monomer acids, trimerization or polymer, wherein, dimerization acid content >=98% in the dimeric dibasic acid,
Monomeric acid content≤0.5%, trimerization and polymer≤2%.
The binary acid is in hexanedioic acid, decanedioic acid, azelaic acid, heneicosanedioic acid, dodecanedioic acid or 14
One kind or any several mixture in docosandioic acid.
The one kind or any several mixing of the diamine in hexamethylene diamine, decamethylene diamine, heptamethylene diamine, dodecamethylene diamine
Thing.
The catalyst is phosphoric acid.
The auxiliary agent small powder is Hinered phenols antioxidant.
The surface drying conditioning agent is ethylene-vinyl acetate copolymer and terpene resin, and the surface drying conditioning agent quality accounts for production
The 10% of product.
A kind of processing method of high temperature resistant copolyamide PUR for footwear material, including it is described a kind of for footwear material
High temperature resistant copolyamide PUR, it is characterized in that, as follows：
Step A, component A and component B are once dosed to reactor, add catalyst phosphoric acid and auxiliary agent small powder Hinered phenols
Antioxidant；
Step B, normal pressure vacuumize holding 2 hours, polycondensation reaction generation polyamide hot after being warming up to 200 DEG C；
Step C, surface drying conditioning agent ethylene-vinyl acetate copolymer and terpene resin are added, finished product PUR can be obtained.
Dimeric acid type polyamide hot melt adhesive is one kind that performance is best in existing PUR, by dimeric dibasic acid and diamine or more
First amine polycondensation forms.Because the amide group in the resin and many materials have good compatibility, and its polarity is strong, can produce
Raw very big molecular separating force has excellent PUR cementability.
Because dimeric acid type polyamide hot melt adhesive has excellent pliability, so being highly suitable for the bag of mechanical shoemaking
Head bonding, the taut last carving of middle rear side and edging sizing.
In general dimeric acid type polyamide hot melt adhesive will come unglued at 90 DEG C, footwear material is compound pass through baking oven when cause matter
Amount problem, the dimer acid type PUR of the present invention temperature that will come unglued have brought up to 120 DEG C, and it is compound logical to have fully met footwear material
Cross high temperature resistant requirement during baking oven.
The present invention has high temperature resistant, wide adaptation range, flexible beneficial effect good, adhesive strength is high.
Embodiment
It is existing that the present invention is further illustrated：
Embodiment 1
With thermometer, thick stick stirred, disposable input dimeric dibasic acid 120g in the 1000ml of condenser pipe three mouthfuls of reactors,
Decanedioic acid 10.6g, decamethylene diamine 45.7g, catalyst being added, auxiliary agent small powder, normal pressure heats up in 2 hours, slowly opens stirring,
There is water to distillate in temperature-rise period, after temperature rises to 200 DEG C, vacuumized with vavuum pump, vacuum ＜ 100Pa, is kept stirring for, 2
Vacuum is released after hour, the copolyamide of melting is poured on barrier paper, long adhesive tape is obtained, is dried in 50 DEG C of baking oven
Every test is carried out after 24 hours.
Embodiment 2
With thermometer, thick stick stirred, disposable input dimeric dibasic acid 120g in the 1000ml of condenser pipe three mouthfuls of reactors,
Azelaic acid 10g, decamethylene diamine 45.7g, catalyst is added, auxiliary agent small powder, normal pressure heats up in 2 hours, slowly opens stirring, heating
During there is water to distillate, after temperature rises to 200 DEG C, vacuumized, vacuum ＜ 100Pa, be kept stirring for, at 2 hours with vavuum pump
After release vacuum, the copolyamide of melting is poured on barrier paper, obtains the adhesive tape of long length, it is small that 24 are dried in 50 DEG C of baking oven
When after carry out every test.
Embodiment 3
With thermometer, thick stick stirred, disposable input dimeric dibasic acid 120g in the 1000ml of condenser pipe three mouthfuls of reactors,
Heneicosanedioic acid 11.3g, caprolactam 30g, catalyst is added, auxiliary agent small powder, normal pressure heats up in 2 hours, slowly opens and stirs
Mix, there is water to distillate in temperature-rise period, after temperature rises to 200 DEG C, vacuumized with vavuum pump, vacuum ＜ 100Pa, is kept stirring for,
Vacuum is released after 2 hours, the copolyamide of melting is poured on barrier paper, long adhesive tape is obtained, in 50 DEG C of baking oven
Every test is carried out after drying 24 hours.
Embodiment 4
With thermometer, thick stick stirred, disposable input dimeric dibasic acid 120g in the 1000ml of condenser pipe three mouthfuls of reactors,
Heneicosanedioic acid 11.3g, decamethylene diamine 45.7g, catalyst is added, auxiliary agent small powder, normal pressure heats up in 2 hours, slowly opens and stirs
Mix, there is water to distillate in temperature-rise period, after temperature rises to 200 DEG C, vacuumized with vavuum pump, vacuum ＜ 100Pa, is kept stirring for,
Vacuum is released after 2 hours, the copolyamide of melting is poured on barrier paper, long adhesive tape is obtained, in 50 DEG C of baking oven
Every test is carried out after drying 24 hours.
Embodiment 5
With thermometer, thick stick stirred, disposable input dimeric dibasic acid 120g in the 1000ml of condenser pipe three mouthfuls of reactors,
Decanedioic acid 10.6g, caprolactam 30g, catalyst is added, auxiliary agent small powder, normal pressure heats up in 2 hours, slowly opens stirring, rises
There is water to distillate during temperature, after temperature rises to 200 DEG C, vacuumized with vavuum pump, vacuum ＜ 100Pa, is kept stirring for, it is small 2
When after release vacuum, the copolyamide of melting is poured on barrier paper, the adhesive tape of long length is obtained, 24 is dried in 50 DEG C of baking oven
Every test is carried out after hour.
Embodiment 6
With thermometer, thick stick stirred, disposable input dimeric dibasic acid 120g in the 1000ml of condenser pipe three mouthfuls of reactors,
Decanedioic acid 10.6g, dodecamethylene diamine 52.5g, catalyst is added, auxiliary agent small powder, normal pressure heats up in 2 hours, slowly opens and stirs
Mix, there is water to distillate in temperature-rise period, after temperature rises to 200 DEG C, vacuumized with vavuum pump, vacuum ＜ 100Pa, is kept stirring for,
Vacuum is released after 2 hours, the copolyamide of melting is poured on barrier paper, long adhesive tape is obtained, in 50 DEG C of baking oven
Every test is carried out after drying 24 hours.
Claims (10)
1. a kind of high temperature resistant copolyamide PUR for footwear material, it is characterized in that, the PUR is by the component of molar percentage 50%
A and 50% component B produces preparation in the presence of catalyst, auxiliary agent small powder and surface drying conditioning agent, wherein, in component A, dimeric dibasic acid
Mol ratio accounts for 70-90%, and binary acid mol ratio accounts for 10-30%, and component B is diamine.
2. a kind of high temperature resistant copolyamide PUR for footwear material as claimed in claim 1, it is characterized in that, the dimeric dibasic acid
Mol ratio accounts for 80%, and the binary acid mol ratio accounts for 20%.
3. a kind of high temperature resistant copolyamide PUR for footwear material as claimed in claim 1 or 2, it is characterized in that, described two
Polyacids are mutually polymerized by octadecadienoic acid by intermolecular.
4. a kind of high temperature resistant copolyamide PUR for footwear material as claimed in claim 3, it is characterized in that, the dimeric dibasic acid
Including monomer acids, trimerization or polymer, wherein, dimerization acid content >=98%, monomeric acid content≤0.5%, three in the dimeric dibasic acid
Poly- and polymer≤2%.
5. a kind of high temperature resistant copolyamide PUR for footwear material as claimed in claim 1, it is characterized in that, described fatty two
One kind in hexanedioic acid, decanedioic acid, azelaic acid, heneicosanedioic acid, dodecanedioic acid or in tetracosandioic acid of first acid is appointed
Anticipate several mixtures.
6. a kind of high temperature resistant copolyamide PUR for footwear material as claimed in claim 1, it is characterized in that, the diamine
One kind or any several mixture in hexamethylene diamine, decamethylene diamine, heptamethylene diamine, dodecamethylene diamine.
7. a kind of high temperature resistant copolyamide PUR for footwear material as claimed in claim 1, it is characterized in that, the catalyst
For phosphoric acid.
8. a kind of high temperature resistant copolyamide PUR for footwear material as claimed in claim 1, it is characterized in that, the auxiliary agent is small
Expect for Hinered phenols antioxidant.
9. a kind of high temperature resistant copolyamide PUR for footwear material as claimed in claim 1, it is characterized in that, the surface drying is adjusted
It is ethylene-vinyl acetate copolymer and terpene resin to save agent, and the surface drying conditioning agent quality accounts for the 10% of product.
10. a kind of processing method of high temperature resistant copolyamide PUR for footwear material, including such as any one of claim 1-6 institutes
A kind of high temperature resistant copolyamide PUR for footwear material stated, it is characterized in that, as follows：
Step A, component A and component B are once dosed to reactor, add catalyst phosphoric acid and auxiliary agent small powder Hinered phenols antioxygen
Agent；
Step B, normal pressure vacuumize holding 2 hours, polycondensation reaction generation polyamide hot after being warming up to 200 DEG C；
Step C, surface drying conditioning agent ethylene-vinyl acetate copolymer and terpene resin are added, finished product PUR can be obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710849090.5A CN107556965A (en) | 2017-09-20 | 2017-09-20 | High temperature resistant copolyamide PUR and processing method for footwear material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710849090.5A CN107556965A (en) | 2017-09-20 | 2017-09-20 | High temperature resistant copolyamide PUR and processing method for footwear material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107556965A true CN107556965A (en) | 2018-01-09 |
Family
ID=60981516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710849090.5A Pending CN107556965A (en) | 2017-09-20 | 2017-09-20 | High temperature resistant copolyamide PUR and processing method for footwear material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107556965A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108690550A (en) * | 2018-05-14 | 2018-10-23 | 启东鑫天鼎热熔胶有限公司 | A kind of formula and preparation method thereof of weaving high temperature resistant water washing polyamide hot-melt adhesive |
| CN109486466A (en) * | 2018-11-23 | 2019-03-19 | 合肥绿普包装材料有限公司 | A method of improving dimer acid polyamide adhesive adhesive property |
| CN112795362A (en) * | 2020-12-31 | 2021-05-14 | 温州华特热熔胶股份有限公司 | Ether modified reinforced hot melt adhesive |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102220105A (en) * | 2011-04-29 | 2011-10-19 | 烟台德邦电子材料有限公司 | Dimer acid type polyamide hot melt adhesive and preparation method thereof |
| CN102443374A (en) * | 2011-11-01 | 2012-05-09 | 烟台德邦电子材料有限公司 | Copolyamide hot melt adhesive and its preparation method |
| CN102492135A (en) * | 2011-11-30 | 2012-06-13 | 上海天洋热熔胶有限公司 | Method for synthesizing dimer acid type polyamide hot melt adhesive |
| CN103555263A (en) * | 2013-10-30 | 2014-02-05 | 安庆市虹泰新材料有限责任公司 | Method for preparing dimer acid type copolymerized polyamide hot melt adhesive |
| CN104356999A (en) * | 2014-10-22 | 2015-02-18 | 重庆市旭星化工有限公司 | Copolyamide hot melt adhesive |
| CN105273676A (en) * | 2015-02-03 | 2016-01-27 | 山东汉德夫新材料科技有限公司 | High-bonding-intensity polyamide hot melt adhesive and preparation method therefor |
-
2017
- 2017-09-20 CN CN201710849090.5A patent/CN107556965A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102220105A (en) * | 2011-04-29 | 2011-10-19 | 烟台德邦电子材料有限公司 | Dimer acid type polyamide hot melt adhesive and preparation method thereof |
| CN102443374A (en) * | 2011-11-01 | 2012-05-09 | 烟台德邦电子材料有限公司 | Copolyamide hot melt adhesive and its preparation method |
| CN102492135A (en) * | 2011-11-30 | 2012-06-13 | 上海天洋热熔胶有限公司 | Method for synthesizing dimer acid type polyamide hot melt adhesive |
| CN103555263A (en) * | 2013-10-30 | 2014-02-05 | 安庆市虹泰新材料有限责任公司 | Method for preparing dimer acid type copolymerized polyamide hot melt adhesive |
| CN104356999A (en) * | 2014-10-22 | 2015-02-18 | 重庆市旭星化工有限公司 | Copolyamide hot melt adhesive |
| CN105273676A (en) * | 2015-02-03 | 2016-01-27 | 山东汉德夫新材料科技有限公司 | High-bonding-intensity polyamide hot melt adhesive and preparation method therefor |
Non-Patent Citations (1)
| Title |
|---|
| 罗文君等: "《大分子设计与实验》", 30 September 2012, 中国地质大学出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108690550A (en) * | 2018-05-14 | 2018-10-23 | 启东鑫天鼎热熔胶有限公司 | A kind of formula and preparation method thereof of weaving high temperature resistant water washing polyamide hot-melt adhesive |
| CN109486466A (en) * | 2018-11-23 | 2019-03-19 | 合肥绿普包装材料有限公司 | A method of improving dimer acid polyamide adhesive adhesive property |
| CN112795362A (en) * | 2020-12-31 | 2021-05-14 | 温州华特热熔胶股份有限公司 | Ether modified reinforced hot melt adhesive |
| CN112795362B (en) * | 2020-12-31 | 2022-06-10 | 温州华特热熔胶股份有限公司 | Ether modified reinforced hot melt adhesive |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107556965A (en) | High temperature resistant copolyamide PUR and processing method for footwear material | |
| CN107267109B (en) | Polyesteramide hot melt adhesive and preparation method thereof | |
| FI58146C (en) | COPYLAMIDE INNEHAOLLANDE CAPROLAKTAM LAURINLAKTAM OCH ADIPINSUR HEXAMETHYLENDIAMIN | |
| JP2010511082A5 (en) | ||
| CN104592930B (en) | Hot melt adhesive with compression sensitivity and preparation method thereof | |
| JPS5811910B2 (en) | Setuchi Yakuzai | |
| CN101818043A (en) | Grafted polyolefin resin modified polyamine hotmelt adhesive and preparation method thereof | |
| WO2017080494A1 (en) | High-performance polyamide hot melt adhesive for surface decoration and preparation method therefor | |
| US3859234A (en) | Fabric bonding improvement | |
| US3515702A (en) | Laurolactam copolyamide shaped articles having highly adhesive surfaces | |
| KR100767234B1 (en) | Branched polyamides comprising unsaturated ends | |
| CN106750330A (en) | A kind of preparation method of polyester amide hot melt adhesive | |
| JPS6019345B2 (en) | Manufacturing method of melt adhesive for fiber bonding | |
| US3717528A (en) | Fabric bonding with thermoplastic fibrous mats | |
| JPS6333492B2 (en) | ||
| US5321120A (en) | Copolyamide adhesive compositions containing asymmetric aliphatic residues | |
| JPS627234B2 (en) | ||
| DK142149B (en) | APPLICATION OF COPOLYAMIDE MELT ADDICTIONS AS EDGE ADHESIVE TO HEAT RESISTANT EDGE ADJUSTMENT IN THE MOBILE INDUSTRY | |
| JPH02245084A (en) | Polyether-amide hot-melt adhesive | |
| CA1110392A (en) | Polyamides | |
| CN108003828B (en) | Preparation method of copolyamide hot melt adhesive | |
| CN107163904B (en) | Hot melt adhesive consisting of high molecular weight polyamide resin, low molecular weight polyamide resin and grafted polyolefin resin and preparation method thereof | |
| CN107216848A (en) | A kind of PUR of flexible polyamide containing organosilicon and preparation method thereof | |
| KR20170024080A (en) | Polyamides based on aminoalkyl- or aminoaryl-piperazine for hot-melt adhesives | |
| CN107227140A (en) | A kind of polyester amide hot melt adhesive and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180109 |
|
| RJ01 | Rejection of invention patent application after publication |