CN102695361A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN102695361A CN102695361A CN201110070481XA CN201110070481A CN102695361A CN 102695361 A CN102695361 A CN 102695361A CN 201110070481X A CN201110070481X A CN 201110070481XA CN 201110070481 A CN201110070481 A CN 201110070481A CN 102695361 A CN102695361 A CN 102695361A
- Authority
- CN
- China
- Prior art keywords
- top layer
- circuit board
- printed circuit
- electronic component
- via hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a printed circuit board which comprises a top layer and a bottom layer. The top layer is provided with a power supply and an electronic component. The power supply is connected with the top layer and the bottom layer through at least one first through hole. A plurality of second through holes are arranged near the electronic element, run through the whole printed circuit board, and are in communication with the top layer and the bottom layer, wherein a center of each second through hole is located on a same straight line, and a line of centers of all second through holes is perpendicular to a current direction of the electronic component. According to the printed circuit board, overhigh temperature caused by excessive current which flows through a second through hole can be avoided.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB).
Background technology
Please refer to Fig. 1 and Fig. 2, printed circuit board (PCB) comprises top layer 1, bottom 2, a signals layer 3 and a ground plane 4, and this top layer 1 and bottom 2 are bus plane.This top layer 1 is provided with an electronic component 5, and this electronic component 5 all links to each other with top layer 1 and bottom 2 through two other via hole 5a and 5b.Two row via hole 6a, 6b, 6c and 9a, 9b, 9c run through whole printed circuit board (PCB) and are communicated with this top layer 1 and bottom 2.One power supply unit 8 that is arranged on the top layer 1 all links to each other with top layer 1 and bottom 2 through two other via hole 8a and 8b; Be used to electronic component 5 operating current is provided; Wherein one part of current directly flow to this electronic component 5 through top layer 1; Another part electric current will flow to bottom 2 through via hole 8a, 8b, 6a, 6b and 6c earlier, be back to top layer 1 through three row via hole 9a, 9b, 9c again, offer this electronic component 5 at last.Because the electric current of bottom 2 can select the minimum path flow of resistance to this electronic component 5, so the time bottom 2 the major part of electric current can flow to top layer 1 by chosen distance electronic component 5 nearest via holes (via hole 9c), thereby arrive electronic component 5.The electric current of via hole 9c of so can causing flowing through is too big, thereby causes this via hole 9c temperature too high, brings unsteadiness for the work of printed circuit board (PCB).
Summary of the invention
In view of above content, the electric current that is necessary to provide a kind of ability to make and flows through via hole is printed circuit board (PCB) comparatively uniformly, and this printed circuit board (PCB) can avoid flowing through electric current of a via hole wherein is excessive.
A kind of printed circuit board (PCB); Comprise top layer and bottom; This top layer is provided with a power supply unit and an electronic component, and this power supply unit all links to each other with bottom with top layer through at least one first via hole, and some second via holes close on said electronic component setting and run through whole printed circuit board (PCB) and be communicated with this top layer and bottom; Being centered close on the same straight line of each second via hole wherein, and the line of centres of all second via holes is vertical with the sense of current of flowing through to said electronic component.
Compare prior art; The form of current vertical of said printed circuit board (PCB) through second via arrangement being become its center line and the electronic component of flowing through avoided a certain second via hole owing to the excessive temperature that causes of the electric current of flowing through is too high so that said some second via holes can be divided equally the electric current of the said electronic component of flowing through.
Description of drawings
Fig. 1 is the sketch map of existing printed circuit board (PCB).
Fig. 2 is the cutaway view of printed circuit board (PCB) among Fig. 1.
Fig. 3 is the sketch map of the preferred embodiments of printed circuit board (PCB) of the present invention.
Fig. 4 is the cutaway view of printed circuit board (PCB) among Fig. 2.
The main element symbol description
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10 |
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20 |
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30 |
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40 |
Via |
80a、80b、60-65、50a、50b |
|
50 |
|
80 |
Following embodiment will combine above-mentioned accompanying drawing to further specify the present invention.
Embodiment
Below in conjunction with accompanying drawing and preferred embodiments the present invention is described in further detail:
Please refer to Fig. 3 and Fig. 4, printed circuit board (PCB) of the present invention comprises a top layer 10, a bottom 20, a ground plane 30 and a signals layer 40, and this top layer 10 and bottom 20 are bus plane.This top layer 10 is provided with an electronic component 50, and said electronic component 50 all links to each other with top layer 10 and bottom 20 through two via hole 50a and 50b.Some via holes (comprising six via hole 60-65 in this execution mode) are insulated from each other and run through whole printed circuit board (PCB), are communicated with this top layer 10 and bottom 20 simultaneously to be electrically connected with this power supply unit 80 and electronic component 50.
One power supply unit 80 that is arranged on the top layer 10 all links to each other with top layer 10 and bottom 20 through two other via hole 80a and 80b; Be used to electronic component 50 operating current is provided; Wherein one part of current directly flow to this electronic component 50 through top layer 10; Another part electric current will be earlier through via hole 80a, 80b, 60-62 to bottom 20, be back to top layer 10 through via hole 63-65 and 50a, 50b again, offer this electronic component 50 at last.
This via hole 60-65 is arranged in two row, and wherein via hole 60-62 forms first row, and via hole 63-65 forms secondary series, and via hole 63-65 is centered close on same the straight line, and the line at the center of via hole 63-65 is vertical with the sense of current of flowing through to said electronic component 50.So, the electric current to said electronic component 50 of flowing through is through three via holes (like via hole 63-65), and is excessive with this electric current that reduces a certain via hole of flowing through.
Because the electric current of bottom 20 can select the minimum path flow of resistance to this electronic component 50, so the time bottom 20 the major part of electric current can flow to top layer 10 by chosen distance electronic component 50 nearest via holes (via hole 63-65), thereby arrive electronic component 50.This printed circuit board (PCB) is carried out simulation calculation can obtain the flowing through electric current of via hole to be 3.83 amperes by the electric current that focuses only on a via hole (like via hole 9c) in Fig. 1 circuit board to reduce to the electric current of being divided equally by three via holes (like via hole 63-65) is 3.5 amperes; So; The temperature of via hole (like 9c) is by about 40 degrees centigrade of original about 50 degrees centigrade of temperature that are reduced to three via holes (like via hole 63-65), thereby avoids said via hole (like via hole 9c) upper reaches through excessive electric current.
Said printed circuit board (PCB) has avoided a certain via hole owing to the excessive temperature that causes of the electric current of flowing through is too high through via arrangement being become its center line and flowing through to the vertical form of the sense of current of said electronic component so that each via hole can be divided equally the electric current of flowing through to said electronic component.
Claims (2)
1. printed circuit board (PCB); Comprise top layer and bottom; This top layer is provided with a power supply unit and an electronic component, and this power supply unit all links to each other with bottom with top layer through at least one first via hole, and some second via holes close on said electronic component setting and run through whole printed circuit board (PCB) and be communicated with this top layer and bottom; Being centered close on the same straight line of each second via hole wherein, and the line of centres of all second via holes is vertical with the sense of current of flowing through to said electronic component.
2. printed circuit board (PCB) as claimed in claim 1 is characterized in that: said top layer and bottom are bus plane.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110070481XA CN102695361A (en) | 2011-03-23 | 2011-03-23 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110070481XA CN102695361A (en) | 2011-03-23 | 2011-03-23 | Printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102695361A true CN102695361A (en) | 2012-09-26 |
Family
ID=46860592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110070481XA Pending CN102695361A (en) | 2011-03-23 | 2011-03-23 | Printed circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102695361A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113411947A (en) * | 2020-03-17 | 2021-09-17 | 纬颖科技服务股份有限公司 | Circuit board |
CN115087193A (en) * | 2022-06-30 | 2022-09-20 | 苏州浪潮智能科技有限公司 | Printed circuit board, power supply system of printed circuit board, simulation method and device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6229095B1 (en) * | 1998-10-01 | 2001-05-08 | Nec Corporation | Multilayer wiring board |
TW434821B (en) * | 2000-02-03 | 2001-05-16 | United Microelectronics Corp | Allocation structure of via plug to connect different metal layers |
CN101005730A (en) * | 2006-01-20 | 2007-07-25 | 佛山市顺德区顺达电脑厂有限公司 | Circuit board for reducing electromagnetic interference of electronic product |
US7746660B1 (en) * | 2006-10-10 | 2010-06-29 | Xilinx, Inc. | Reduced mounting inductance and increased self-resonant frequency range |
-
2011
- 2011-03-23 CN CN201110070481XA patent/CN102695361A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6229095B1 (en) * | 1998-10-01 | 2001-05-08 | Nec Corporation | Multilayer wiring board |
TW434821B (en) * | 2000-02-03 | 2001-05-16 | United Microelectronics Corp | Allocation structure of via plug to connect different metal layers |
CN101005730A (en) * | 2006-01-20 | 2007-07-25 | 佛山市顺德区顺达电脑厂有限公司 | Circuit board for reducing electromagnetic interference of electronic product |
US7746660B1 (en) * | 2006-10-10 | 2010-06-29 | Xilinx, Inc. | Reduced mounting inductance and increased self-resonant frequency range |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113411947A (en) * | 2020-03-17 | 2021-09-17 | 纬颖科技服务股份有限公司 | Circuit board |
CN113411947B (en) * | 2020-03-17 | 2023-08-29 | 纬颖科技服务股份有限公司 | circuit board |
CN115087193A (en) * | 2022-06-30 | 2022-09-20 | 苏州浪潮智能科技有限公司 | Printed circuit board, power supply system of printed circuit board, simulation method and device |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120926 |