CN102487022B - The packaging protection method of COB module - Google Patents
The packaging protection method of COB module Download PDFInfo
- Publication number
- CN102487022B CN102487022B CN201010579339.3A CN201010579339A CN102487022B CN 102487022 B CN102487022 B CN 102487022B CN 201010579339 A CN201010579339 A CN 201010579339A CN 102487022 B CN102487022 B CN 102487022B
- Authority
- CN
- China
- Prior art keywords
- chip
- groove
- board package
- package module
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 239000003292 glue Substances 0.000 claims abstract description 39
- 230000000694 effects Effects 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 13
- 238000004080 punching Methods 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
A kind of method disclosing protection packaging of chip on board package module of the present invention, the method comprises the following steps: in card, form the groove being applicable to chip on board package module; In described groove, instill glue, described glue has the effect of protection and bonding; Chip on board package module is embedded in described groove; Make glue curing.
Description
Technical field
The present invention relates to a kind of packaging protection method of COB module, specifically, the present invention relates to a kind of can directly by the packaging protection method of the chip package after wire bonding to the COB module in card.
Background technology
The packaging protection technique of traditional chip on board encapsulation (COB) module generally includes following steps: first, utilize lead key closing process to manufacture chip on board package module; Utilize the chip on board package module that the tamper seal such as solidified glue or epoxide resin material installs; Chip encapsulation module on the production board protected is installed in the groove milling of card; Glue is utilized to make chip on board package module be fixed to card.
Fig. 1 shows the schematic diagram of the card 100 that COB module is housed according to prior art.Card 100 comprises solidified glue 101, bonding line 102, substrate 103, chip 104, bonding glue 105 and card 106.Wherein, after utilizing solidified glue 101 that the COB module be made up of bonding line 102, substrate 103 and chip 104 is carried out protection packaging, recycling bonding glue 105 makes COB module be fixed to card 106.
Owing to needing to utilize solidified glue or epoxy resin to protect COB module before COB module is fixed to card in prior art, thus cause processing step complicated, and cause cost higher thus.Therefore, a kind of packaging protection method of the COB module that can reduce costs is needed.
Summary of the invention
In order to solve one or more problem of the prior art, an aspect of of the present present invention provides a kind of method of protection packaging of chip on board package module, and the method comprises the following steps: in card, form the groove being applicable to chip on board package module; In described groove, instill glue, described glue has the effect of protection and bonding; Chip on board package module is embedded in described groove; Make glue curing.
According to an aspect of the present invention, chip on board package module comprises substrate, setting chip on the upper surface of the substrate and the bonding line be electrically connected with the upper surface of substrate by chip.
According to an aspect of the present invention, the mobility that described glue is predetermined and viscosity, make it possible to complete protected key zygonema and bonding line can not be made to be out of shape simultaneously, and COB module can be made firmly to be attached to card.
According to an aspect of the present invention, described glue comprises the combination of epoxy resin and vinyl acetate resin or polyvinyl alcohol.
According to an aspect of the present invention, chip on board package module is made up of lead key closing process and Sheet Metal Forming Technology.
According to an aspect of the present invention, described groove comprises the first groove and is arranged on the second groove in the first groove, and the first groove is for holding the base part of chip on board package module, and the second groove is for holding chip and the bonding line part of chip on board package module.
According to an aspect of the present invention, in Sheet Metal Forming Technology, the substrate of chip on board package module is connected by multistage base material with between frame.
According to an aspect of the present invention, Sheet Metal Forming Technology comprises: be placed on by chip encapsulation module on the microscope carrier of stamping tool, is contained in the groove on microscope carrier with the chip and bonding line that make chip encapsulation module; Utilize pressing plate push down the substrate of chip encapsulation module back to the part of a part being provided with chip and bonding line; Utilize stamping tool punching press substrate not by part that pressing plate is pushed down.
Accompanying drawing explanation
By the description to embodiment carried out below in conjunction with accompanying drawing, above-mentioned and/or other objects of the present invention and advantage will become apparent, wherein:
Fig. 1 is the schematic diagram of the COB module according to prior art;
Fig. 2 A to Fig. 2 C is the schematic diagram of the packaging protection method that COB module is according to an exemplary embodiment of the present invention shown;
Fig. 3 A and Fig. 3 B is the schematic diagram of the example of the process for stamping of COB module according to an exemplary embodiment of the present invention.
Embodiment
Exemplary embodiment of the present invention is described below with reference to accompanying drawings.Embodiments of the invention shown in the drawings, and accompanying drawing and specification one are used from and explain principle of the present invention.
Fig. 2 A to Fig. 2 C schematically shows the packaging protection method of chip on board encapsulation (COB) module according to an exemplary embodiment of the present invention.With reference to Fig. 2 A to Fig. 2 C, the packaging protection method according to COB module of the present invention comprises the following steps: in card, form the groove being applicable to COB module; In described groove, instill glue, described glue has the effect of protection and bonding; By COB Module-embedding in described groove; Make glue curing.Wherein, COB module is formed by lead key closing process and Sheet Metal Forming Technology.
Specifically, with reference to Fig. 2 A, in card 210, form the groove 220 being applicable to COB module.According to an embodiment, groove 220 can comprise the first groove 221 and the second groove 222, second groove 222 can be formed in the first groove 221.First groove 221 can be used for the base part holding COB module, and the second groove 222 can be used for the chip part and the bonding line that hold COB module.After formation groove 220, glue 230 is added dropwise in groove 220.According to embodiments of the invention, glue 230 needs certain mobility and viscosity.Wherein, glue 230 has enough mobility, and the bonding line of connection function is protected completely, and simultaneously soft bonding line also due to the resistance of glue, deformation can not occur.In addition, glue 230 has enough viscosity, makes the bonding strength between COB module and card sheet 210 meet the reliability requirement of COB card, that is, COB module can be enable firmly to be attached to card 210.For different bonding lines, the character of available glue is different.Those skilled in the art can select the commercial suitable glue bought according to the character of bonding line (such as, thickness, hardness etc.).According to one or more embodiment of the present invention, glue 230 comprises the combination of epoxy resin and vinyl acetate resin or polyvinyl alcohol.
With reference to Fig. 2 B, by the direction indicated by the arrow in Fig. 2 B, the COB module 240 through lead key closing process and Sheet Metal Forming Technology is embedded in groove 220.Wherein, COB module 240 bonding line 243 that can comprise substrate 241, be arranged on the chip 242 on the upper surface of substrate 241 and chip 242 is electrically connected with the upper surface of substrate 241.Chip 242 and bonding line 243 can be contained in the second groove 222 and to be immersed in the glue 230 in the second groove 222.Substrate 241 can be contained in the first groove 221 and to be immersed in the glue in the first groove 221.The degree of depth of the second groove 222 can be greater than the maximum height being benchmark with the upper surface of substrate 241 of bonding line 243, is damaged owing to contacting with the bottom of the second groove 222 to avoid bonding line 243.
With reference to Fig. 2 C, glue 230 is solidified.According to one embodiment of present invention, solidify to make glue 230 by carrying out heating to glue 230.In addition, according to the curing properties of glue 230, also by alternate manner (such as UV line irradiation etc.), glue 230 is solidified.Glue 230 after solidification not only can make COB module 240 be fixed to card 210, also can play the effect of protection COB module 240 simultaneously, thus complete the packaging protection of COB module.
In the packaging protection method of COB module according to the present invention, can after wire bonding and Sheet Metal Forming Technology directly by COB Module-embedding in card, thus achieve the object of encapsulation to COB module and protection with the technique simplified.Therefore, eliminate traditional step that COB module is encapsulated and protected, thus can to boost productivity and cost-saving.
In the above-described embodiments, although describe the COB module formed by wire bonding and Sheet Metal Forming Technology, but the present invention is not limited thereto.The COB module formed by other techniques also be can be applicable in method of the present invention.
When the technique preparing COB module comprises Sheet Metal Forming Technology, usually after lead key closing process completes, utilize stamping tool to carry out punching press along the edge line of PCB module, the substrate of PCB module and frame are separated, thus forms independently COB module.
Owing to not carrying out independent encapsulating and conservation treatment to COB module in the above-mentioned methods; therefore in the punching course to COB module; COB module damage may be caused due to the substrate discontinuity of COB module in punching course, thus cause defect rate to raise.
Therefore, in the process to COB module punching, also can protect COB module, to reduce the possibility of COB module damage.Fig. 3 A and Fig. 3 B is the schematic diagram of the example of the process for stamping of COB module according to an exemplary embodiment of the present invention.
With reference to Fig. 3 A, before carrying out Sheet Metal Forming Technology, first in frame 320, fall some parts along substrate 310 edge punching press, thus between substrate 310 and frame 320, form multiple hole 330.Through such process, can make to be connected by means of only the discontinuous base material 340 of multistage between substrate 310 with frame 320, therefore, in the process of carrying out punching press, owing to making the shearing force be applied between substrate 310 and frame 320 be dispersed on described multistage base material, thus avoid stress and too concentrate on certain and a bit cause COB module damage.
Fig. 3 B shows the schematic diagram of the example of the process for stamping of the COB module according to another exemplary embodiment of the present invention.With reference to Fig. 3 B, COB module 640 can have the structure identical with the structure of the COB module 240 described with reference to Fig. 2 A to Fig. 2 C.Described process for stamping can comprise the following steps: COB module 640 be placed on the microscope carrier 630 of stamping tool, is contained in the groove on microscope carrier with the chip and bonding line that make COB module; Utilize pressing plate 610 push down the substrate of COB module back to the part of a part being provided with chip and bonding line; Utilize stamping tool 620 punching press substrate not by part that pressing plate is pushed down.By such method, the impact to COB module in punching course can be prevented, thus prevent COB module damage.
Utilize the packaging protection method of COB module of the present invention, the step in packaging technology can be reduced, thus can packaging cost be reduced.In addition, the packaging protection method of COB module of the present invention also can prevent the damage causing COB module in the Sheet Metal Forming Technology to COB module.
Describe exemplary embodiment of the present invention, but those skilled in the art should understand that, without departing from the spirit and scope of the present invention, can carry out various amendment and change to these embodiments, scope of the present invention limits in claims and equivalent thereof.
Claims (6)
1. a method for the protection packaging of chip on board package module, the method comprises the following steps:
The groove being applicable to chip on board package module is formed in card;
In described groove, instill glue, described glue has the effect of protection and bonding;
Chip on board package module is embedded in described groove;
Make glue curing,
Wherein, the bonding line that chip on board package module comprises substrate, arranges chip on the upper surface of the substrate and be electrically connected with the upper surface of substrate by chip,
Wherein, described glue has predetermined mobility and viscosity, makes it possible to complete protected key zygonema and bonding line can not be made to be out of shape simultaneously, and chip on board package module can be made firmly to be attached to card.
2. the method for claim 1, wherein described glue comprises the combination of epoxy resin and vinyl acetate resin or polyvinyl alcohol.
3. the method for claim 1, wherein chip on board package module is made up of lead key closing process and Sheet Metal Forming Technology.
4. the method for claim 1, wherein described groove comprises the first groove and is arranged on the second groove in the first groove, and the first groove is for holding the substrate of chip on board package module, and the second groove is for holding chip and the bonding line of chip on board package module.
5. method as claimed in claim 3, wherein, in Sheet Metal Forming Technology, the substrate of chip on board package module is connected by multistage base material with between frame.
6. method as claimed in claim 3, wherein, Sheet Metal Forming Technology comprises:
Chip on board package module is placed on the microscope carrier of stamping tool, is contained in the groove in microscope carrier with the chip and bonding line that make chip encapsulation module;
Utilize pressing plate push down the substrate of chip encapsulation module back to the part of a part being provided with chip and bonding line;
Utilize stamping tool punching press substrate not by part that pressing plate is pushed down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010579339.3A CN102487022B (en) | 2010-12-06 | 2010-12-06 | The packaging protection method of COB module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010579339.3A CN102487022B (en) | 2010-12-06 | 2010-12-06 | The packaging protection method of COB module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102487022A CN102487022A (en) | 2012-06-06 |
| CN102487022B true CN102487022B (en) | 2016-01-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010579339.3A Expired - Fee Related CN102487022B (en) | 2010-12-06 | 2010-12-06 | The packaging protection method of COB module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102487022B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6191366B1 (en) * | 1994-07-21 | 2001-02-20 | Hitachi Maxell, Ltd. | Board for IC card having component mounting recess |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100255108B1 (en) * | 1997-06-18 | 2000-05-01 | Samsung Electronics Co Ltd | Chip card |
| KR100791196B1 (en) * | 2007-04-11 | 2008-01-03 | 주식회사 하이스마텍 | Contact or contactless ic card and manufacturing method thereof |
-
2010
- 2010-12-06 CN CN201010579339.3A patent/CN102487022B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6191366B1 (en) * | 1994-07-21 | 2001-02-20 | Hitachi Maxell, Ltd. | Board for IC card having component mounting recess |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102487022A (en) | 2012-06-06 |
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Granted publication date: 20160120 Termination date: 20191206 |
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