A kind of piezoelectric ultrasonic vibration absorption pick-up
Technical field
The present invention relates to a kind of piezoelectric ultrasonic vibration absorption pick-up, specifically, relate to a kind of ultrasonic vibration adsorption pick-up apparatus that utilizes piezo-electric effect.
Background technology
Continuous development along with science and technology; The range of application of crisp fritter wafer materials such as solar energy silicon crystal chip constantly enlarges; Because wafer material itself is very crisp; The very thin thickness of wafer after processing in addition, the loading and unloading of wafer in manufacturing processes such as cutting, edge polishing, grinding, etching, polishing, cleaning be difficulty very, and is easy to breakage.If method is improper, the nanoscale surface after the processing also is easy to be destroyed.Therefore, safe, reliable, efficient picking up system has important effect.
The Grasp Modes of present thin and brittle wafer, the mode that adopts the gas vacuum cup to pick up more, there is this following point in this mode:
1, the bleed pressure of vacuum cup pick device is non-constant, causes the pickup force of vacuum cup unstable;
2, the grasp force peak value of vacuum cup pick device is excessive, can cause broken wafers once in a while;
3, the grasp force of vacuum cup pick device is inhomogeneous, wafer be adsorbed surperficial unbalance stress, be easy to generate wafer breakage;
4, the volume of vacuum cup pick device is big, power consumption is big, efficiency is low;
5, the vacuum cup pick device is air-breathing, the venting reaction time is of a specified duration, and efficient is low.
Summary of the invention
The volume that uses vavuum pump to cause is big, power consumption is big, efficiency is low, the unequal limitation of absorption affinity in order to overcome; The present invention proposes a kind of brand-new piezoelectric ultrasonic vibration absorption pick-up, this structure has that volume is little, power consumption is little, response speed is fast, steady performance.
Technical scheme of the present invention is:
A kind of ultrasonic vibration absorption pick-up comprises
The inside of one vibration cavity, vibration cavity is provided with a space as vibration cavity,
One vibrating disk places the rear end of vibration cavity, is connected the inside of vibration cavity, and the rear end of vibrating disk is provided with piezoelectric ceramic piece, is bonded as one with vibrating disk, and piezoelectric ceramic piece is connected with the piezoelectric supersonic driving power,
One picks up sucker, is connected the front end of vibration cavity, is communicated with vibration cavity, and the rear end of picking up sucker also is communicated with inlet valve and air bleeding valve, and the front end that picks up sucker is provided with one or more mini elastic cavitys, and each mini elastic cavity all is connected with inlet valve.
Preferably, said vibrating disk is through compressing the inside of end cap flexible fastening at the vibration cavity.
The said elastic cavity that picks up the setting of sucker front end impels sucker front end lip to be fitted the formation closed cavity with picking up the thing surface.Looping exhaust passage between the endoporus of said air bleeding valve and vibration cavity lower end constitutes air intake passage between the endoporus of said inlet valve and air bleeding valve, and air intake passage and exhaust passage are the annulus of variable cross-section.Said vibration cavity and inlet valve, air bleeding valve, vibrating disk constitute the vibration cavity of sealing.
The present invention also has the following advantages:
1. vibrating disk according to the invention adopts Piezoelectric Ceramic.Have the amplitude adjustable size, the absorption grasp force is adjustable, advantages of simple structure and simple.
2. on the basis that guarantees the absorption grasp force, can reduce the consumption of the energy to greatest extent.
3. pick up the efficient height, realize that moment picks up.
4. be widely used
The present invention not only can be used in crisp fritter wafers such as silicon wafer extracting, can also be applied to the extracting of more multi-field object such as energy source and power, chemical, information electronics, Aero-Space and bioengineering.
Description of drawings
Fig. 1 is the structural representation of a kind of piezoelectric ultrasonic vibration absorption pick-up of the present invention.
The air-flow sketch map of air-breathing and exhaust passage when Fig. 2 is a kind of piezoelectric ultrasonic vibration absorption pick-up work of the present invention.
Fig. 3 is the side view of the inlet valve of a kind of piezoelectric ultrasonic vibration absorption pick-up of the present invention.
Fig. 4 is the upward view of the inlet valve of a kind of piezoelectric ultrasonic vibration absorption pick-up of the present invention.
Fig. 5 is the side view of the air bleeding valve of a kind of piezoelectric ultrasonic vibration absorption pick-up of the present invention.
Fig. 6 is the vertical view of the air bleeding valve of a kind of piezoelectric ultrasonic vibration absorption pick-up of the present invention.
Label declaration among the figure: 1. piezoelectric ceramic piece, 2. vibrating disk, 3. vibration cavity, 4. inlet valve, 5. air bleeding valve, 6. the vibration cavity 7. picks up sucker, 8. compresses end cap.
The specific embodiment
Embodiment 1
In conjunction with shown in Figure 1, a kind of piezoelectric ultrasonic vibration absorption pick-up comprises
One vibration cavity 6, the inside of vibration cavity 6 is provided with a space as vibration cavity 3;
One vibrating disk 2; Place the rear end of vibration cavity 3, through compressing the inside of end cap 8 flexible fastenings at vibration cavity 6, the rear end of vibrating disk 2 is provided with piezoelectric ceramic piece 1; Piezoelectric ceramic piece 1 is bonded as one with vibrating disk 2 and forms the piezoelectric vibration dish, and piezoelectric ceramic piece 1 is connected with the piezoelectric supersonic driving power;
One picks up sucker 7; Be connected the front end of vibration cavity 6, be communicated with vibration cavity 3, the rear end of picking up sucker 7 also is communicated with inlet valve 4 and air bleeding valve 5; The front end that picks up sucker 7 is provided with one or more mini elastic cavitys, and each mini elastic cavity all is connected with inlet valve 4.
Pick up the cavity of the front end setting of sucker 7, picked up the thing surface with quilt and contact the airtight cavity of back formation.The rear end of picking up sucker 7 is fixed on the front end face of air bleeding valve, and is communicated with air intake passage.
In conjunction with Fig. 2-shown in Figure 6, the endoporus of the cylindrical of inlet valve 4 and the conical surface and air bleeding valve 5 is combined to form the circular passage with tapered cross-section and micro chink, and gas is sucked by big end, gets into vibration cavity 3 through micro chink; The lower end endoporus of the cylindrical of air bleeding valve 5 and the conical surface and vibration cavity 6 is combined to form the circular passage with tapered cross-section and micro chink, and the gas in the vibration cavity is got into by big end, is discharged to atmosphere through micro chink.
During system works, the piezoelectric vibration dish links to each other with the piezoelectric supersonic driving power, and under the driving of driving power, the piezoelectric vibration dish produces disk flexural vibrations, the Volume Changes of vibration cavity.
When the vibration cavity volume increased, gas was inhaled into outside vibration cavity because the tapered cross-section and with the effect of micro chink, the gas volume that is got into vibration cavity by air intake passage is greater than the gas volume that is got into by the exhaust passage; Otherwise when vibration cavity reduced, gas was discharged from vibration cavity, and the gas volume of being discharged by the exhaust passage is greater than the gas volume of being discharged by air intake passage.So air intake passage sucks gas in a vibration period, gas is discharged in the exhaust passage.
During the piezoelectric vibration disc vibration, the air that picks up in the sucker closed cavity is inhaled into the vibration cavity, enters atmosphere through the exhaust passage again, thereby in sucker, forms negative pressure, produces absorption affinity, and then can pick up object, accomplishes the work of picking up.
When needs put down when being picked up thing, driving power quits work, and vibrating disk no longer vibrates; The vibration cavity volume no longer changes; The closed chamber of picking up sucker is through air intake passage and exhaust passage and atmosphere, and inside and outside differential pressure disappears, and sucker and quilt are picked up natural separation between the thing.
The foregoing description just is to let the one of ordinary skilled in the art can understand content of the present invention and enforcement according to this in order technical conceive of the present invention and characteristics to be described, to be its objective is, can not limit protection scope of the present invention with this.The variation or the modification of every equivalence that the essence of content has been done according to the present invention all should be encompassed in protection scope of the present invention.