CN102490132A - Piezoelectric ultrasonic vibration-absorption picker - Google Patents
Piezoelectric ultrasonic vibration-absorption picker Download PDFInfo
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- CN102490132A CN102490132A CN2011103800039A CN201110380003A CN102490132A CN 102490132 A CN102490132 A CN 102490132A CN 2011103800039 A CN2011103800039 A CN 2011103800039A CN 201110380003 A CN201110380003 A CN 201110380003A CN 102490132 A CN102490132 A CN 102490132A
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- 238000010521 absorption reaction Methods 0.000 title claims description 22
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 230000000740 bleeding effect Effects 0.000 claims description 14
- 208000002925 dental caries Diseases 0.000 claims description 3
- 239000002699 waste material Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 11
- 238000001179 sorption measurement Methods 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000003912 environmental pollution Methods 0.000 abstract 1
- 241000167854 Bourreria succulenta Species 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
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Abstract
本发明公开了一种压电超声振动吸附拾取器，包括一内部设有振动腔和振动盘的振动腔体，振动盘上粘接有压电陶瓷片，振动腔体的前端设有与振动腔连通的拾取吸盘，拾取吸盘的后端连通有吸气阀和排气阀，拾取吸盘的前端设有与吸气阀相连通的一个或多个小型弹性空腔。振动腔体与吸气阀、排气阀、振动盘构成封闭的振动腔，振动盘在电源驱动下振动，使得振动腔的体积变化，密闭振动腔内的空气被排入大气，吸盘内形成了负压，从而完成拾取工作。本发明的压电超声振动吸附拾取器，体质轻便、功率容量大、抓取速度快、吸附力变化平稳、生产成本低、对环境污染小，可应用于超薄硅晶片等薄脆材料的上下料、能源动力、信息电子、航空航天及生物工程等较多领域。
The invention discloses a piezoelectric ultrasonic vibration adsorption pick-up, which comprises a vibrating cavity with a vibrating cavity and a vibrating plate inside, a piezoelectric ceramic sheet is bonded on the vibrating plate, and the front end of the vibrating cavity is provided with a vibrating cavity Connected pick-up suction cup, the rear end of the pick-up suction cup is connected with suction valve and exhaust valve, and the front end of the pick-up suction cup is provided with one or more small elastic cavities connected with the suction valve. The vibrating cavity, the suction valve, the exhaust valve and the vibrating plate form a closed vibrating cavity. The vibrating plate vibrates under the drive of the power supply, which makes the volume of the vibrating cavity change, and the air in the closed vibrating cavity is discharged into the atmosphere, forming a vacuum in the suction cup. Negative pressure to complete the pick-up work. The piezoelectric ultrasonic vibration adsorption picker of the present invention is light in body, large in power capacity, fast in grasping speed, stable in adsorption force change, low in production cost, and less in environmental pollution, and can be applied to loading and unloading of thin and brittle materials such as ultra-thin silicon wafers , energy power, information electronics, aerospace and bioengineering and many other fields.
Description
Technical field
The present invention relates to a kind of piezoelectric ultrasonic vibration absorption pick-up, specifically, relate to a kind of ultrasonic vibration adsorption pick-up apparatus that utilizes piezo-electric effect.
Background technology
Continuous development along with science and technology; The range of application of crisp fritter wafer materials such as solar energy silicon crystal chip constantly enlarges; Because wafer material itself is very crisp; The very thin thickness of wafer after processing in addition, the loading and unloading of wafer in manufacturing processes such as cutting, edge polishing, grinding, etching, polishing, cleaning be difficulty very, and is easy to breakage.If method is improper, the nanoscale surface after the processing also is easy to be destroyed.Therefore, safe, reliable, efficient picking up system has important effect.
The Grasp Modes of present thin and brittle wafer, the mode that adopts the gas vacuum cup to pick up more, there is this following point in this mode:
1, the bleed pressure of vacuum cup pick device is non-constant, causes the pickup force of vacuum cup unstable;
2, the grasp force peak value of vacuum cup pick device is excessive, can cause broken wafers once in a while;
3, the grasp force of vacuum cup pick device is inhomogeneous, wafer be adsorbed surperficial unbalance stress, be easy to generate wafer breakage;
4, the volume of vacuum cup pick device is big, power consumption is big, efficiency is low;
5, the vacuum cup pick device is air-breathing, the venting reaction time is of a specified duration, and efficient is low.
Summary of the invention
The volume that uses vavuum pump to cause is big, power consumption is big, efficiency is low, the unequal limitation of absorption affinity in order to overcome; The present invention proposes a kind of brand-new piezoelectric ultrasonic vibration absorption pick-up, this structure has that volume is little, power consumption is little, response speed is fast, steady performance.
Technical scheme of the present invention is:
A kind of ultrasonic vibration absorption pick-up comprises
The inside of one vibration cavity, vibration cavity is provided with a space as vibration cavity,
One vibrating disk places the rear end of vibration cavity, is connected the inside of vibration cavity, and the rear end of vibrating disk is provided with piezoelectric ceramic piece, is bonded as one with vibrating disk, and piezoelectric ceramic piece is connected with the piezoelectric supersonic driving power,
One picks up sucker, is connected the front end of vibration cavity, is communicated with vibration cavity, and the rear end of picking up sucker also is communicated with inlet valve and air bleeding valve, and the front end that picks up sucker is provided with one or more mini elastic cavitys, and each mini elastic cavity all is connected with inlet valve.
Preferably, said vibrating disk is through compressing the inside of end cap flexible fastening at the vibration cavity.
The said elastic cavity that picks up the setting of sucker front end impels sucker front end lip to be fitted the formation closed cavity with picking up the thing surface.Looping exhaust passage between the endoporus of said air bleeding valve and vibration cavity lower end constitutes air intake passage between the endoporus of said inlet valve and air bleeding valve, and air intake passage and exhaust passage are the annulus of variable cross-section.Said vibration cavity and inlet valve, air bleeding valve, vibrating disk constitute the vibration cavity of sealing.
The present invention also has the following advantages:
1. vibrating disk according to the invention adopts Piezoelectric Ceramic.Have the amplitude adjustable size, the absorption grasp force is adjustable, advantages of simple structure and simple.
2. on the basis that guarantees the absorption grasp force, can reduce the consumption of the energy to greatest extent.
3. pick up the efficient height, realize that moment picks up.
4. be widely used
The present invention not only can be used in crisp fritter wafers such as silicon wafer extracting, can also be applied to the extracting of more multi-field object such as energy source and power, chemical, information electronics, Aero-Space and bioengineering.
Description of drawings
Fig. 1 is the structural representation of a kind of piezoelectric ultrasonic vibration absorption pick-up of the present invention.
The air-flow sketch map of air-breathing and exhaust passage when Fig. 2 is a kind of piezoelectric ultrasonic vibration absorption pick-up work of the present invention.
Fig. 3 is the side view of the inlet valve of a kind of piezoelectric ultrasonic vibration absorption pick-up of the present invention.
Fig. 4 is the upward view of the inlet valve of a kind of piezoelectric ultrasonic vibration absorption pick-up of the present invention.
Fig. 5 is the side view of the air bleeding valve of a kind of piezoelectric ultrasonic vibration absorption pick-up of the present invention.
Fig. 6 is the vertical view of the air bleeding valve of a kind of piezoelectric ultrasonic vibration absorption pick-up of the present invention.
Label declaration among the figure: 1. piezoelectric ceramic piece, 2. vibrating disk, 3. vibration cavity, 4. inlet valve, 5. air bleeding valve, 6. the vibration cavity 7. picks up sucker, 8. compresses end cap.
The specific embodiment
Embodiment 1
In conjunction with shown in Figure 1, a kind of piezoelectric ultrasonic vibration absorption pick-up comprises
One vibration cavity 6, the inside of vibration cavity 6 is provided with a space as vibration cavity 3;
One vibrating disk 2; Place the rear end of vibration cavity 3, through compressing the inside of end cap 8 flexible fastenings at vibration cavity 6, the rear end of vibrating disk 2 is provided with piezoelectric ceramic piece 1; Piezoelectric ceramic piece 1 is bonded as one with vibrating disk 2 and forms the piezoelectric vibration dish, and piezoelectric ceramic piece 1 is connected with the piezoelectric supersonic driving power;
One picks up sucker 7; Be connected the front end of vibration cavity 6, be communicated with vibration cavity 3, the rear end of picking up sucker 7 also is communicated with inlet valve 4 and air bleeding valve 5; The front end that picks up sucker 7 is provided with one or more mini elastic cavitys, and each mini elastic cavity all is connected with inlet valve 4.
Pick up the cavity of the front end setting of sucker 7, picked up the thing surface with quilt and contact the airtight cavity of back formation.The rear end of picking up sucker 7 is fixed on the front end face of air bleeding valve, and is communicated with air intake passage.
In conjunction with Fig. 2-shown in Figure 6, the endoporus of the cylindrical of inlet valve 4 and the conical surface and air bleeding valve 5 is combined to form the circular passage with tapered cross-section and micro chink, and gas is sucked by big end, gets into vibration cavity 3 through micro chink; The lower end endoporus of the cylindrical of air bleeding valve 5 and the conical surface and vibration cavity 6 is combined to form the circular passage with tapered cross-section and micro chink, and the gas in the vibration cavity is got into by big end, is discharged to atmosphere through micro chink.
During system works, the piezoelectric vibration dish links to each other with the piezoelectric supersonic driving power, and under the driving of driving power, the piezoelectric vibration dish produces disk flexural vibrations, the Volume Changes of vibration cavity.
When the vibration cavity volume increased, gas was inhaled into outside vibration cavity because the tapered cross-section and with the effect of micro chink, the gas volume that is got into vibration cavity by air intake passage is greater than the gas volume that is got into by the exhaust passage; Otherwise when vibration cavity reduced, gas was discharged from vibration cavity, and the gas volume of being discharged by the exhaust passage is greater than the gas volume of being discharged by air intake passage.So air intake passage sucks gas in a vibration period, gas is discharged in the exhaust passage.
During the piezoelectric vibration disc vibration, the air that picks up in the sucker closed cavity is inhaled into the vibration cavity, enters atmosphere through the exhaust passage again, thereby in sucker, forms negative pressure, produces absorption affinity, and then can pick up object, accomplishes the work of picking up.
When needs put down when being picked up thing, driving power quits work, and vibrating disk no longer vibrates; The vibration cavity volume no longer changes; The closed chamber of picking up sucker is through air intake passage and exhaust passage and atmosphere, and inside and outside differential pressure disappears, and sucker and quilt are picked up natural separation between the thing.
The foregoing description just is to let the one of ordinary skilled in the art can understand content of the present invention and enforcement according to this in order technical conceive of the present invention and characteristics to be described, to be its objective is, can not limit protection scope of the present invention with this.The variation or the modification of every equivalence that the essence of content has been done according to the present invention all should be encompassed in protection scope of the present invention.
Claims (6)
1. a piezoelectric ultrasonic vibration absorption pick-up is characterized in that, comprises
The inside of one vibration cavity (6), vibration cavity (6) is provided with a space as vibration cavity (3),
One vibrating disk (2) places the rear end of vibration cavity (3), is connected the inside of vibration cavity (6), and the rear end of vibrating disk (2) is provided with piezoelectric ceramic piece (1),
One picks up sucker (7); Be connected the front end of vibration cavity (6); Be communicated with vibration cavity (3); The rear end of picking up sucker (7) also is communicated with inlet valve (4) and air bleeding valve (5), and the front end that picks up sucker (7) is provided with one or more mini elastic cavitys, and each mini elastic cavity all is connected with inlet valve (4).
2. piezoelectric ultrasonic vibration absorption pick-up according to claim 1 is characterized in that said piezoelectric ceramic piece (1) is bonded as one with vibrating disk (2).
3. piezoelectric ultrasonic vibration absorption pick-up according to claim 1 and 2 is characterized in that described piezoelectric ceramic piece (1) is connected with the piezoelectric supersonic driving power.
4. piezoelectric ultrasonic vibration absorption pick-up according to claim 1 is characterized in that said vibrating disk (2) is through compressing the inside of end cap (8) flexible fastening at vibration cavity (6).
5. piezoelectric ultrasonic vibration absorption pick-up according to claim 1 is characterized in that, constitutes the annular waste air duct of variable cross-section between the front end endoporus of said air bleeding valve (5) and vibration cavity (6).
6. piezoelectric ultrasonic vibration absorption pick-up according to claim 1 is characterized in that, constitutes the annular air intake passage of variable cross-section between the endoporus of said inlet valve (4) and air bleeding valve (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110380003 CN102490132B (en) | 2011-11-25 | 2011-11-25 | Piezoelectric ultrasonic vibration-absorption picker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110380003 CN102490132B (en) | 2011-11-25 | 2011-11-25 | Piezoelectric ultrasonic vibration-absorption picker |
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| Publication Number | Publication Date |
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| CN102490132A true CN102490132A (en) | 2012-06-13 |
| CN102490132B CN102490132B (en) | 2013-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110380003 Expired - Fee Related CN102490132B (en) | 2011-11-25 | 2011-11-25 | Piezoelectric ultrasonic vibration-absorption picker |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192402A (en) * | 2013-04-14 | 2013-07-10 | 苏州科技学院 | Piezoelectric ultrasonic vibration absorption picker |
| WO2019028601A1 (en) * | 2017-08-07 | 2019-02-14 | 大族激光科技产业集团股份有限公司 | Non-contact conveying device |
| CN110234916A (en) * | 2017-01-27 | 2019-09-13 | 穆格控制系统有限公司 | Actuator |
| CN110593539A (en) * | 2019-09-24 | 2019-12-20 | 谢方生 | An adjustable large-slab ceramic tile automatic laying frame |
| CN111843572A (en) * | 2020-08-25 | 2020-10-30 | 中国工程物理研究院机械制造工艺研究所 | A negative pressure suction tool for round flat sheet processing |
| CN112236274A (en) * | 2018-06-01 | 2021-01-15 | 无绳发展有限公司 | Equipment for contactless handling of objects |
| CN108451499B (en) * | 2017-02-21 | 2021-03-16 | 通用电气公司 | Elastography system, method and vibration unit therefor |
| CN114222443A (en) * | 2021-11-08 | 2022-03-22 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Flexible patch head structure with high pick-up rate and capable of rotating by 360 degrees |
| CN116331880A (en) * | 2023-02-01 | 2023-06-27 | 四川托璞勒科技有限公司 | Feeding sucker and feeding device for film |
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| WO1989010241A1 (en) * | 1988-04-29 | 1989-11-02 | Fraunhofer-Gesellschaft Zur Förderung Der Angewand | Micromanipulator for moving objects |
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2011
- 2011-11-25 CN CN 201110380003 patent/CN102490132B/en not_active Expired - Fee Related
Patent Citations (5)
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|---|---|---|---|---|
| WO1989010241A1 (en) * | 1988-04-29 | 1989-11-02 | Fraunhofer-Gesellschaft Zur Förderung Der Angewand | Micromanipulator for moving objects |
| DE4015196C2 (en) * | 1989-05-12 | 1995-02-23 | Fuji Electric Co Ltd | Press with piezoelectric actuators and control thereof |
| DE19606145B4 (en) * | 1996-02-20 | 2004-10-28 | Nagel Maschinen- Und Werkzeugfabrik Gmbh | Device for expanding a honing tool |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192402A (en) * | 2013-04-14 | 2013-07-10 | 苏州科技学院 | Piezoelectric ultrasonic vibration absorption picker |
| CN110234916A (en) * | 2017-01-27 | 2019-09-13 | 穆格控制系统有限公司 | Actuator |
| CN108451499B (en) * | 2017-02-21 | 2021-03-16 | 通用电气公司 | Elastography system, method and vibration unit therefor |
| WO2019028601A1 (en) * | 2017-08-07 | 2019-02-14 | 大族激光科技产业集团股份有限公司 | Non-contact conveying device |
| US11345553B2 (en) | 2017-08-07 | 2022-05-31 | Han's Laser Technology Industry Group Co., Ltd. | Non-contact transporting apparatus |
| CN112236274A (en) * | 2018-06-01 | 2021-01-15 | 无绳发展有限公司 | Equipment for contactless handling of objects |
| CN110593539A (en) * | 2019-09-24 | 2019-12-20 | 谢方生 | An adjustable large-slab ceramic tile automatic laying frame |
| CN111843572A (en) * | 2020-08-25 | 2020-10-30 | 中国工程物理研究院机械制造工艺研究所 | A negative pressure suction tool for round flat sheet processing |
| CN114222443A (en) * | 2021-11-08 | 2022-03-22 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Flexible patch head structure with high pick-up rate and capable of rotating by 360 degrees |
| CN116331880A (en) * | 2023-02-01 | 2023-06-27 | 四川托璞勒科技有限公司 | Feeding sucker and feeding device for film |
| CN116331880B (en) * | 2023-02-01 | 2023-08-11 | 四川托璞勒科技有限公司 | Feeding sucker and feeding device for film |
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| CN102490132B (en) | 2013-06-19 |
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Granted publication date: 20130619 Termination date: 20131125 |