CN102487575A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN102487575A CN102487575A CN2010105706003A CN201010570600A CN102487575A CN 102487575 A CN102487575 A CN 102487575A CN 2010105706003 A CN2010105706003 A CN 2010105706003A CN 201010570600 A CN201010570600 A CN 201010570600A CN 102487575 A CN102487575 A CN 102487575A
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- China
- Prior art keywords
- circuit board
- printed circuit
- top layer
- via hole
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004364 calculation method Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
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- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a printed circuit board which comprises a top layer and a bottom layer. A power supply and an electronic element are arranged on the top layer. The power supply is connected with both the top layer and the bottom layer through at least one first through hole. A plurality of second through holes run through the integral printed circuit board and are communicated with the top layer and the bottom layer, wherein the distances from the second through holes to the electronic element are equal. According to the printed circuit board, the condition that the current flowing a certain second through hole is excessively large to cause excessively high temperature of the printed circuit board can be avoided.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB).
Background technology
Please refer to Fig. 1 and Fig. 2, printed circuit board (PCB) comprises top layer 1, bottom 2, a signals layer 3 and a ground plane 4, and this top layer 1 and bottom 2 are bus plane.This top layer 1 is provided with an electronic component 5.Two row's via hole 6a, 6b and 7a, 7b run through whole printed circuit board (PCB) and are communicated with this top layer 1 and bottom 2.One power supply unit 8 that is arranged on the top layer 1 all links to each other with top layer 1 and bottom 2 through two other via hole 8a and 8b; Be used to electronic component 5 operating current is provided; Wherein one part of current directly flow to this electronic component 5 through top layer 1; Another part electric current will flow to bottom 2 through via hole 8a, 8b, 9a and 9b earlier, be back to top layer 1 through two row's via hole 6a, 6b and 7a, 7b again, offer this electronic component 5 at last.Because the electric current of bottom 2 can select the minimum path flow of resistance to this electronic component 5, so the time bottom 2 the major part of electric current can flow to top layer 1 by chosen distance electronic component 5 nearest via holes (via hole 7b), thereby arrive electronic component 5.The electric current of via hole 7b of so can causing flowing through is too big, thereby causes this via hole 7b temperature too high, brings unsteadiness for the work of printed circuit board (PCB).
Summary of the invention
In view of above content, the electric current that is necessary to provide a kind of ability to make and flows through via hole is printed circuit board (PCB) comparatively uniformly, and this printed circuit board (PCB) can avoid flowing through electric current of a via hole wherein is excessive.
A kind of printed circuit board (PCB); Comprise a top layer and a bottom; This top layer is provided with a power supply unit and an electronic component; This power supply unit all links to each other with bottom with top layer through at least one first via hole, and some second via holes run through whole printed circuit board (PCB) and are communicated with this top layer and bottom, and wherein each second via hole equates to the distance between this electronic component.
Above-mentioned printed circuit board (PCB) is set to equate avoided a certain second via hole owing to the excessive temperature that causes of the electric current of flowing through is too high so that the electric current of each second via hole of flowing through is comparatively approaching through the distance of each second via hole to electronic component.
Description of drawings
Fig. 1 is the sketch map of existing printed circuit board (PCB).
Fig. 2 is the cutaway view of printed circuit board (PCB) among Fig. 1.
Fig. 3 is the sketch map of the preferred embodiments of printed circuit board (PCB) of the present invention.
Fig. 4 is the cutaway view of printed circuit board (PCB) among Fig. 2.
The main element symbol description
Bottom 20
Ground plane 30
Signals layer 40
Via hole 80a, 80b, 60-69,90a, 90b
Embodiment
Below in conjunction with accompanying drawing and preferred embodiments the present invention is described in further detail:
Please refer to Fig. 3 and Fig. 4, printed circuit board (PCB) of the present invention comprises a top layer 10, a bottom 20, a ground plane 30 and a signals layer 40, and this top layer 10 and bottom 20 are bus plane.This top layer 10 is provided with an electronic component 50.Some via holes (comprising ten via hole 60-69 in this execution mode) run through whole printed circuit board (PCB) and are communicated with this top layer 10 and bottom 20.
One power supply unit 80 that is arranged on the top layer 10 all links to each other with top layer 10 and bottom 20 through two other via hole 80a and 80b; Be used to electronic component 50 operating current is provided; Wherein one part of current directly flow to this electronic component 50 through top layer 10; Another part electric current will flow to bottom 20 through via hole 80a, 80b, 90a and 90b earlier, be back to top layer 10 through via hole 60-69 again, offer this electronic component 50 at last.
This via hole 60-69 is arranged in two rows, and wherein each row all is a center of circle fan-shaped and that this is fan-shaped and overlaps with this electronic component 50.So, each the via hole 60-64 in first row's via hole equates that with the distance between the electronic component 50 each the via hole 65-69 in second row's via hole also equates with the distance between the electronic component 50.
Because the electric current of bottom 20 can select the minimum path flow of resistance to this electronic component 50, so the time bottom 20 the major part of electric current can flow to top layer 10 by chosen distance electronic component 50 nearest via holes (first row's via hole 60-64), thereby arrival electronic component 50.This printed circuit board (PCB) is carried out simulation calculation can obtain the flowing through current value of each via hole, as shown in table 1:
| First row's via |
60 | 61 | 62 | 63 | 64 |
| Electric current (A) | 4.007 | 3.305 | 3.099 | 3.033 | 3.234 |
| Second row's via hole | 65 | 66 | 67 | 68 | 69 |
| Electric current (A) | 2.619 | 1.939 | 1.701 | 1.662 | 1.809 |
Table 1
Can learn that from table 1 electric current of five via hole 60-64 of first row that flows through is comparatively approaching, thereby avoids a certain via hole upper reaches through excessive electric current.
Above-mentioned printed circuit board (PCB) equates to the distance of electronic component 50 through via arrangement being become fan-shaped so that each via hole, thereby makes the flow through electric current of each via hole also comparatively approaching, avoided a certain via hole owing to the excessive temperature that causes of the electric current of flowing through is too high.Certainly, in other execution mode, the fan-shaped center of circle that said some via holes are formed also can not overlap with this electronic component 50 or be arranged in other shape, as long as it is equal or close to the distance of each via hole to satisfy electronic component 50.
Claims (3)
1. printed circuit board (PCB); Comprise top layer and bottom; This top layer is provided with a power supply unit and an electronic component; This power supply unit all links to each other with bottom with top layer through at least one first via hole, and some second via holes run through whole printed circuit board (PCB) and are communicated with this top layer and bottom, and wherein each second via hole equates to the distance between this electronic component.
2. printed circuit board (PCB) as claimed in claim 1 is characterized in that: said some second via arrangement become fan-shaped.
3. printed circuit board (PCB) as claimed in claim 2 is characterized in that: the fan-shaped center of circle that said some second via holes are formed overlaps with this electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010570600.3A CN102487575B (en) | 2010-12-02 | 2010-12-02 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010570600.3A CN102487575B (en) | 2010-12-02 | 2010-12-02 | Printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102487575A true CN102487575A (en) | 2012-06-06 |
| CN102487575B CN102487575B (en) | 2015-05-20 |
Family
ID=46153018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010570600.3A Expired - Fee Related CN102487575B (en) | 2010-12-02 | 2010-12-02 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102487575B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6483045B1 (en) * | 2000-02-03 | 2002-11-19 | United Microelectronics Corp. | Via plug layout structure for connecting different metallic layers |
| JP2005136179A (en) * | 2003-10-30 | 2005-05-26 | U-Ai Electronics Corp | Printed circuit board |
| CN2894199Y (en) * | 2006-03-30 | 2007-04-25 | 华为技术有限公司 | Printed circuit board |
| CN101005730A (en) * | 2006-01-20 | 2007-07-25 | 佛山市顺德区顺达电脑厂有限公司 | Circuit board for reducing electromagnetic interference of electronic product |
| US7279771B2 (en) * | 2004-03-31 | 2007-10-09 | Shinko Electric Industries Co., Ltd. | Wiring board mounting a capacitor |
| US20090200074A1 (en) * | 2008-02-12 | 2009-08-13 | International Business Machines Corporation | Circuit Substrate Having Post-Fed Die Side Power Supply Connections |
| US7615708B2 (en) * | 2006-02-23 | 2009-11-10 | Via Technologies, Inc. | Arrangement of non-signal through vias and wiring board applying the same |
| US20100236823A1 (en) * | 2009-03-18 | 2010-09-23 | Sun Microsystems, Inc. | Ring of power via |
-
2010
- 2010-12-02 CN CN201010570600.3A patent/CN102487575B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6483045B1 (en) * | 2000-02-03 | 2002-11-19 | United Microelectronics Corp. | Via plug layout structure for connecting different metallic layers |
| JP2005136179A (en) * | 2003-10-30 | 2005-05-26 | U-Ai Electronics Corp | Printed circuit board |
| US7279771B2 (en) * | 2004-03-31 | 2007-10-09 | Shinko Electric Industries Co., Ltd. | Wiring board mounting a capacitor |
| CN101005730A (en) * | 2006-01-20 | 2007-07-25 | 佛山市顺德区顺达电脑厂有限公司 | Circuit board for reducing electromagnetic interference of electronic product |
| US7615708B2 (en) * | 2006-02-23 | 2009-11-10 | Via Technologies, Inc. | Arrangement of non-signal through vias and wiring board applying the same |
| CN2894199Y (en) * | 2006-03-30 | 2007-04-25 | 华为技术有限公司 | Printed circuit board |
| US20090200074A1 (en) * | 2008-02-12 | 2009-08-13 | International Business Machines Corporation | Circuit Substrate Having Post-Fed Die Side Power Supply Connections |
| US20100236823A1 (en) * | 2009-03-18 | 2010-09-23 | Sun Microsystems, Inc. | Ring of power via |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102487575B (en) | 2015-05-20 |
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| ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY CO., LTD. Effective date: 20141229 Owner name: SCIENBIZIP CONSULTING (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY (SHENZHEN) CO., LTD. Effective date: 20141229 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20141229 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Applicant before: Hon Hai Precision Industry Co., Ltd. |
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| ASS | Succession or assignment of patent right |
Owner name: ANHUI ZHILIAN INVESTMENT GROUP CO., LTD. Free format text: FORMER OWNER: SCIENBIZIP CONSULTING (SHENZHEN) CO., LTD. Effective date: 20150420 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Gao Yuchao Inventor after: Wei Wei Inventor before: Huang Zongsheng |
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| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: HUANG ZONGSHENG TO: GAO YUCHAO WEI WEI Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 241300 WUHU, ANHUI PROVINCE |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20150420 Address after: 241300 Anhui city of Wuhu province Nanling County Yan Dun Zhen Yan Dun Cun Applicant after: ANHUI ZHILIAN INVESTMENT GROUP CO., LTD. Address before: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant before: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Yu Xinmei Inventor before: Gao Yuchao Inventor before: Wei Wei |
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| TR01 | Transfer of patent right |
Effective date of registration: 20170512 Address after: No. 5 Panyu District Hualong Town Lake Road in Guangzhou city of Guangdong Province in 511434 Patentee after: Guangzhou Tongyue Electronic Technology Co. Ltd. Address before: 241300 Anhui city of Wuhu province Nanling County Yan Dun Zhen Yan Dun Cun Patentee before: ANHUI ZHILIAN INVESTMENT GROUP CO., LTD. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150520 Termination date: 20171202 |
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| CF01 | Termination of patent right due to non-payment of annual fee |