CN102487575A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN102487575A CN102487575A CN2010105706003A CN201010570600A CN102487575A CN 102487575 A CN102487575 A CN 102487575A CN 2010105706003 A CN2010105706003 A CN 2010105706003A CN 201010570600 A CN201010570600 A CN 201010570600A CN 102487575 A CN102487575 A CN 102487575A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- top layer
- via hole
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004364 calculation method Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
First row's via |
60 | 61 | 62 | 63 | 64 |
Electric current (A) | 4.007 | 3.305 | 3.099 | 3.033 | 3.234 |
Second row's via hole | 65 | 66 | 67 | 68 | 69 |
Electric current (A) | 2.619 | 1.939 | 1.701 | 1.662 | 1.809 |
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010570600.3A CN102487575B (en) | 2010-12-02 | 2010-12-02 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010570600.3A CN102487575B (en) | 2010-12-02 | 2010-12-02 | Printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102487575A true CN102487575A (en) | 2012-06-06 |
CN102487575B CN102487575B (en) | 2015-05-20 |
Family
ID=46153018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010570600.3A Expired - Fee Related CN102487575B (en) | 2010-12-02 | 2010-12-02 | Printed circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102487575B (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6483045B1 (en) * | 2000-02-03 | 2002-11-19 | United Microelectronics Corp. | Via plug layout structure for connecting different metallic layers |
JP2005136179A (en) * | 2003-10-30 | 2005-05-26 | U-Ai Electronics Corp | Printed circuit board |
CN2894199Y (en) * | 2006-03-30 | 2007-04-25 | 华为技术有限公司 | Printed circuit board |
CN101005730A (en) * | 2006-01-20 | 2007-07-25 | 佛山市顺德区顺达电脑厂有限公司 | Circuit board for reducing electromagnetic interference of electronic product |
US7279771B2 (en) * | 2004-03-31 | 2007-10-09 | Shinko Electric Industries Co., Ltd. | Wiring board mounting a capacitor |
US20090200074A1 (en) * | 2008-02-12 | 2009-08-13 | International Business Machines Corporation | Circuit Substrate Having Post-Fed Die Side Power Supply Connections |
US7615708B2 (en) * | 2006-02-23 | 2009-11-10 | Via Technologies, Inc. | Arrangement of non-signal through vias and wiring board applying the same |
US20100236823A1 (en) * | 2009-03-18 | 2010-09-23 | Sun Microsystems, Inc. | Ring of power via |
-
2010
- 2010-12-02 CN CN201010570600.3A patent/CN102487575B/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6483045B1 (en) * | 2000-02-03 | 2002-11-19 | United Microelectronics Corp. | Via plug layout structure for connecting different metallic layers |
JP2005136179A (en) * | 2003-10-30 | 2005-05-26 | U-Ai Electronics Corp | Printed circuit board |
US7279771B2 (en) * | 2004-03-31 | 2007-10-09 | Shinko Electric Industries Co., Ltd. | Wiring board mounting a capacitor |
CN101005730A (en) * | 2006-01-20 | 2007-07-25 | 佛山市顺德区顺达电脑厂有限公司 | Circuit board for reducing electromagnetic interference of electronic product |
US7615708B2 (en) * | 2006-02-23 | 2009-11-10 | Via Technologies, Inc. | Arrangement of non-signal through vias and wiring board applying the same |
CN2894199Y (en) * | 2006-03-30 | 2007-04-25 | 华为技术有限公司 | Printed circuit board |
US20090200074A1 (en) * | 2008-02-12 | 2009-08-13 | International Business Machines Corporation | Circuit Substrate Having Post-Fed Die Side Power Supply Connections |
US20100236823A1 (en) * | 2009-03-18 | 2010-09-23 | Sun Microsystems, Inc. | Ring of power via |
Also Published As
Publication number | Publication date |
---|---|
CN102487575B (en) | 2015-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY CO., LTD. Effective date: 20141229 Owner name: SCIENBIZIP CONSULTING (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY (SHENZHEN) CO., LTD. Effective date: 20141229 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20141229 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Applicant before: Hon Hai Precision Industry Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: ANHUI ZHILIAN INVESTMENT GROUP CO., LTD. Free format text: FORMER OWNER: SCIENBIZIP CONSULTING (SHENZHEN) CO., LTD. Effective date: 20150420 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C53 | Correction of patent of invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Gao Yuchao Inventor after: Wei Wei Inventor before: Huang Zongsheng |
|
COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: HUANG ZONGSHENG TO: GAO YUCHAO WEI WEI Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 241300 WUHU, ANHUI PROVINCE |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20150420 Address after: 241300 Anhui city of Wuhu province Nanling County Yan Dun Zhen Yan Dun Cun Applicant after: ANHUI ZHILIAN INVESTMENT GROUP CO., LTD. Address before: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant before: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Yu Xinmei Inventor before: Gao Yuchao Inventor before: Wei Wei |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170512 Address after: No. 5 Panyu District Hualong Town Lake Road in Guangzhou city of Guangdong Province in 511434 Patentee after: Guangzhou Tongyue Electronic Technology Co. Ltd. Address before: 241300 Anhui city of Wuhu province Nanling County Yan Dun Zhen Yan Dun Cun Patentee before: ANHUI ZHILIAN INVESTMENT GROUP CO., LTD. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150520 Termination date: 20171202 |
|
CF01 | Termination of patent right due to non-payment of annual fee |